DK2290753T3 - Konnektor og flerlagsprintplade - Google Patents

Konnektor og flerlagsprintplade

Info

Publication number
DK2290753T3
DK2290753T3 DK09011143.6T DK09011143T DK2290753T3 DK 2290753 T3 DK2290753 T3 DK 2290753T3 DK 09011143 T DK09011143 T DK 09011143T DK 2290753 T3 DK2290753 T3 DK 2290753T3
Authority
DK
Denmark
Prior art keywords
connector
printing plate
layer printing
layer
plate
Prior art date
Application number
DK09011143.6T
Other languages
English (en)
Inventor
Juergen Lappoehn
Original Assignee
Erni Electronics Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Erni Electronics Gmbh filed Critical Erni Electronics Gmbh
Application granted granted Critical
Publication of DK2290753T3 publication Critical patent/DK2290753T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/727—Coupling devices presenting arrays of contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Combinations Of Printed Boards (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
DK09011143.6T 2009-08-31 2009-08-31 Konnektor og flerlagsprintplade DK2290753T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09011143A EP2290753B1 (de) 2009-08-31 2009-08-31 Steckverbinder und Multilayerplatine

Publications (1)

Publication Number Publication Date
DK2290753T3 true DK2290753T3 (da) 2013-03-18

Family

ID=41477650

Family Applications (1)

Application Number Title Priority Date Filing Date
DK09011143.6T DK2290753T3 (da) 2009-08-31 2009-08-31 Konnektor og flerlagsprintplade

Country Status (8)

Country Link
US (1) US8622751B2 (da)
EP (1) EP2290753B1 (da)
JP (1) JP5663773B2 (da)
KR (1) KR101691360B1 (da)
CN (1) CN102726125B (da)
CA (1) CA2772312C (da)
DK (1) DK2290753T3 (da)
WO (1) WO2011023317A1 (da)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014109867A1 (de) * 2014-07-14 2016-01-14 Erni Production Gmbh & Co. Kg Steckverbinder und Bauelement
CN105161879A (zh) * 2015-09-24 2015-12-16 上海埃而生电气有限公司 多层pcb中央配电盒
US10283885B2 (en) * 2015-11-06 2019-05-07 Foxconn Interconnect Technology Limited Electrical connector assembly and system using the same
JP2019012586A (ja) * 2015-11-17 2019-01-24 株式会社ジェイエイアイコーポレーション コネクタ構造体
CN106771831B (zh) * 2017-01-09 2023-09-01 昆山艾伯格机器人科技有限公司 多种针高的连接器的自动检测机构
CN107369932A (zh) * 2017-08-08 2017-11-21 四川华丰企业集团有限公司 具有多层布线印制板的高速背板连接器
US11664626B2 (en) * 2021-07-29 2023-05-30 Dell Products L.P. Staggered press-fit fish-eye connector

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* Cited by examiner, † Cited by third party
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US3660726A (en) * 1970-10-12 1972-05-02 Elfab Corp Multi-layer printed circuit board and method of manufacture
JPS5758701Y2 (da) * 1978-12-30 1982-12-15
US4707039A (en) * 1984-04-11 1987-11-17 John Fluke Mfg. Co., Inc. Coaxial connector for controlled impedance transmission lines
JPS6177286A (ja) * 1984-09-21 1986-04-19 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 同軸ケーブル用インターフェース装置
US5038252A (en) 1989-01-26 1991-08-06 Teradyne, Inc. Printed circuit boards with improved electrical current control
FR2647971B1 (fr) * 1989-06-01 1991-09-20 Itt Composants Instr Ensemble de connexion pour cartes a circuits imprimes
SE466126B (sv) * 1990-12-21 1991-12-16 Vemako Ab Flerpoligt skaermat kontaktdon med gemensam jord
US5201662A (en) * 1991-08-23 1993-04-13 Molex Incorporated Electrical connector for mounting on a printed circuit board
US5241454A (en) * 1992-01-22 1993-08-31 International Business Machines Corporation Mutlilayered flexible circuit package
DE4217205C2 (de) * 1992-05-23 1994-09-08 Amphenol Tuchel Elect Steckverbinder
JPH06163123A (ja) * 1992-11-26 1994-06-10 Nec Corp 多極コネクタ
US5543586A (en) * 1994-03-11 1996-08-06 The Panda Project Apparatus having inner layers supporting surface-mount components
DE69413679T2 (de) * 1994-07-15 1999-04-29 Berg Electronics Mfg Zusammenbau eines abgeschirmten Verbinders und einer Leiterplatte mit kontaktierten Löchern
JPH09139264A (ja) * 1995-11-13 1997-05-27 Yazaki Corp Ｐｃｂ用多極コネクタ
DE29601655U1 (de) 1996-01-31 1996-03-28 Siemens Ag Baugruppenleiterplatte mit Steckverbinder
DE19604432C2 (de) * 1996-02-07 1997-12-11 Siemens Ag Kontaktierung einer Leiterplatte mittels Einführkontakten und Druckkontakten
US5819401A (en) * 1996-06-06 1998-10-13 Texas Instruments Incorporated Metal constrained circuit board side to side interconnection technique
DE29721401U1 (de) 1997-12-06 1998-02-05 Erni Elektroapp Steckverbinder für Backplanes und Einschubkarten bei sogenannten Compact PCI-Systemen
DE19902950A1 (de) 1998-06-24 1999-12-30 Wuerth Elektronik Gmbh & Co Kg Verfahren zum Herstellen einer Leiterplatte und Leiterplatte
US6394822B1 (en) 1998-11-24 2002-05-28 Teradyne, Inc. Electrical connector
US6538538B2 (en) * 1999-02-25 2003-03-25 Formfactor, Inc. High frequency printed circuit board via
US6280201B1 (en) * 2000-01-21 2001-08-28 Hewlett-Packard Company Laminated 90-degree connector
DE10040303C2 (de) 2000-08-17 2002-07-11 Volker Nissen Verfahren zum definierten Tiefenbohren von Sacklöchern (blind vias) in mehrlagigen Leiterplatten (Multilayer)
CN100483886C (zh) 2001-11-14 2009-04-29 Fci公司 用于电连接器的串扰减小
US6822874B1 (en) * 2002-11-12 2004-11-23 Wooshcom Corporation Modular high availability electronic product architecture with flexible I/O
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US6971896B2 (en) * 2004-01-08 2005-12-06 International Business Machines Corporaion Flex strips for high frequency connectors
JP3909769B2 (ja) * 2004-01-09 2007-04-25 日本航空電子工業株式会社 コネクタ
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Also Published As

Publication number Publication date
EP2290753B1 (de) 2012-12-05
CN102726125B (zh) 2016-07-20
US20120184115A1 (en) 2012-07-19
US8622751B2 (en) 2014-01-07
JP2013503418A (ja) 2013-01-31
CN102726125A (zh) 2012-10-10
CA2772312A1 (en) 2011-03-03
EP2290753A1 (de) 2011-03-02
JP5663773B2 (ja) 2015-02-04
WO2011023317A1 (de) 2011-03-03
KR20120060220A (ko) 2012-06-11
KR101691360B1 (ko) 2016-12-30
CA2772312C (en) 2016-09-27

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