CN101566750A - 带触摸屏的显示装置 - Google Patents

带触摸屏的显示装置 Download PDF

Info

Publication number
CN101566750A
CN101566750A CNA2009101351447A CN200910135144A CN101566750A CN 101566750 A CN101566750 A CN 101566750A CN A2009101351447 A CNA2009101351447 A CN A2009101351447A CN 200910135144 A CN200910135144 A CN 200910135144A CN 101566750 A CN101566750 A CN 101566750A
Authority
CN
China
Prior art keywords
mentioned
electrode
electrodes
screen
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2009101351447A
Other languages
English (en)
Inventor
寺本雅博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ips Pioneer Support Society
Panasonic Liquid Crystal Display Co Ltd
Japan Display Inc
Original Assignee
Hitachi Displays Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Displays Ltd filed Critical Hitachi Displays Ltd
Priority to CN201110431993.4A priority Critical patent/CN102622122B/zh
Publication of CN101566750A publication Critical patent/CN101566750A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/13338Input devices, e.g. touch panels
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/033Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
    • G06F3/0354Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
    • G06F3/03547Touch pads, in which fingers can move on a surface
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • H01L21/0206Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/0405Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising semiconducting carbon, e.g. diamond, diamond-like carbon
    • H01L21/0425Making electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/0405Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising semiconducting carbon, e.g. diamond, diamond-like carbon
    • H01L21/0425Making electrodes
    • H01L21/044Conductor-insulator-semiconductor electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/3213Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Position Input By Displaying (AREA)
  • Liquid Crystal (AREA)

Abstract

提供一种带触摸屏的显示装置,能抑制特性降低。该带触摸屏的显示装置包括:显示屏;以及在显示屏的观察者侧的面上配置的静电电容耦合方式的触摸屏,触摸屏在衬底上具有:沿第一方向延伸且在与第一方向交叉的第二方向上并排设置的多个第一电极、以及与多个第一电极交叉且沿第二方向延伸并在第一方向上并排设置的多个第二电极,多个第一电极的每一个,具有:在与多个第二电极不同的层中形成且与第二电极交叉的第一部分、以及与第二电极分离而同层地形成的第二部分,第一部分通过在第一部分和第二电极之间的绝缘膜中形成的接触孔与第二部分连接。

