CN101340754B - 有机el显示装置及其制造方法 - Google Patents
有机el显示装置及其制造方法 Download PDFInfo
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- CN101340754B CN101340754B CN2008101357294A CN200810135729A CN101340754B CN 101340754 B CN101340754 B CN 101340754B CN 2008101357294 A CN2008101357294 A CN 2008101357294A CN 200810135729 A CN200810135729 A CN 200810135729A CN 101340754 B CN101340754 B CN 101340754B
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- electrode
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- organic electroluminescence
- organic layer
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000012044 organic layer Substances 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 239000010410 layer Substances 0.000 claims abstract description 37
- 239000004020 conductor Substances 0.000 claims abstract description 18
- 239000012212 insulator Substances 0.000 claims abstract description 10
- 239000012528 membrane Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 31
- 238000000926 separation method Methods 0.000 claims description 27
- 238000007740 vapor deposition Methods 0.000 claims description 12
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000005401 electroluminescence Methods 0.000 claims 14
- 238000005192 partition Methods 0.000 abstract description 3
- 238000002955 isolation Methods 0.000 abstract 2
- 210000004379 membrane Anatomy 0.000 description 32
- 239000000463 material Substances 0.000 description 26
- 238000000059 patterning Methods 0.000 description 19
- 239000011521 glass Substances 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 8
- 239000004411 aluminium Substances 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 230000005525 hole transport Effects 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000284 extract Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- DHDHJYNTEFLIHY-UHFFFAOYSA-N 4,7-diphenyl-1,10-phenanthroline Chemical compound C1=CC=CC=C1C1=CC=NC2=C1C=CC1=C(C=3C=CC=CC=3)C=CN=C21 DHDHJYNTEFLIHY-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- PQMOXTJVIYEOQL-UHFFFAOYSA-N Cumarin Natural products CC(C)=CCC1=C(O)C(C(=O)C(C)CC)=C(O)C2=C1OC(=O)C=C2CCC PQMOXTJVIYEOQL-UHFFFAOYSA-N 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- FSOGIJPGPZWNGO-UHFFFAOYSA-N Meomammein Natural products CCC(C)C(=O)C1=C(O)C(CC=C(C)C)=C(O)C2=C1OC(=O)C=C2CCC FSOGIJPGPZWNGO-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- -1 expectation used Mo Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/5328—Conductive materials containing conductive organic materials or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/81—Electrodes
- H10K30/82—Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-175304 | 2007-07-03 | ||
| JP2007175304 | 2007-07-03 | ||
| JP2007175304 | 2007-07-03 | ||
| JP2008140297A JP5008606B2 (ja) | 2007-07-03 | 2008-05-29 | 有機el表示装置及びその製造方法 |
| JP2008140297 | 2008-05-29 | ||
| JP2008-140297 | 2008-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101340754A CN101340754A (zh) | 2009-01-07 |
| CN101340754B true CN101340754B (zh) | 2010-09-08 |
Family
ID=40214679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101357294A Expired - Fee Related CN101340754B (zh) | 2007-07-03 | 2008-07-03 | 有机el显示装置及其制造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5008606B2 (enExample) |
| KR (1) | KR100970607B1 (enExample) |
| CN (1) | CN101340754B (enExample) |
