CN101340781A - 高频印刷线路板通孔(via) - Google Patents
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Abstract
一种印刷线路板(PCB)通孔,提供一条导体,在PCB的各层上形成的微带或带状线导体之间垂直地延伸,该通孔包括一个导电焊盘,围绕着所述导体并嵌入在所述PCB内,位于这些PCB层之间。该焊盘的并联电容和该通孔其他部分的电容量的大小相对于所述导体固有阻抗,优化所述通孔的频率响应特性。
Description
本发明是提交于2002年1月15日,申请号为“02803755.3”,题为“高频印刷线路板通孔(VIA)”的专利申请的分案申请。
技术领域
本发明一般涉及一种通孔,用于在印刷线路板的各层上形成的导线之间提供一条信号通路,并特别涉及用作调谐滤波器的一种通孔,以优化其频率响应特性。
相关技术描述
图1和图2是先前技术的印刷线路板(PCB)的部分平面和竖直剖面图,用导电通孔12将PCB上表面16上形成的微带导体14连接到PCB下表面20上形成的微带导体18。通孔12包括与导体14接触的上盖帽(upper cap)(环形圈22);与导体18接触的下盖帽(lower cap)(环形圈24);及延伸在上下环形圈22和24之间的垂直导体26。PCB10还包括在PCB衬底层上形成的嵌入式电源和接地层28,位于上表面16下面和下表面20的上面,并也可以包括额外的嵌入式电源,接地或信号层30。通孔导体26穿过电源信号层28和30上的小孔,这些小孔应足够大,以防止导体26与层28和30接触。
图3是信号通路的阻抗模型,信号经过导体14,通孔12和导体18。微带导体14和18分别由它们的特性阻抗Z1和Z2模仿,它们的大小和间隙常常(with respect)考虑邻近的电源层或接地层,因此具有标准的特性阻抗,例如50欧。上下通孔环形圈22和24将并联电容C1和C2添加到由垂直导体26提供的信号通路上。电感L1模拟垂直导体26。图3的模型也可包括某些并联电阻,以说明经过通孔12四周的绝缘衬底的泄漏,但在高频时,电容C1和C2和电感L1是通孔频率响应的主要影响。
通孔12,其作用类似于三极滤波器或无源网络,能够严重地衰减和变形在导体14和18间传输的高频信号。由垂直导体26提供的串联电感主要取决于它的垂直尺寸。因为垂直导体26必须延伸穿过PCB10,其长度由PCB10的厚度确定,L1值的调整量通常很小。这样,减少在高频应用中由通孔12引起信号变形和衰减的传统方法必须使通孔的并联电容减少到最小。通过减少环形圈22和24的水平尺寸以及通过使环形圈22,24和邻近的电源层,接地层28之间的距离达到最大,能够减少并联电容C1和C2。然而,对电容C1和C2能够减少的电容量有某些实际的限制。因此,总会存在适量的通孔电容,并会引起某些信号电平的变形和衰减,特别是在高频信号中。
图4包括一种典型通孔的频率响应曲线A,该典型通孔已经设计成能提供最小分流电容和串联电感。滤波器的带宽通常定义为最低频率,其衰减达到-3db。图4中的线A示出通孔22的宽度大约3.2GHz。这样电路板设计者一般希望避免使用这样的电路板通孔来使频率信号高于大约3GHz。
因此在高频应用中使用通孔的常规方法通常是完全避免使用它们。不过,限制使用通孔会使在电路板上布线大量高频元件变得困难。在一些高频应用设计中,采用不完全穿透PCB的短“封闭”通孔连接在PCB上形成的互相垂直的嵌入带状导线。由于封闭通孔是短的,通孔有相对小的串联电感,因此通常比延伸完全穿透PCB的通孔有较宽的带宽。然而,隐蔽通孔的费用比穿透通孔(though via)的费用更贵,并且还未具有足够的带宽以处理甚高频信号。
因此,需要有一种充分地增加PCB通孔的带宽,以使能传输甚高频信号,并不会引起信号的过度衰减或失真。
发明内容
印刷线路板(PCB)通孔在PCB各水平层上形成的微带或带状导体之间提供垂直信号通路。通孔将并联电容和串联电感添加到信号通路上,这些电容和电感是通孔形状和大小函数,也是通孔和PCB上实现的邻近电源层及接地层之间的间距的函数。
按照本发明的一个方面,相对于另一个以及相对于通孔电感将通孔电容调整到大于实际可得到的最小电容值的一个电容值,在该电容值,优化所述通孔的频率响应特性,例如带宽。