Description

带触摸屏的显示装置
技术领域
本发明涉及带触摸屏的显示装置,尤其涉及具有静电电容耦合方式的触摸屏的带触摸屏的显示装置。
背景技术
作为触摸屏的主要方式,已知有检测光的变化的方式、检测电气特性的变化的方式。另外,作为检测电气特性的变化的方式已知有静电电容耦合方式(参照日本特开2008-65748号公报、日本特开2009-015489号公报)。
图9~图11是关于以往的静电电容耦合方式的触摸屏的图,图9是示出电极图案的平面图、图10是示出沿图9的X-X线的剖面结构的剖面图,图11是示出沿图9的XI-XI线的剖面结构的剖面图。
以往的静电电容耦合方式的触摸屏,如图9~图11所示,具有:沿第一方向(例如X方向)延伸且在与上述第一方向交叉的第二方向(例如Y方向)上并排设置的多个电极1X、以及与该电极1X交叉且沿上述第二方向延伸并在上述第一方向上并排设置的多个电极2Y。多个电极1X配置在衬底11上,被在其上层形成的绝缘膜12覆盖。多个电极2Y配置在绝缘膜12上,被在其上层形成的保护膜13覆盖。电极1X和电极2Y由例如ITO(氧化铟锡)等的透明性导电材料形成。
发明内容
(发明要解决的问题)
在以往的静电电容耦合方式的触摸屏中,如图9~图11所示,多个电极1X和多个电极2Y隔着绝缘膜12分别形成在不同的导电层(下层和上层)中。在这样的电极结构的情况下,由于绝缘膜12和上层的电极1X上形成的保护膜13因上层的电极1X而在膜中发生畸变,而且对于反射光来说在下层和上层中光路长度不同,所以在下层的电极1X和上层的电极2Y中发生色差,电极1X和电极2Y的电极图案显现化。这样的电极图案的显现化成为导致光学特性劣化、引起组装有触摸屏的显示装置的特性降低的主要原因,所以必须采取对策。
本发明的目的在于提供可以抑制带触摸屏的显示装置的特性降低的技术。
通过本说明书的描述和附图能够更清楚地理解本发明的上述和其它的目的和新颖特征。
(用来解决问题的手段)
如果简要地说明本申请中公开的发明中的代表性方案的概要,则如下所述。
(1)、一种带触摸屏的显示装置,包括:显示屏;以及在上述显示屏的观察侧的面上配置的静电电容耦合方式的触摸屏,上述触摸屏在衬底上具有:沿第一方向延伸且在与上述第一方向交叉的第二方向上并排设置的多个第一电极、以及与上述第一电极交叉且沿上述第二方向延伸并在上述第一方向上并排设置的多个第二电极,上述多个第一电极的每一个,具有:在与上述第二电极不同的层中形成且与上述第二电极交叉的第一部分、以及在与上述第二电极相同的层中与上述第二电极分离形成的第二部分,上述第一部分通过在上述第一部分和上述第二电极之间的绝缘膜中形成的接触孔与上述第二部分电气连接。
(2)、在上述(1)中,上述第一电极的上述第一部分在上述多个第二电极的上层形成。
(3)、在上述(1)中,上述第一电极的上述第一部分在上述多个第二电极的下层形成。
(4)、在上述(1)-(3)中任一个中,上述第二电极在上述第一电极之间具有比与上述第一电极交叉的部分的宽度宽的部分;上述第一电极在上述第二电极之间具有比与上述第二电极交叉的部分的宽度宽的部分。
(5)、在上述(1)-(4)中任一个中,上述第一电极和上述第二电极由透明导电性材料构成。
(6)、在上述(1)-(5)中任一个中,还具有在上述衬底上形成为覆盖上述第一电极和上述第二电极的保护膜。
(发明的效果)
如果简要地说明由本申请中公开的发明中的代表性方案得到的效果,则如下所述。
根据本发明,可以抑制带触摸屏的显示装置的特性降低。
附图说明
图1是示出在本发明的实施例1的带触摸屏的显示装置中组装的触摸屏的电极图案的平面图。
图2是把图1的一部分放大得到的平面图。
图3是示出沿图1的III-III线的剖面结构的剖面图。
图4是示出沿图1的IV-IV线的剖面结构的剖面图。
图5是示出本发明的实施例1的带触摸屏的显示装置的概略构成的框图。
图6是示出在本发明的实施例2的带触摸屏的显示装置中组装的触摸屏的电极图案的平面图。
图7是示出沿图6的VII-VII线的剖面结构的剖面图。
图8是示出沿图6的VIII-VIII线的剖面结构的剖面图。
图9是示出以往的静电电容耦合方式的触摸屏的电极图案的平面图、
图10是示出沿图9的X-X线的剖面结构的剖面图。
图11是示出沿图9的XI-XI线的剖面结构的剖面图。
(附图标记说明)
1X:电极;
1a:第一部分;
1b:第二部分;
2Y:电极;
2a:第一部分;
2b:第二部分;
11:衬底;
12:绝缘膜;
12a:接触孔;
13:保护膜;
20、触摸屏;
30:液晶显示屏;
40:背光源
具体实施方式
下面,参照附图详细说明本发明的实施例。另外,在用来说明发明的实施例的全部附图中,对具有相同功能的部件赋予相同的附图标记,省略其重复的说明。
(实施例1)
在本实施例1中说明在作为显示屏的一例的例如液晶显示屏上具有触摸屏的带触摸屏的显示装置中使用本发明的例子。
图1-图5是关于本发明的实施例1的带触摸屏的显示装置的图。
图1是示出带触摸屏的显示装置中组装的触摸屏的电极图案的平面图。
图2是把图1的一部分放大得到的平面图。
图3是示出沿图1的III-III线的剖面结构的剖面图。
图4是示出沿图1的IV-IV线的剖面结构的剖面图。
图5是示出带触摸屏的显示装置的概略构成的框图。
另外,在图5中示出触摸屏20的沿图1的V-V线的剖面结构。
本实施例1的带触摸屏的显示装置,如图5所示,包括:液晶显示屏30;在液晶显示屏30的观察者侧的面上配置的静电电容耦合方式的触摸屏20;以及在液晶显示屏30的与观察者侧相反一侧的面下配置的背光源40。作为液晶显示屏30,使用例如IPS方式、TN方式、VA方式等的液晶显示屏。
触摸屏20,如图1~图4所示,具有:沿第一方向(例如X方向)延伸且在与上述第一方向交叉的第二方向(例如Y方向)上以预定的排列间距并排设置的多个电极1X、以及与该电极1X交叉且沿上述第二方向延伸并在上述第一方向上以预定的排列间距并排设置的多个电极2Y。
多个电极2Y的每一个由在上述第二方向上交互配置多个第一部分2a和多个宽度比该第一部分2a宽的第二部分2b而成的电极图案形成。多个电极2Y的每一个配置在衬底11的观察者侧的面上,被在其上层形成的绝缘膜12覆盖。作为衬底11使用例如玻璃等的透明的绝缘性衬底。