Families Citing this family (89)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102668706B (zh) | 2009-11-17 | 2015-03-25 | 联合创新技术有限公司 | 有机el显示器 |
| KR101074813B1 (ko) | 2010-01-07 | 2011-10-19 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| WO2012108366A1 (en) * | 2011-02-10 | 2012-08-16 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and manufacturing method thereof, lighting device, and display device |
| KR102004305B1 (ko) * | 2011-02-11 | 2019-07-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 그 제작 방법, 그리고 조명 장치 및 표시 장치 |
| WO2012115466A2 (ko) * | 2011-02-25 | 2012-08-30 | 주성엔지니어링(주) | 발광 장치 |
| TWI562423B (en) | 2011-03-02 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Light-emitting device and lighting device |
| KR101933952B1 (ko) * | 2011-07-01 | 2018-12-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치, 전자 기기 및 조명 장치 |
| US8963137B2 (en) | 2011-09-02 | 2015-02-24 | Lg Display Co., Ltd. | Organic light-emitting display device and method of fabricating the same |
| US20130056784A1 (en) * | 2011-09-02 | 2013-03-07 | Lg Display Co., Ltd. | Organic Light-Emitting Display Device and Method of Fabricating the Same |
| JP6057143B2 (ja) * | 2012-03-19 | 2017-01-11 | 株式会社Joled | 有機エレクトロルミネッセンス素子 |
| WO2014038094A1 (ja) * | 2012-09-10 | 2014-03-13 | パイオニア株式会社 | 発光装置およびその製造方法 |
| KR101548304B1 (ko) * | 2013-04-23 | 2015-08-28 | 엘지디스플레이 주식회사 | 유기 전계 발광 표시장치 및 그 제조방법 |
| KR102131248B1 (ko) * | 2013-07-04 | 2020-07-08 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| US9478591B2 (en) * | 2013-12-23 | 2016-10-25 | Lg Display Co., Ltd. | Organic light emitting display device and repair method thereof |
| KR102278160B1 (ko) * | 2013-12-23 | 2021-07-19 | 엘지디스플레이 주식회사 | 유기전계발광표시장치 및 그 리페어 방법 |
| JP6294071B2 (ja) * | 2013-12-27 | 2018-03-14 | パイオニアOledライティングデバイス株式会社 | 発光装置 |
| JP5937124B2 (ja) * | 2014-03-10 | 2016-06-22 | ユニファイド イノヴェイティヴ テクノロジー, エルエルシー | 有機elディスプレイ |
| JP6371094B2 (ja) | 2014-03-31 | 2018-08-08 | 株式会社ジャパンディスプレイ | 有機el表示装置 |
| US9806279B2 (en) * | 2014-07-08 | 2017-10-31 | Lg Display Co., Ltd. | Organic light emitting display device comprising auxiliary electrode having void therein and manufacturing method thereof |
| KR102584253B1 (ko) * | 2014-12-12 | 2023-10-05 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
| KR102399435B1 (ko) * | 2014-12-26 | 2022-05-17 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
| JP2015156381A (ja) * | 2015-03-31 | 2015-08-27 | ユニファイド イノヴェイティヴ テクノロジー, エルエルシー | 有機elディスプレイ |
| CN104867962B (zh) | 2015-05-06 | 2019-04-05 | 京东方科技集团股份有限公司 | 一种oled阵列基板及其制作方法、oled显示装置 |
| KR102465826B1 (ko) * | 2015-10-29 | 2022-11-09 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| JP6736385B2 (ja) | 2016-07-01 | 2020-08-05 | 株式会社ジャパンディスプレイ | 表示装置 |
| KR102636749B1 (ko) | 2016-11-28 | 2024-02-14 | 엘지디스플레이 주식회사 | 유기발광소자를 이용한 조명장치 및 그 제조방법 |
| KR102397900B1 (ko) | 2016-12-08 | 2022-05-13 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR102663231B1 (ko) * | 2016-12-30 | 2024-05-02 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
| KR102604310B1 (ko) | 2016-12-30 | 2023-11-20 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
| CN107565048B (zh) * | 2017-08-24 | 2020-05-26 | 京东方科技集团股份有限公司 | 一种阵列基板的制备方法、阵列基板和显示装置 |
| KR102430808B1 (ko) * | 2017-09-12 | 2022-08-09 | 엘지디스플레이 주식회사 | 발광 표시 패널 |
| KR102474205B1 (ko) * | 2017-12-26 | 2022-12-06 | 삼성디스플레이 주식회사 | 디스플레이 장치 및 그 제조방법 |
| KR102439307B1 (ko) | 2018-01-29 | 2022-09-02 | 삼성디스플레이 주식회사 | 유기발광표시장치 및 그 제조방법 |