按照本发明的另一个方面,在特殊实施例中,调整通孔电容,以使通孔的作用像多级切比雪夫(Chebyshev)或巴特沃斯(Butterworth)滤波器。
按照本发明的又一个方面,通孔包括嵌入PCB内的一个电容元件,与由该通孔提供的信号通路接触。相对于通孔的固有串联电感和带状线或微带导体的阻抗,调整该元件的并联电容和该通孔其他部分的电容幅值,以微调该通孔,用于优化频率响应特性。
因此,本发明的一个目标是提供一种PCB通孔,能传输高频信号,并没有过度地衰减这些信号。
该说明的权利要求部分特别地指出并清楚地要求本发明的主题。然而,通过阅读本说明的剩余部分及参考附图,技术熟练人员最能理解本发明结构和工作方法,以及它的更深一层的优点和目标。附图中相似的参考字符涉及相似的元件。
附图说明
图1是先前技术印刷线路板(PCB)的部分平面图,用导电通孔连接在PCB上表面和下表面上形成的微带导体;
图2是图1PCB的竖直剖面图;
图3是原理图,描述一条信号通路的阻抗模型,该信号通路经过图2的微带导体和通孔;
图4是曲线图,描述图2和图6通孔的频率响应;
图5是刷线路板的部分平面图,该印刷线路板使用按照本发明的一种通孔,以连接在PCB上表面和下表面上形成的微带导体;
图6是图5的PCB的竖直剖面图;
图7是原理图,描述一条信号通路的阻抗模型,当使用图8所述的微带配置时,该信号通路经过图6的微带导体和通孔;
图8是图5和图6的微带导体和通孔的平面图;
图9是图5和图6微带导体和通孔的替代实施例的平面图;
图10是原理图,描述一条信号通路的阻抗模型,当使用图9所述的微带配置时,该信号通路经过图6的微带导体和通孔;
图11是先前技术PCB的部分平面图,该PCB使用一种按照本发明的导电通孔,以连接在PCB各层上形成的嵌入式带状线导体;
图12是图11PCB的竖直剖面图;
图13是原理图,描述一条信号通路的阻抗模型,该信号通路经过图12的带状线导体和通孔;
图14是曲线图,描述图12和图15通孔的频率响应;
图15是印刷线路板的竖直剖面图,该印刷线路板使用一种按照本发明第一替代实施例的导电通孔;
图16是原理图,描述一条信号通路的阻抗模型,该信号通路经过图15的带状线导体和通孔;
图17是印刷线路板的竖直剖面图,该印刷线路板使用按照本发明第二替代实施例的一种导电通孔;及
图18是原理图,描述一条信号通路的阻抗模型,该信号通路经过图17的带状线导体和通孔。
具体实施方式
图5和图6是多层印刷线路板(PCB)40的部分平面和竖直剖面图,该多层印刷线路板40使用按照本发明的一种导电通孔42,将PCB40上表面46上形成的微带导体44连接到在PCB下表面50上形成的微带导体48。通孔42包括与导体34接触的上盖帽(环形圈52);下盖帽(环形圈54),用于与导体48接触;以及垂直导体56,在上环形圈52和下环形圈54之间延伸。PCB 40还包括在衬底层上形成的电源层和接地层,位于上表面46的下面以及下表面50的上面,并且也可以包括其他层上形成的额外的电源层和接地层或信号层58。垂直导体56穿过电源信号层57和58内的小孔,这些小孔应足够大,以避免导体56与层57和58接触。
按照本发明,将一个电容加到通孔42上,适当地嵌在上环形圈52和下环形圈54间的中间位置上。通过用相同的金属材料在PCB的多衬底层的一层上平版地构成导电焊盘59可以提供该电容,在联结PCB40的各单独衬底层之前,用该金属材料在那一层上平版地构成其余的电源,接地或信号层58的导体。当钻小孔穿过PCB 40和焊盘59,并用种导电材料进行填充形成导体56时,焊盘59形成一个环形圈,围绕在导体56的周围,并与导体56接触。焊盘59的水平表面和邻近的电源或接地层58担当一个电容的作用,将并联电容加到由垂直导体56提供的信号通路上。
图7是信号通过导体44,通孔42和导体48的信号通路的阻抗模型。分别由特性阻抗Z1和Z2模拟微带导体44和48。微带导体的尺寸和间隙常常相对于它们最近的电源或接地层57,所以他们具有标准的特性阻抗,例如50欧。上下环形圈52和54分别将电容C1和C2加在信号通路和最近的电源或接地层58之间。电容C3模拟焊盘59和它附近的电源或接地层58之间的电容。电感L1和L2分别模拟在焊盘59上面和下面的垂直导体部分的阻抗。图7的阻抗模型也可包括某些并联电阻,以模拟经过围绕PCB衬底绝缘材料的泄漏,但在高信号频率时,电容和电感元件控制通孔42的频率响应。