多个电极1X的每一个由在上述第一方向上交互配置多个第一部分1a、和多个宽度比该第一部分1a宽的第二部分1b而成的电极图案形成。多个电极1X的每一个的第一部分1a在与电极2Y不同的导电层中形成,与电极2Y的第一部分2a在平面上交叉。多个电极1X的每一个的第二部分1b在与电极2Y相同的导电层中与电极2Y分离地形成。在本实施例中,电极1X的第一部分1a在电极2Y的上层形成。
多个电极1X的每一个的第二部分1b与电极2Y同样地被绝缘膜12覆盖。多个电极1X的每一个的第一部分1a配置在绝缘膜12上,被在其上层形成的保护膜13覆盖。
电极1X的第一部分1a与电极2Y的第一部分2a在平面上交叉,通过在位于电极1X的第一部分1a和电极2Y之间的层间绝缘膜即绝缘膜12中形成的接触孔12a分别与夹着该第一部分2a而相邻的两个第二部分1b电气且机械地连接。
即,多个电极1X的每一个,具有:在与电极2Y不同的导电层中形成且与电极2Y交叉的第一部分1a、以及与电极2Y分离且在与电极2Y同层的导电层中形成的第二部分1b,电极1X的第一部分1a通过在该第一部分1a和电极2Y之间的绝缘膜12中形成的接触孔12a与电极1X的第二部分1b连接。
从平面上看时,电极2Y的第二部分2b配置在相邻的两个电极1X的各自的第一部分1a之间。从平面上看时,电极1X的第二部分1b配置在相邻的两个电极2Y的各自的第一部分2a之间。
即,电极2Y在电极1X之间具有比与电极1X交叉的部分的宽度宽的部分,而电极1X在电极2Y之间具有比与电极2Y交叉的部分的宽度宽的部分。
另外,电极1X和电极2Y由具有高透射性的材料,例如ITO(氧化铟锡)等的透明性导电材料形成。
另外,在图5中,示意性地示出在观察者的手指50与电极1X之间形成C1、C3的电容,观察者的手指50与电极2Y之间形成C2的电容。本实施例的触摸屏20检测电极1X和电极2Y的耦合电容的电容差,检测观察者的手指50触摸的、触摸屏20的触摸面内的触摸位置坐标。
下面,参照图1~图4说明本实施例的触摸屏20的制造方法。
首先,在衬底11的观察者侧的面上形成由透明性导电材料(例如ITO)构成的第一导电膜。
接着,用例如正型光刻胶在上述第一导电膜上形成电极图案的第一掩模,然后,通过使用上述第一掩模作为蚀刻掩模,蚀刻上述第一导电膜,在衬底11上形成电极2Y和电极1X的第二部分1b。
接着,除去上述第一掩模,然后,在包含电极2Y和电极1X的第二部分1b上的衬底11上形成由例如负型光刻胶构成的绝缘膜12。在该工序中,电极2Y和电极1X的第二部分1b被绝缘膜12覆盖。
在绝缘膜12的必要部分上形成接触孔12a,然后,在包含接触孔12a内的绝缘膜12上形成由透明性导电材料(例如ITO)构成的第二导电膜。
接着,用例如正型光刻胶在上述第二导电膜上形成电极图案的第二掩模,然后,通过使用上述第二掩模作为蚀刻掩模,蚀刻上述第二导电膜,在绝缘膜12上形成电极1X的第一部分1a。在该工序中,上层的第一部分1a通过接触孔12a与下层的第二部分1b电气且机械地连接。另外,上层的第一部分1a与下层的电极2Y的第一部分1a交叉。
接着,除去上述第二掩模,然后,在包含电极1X的第一部分1a上的绝缘膜12上形成由例如负型光刻胶构成的保护膜13,由此成为图1~4所示的结构。在该工序中,电极1X的第一部分1a被保护膜13覆盖。
另外,在上述各工序间的适当位置可以插入形成周边的布线图案的工序。
但是,在以往的静电电容耦合方式的触摸屏中,如图9~图11所示,多个电极1X和多个电极2Y隔着绝缘膜12分别形成在不同的导电层(下层和上层)中。在这样的电极结构的情况下,由于绝缘膜12和上层的电极1X上形成的保护膜13因上层的电极1X而在膜中发生畸变,而且对于反射光来说在下层和上层中光路长度不同,所以在下层的电极2Y和上层的电极1X中发生色差,电极1X和电极2Y的电极图案显现化。
与此相对,在本实施例的静电电容耦合方式的触摸屏20中,如图1~图4所示,电极1X具有:在与电极2Y不同的层中与电极2Y交叉地形成的第一部分1a、以及在与电极2Y相同的层中与电极2Y分离地形成的第二部分1b,第一部分1a通过在第一部分1a和电极2Y之间的绝缘膜12中形成的接触孔12a与第二部分1b连接。
在这样的电极结构的情况下,由于保护膜13能够具有均匀的成膜面,能够抑制保护膜13中产生的畸变,抑制因保护膜13的畸变导致的色差发生的电极图案显现化。结果,能够抑制电极图案显现化导致的光学特性劣化,由此能够抑制组装有触摸屏20的显示装置的特性降低。
另外,由于能够使产生色差的部分最小,即,仅仅是电极1X的第一部分1a,所以还能够抑制因光路差导致的色差发生的电极图案显现化。结果,能够抑制电极图案显现化导致的光学特性劣化,由此能够抑制组装有触摸屏20的显示装置的特性降低。
另外,在上层形成的第一部分1a(交联部分)形成了缺陷时,可以通过再次进行形成第一部分1a的工序来修复,能够抑制电极图案显现化导致的光学特性劣化而实现加工性的提高。
(实施例2)
图6至图8是关于本发明的实施例2的带触摸屏的显示装置的图。
图6是示出在带触摸屏的显示装置中组装的触摸屏的电极图案的平面图。
图7是示出沿图6的VII-VII线的剖面结构的剖面图。
图8是示出沿图6的VIII-VIII线的剖面结构的剖面图。
本实施例2的带触摸屏的显示装置基本上是与上述实施例1同样的构成,而以下的构成不同。
即,在上述实施例1中说明了,如图1至图4所示,在下层的导电层中形成电极2Y和电极1X的第二部分1b,在它上层的导电层中形成电极1X的第一部分1a的例子,但是在本实施例2中,如图6至图8所示,在下层的导电层中形成电极1X的第一部分1a,在它上层的导电层中形成电极2Y和电极1X的第二部分1b。
电极1X的第一部分1a(在本实施例中是下层)与电极2Y的第一部分2a在平面上交叉,通过在位于电极1X的第一部分1a和电极2Y之间的层间绝缘膜即绝缘膜12中形成的接触孔12a分别与夹着该第一部分2a而相邻的两个第二部分1b(在本实施例中是上层)电气且机械地连接。
在本实施例2中也是,能够抑制由于保护膜13的畸变导致的色差发生的电极图案显现化以及由于光路差导致的色差发生的电极图案显现化,因此,能够抑制电极图案显现化导致的光学特性劣化,能够抑制组装有触摸屏20的显示装置的特性降低。
另外,在上述的实施例中,作为显示屏的一例,说明了在液晶显示屏上具有触摸屏的带触摸屏的显示装置,但本发明并不仅限于此,也能够在有机EL显示屏、无机EL显示屏等的其它显示屏上具有触摸屏的带触摸屏的显示装置中使用本发明。
以上,基于上述实施例具体说明了由本发明人提出的发明,但本发明不限于上述实施例,在不脱离其主要构思的范围内可以进行各种变形。

