JP2013503418A - プラグコネクタ及び多層回路基板 - Google Patents
プラグコネクタ及び多層回路基板 Download PDFInfo
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- 239000004020 conductor Substances 0.000 claims abstract description 79
- 230000005405 multipole Effects 0.000 claims description 18
- 238000005553 drilling Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 241001076195 Lampsilis ovata Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/727—Coupling devices presenting arrays of contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (13)
- 接触要素列(13)として配列された複数の接触要素(50a、50b〜50’a、50’b)を有する多層回路基板(51)に接触するための多極プラグコネクタであって、
接触要素列(13)として配設された前記接触要素(50a、50b〜50’a、50’b)の端子ピン(53a、53b〜53’a、53’b)は、それぞれ、等しい長さを有する多極プラグコネクタにおいて、
異なる回路基板レベル(71〜71’)において設けられた多層回路基板(51)の接触要素(50a、50b〜50’a、50’b)に接触するための接触要素(50a、50b〜50’a、50’b)の端子ピン(53a、53b〜53’a、53’b)は、接触要素列(13)から接触要素列(13)に段階的により短い長さを有するように終端していることを特徴とする多層回路基板(51)に接触するための多極プラグコネクタ。 - 接触要素列(13)として配列された接触要素(50a、50b〜50’a、50’b)は、接触要素(50a、50b〜50’a、50’b)のペアとして組み合わせられることを特徴とする請求項1に記載の多層回路基板(51)に接触するための多極プラグコネクタ。
- 接触要素(50a、50b〜50’a、50’b)のペアは、差動信号を伝導することを特徴とする請求項2に記載の多層回路基板(51)に接触するための多極プラグコネクタ。
- 接触要素(50a、50b〜50’a、50’b)のペアは、既定の特性インピーダンスを有するように実現されることを特徴とする請求項2に記載の多層回路基板(51)に接触するための多極プラグコネクタ。
- 多極プラグコネクタ(90)と共に組み立てるための多層回路基板であって、
接触要素列(13)として配列された多極プラグコネクタ(90)の接触要素(50a、50b〜50’a、50’b)の端子ピン(53a、53b〜53’a、53’b)に接触するべく列として配列された止まり孔(60a、60b〜60’a、60’b)を有し、且つ、異なるストリップ導体プレーン(71〜71’)において設けられたストリップ導体(52a、52b、72a、72b〜72’a、72’b)を有する多層回路基板において、
接触要素列(13)として配列された接触要素(50a、50b〜50’a、50’b)の端子ピン(53a、53b〜53’a、53’b)の意図的な接触のための止まり孔(60a、60b〜60’a、60’b)は、列から列に段階的に異なる深さを有し、且つ、多層回路基板(51)の異なるストリップ導体レベル(71〜71’)において終端していることを特徴とする多極プラグコネクタ(90)と共に組み立てるための多層回路基板。 - 止まり孔(60a、60b〜60’a、60’b)は、多層回路基板(51)のエッジにおいて最も深く、且つ、それぞれ、エッジの背後において段階的により浅くなる方式で終端していることを特徴とする請求項5に記載の多極プラグコネクタ(90)と共に組み立てるための多層回路基板。
- 列として配列された止まり孔(60a、60b〜60’a、60’b)は、互いに隣接して配列されると共に接触要素列(13)として互いに隣接して配列された接触要素(50a、50b〜50’a、50’b)のペアの端子ピン(53a、53b〜53’a、53’b)に接触するべく設けられた止まり孔(60a、60b〜60’a、60’b)のペアとして組み合わせられることを特徴とする請求項5又は6に記載の多極プラグコネクタ(90)と共に組み立てるための多層回路基板。
- 止まり孔(60a、60b〜60’a、60’b)のペアと関連付けられたストリップ導体(52a、52b、72a、72b〜72’a、72’b)は、既定の特性インピーダンスを有することを特徴とする請求項7に記載の多極プラグコネクタ(90)と共に組み立てるための多層回路基板。
- 多極プラグコネクタ(90)と多層回路基板(51)の組合せであって、
プラグコネクタ(90)は、接触要素列(13)として配列された複数の接触要素(50a、50b〜50’a、50’b)を有し、且つ、接触要素列(13)として配列された接触要素(50a、50b〜50’a、50’b)の端子ピン(53a、53b〜53’a、53’b)は、それぞれ、等しい長さを有し、且つ、多層回路基板(51)は、接触要素列(13)として配列された多極プラグコネクタ(90)の接触要素(50a、50b〜50’a、50’b)の端子ピン(53a、53b〜53’a、53’b)に接触するべく列として配列された止まり孔(60a、60b〜60’a、60’b)と、異なるストリップ導体レベル(71〜71’)において設けられたストリップ導体(52a、52b、72a、72b〜72’a、72’b)と、を有する組合せにおいて、
接触要素(50a、50b〜50’a、50’b)の端子ピン(53a、53b〜53’a、53’b)は、それぞれ、異なるストリップ導体レベル(71〜71’)において配列された多層回路基板(51)のストリップ導体(52a、52b、72a、72b〜72’a、72’b)に接触するべく接触要素列(13)から接触要素列(13)に段階的により短い長さを有するように終端しており、且つ、止まり孔(60a、60b〜60’a、60’b)は、接触要素列(13)として配列された接触要素(50a、50b〜50’a、50’b)の端子ピン(53a、53b〜53’a、53’b)の意図的な接触のために列から列に段階的に異なる深さを有し、且つ、多層回路基板(51)の異なるストリップ導体レベル(71〜71’)において終端していることを特徴とする多極プラグコネクタ(90)と多層回路基板(51)の組合せ。 - 端子ピン(53a、53b〜53’a、53’b)は、関連する止まり孔(60a、60b〜60’a、60’b)を少なくとも略完全な程度にまで充填することを特徴とする請求項9に記載の多極プラグコネクタ(90)と多層回路基板(51)の組合せ。
- 接触要素列(13)として配列された接触要素(50a、50b〜50’a、50’b)は、接触要素(50a、50b〜50’a、50’b)のペアとして組み合わせられることを特徴とする請求項9又は10に記載の多極プラグコネクタ(90)と多層回路基板(51)の組合せ。
- 接触要素(50a、50b〜50’a、50’b)のペアは、差動信号を伝導することを特徴とする請求項11に記載の多極プラグコネクタ(90)と多層回路基板(51)の組合せ。
- 接触要素(50a、50b〜50’a、50’b)のペアは、既定の特性インピーダンスを有するように実現されることを特徴とする請求項11又は12に記載の多極プラグコネクタ(90)と多層回路基板(51)の組合せ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09011143A EP2290753B1 (de) | 2009-08-31 | 2009-08-31 | Steckverbinder und Multilayerplatine |
EP09011143.6 | 2009-08-31 | ||
PCT/EP2010/005033 WO2011023317A1 (de) | 2009-08-31 | 2010-08-17 | Steckverbinder und multilayerplatine |