如图7所示,通孔42担当五极滤波器。在高频应用中,通孔的串联电感L1和L2及并联电容C1-C3衰减在导体44和48间传输的信号,并使信号失真。信号的频率越高,信号的衰减和失真就越大。如果通孔没有阻抗,就根本就不会衰减信号,也不会使信号失真。因此,减少信号衰减和失真的传统方法必须减少通孔的并联电容。例如,通过减少环形圈52和54的水平尺寸,以及通过增加环形圈52和54与它们最近的电源或接地层57之间的距离,能够减少并联电容C1和C2。然而,对电容C1和C2能够减少的电容量有些实际限制。主要用垂直导体56的垂直尺寸也可减少垂直导体56的串联电感L1和L2。然而,因为垂直导体56必须延伸穿透PCB 40,它的长度由PCB 40的厚度确定,L1和L2调整量的空间很少。
因此,总是存在适量的通孔电容和电感,并总是会引起信号的失真和衰减。如下面所讨论的,本发明增加带宽及改善通孔的其他频率响应特性,超出了通过简单地使通孔的并联电容减少到最小所能获得的效果。
调整通孔电容
图2是先前技术的通孔12(图2)的竖直剖面图,该通孔12除了不包含通孔42的焊盘59外,类似于本发明图5的通孔42。图3是通孔12的阻抗模型,该阻抗模型含有与上下环形圈22和24相关的电容C1和C2,以及与它的垂直导体26相关的电感L1。注意电容C1和C2及电感L1形成一种双端口,3极滤波器,与图7的5极滤波器成对比。
图4的曲线A描述当图3的3极滤波器的各种元件具有下面表I所示的数值时,先前技术通孔12的频率响应。
C1和C2电容值0.17pF是可达到的典型的最小通孔电容值。
滤波器的带宽常常定义该滤波器的衰减量达到-3db时的最低信号频率。图5的曲线A示出先前技术通孔22的带宽,约为3.2GHz。遵循传统惯例,人们或许希望环形圈22和24的电容C1和C2的增加会导致通孔22带宽的减少。然而,那并不是适用所有电容值的情况,对这种情况,人们或许增加C1和C2的电容值。当元件值如下面表II所列的数值时,图4的曲线B描述图3滤波器的频率响应。
注意,C1和C2电容增加了4倍多,而通孔电感L1和微带阻抗Z1和Z2的值保持不变。图4的曲线B示出通过增加通孔电容,能将通孔带宽从约3.2GHz增加到3.5GHz。不需要通过尽可能地降低通孔电容使通孔带宽达到最宽;替代地,通过将通孔电容调整到相对于通孔电感的合适数值,使带宽达到最宽。像调整滤波器一样处理该通孔,使频率响应最优化。
这样可以通过适当地调整通孔电容而不是通过使通孔电容减少到最小,能优化通孔的频率响应。然而,通孔的“最佳”频率响应依赖于应用。在大多数高频应用中,通常希望使通孔带宽达到最宽。但在某些高频应用中,或许乐意,例如,采用一种较窄的带宽,以调换一种较平坦通带,在低频衰减较少,或在阻带上迅速下降。因为图2的通孔12和图6的通孔42形成3极或5极滤波器,通过适当地调整通孔电容,能够使这些通孔效果像众所周知的3极或5极“巴特沃斯”滤波器能,提供极其平坦的频率响应,或像众所周知的多极切比雪夫滤波器,能够优化带宽和衰减特性的组合。那些技术熟练人员已知多极巴特沃斯和切比雪夫滤波器的设计,包括元件数值的合适选择,以使最优化滤波器频率响应的各种特性。例如参阅W.H.Hayward编写的《射频设计入门》一书中的59-68页,1982年,由Prentice-Hall有限公司出版,这儿并入作参考。
分布通孔电容
将焊盘59加到通孔42与试图将通孔电容减少到最小以改善该通孔的高频响应的传统惯例不一致,因为焊盘59将并联电容C3加到该通孔的信号通路上。然而,如下面所示范的,当相对于通孔42的其他部分的电容C1和C2及电感L1和L2适当地调整电容C3时,大大地改善了该通孔的频率响应特性。
图4的曲线C描述图7的5极滤波器的频率响应,模拟图6中的改进通孔42,该通孔42带有如下面表III中列出的元件数值。
从曲线C可以看出通孔42的带宽约为5.6GHz,远大于图2通孔12的“最小电容”和“调整电容”版本的3.2和3.5GHz带宽,这两种版本具有图4曲线A和B中描述的频率响应。还应注意,通孔42的总电容为1.8pF,远大于通过通孔12的最小电容版本所加的总并联电容0.34pF,约与由通孔12的调整电容版本所加的电容1.76相同。