Claims (6)

1.一种带触摸屏的显示装置,其特征在于包括:
显示屏;以及
在上述显示屏的观察侧的面上配置的静电电容耦合方式的触摸屏,
上述触摸屏具有:衬底;在上述衬底上沿第一方向延伸且在与上述第一方向交叉的第二方向上并排设置的多个第一电极、以及与上述多个第一电极立体交叉且沿上述第二方向延伸并在上述第一方向上并排设置的多个第二电极,
上述多个第一电极的每一个,具有:在与上述多个第二电极不同的层中形成且与上述多个第二电极的一个立体交叉的第一部分、以及在与上述多个第二电极相同的层中与上述多个第二电极分离地形成的第二部分,
上述第一部分通过在上述第一部分和上述多个第二电极之间的绝缘膜中形成的接触孔与上述第二部分电气连接。
2.如权利要求1所述的带触摸屏的显示装置,其特征在于:
上述第一部分在上述多个第二电极的上层形成。
3.如权利要求1所述的带触摸屏的显示装置,其特征在于:
上述第一部分在上述多个第二电极的下层形成。
4.如权利要求1~3中任一项所述的带触摸屏的显示装置,其特征在于:
上述多个第二电极的每一个,在彼此相邻的上述第一电极之间具有比与上述第一部分立体交叉的部分的宽度宽的部分;
上述多个第一电极的每一个,在彼此相邻的上述第二电极之间,以成为比上述第一部分的宽度宽的方式具有上述第二部分。
5.如权利要求1~3中任一项所述的带触摸屏的显示装置,其特征在于:
上述多个第一电极和上述多个第二电极由透明导电性材料构成。
6.如权利要求1~3中任一项所述的带触摸屏的显示装置,其特征在于:
还具有在上述衬底上形成为覆盖上述多个第一电极和上述多个第二电极的保护膜。
CNA2009101351447A 2008-04-22 2009-04-22 带触摸屏的显示装置 Pending CN101566750A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110431993.4A CN102622122B (zh) 2008-04-22 2009-04-22 触摸屏

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008111414 2008-04-22
JP2008111414A JP2009265748A (ja) 2008-04-22 2008-04-22 タッチパネル付き表示装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201110431993.4A Division CN102622122B (zh) 2008-04-22 2009-04-22 触摸屏

Publications (1)

Publication Number Publication Date
CN101566750A true CN101566750A (zh) 2009-10-28

Family

ID=40849226

Family Applications (2)

Application Number Title Priority Date Filing Date
CNA2009101351447A Pending CN101566750A (zh) 2008-04-22 2009-04-22 带触摸屏的显示装置
CN201110431993.4A Active CN102622122B (zh) 2008-04-22 2009-04-22 触摸屏

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201110431993.4A Active CN102622122B (zh) 2008-04-22 2009-04-22 触摸屏

Country Status (6)

Country Link
US (8) US8436830B2 (zh)
EP (2) EP2112574A1 (zh)
JP (1) JP2009265748A (zh)
KR (1) KR101050900B1 (zh)
CN (2) CN101566750A (zh)
TW (1) TWI388896B (zh)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102053427A (zh) * 2009-10-27 2011-05-11 乐金显示有限公司 具有触摸屏的立体液晶显示装置及其制造方法
CN102062965A (zh) * 2009-11-12 2011-05-18 乐金显示有限公司 具有触摸面板的立体液晶显示器及其制造方法
CN102096496A (zh) * 2009-12-10 2011-06-15 乐金显示有限公司 触摸屏面板
CN102163095A (zh) * 2010-02-22 2011-08-24 三星移动显示器株式会社 触摸屏面板及其制造方法
CN102236482A (zh) * 2010-05-04 2011-11-09 宸鸿光电科技股份有限公司 电容式触控结构及其制造方法以及触控设备
CN102622114A (zh) * 2011-01-28 2012-08-01 深圳华映显示科技有限公司 一种触控面板的感应装置
CN102654797A (zh) * 2011-03-02 2012-09-05 东莞万士达液晶显示器有限公司 触控面板
CN102713799A (zh) * 2009-12-28 2012-10-03 京瓷株式会社 输入装置、以及具备其的显示装置
CN102736763A (zh) * 2011-04-14 2012-10-17 联咏科技股份有限公司 触控传感装置
CN103092403A (zh) * 2011-11-04 2013-05-08 株式会社日本显示器东 触摸面板
CN103092390A (zh) * 2011-10-27 2013-05-08 瀚宇彩晶股份有限公司 触控感测装置及其制造方法
CN103324336A (zh) * 2012-03-22 2013-09-25 株式会社日本显示器东 触摸面板和带触摸面板的显示装置
CN103518180A (zh) * 2011-04-29 2014-01-15 高通Mems科技公司 用于集成电容式触摸装置的接线及外围