Publications (2)
Publication Number | Publication Date |
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JP2013503418A true JP2013503418A (ja) | 2013-01-31 |
JP5663773B2 JP5663773B2 (ja) | 2015-02-04 |
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Application Number | Title | Priority Date | Filing Date |
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JP2012525907A Active JP5663773B2 (ja) | 2009-08-31 | 2010-08-17 | プラグコネクタ及び多層回路基板 |
Country Status (8)
Country | Link |
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US (1) | US8622751B2 (ja) |
EP (1) | EP2290753B1 (ja) |
JP (1) | JP5663773B2 (ja) |
KR (1) | KR101691360B1 (ja) |
CN (1) | CN102726125B (ja) |
CA (1) | CA2772312C (ja) |
DK (1) | DK2290753T3 (ja) |
WO (1) | WO2011023317A1 (ja) |
Cited By (2)
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WO2017086077A1 (ja) * | 2015-11-17 | 2017-05-26 | 株式会社ジェイエイアイコーポレーション | コネクタ構造体 |
JP2017520896A (ja) * | 2014-07-14 | 2017-07-27 | エルニ プロダクション ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト | プラグコネクタ及び構成要素 |
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US10283885B2 (en) * | 2015-11-06 | 2019-05-07 | Foxconn Interconnect Technology Limited | Electrical connector assembly and system using the same |
CN106771831B (zh) * | 2017-01-09 | 2023-09-01 | 昆山艾伯格机器人科技有限公司 | 多种针高的连接器的自动检测机构 |
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DE102004050687B4 (de) * | 2004-10-18 | 2019-01-31 | Continental Automotive Gmbh | Kontaktierungsanordnung für eine flexible Leiterplatte und deren Verwendung |
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DE102007060429B4 (de) * | 2007-12-14 | 2022-02-10 | Vitesco Technologies GmbH | Elektronisches Modul, insbesondere Steuergerät für ein Kraftfahrzeug |
US7878854B2 (en) * | 2008-07-21 | 2011-02-01 | Tyco Electronics Corporation | Electrical connector having variable length mounting contacts |
EP2207244B1 (de) * | 2009-01-12 | 2014-01-15 | ERNI Electronics GmbH & Co. KG | Anordnung aus Steckverbinder und Multilayerplatine |
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2009
- 2009-08-31 EP EP09011143A patent/EP2290753B1/de active Active
- 2009-08-31 DK DK09011143.6T patent/DK2290753T3/da active
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2010
- 2010-08-17 CA CA2772312A patent/CA2772312C/en not_active Expired - Fee Related
- 2010-08-17 KR KR1020127007972A patent/KR101691360B1/ko active IP Right Grant
- 2010-08-17 CN CN201080045066.2A patent/CN102726125B/zh active Active
- 2010-08-17 JP JP2012525907A patent/JP5663773B2/ja active Active
- 2010-08-17 US US13/392,933 patent/US8622751B2/en active Active
- 2010-08-17 WO PCT/EP2010/005033 patent/WO2011023317A1/de active Application Filing
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2017520896A (ja) * | 2014-07-14 | 2017-07-27 | エルニ プロダクション ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト | プラグコネクタ及び構成要素 |
WO2017086077A1 (ja) * | 2015-11-17 | 2017-05-26 | 株式会社ジェイエイアイコーポレーション | コネクタ構造体 |
JP2019012586A (ja) * | 2015-11-17 | 2019-01-24 | 株式会社ジェイエイアイコーポレーション | コネクタ構造体 |
Also Published As
Publication number | Publication date |
---|---|
EP2290753B1 (de) | 2012-12-05 |
DK2290753T3 (da) | 2013-03-18 |
EP2290753A1 (de) | 2011-03-02 |
WO2011023317A1 (de) | 2011-03-03 |
KR101691360B1 (ko) | 2016-12-30 |
CN102726125A (zh) | 2012-10-10 |
KR20120060220A (ko) | 2012-06-11 |
US8622751B2 (en) | 2014-01-07 |
JP5663773B2 (ja) | 2015-02-04 |
CA2772312A1 (en) | 2011-03-03 |
CN102726125B (zh) | 2016-07-20 |
US20120184115A1 (en) | 2012-07-19 |
CA2772312C (en) | 2016-09-27 |
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