通过比较曲线A和B,可以看出通过适当地调整通孔电容,而不是通过试图使该电容减少到最小,能够改善通孔的频率响应。通过将曲线C与曲线A和B相比较还能够看出,当将通孔电容更均匀地分布在通孔垂直长度上时,能够极大地增加通孔的频率响应特性。例如,如果沿着垂直导体56的长度上均匀地分布几个具有电容的焊盘59并相对于通孔电感适当调整上下环形圈52和54的电容,将进一步增加通孔带宽。一般加到由通孔形成的滤波器上极数越多,通过适当地调整所提供的所有阻抗元件能够获得的带宽就越宽。增加极的数量还有助于使滤波器的通带更平坦,并使阻带上的高频更陡地衰减,也理想地改善了许多应用中的频率响应特性。
增加通孔电感
图8和图9是图5微带导体44和48及通孔42替代版本的平面图。微带导体的阻抗基本上是微带导体的带宽和该导体与附近电源或接地层间的距离的函数。通常设计微带导体,使其在整个长度上具有均匀的特性阻抗,例如50欧。因此,微带导体的宽度通常是相同的,如图8所示。图8的阻抗模型假设微带导体44和48的宽度是相同的。然而通过使通孔42附近部分60和62上的微带导体44和46的宽度减少,如图9所示,能使这些部分主要为电感性。
图10描述当已经修改了导体44和48,含有电感性部分60和62时,如图9所示,由导体44,通孔42和导体48形成的信号通路的阻抗模型。除了通孔42的电容C1-C3和电感L1和L2外,与导体44和48有关的Z1和Z2特性阻抗之间的结构包括导体部分60和62的电感L3和L4。这样,导体44和48间的结构担当一个7极滤波器。
图4的曲线D描述当阻抗元件含有下面表IV列出的数值时,图10的7极滤波器的频率响应。
曲线D示出图10的7极滤波器结构的带宽约为6.8GHz。远大于图7的5极滤波器带宽(曲线C)。这样可以看出,即使图10的7极滤器比图7的5极滤波器,和图3的最小电容或调整电容版本的3极滤波器具有更大的电容和电感,它具有更宽的带宽。这样除了通过调整和更均匀地分布电容改善通孔的频率响应外,能够通过在该通孔的上下末端增加适当大小的电感,进一步地改善通孔的频率特性。这将增加连接两条微带线的滤波器结构的极数。
调整用于互连嵌入式带状导体的通孔
通孔也用于内部连接PCB衬底的单独埋层上形成的带状导体。PCB设计者常常应用隐蔽通孔或埋入通孔代替穿透通孔,使嵌入导体互相连接,隐蔽通孔或埋入通孔不是全部穿透PCB,而穿透通孔延伸完全穿透PCB,因为较短的隐蔽通孔和埋入通孔没有给信号通路增加同样多的电容或电感。然而,隐蔽通孔和埋入通孔的制造费用比穿透通孔贵,因为不同的PCB层必须分别钻孔。本发明改善了穿透通孔的带宽,所以通孔能用于在高频应用中,使嵌入式带状导体互相连接。
图11和图12是多层印刷线路板(PCB)70的部分平面图和竖直剖面图,应用按照本发明的先前技术通孔72,使PCB70的某一埋层上形成的带状导体74连接到PCB另一埋层上形成的带状导体78。通孔72包括上环形圈82;下环形圈84;垂直导体86,延伸在上环形圈82和下环形圈84之间。PCB40还包括在带状导体74和78的上一层和下一层上形成的电源层和接地层87,并还包括在其他层上形成的附加嵌入式电源,接地或信号层88。垂直导体86穿过电源信号层87和88上的小孔,这些小孔应足够大,以避免垂直导体86与层87和88接触。然而,带状导体74和78确实与垂直导体88接触,所以通孔72能够在导体74和78之间提供一条信号通路。
图13是信号通过导体74,通孔72和导体78的信号通路的阻抗模型。带状导体74和78分别由它们的特性阻抗Z1和Z2模拟。上下环形圈52和54在信号通路和地之间分别加入并联电容C1和C2。电感L1模拟上环形圈82和导体74之间垂直导体86的电感。电感L3表示导体74和78之间的导体86的电感。电感L2模拟导体78和下环形圈84之间和导体86的电感。
图14曲线E描述当按照本发明相对于电感L1-L3调整通孔电容C1和C2,以提供最大带宽时,图13先前技术的5极滤波器结构的频率响应。当计算曲线E时,使用下面表V中列出的阻抗数值。
从曲线E中可注意到,图14的5极滤波器的带宽约为6.3GHz。这比图3(见图4的曲线C)的3极滤波器电容调整版本的3.5GHz带宽要宽得多,因为图13的电感L1和L2是并联电感而不是串联电感,并用于使上下环形圈电容C1和C2与信号通路隔离。
图15是按照本发明的图11和12的PCB70的竖直剖面图,其中,沿垂直导体56在导体70和78之间的中间某一位置上,导电焊盘90将并联电容加到通孔72。