Families Citing this family (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101382651B (zh) * 2007-09-07 2011-12-14 群康科技(深圳)有限公司 触控式电润湿显示装置、触控式电路基板及其制造方法
JP2009265748A (ja) * 2008-04-22 2009-11-12 Hitachi Displays Ltd タッチパネル付き表示装置
JP5178379B2 (ja) 2008-07-31 2013-04-10 株式会社ジャパンディスプレイイースト 表示装置
JP5423004B2 (ja) * 2009-01-08 2014-02-19 東レ株式会社 ネガ型感光性樹脂組成物およびそれを用いたタッチパネル用材料
CN101893977B (zh) * 2009-05-19 2012-07-25 北京京东方光电科技有限公司 触摸屏、彩膜基板及其制造方法
JP5278759B2 (ja) * 2009-05-28 2013-09-04 凸版印刷株式会社 静電容量型入力装置
CN102023733B (zh) * 2009-09-11 2012-11-14 北京京东方光电科技有限公司 触摸屏、彩膜基板及其制造方法
KR101322981B1 (ko) * 2009-12-01 2013-10-29 엘지디스플레이 주식회사 터치 소자를 구비한 표시장치
KR101649228B1 (ko) * 2009-12-02 2016-08-19 엘지디스플레이 주식회사 터치패널 일체형 액정 표시 장치
TWI408441B (zh) * 2009-12-09 2013-09-11 Au Optronics Corp 觸控顯示面板以及觸控基板
US8970509B2 (en) 2009-12-09 2015-03-03 Lg Display Co., Ltd. Touch panel and liquid crystal display device including the same
KR101351415B1 (ko) * 2009-12-09 2014-01-16 엘지디스플레이 주식회사 터치 패널 및 터치 패널 일체형 액정 표시 장치
KR101320074B1 (ko) * 2009-12-10 2013-10-18 엘지디스플레이 주식회사 정전용량 방식 터치 스크린 패널
TWI417600B (zh) * 2009-12-11 2013-12-01 Century Display Shenzhen Co 觸控面板的製作方法以及母板
KR101630493B1 (ko) * 2009-12-29 2016-06-14 퀄컴 엠이엠에스 테크놀로지스, 인크. 보조 전극 구조물을 갖는 코팅된 광 방향 전환 조명 장치
KR101093326B1 (ko) * 2010-02-18 2011-12-14 삼성모바일디스플레이주식회사 터치 스크린 패널 및 그 제작방법
WO2011105202A1 (ja) * 2010-02-24 2011-09-01 京セラ株式会社 入力装置、表示装置、および携帯端末
KR101073215B1 (ko) * 2010-03-05 2011-10-12 삼성모바일디스플레이주식회사 터치 스크린 패널 일체형 평판표시장치
KR101040846B1 (ko) 2010-03-16 2011-06-14 삼성모바일디스플레이주식회사 터치 스크린 패널 및 그 제조방법
KR101082219B1 (ko) 2010-03-16 2011-11-09 삼성모바일디스플레이주식회사 터치 스크린 패널 일체형 평판표시장치
TWI412970B (zh) * 2010-03-30 2013-10-21 Chunghwa Picture Tubes Ltd 觸控輸入裝置
KR101073147B1 (ko) * 2010-04-05 2011-10-12 삼성모바일디스플레이주식회사 터치 스크린 패널 일체형 평판표시장치 및 그 제조방법
JP5454314B2 (ja) * 2010-04-06 2014-03-26 セイコーエプソン株式会社 表示装置、および電子機器
KR101048918B1 (ko) * 2010-04-28 2011-07-12 삼성모바일디스플레이주식회사 터치 스크린 패널 및 이를 구비한 영상표시장치
KR101693698B1 (ko) * 2010-04-28 2017-01-09 (주)멜파스 접촉 감지 패널 및 접촉 감지 장치
JP2013531317A (ja) * 2010-07-14 2013-08-01 エルジー イノテック カンパニー リミテッド タッチパネル及びその製造方法
CN102375643B (zh) * 2010-08-20 2014-02-26 上海立体数码科技发展有限公司 具有视差栅栏功能的电阻式触摸屏、显示装置及制备方法
JP2012068287A (ja) * 2010-09-21 2012-04-05 Toppan Printing Co Ltd カラーフィルタ基板及びその製造方法
KR101323004B1 (ko) * 2010-10-01 2013-10-29 엘지디스플레이 주식회사 정전용량 방식 터치 스크린 패널
JP5659684B2 (ja) * 2010-10-18 2015-01-28 凸版印刷株式会社 タッチパネル基板及びその製造方法
KR101339669B1 (ko) * 2010-10-26 2013-12-11 삼성디스플레이 주식회사 터치 스크린 패널
KR101779594B1 (ko) * 2010-10-26 2017-09-19 엘지디스플레이 주식회사 터치 스크린 패널과 이의 제조방법
JP5755752B2 (ja) * 2010-11-09 2015-07-29 ティーピーケイ タッチ ソリューションズ インコーポレーテッド タッチパネルデバイス
KR101397250B1 (ko) * 2010-12-30 2014-05-20 하이디스 테크놀로지 주식회사 정전 용량 터치 패널 및 그 제조 방법
KR101908492B1 (ko) * 2011-04-12 2018-10-17 엘지디스플레이 주식회사 터치 패널 일체형 표시 장치
KR101191949B1 (ko) * 2011-06-20 2012-10-17 박준영 정전용량 터치 패널의 제조 방법 및 이에 의해 제조되는 터치 패널
CN102929454A (zh) * 2011-08-12 2013-02-13 宸鸿科技(厦门)有限公司 电容式触控面板及降低其金属导体可见度的方法
KR101357585B1 (ko) * 2011-12-08 2014-02-11 엘지이노텍 주식회사 터치패널의 전극 패턴 및 그 제조 방법
WO2013106773A2 (en) 2012-01-12 2013-07-18 Synaptics Incorporated Single layer capacitive imaging sensors
JP5509473B2 (ja) * 2012-04-27 2014-06-04 株式会社ジャパンディスプレイ タッチパネル
KR102017155B1 (ko) * 2012-11-01 2019-09-03 삼성디스플레이 주식회사 터치스크린 패널 및 그의 제조방법
KR102052165B1 (ko) * 2012-11-30 2019-12-05 삼성디스플레이 주식회사 터치스크린 패널의 제조방법
KR101426303B1 (ko) * 2013-02-20 2014-08-05 주식회사 하이딥 터치 센서 패널
KR101469653B1 (ko) * 2013-02-28 2014-12-05 이성규 터치 스크린 패널 및 그 제조방법
CN103345317B (zh) * 2013-03-25 2014-10-29 深圳欧菲光科技股份有限公司 触摸屏
JP2014219963A (ja) * 2013-04-12 2014-11-20 信越ポリマー株式会社 センサーシート作製用シート及びその製造方法、タッチパッド用センサーシート及びその製造方法
TWI484382B (zh) * 2013-04-17 2015-05-11 E Ink Holdings Inc 觸控面板
KR101478043B1 (ko) * 2013-04-24 2015-01-02 일진디스플레이(주) 터치 패널 및 그 제조 방법
JP2014219816A (ja) * 2013-05-08 2014-11-20 株式会社ジャパンディスプレイ タッチパネル付き表示装置
US9542023B2 (en) 2013-08-07 2017-01-10 Synaptics Incorporated Capacitive sensing using matrix electrodes driven by routing traces disposed in a source line layer
US9298325B2 (en) 2013-09-30 2016-03-29 Synaptics Incorporated Processing system for a capacitive sensing device
US10042489B2 (en) 2013-09-30 2018-08-07 Synaptics Incorporated Matrix sensor for image touch sensing
US20150091842A1 (en) 2013-09-30 2015-04-02 Synaptics Incorporated Matrix sensor for image touch sensing
US9459367B2 (en) 2013-10-02 2016-10-04 Synaptics Incorporated Capacitive sensor driving technique that enables hybrid sensing or equalization
US9274662B2 (en) 2013-10-18 2016-03-01 Synaptics Incorporated Sensor matrix pad for performing multiple capacitive sensing techniques
US9081457B2 (en) 2013-10-30 2015-07-14 Synaptics Incorporated Single-layer muti-touch capacitive imaging sensor
US10804897B2 (en) * 2014-01-10 2020-10-13 Touchplus Information Corp. Touch-sensitive keypad control device
TWM485446U (zh) * 2014-01-10 2014-09-01 Touchplus Information Corp 遠端控制裝置
US20150206493A1 (en) * 2014-01-21 2015-07-23 Apple Inc. Devices and methods for reducing or eliminating mura artifact
JP2015153297A (ja) 2014-02-18 2015-08-24 Nltテクノロジー株式会社 タッチセンサー基板、画像表示装置、およびタッチセンサー基板の製造方法
US9798429B2 (en) 2014-02-28 2017-10-24 Synaptics Incorporated Guard electrodes in a sensing stack
US10133421B2 (en) 2014-04-02 2018-11-20 Synaptics Incorporated Display stackups for matrix sensor
KR101450248B1 (ko) * 2014-04-16 2014-10-15 에스맥 (주) 전기적 특성이 향상된 터치 스크린 패널
US9927832B2 (en) 2014-04-25 2018-03-27 Synaptics Incorporated Input device having a reduced border region
US9690397B2 (en) 2014-05-20 2017-06-27 Synaptics Incorporated System and method for detecting an active pen with a matrix sensor
TWI502445B (zh) * 2014-06-11 2015-10-01 Innolux Corp 觸控顯示裝置及觸控基板
CN104317470B (zh) * 2014-11-14 2017-06-13 深圳市华星光电技术有限公司 互电容式ogs触摸面板及其制造方法
CN104461142B (zh) * 2014-12-10 2017-06-30 京东方科技集团股份有限公司 触控显示基板及其制备方法、触控显示装置
US10175827B2 (en) 2014-12-23 2019-01-08 Synaptics Incorporated Detecting an active pen using a capacitive sensing device
US10990148B2 (en) 2015-01-05 2021-04-27 Synaptics Incorporated Central receiver for performing capacitive sensing
CN104679343B (zh) * 2015-03-26 2017-07-28 京东方科技集团股份有限公司 一种触控显示装置、触摸面板、导电搭桥方法及搭桥结构
US9939972B2 (en) 2015-04-06 2018-04-10 Synaptics Incorporated Matrix sensor with via routing
US9715304B2 (en) 2015-06-30 2017-07-25 Synaptics Incorporated Regular via pattern for sensor-based input device
US9720541B2 (en) 2015-06-30 2017-08-01 Synaptics Incorporated Arrangement of sensor pads and display driver pads for input device
US10095948B2 (en) 2015-06-30 2018-10-09 Synaptics Incorporated Modulation scheme for fingerprint sensing
CN205028263U (zh) 2015-09-07 2016-02-10 辛纳普蒂克斯公司 一种电容传感器
KR102510915B1 (ko) 2015-09-16 2023-03-17 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
US10037112B2 (en) 2015-09-30 2018-07-31 Synaptics Incorporated Sensing an active device'S transmission using timing interleaved with display updates
CN105448933B (zh) * 2015-11-24 2018-10-30 深圳市华星光电技术有限公司 用于液晶面板中的阵列基板及其制作方法
US10067587B2 (en) 2015-12-29 2018-09-04 Synaptics Incorporated Routing conductors in an integrated display device and sensing device
CN106933400B (zh) 2015-12-31 2021-10-29 辛纳普蒂克斯公司 单层传感器图案和感测方法
KR102374561B1 (ko) * 2017-06-19 2022-03-15 삼성디스플레이 주식회사 표시 장치 및 입력감지부재
KR20210005437A (ko) * 2019-07-05 2021-01-14 삼성디스플레이 주식회사 센서 모듈 및 이를 포함하는 표시 장치
CN110658951B (zh) * 2019-09-25 2023-09-26 京东方科技集团股份有限公司 一种触控基板及其制作方法、触控显示装置

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1112405A (en) * 1963-11-01 1968-05-08 Texas Instruments Ltd Formation of small dimensioned apertures using photographic masking and etching techniques
JPS54103694A (en) 1978-02-01 1979-08-15 Seiko Epson Corp Production of transparent conductive film patterns of liquid crystal panel
US4639720A (en) * 1981-01-12 1987-01-27 Harris Corporation Electronic sketch pad
JPS58166437A (ja) * 1982-03-26 1983-10-01 Fujitsu Ltd 指タツチ式座標検出パネルの製造方法
JPS609021A (ja) * 1983-06-27 1985-01-18 シャープ株式会社 マトリツクス型タツチキ−入力装置
US5403435A (en) * 1992-01-23 1995-04-04 Micron Technology, Inc. Process for selectively etching integrated circuit devices having deep trenches or troughs or elevated features with re-entrant profiles
EP0574213B1 (en) * 1992-06-08 1999-03-24 Synaptics, Inc. Object position detector
US5952998A (en) * 1997-01-15 1999-09-14 Compaq Computer Corporation Transparent touchpad with flat panel display for personal computers
US6177968B1 (en) * 1997-09-01 2001-01-23 Canon Kabushiki Kaisha Optical modulation device with pixels each having series connected electrode structure
JP3624703B2 (ja) * 1998-07-28 2005-03-02 セイコーエプソン株式会社 電気光学装置及びそれを用いた投射型表示装置
US6642984B1 (en) * 1998-12-08 2003-11-04 Fujitsu Display Technologies Corporation Liquid crystal display apparatus having wide transparent electrode and stripe electrodes
US6174801B1 (en) * 1999-03-05 2001-01-16 Taiwan Semiconductor Manufacturing Company E-beam direct writing to pattern step profiles of dielectric layers applied to fill poly via with poly line, contact with metal line, and metal via with metal line
US7223643B2 (en) * 2000-08-11 2007-05-29 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
JP2002313121A (ja) * 2001-04-16 2002-10-25 Nitto Denko Corp タッチパネル付照明装置及び反射型液晶表示装置
US6970160B2 (en) * 2002-12-19 2005-11-29 3M Innovative Properties Company Lattice touch-sensing system
JP4118708B2 (ja) 2003-02-28 2008-07-16 アルプス電気株式会社 フレキシブルセンサおよびそれを用いた入力装置並びにフレキシブルセンサの製造方法
JP3972846B2 (ja) * 2003-03-25 2007-09-05 セイコーエプソン株式会社 半導体装置の製造方法
US7580030B2 (en) * 2003-06-13 2009-08-25 Semtech Corporation Sensor for capacitive touch pad pointing device
TWI269213B (en) * 2004-01-07 2006-12-21 Elan Microelectronics Corp A capacitor type touch pad using thin film and the process thereof
TWI247184B (en) * 2004-04-16 2006-01-11 Toppoly Optoelectronics Corp Method for manufacturing LCD device with integrated touch panel
US20070229470A1 (en) * 2006-03-31 2007-10-04 Warren Snyder Capacitive touch sense device having polygonal shaped sensor elements
TWI313431B (en) 2006-04-14 2009-08-11 Ritdisplay Corporatio Transparent touch panel
TWI322374B (en) * 2006-04-14 2010-03-21 Ritdisplay Corp Light transmission touch panel and manufacturing method thereof
US8059015B2 (en) * 2006-05-25 2011-11-15 Cypress Semiconductor Corporation Capacitance sensing matrix for keyboard architecture
JP2008065748A (ja) 2006-09-11 2008-03-21 Sharp Corp タッチパネル及びタッチパネルを用いた表示装置
US7920129B2 (en) * 2007-01-03 2011-04-05 Apple Inc. Double-sided touch-sensitive panel with shield and drive combined layer
KR101481682B1 (ko) * 2007-04-09 2015-01-12 삼성디스플레이 주식회사 터치스크린 표시장치
TW200842681A (en) * 2007-04-27 2008-11-01 Tpk Touch Solutions Inc Touch pattern structure of a capacitive touch panel
US20080309633A1 (en) * 2007-06-13 2008-12-18 Apple Inc. Touch-sensitive display
JP4506785B2 (ja) * 2007-06-14 2010-07-21 エプソンイメージングデバイス株式会社 静電容量型入力装置
JP4945345B2 (ja) * 2007-07-03 2012-06-06 株式会社 日立ディスプレイズ タッチパネル付き表示装置
CN100495139C (zh) * 2007-10-10 2009-06-03 友达光电股份有限公司 触控面板及其制作方法
JP4582169B2 (ja) * 2008-03-26 2010-11-17 ソニー株式会社 静電容量型入力装置、入力機能付き表示装置および電子機器
JP2009265748A (ja) * 2008-04-22 2009-11-12 Hitachi Displays Ltd タッチパネル付き表示装置
JP5178379B2 (ja) * 2008-07-31 2013-04-10 株式会社ジャパンディスプレイイースト 表示装置
US7982723B2 (en) * 2008-09-18 2011-07-19 Stmicroelectronics Asia Pacific Pte. Ltd. Multiple touch location in a three dimensional touch screen sensor
JP5113773B2 (ja) * 2009-01-20 2013-01-09 株式会社ジャパンディスプレイイースト 表示装置
US7995041B2 (en) * 2009-02-02 2011-08-09 Apple Inc. Integrated touch screen