图16是加入环形圈90时,通孔72的阻抗模型。电容C3模拟环形圈90的电容。电感L3A和L3B表示图13中的部分电感L3,由导体74和78之间的垂直导体56提供。注意,该通孔担当7极滤波器。图14的曲线F描述图16的7极滤波器的频率响应,使用下面表VI中列出的阻抗元件。
比较曲线E和F,可以看出将带有适当调整电容的焊盘90加到通孔72,能够使该通孔的带宽从约6.3GHz增加到约9.3GHz。
通过使带状线74和78的末端变为电感性,例如通过减少在该通孔附近的带状线的宽度,能够进一步地增宽该通孔的带宽,如上面连接同图9所述本发明的微带版本中所讨论的。因为Z1和L3A之间及Z2和L3B之间的附加串联电感将图16的7极滤波器转变为9极滤波器,能够进行调整,用于增加带宽。
应用多个嵌入电容的通孔
通过在导体74和78之间提供多于一个适当调整的焊盘90,以更均匀地配置通孔电容,可以使带宽得到额外的改善。例如,图17描述按照本发明替代实施例的图6通孔42的一种改进版本。在图6中,通孔42仅包括单个导电焊盘59,嵌入在PCB40内,以沿由通孔42提供的信号通路的单个点上提供附加并联电容。导电焊盘59将通孔42转变为图7所述的5极滤波器。导体56担当两个串联电感L1和L2,而上下环形圈52和54及焊盘59分别担当电容C1,C2和C3。
在图17所述的通孔版本中,两个导电焊盘59A和59B嵌入在PCB40内(不是放在),以在沿由通孔42提供的信号通路的两点上提供附加并联电容,这两点位于导体44和48之间。如图17所述,现在导体56担当3个串联电感L1-L3,而上下环形圈52和54及焊盘59A和59B分别担当电容C1,C2,C3A和C3B。这样,图17的通孔42担当7极滤波器,能够调整该通孔,使它的带宽比图7的5极滤波器带宽更宽,给出相似的串联电感总量。当PCB含有较多层时,能够将额外的嵌入式电容添加到通孔上,以进一步增加由它形成的滤波器的极数。
虽然在上述说明书中已经描述了本发明较佳实施例,本领域的技术熟练人员可对较佳实施例做许多改变,而在各个方面并不背离本发明。例如,表I-VI中列出的阻抗值仅是示范性的。本领域的技术熟练人员将明白,按照本发明设计的通孔可以具有其他组合的阻抗值。他们也应当明白,按照本发明通过适当地调整它们的电容元件,以及通过将适当大小的电容和/或电感元件加到该通孔,也能够改善隐蔽式和嵌入式通孔的频率响应。因此附加的权利要求能够覆盖所有这样的落在本发明的真实范畴和精神内的改变。
Claims (13)
1.一种制作连接线基板的方法,包括:
提供一基板,所述基板包括:
第一导电带;
第二导电带;以及
一导电通路,穿过所述基板上的一通孔并使得第一导电带和第二导电带电气互联,所述导电通路具有电感性阻抗;
增加并联电容至所述通孔,该并联电容和该导电通路的电感形成一滤波器;以及
根据所述电感调整所述并联电容的大小,以调谐所述滤波器使之具有一预定带宽。
2.如权利要求1所述的方法,其特征在于,该滤波器包括切比雪夫滤波器。
3.如权利要求1所述的方法,其特征在于,该滤波器包括巴特沃斯滤波器。
4.如权利要求1所述的方法,其特征在于,所述滤波器的预定带宽大于没有并联电容的导电通路的带宽。
5.如权利要求1所述的方法,其特征在于,所滤波器的预定带宽是该导电通路的最大带宽。
6.如权利要求1所述的方法,其特征在于,所述增加并联电容的步骤包括在所述基板中嵌入一导电的第一衬垫,该第一衬垫与位于第一导电带和第二导电带之间的带电通路相接触。
7.如权利要求6所述的方法,其特征在于,所述增加并联电容的步骤还包括在所述基板中与第一衬垫分离的位置嵌入一导电的第二衬垫,该第二衬垫与位于第一导电带和第二导电带之间的带电通路相接触。
8.如权利要求6所述的方法,其特征在于,该第一衬垫围绕该导电通路。
9.如权利要求6所述的方法,其特征在于,该第一衬垫位于第一导电带和第二导电带的中间位置。
10.如权利要求1所述的方法,其特征在于,该基板是一印刷电路板。
11.如权利要求1所述的方法,其特征在于,该第二导电带嵌入在该基板中。
12.如权利要求1所述的方法,其特征在于,还包括通过改变第一导电带的方向来调整第一导电带的特性阻抗。
13.如权利要求12所述的方法,其特征在于,所述第一导电带中的第二个与导电通路相接触。
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JP (1) | JP4336497B2 (zh) |
KR (2) | KR100890128B1 (zh) |