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102053427A (zh) * 2009-10-27 2011-05-11 乐金显示有限公司 具有触摸屏的立体液晶显示装置及其制造方法
CN102062965A (zh) * 2009-11-12 2011-05-18 乐金显示有限公司 具有触摸面板的立体液晶显示器及其制造方法
US8687135B2 (en) 2009-11-12 2014-04-01 Lg Display Co., Ltd. Stereoscopic liquid crystal display device having touch panel and method for manufacturing the same
CN102096496A (zh) * 2009-12-10 2011-06-15 乐金显示有限公司 触摸屏面板
CN102096496B (zh) * 2009-12-10 2014-02-19 乐金显示有限公司 触摸屏面板
CN102713799B (zh) * 2009-12-28 2015-11-25 京瓷株式会社 输入装置、以及具备其的显示装置
CN102713799A (zh) * 2009-12-28 2012-10-03 京瓷株式会社 输入装置、以及具备其的显示装置
CN102163095A (zh) * 2010-02-22 2011-08-24 三星移动显示器株式会社 触摸屏面板及其制造方法
CN102163095B (zh) * 2010-02-22 2015-04-01 三星显示有限公司 触摸屏面板及其制造方法
CN102236482B (zh) * 2010-05-04 2013-11-06 宸鸿光电科技股份有限公司 电容式触控结构及其制造方法以及触控设备
CN102236482A (zh) * 2010-05-04 2011-11-09 宸鸿光电科技股份有限公司 电容式触控结构及其制造方法以及触控设备
CN102622114A (zh) * 2011-01-28 2012-08-01 深圳华映显示科技有限公司 一种触控面板的感应装置
CN102622114B (zh) * 2011-01-28 2015-03-25 华映科技(集团)股份有限公司 一种触控面板的感应装置
CN102654797A (zh) * 2011-03-02 2012-09-05 东莞万士达液晶显示器有限公司 触控面板
CN102736763A (zh) * 2011-04-14 2012-10-17 联咏科技股份有限公司 触控传感装置
CN103518180A (zh) * 2011-04-29 2014-01-15 高通Mems科技公司 用于集成电容式触摸装置的接线及外围
CN103092390A (zh) * 2011-10-27 2013-05-08 瀚宇彩晶股份有限公司 触控感测装置及其制造方法
CN103092403A (zh) * 2011-11-04 2013-05-08 株式会社日本显示器东 触摸面板
CN103092403B (zh) * 2011-11-04 2016-06-22 株式会社日本显示器 触摸面板
CN103324336A (zh) * 2012-03-22 2013-09-25 株式会社日本显示器东 触摸面板和带触摸面板的显示装置
CN103324336B (zh) * 2012-03-22 2016-10-19 株式会社日本显示器 触摸面板和带触摸面板的显示装置