CN (2) | CN100512593C (zh) |
AU (1) | AU2002235384A1 (zh) |
DE (1) | DE60234014D1 (zh) |
TW (1) | TW525414B (zh) |
WO (1) | WO2002058234A2 (zh) |
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2002
- 2002-01-15 JP JP2002558608A patent/JP4336497B2/ja not_active Expired - Fee Related
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- 2002-01-15 CN CNB028037553A patent/CN100512593C/zh not_active Expired - Fee Related
- 2002-01-15 DE DE60234014T patent/DE60234014D1/de not_active Expired - Lifetime
- 2002-01-15 CN CNA2007101419582A patent/CN101340781A/zh active Pending
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- 2002-01-15 KR KR1020087003839A patent/KR100945401B1/ko not_active IP Right Cessation
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Publication number | Priority date | Publication date | Assignee | Title |
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CN104519658A (zh) * | 2013-09-30 | 2015-04-15 | 北大方正集团有限公司 | 一种电路板跳层盲孔的制作方法及电路板 |
CN104519658B (zh) * | 2013-09-30 | 2017-09-29 | 北大方正集团有限公司 | 一种电路板跳层盲孔的制作方法及电路板 |
Also Published As
Publication number | Publication date |
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US6538538B2 (en) | 2003-03-25 |
JP4336497B2 (ja) | 2009-09-30 |
US20020130737A1 (en) | 2002-09-19 |
TW525414B (en) | 2003-03-21 |
US6661316B2 (en) | 2003-12-09 |
KR20030071826A (ko) | 2003-09-06 |
KR100890128B1 (ko) | 2009-03-20 |
EP1354502B1 (en) | 2009-10-14 |
EP1354502A2 (en) | 2003-10-22 |
AU2002235384A1 (en) | 2002-07-30 |
KR100945401B1 (ko) | 2010-03-04 |
WO2002058234A3 (en) | 2002-10-24 |
CN100512593C (zh) | 2009-07-08 |
KR20080018288A (ko) | 2008-02-27 |
JP2004521536A (ja) | 2004-07-15 |
US20030080835A1 (en) | 2003-05-01 |
CN1531841A (zh) | 2004-09-22 |
DE60234014D1 (de) | 2009-11-26 |
WO2002058234A2 (en) | 2002-07-25 |
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