Also Published As

Publication number Publication date
US10168828B2 (en) 2019-01-01
CN102622122B (zh) 2015-11-18
EP2112574A1 (en) 2009-10-28
US20190095038A1 (en) 2019-03-28
TW200944874A (en) 2009-11-01
CN102622122A (zh) 2012-08-01
US9292147B2 (en) 2016-03-22
US20160162109A1 (en) 2016-06-09
JP2009265748A (ja) 2009-11-12
US20090262096A1 (en) 2009-10-22
US8643627B2 (en) 2014-02-04
KR101050900B1 (ko) 2011-07-20
US20150122771A1 (en) 2015-05-07
US20180203563A1 (en) 2018-07-19
KR20090111783A (ko) 2009-10-27
US20130194233A1 (en) 2013-08-01
TWI388896B (zh) 2013-03-11
US8941616B2 (en) 2015-01-27
US10719166B2 (en) 2020-07-21
US9952710B2 (en) 2018-04-24
US20140139485A1 (en) 2014-05-22
US20200319745A1 (en) 2020-10-08
US8436830B2 (en) 2013-05-07
EP3333686A1 (en) 2018-06-13

Similar Documents

Publication Publication Date Title
CN101566750A (zh) 带触摸屏的显示装置
CN101639580B (zh) 显示装置
US8717322B2 (en) Touch panel with shield electrode
KR101307962B1 (ko) 터치인식 횡전계형 액정표시장치 및 이의 제조 방법
US10719181B2 (en) Capacitive single layer multi-touch panel having improved response characteristics
US11237684B2 (en) Touch detection device
CN106354320A (zh) 触摸屏及其制备方法、触控显示装置
KR102174933B1 (ko) 본딩 강건 구조가 적용된 터치 패널 및 그 제조 방법
JP2012168980A (ja) タッチパネル
CN103985714A (zh) 阵列基板及其制造方法
CN102306074B (zh) 电容式触控面板及其制作方法
KR101950434B1 (ko) 액정 표시장치
CN102955599A (zh) 图像显示系统

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: PANASONIC LCD CO., LTD.

Free format text: FORMER OWNER: IPS ALPHA SUPPORT CO., LTD.

Effective date: 20111125

Owner name: IPS ALPHA SUPPORT CO., LTD.

Effective date: 20111125

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20111125

Address after: Chiba County, Japan

Applicant after: Hitachi Displays, Ltd.

Co-applicant after: Panasonic Liquid Crystal Display Co.,Ltd.

Address before: Chiba County, Japan

Applicant before: Hitachi Displays, Ltd.

Co-applicant before: IPS pioneer support society

Effective date of registration: 20111125

Address after: Chiba County, Japan

Applicant after: Hitachi Displays, Ltd.

Co-applicant after: IPS Pioneer Support Society

Address before: Chiba County, Japan

Applicant before: Hitachi Displays, Ltd.

C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20091028