| JP2019160393A (ja) * | 2018-03-07 | 2019-09-19 | 株式会社ジャパンディスプレイ | 有機el表示装置 |
| CN108461649B (zh) * | 2018-03-22 | 2020-02-07 | 京东方科技集团股份有限公司 | 一种显示基板及其制备方法、显示装置 |
| KR102480092B1 (ko) * | 2018-04-30 | 2022-12-23 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| CN109802052B (zh) * | 2019-01-25 | 2021-05-07 | 上海天马微电子有限公司 | 一种有机发光显示面板及其制作方法 |
| KR102654917B1 (ko) * | 2019-04-15 | 2024-04-05 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
| KR20210016145A (ko) | 2019-07-31 | 2021-02-15 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
| CN111463250A (zh) | 2020-04-14 | 2020-07-28 | 合肥京东方卓印科技有限公司 | 显示基板及其制备方法、显示面板、显示装置 |
| CN111863918B (zh) * | 2020-07-29 | 2023-05-02 | 京东方科技集团股份有限公司 | 显示背板及其制作方法、显示面板和显示装置 |
| US11610952B2 (en) | 2020-09-04 | 2023-03-21 | Applied Materials, Inc. | Methods of fabricating OLED panel with inorganic pixel encapsulating barrier |
| JP7520697B2 (ja) * | 2020-11-17 | 2024-07-23 | 株式会社ジャパンディスプレイ | 表示装置 |
| JP7570896B2 (ja) | 2020-11-17 | 2024-10-22 | 株式会社ジャパンディスプレイ | 表示装置 |
| JP7555798B2 (ja) | 2020-11-17 | 2024-09-25 | 株式会社ジャパンディスプレイ | 表示装置 |
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| JPWO2022176395A1 (enExample) * | 2021-02-17 | 2022-08-25 | ||
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| CN115295581A (zh) | 2022-06-07 | 2022-11-04 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
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| KR20250100106A (ko) * | 2023-12-26 | 2025-07-03 | 엘지디스플레이 주식회사 | 표시장치 |
| CN118139470B (zh) * | 2024-02-21 | 2024-12-17 | 惠科股份有限公司 | 显示面板及其制备方法、显示装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1816237A (zh) * | 2005-02-03 | 2006-08-09 | 悠景科技股份有限公司 | 有机电激发光平面显示器的电极结构及其制作方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3813217B2 (ja) * | 1995-03-13 | 2006-08-23 | パイオニア株式会社 | 有機エレクトロルミネッセンスディスプレイパネルの製造方法 |
| JP3814102B2 (ja) * | 1999-05-24 | 2006-08-23 | 東北パイオニア株式会社 | 有機elディスプレイパネルおよびその製造方法 |
| JP4434411B2 (ja) * | 2000-02-16 | 2010-03-17 | 出光興産株式会社 | アクティブ駆動型有機el発光装置およびその製造方法 |
| US6626721B1 (en) * | 2000-09-22 | 2003-09-30 | Eastman Kodak Company | Organic electroluminescent device with supplemental cathode bus conductor |
| JP2002318553A (ja) * | 2001-04-20 | 2002-10-31 | Toshiba Corp | 自己発光型表示装置 |
| JP4664604B2 (ja) * | 2004-02-18 | 2011-04-06 | Tdk株式会社 | 画像表示装置 |
| JP4121514B2 (ja) * | 2004-07-22 | 2008-07-23 | シャープ株式会社 | 有機発光素子、及び、それを備えた表示装置 |
| KR100599469B1 (ko) * | 2004-10-05 | 2006-07-12 | 주식회사 대우일렉트로닉스 | 유기 el 소자 및 그 제조 방법 |
| KR100683766B1 (ko) * | 2005-03-30 | 2007-02-15 | 삼성에스디아이 주식회사 | 평판표시장치 및 그의 제조방법 |
| KR100686120B1 (ko) * | 2005-05-17 | 2007-02-26 | 엘지전자 주식회사 | 유기 el 소자의 제조방법 |
| JP4736757B2 (ja) | 2005-12-01 | 2011-07-27 | セイコーエプソン株式会社 | 発光装置および電子機器 |
| JP2008084541A (ja) * | 2006-09-25 | 2008-04-10 | Fujifilm Corp | 有機el表示装置及びその製造方法 |
| JP2008135325A (ja) * | 2006-11-29 | 2008-06-12 | Hitachi Displays Ltd | 有機el表示装置とその製造方法 |
-
2008
- 2008-05-29 JP JP2008140297A patent/JP5008606B2/ja not_active Expired - Fee Related
- 2008-07-02 KR KR1020080063717A patent/KR100970607B1/ko not_active Expired - Fee Related
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1816237A (zh) * | 2005-02-03 | 2006-08-09 | 悠景科技股份有限公司 | 有机电激发光平面显示器的电极结构及其制作方法 |
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| CN101340754A (zh) | 2009-01-07 |
| JP2009032673A (ja) | 2009-02-12 |
| KR100970607B1 (ko) | 2010-07-16 |
| JP5008606B2 (ja) | 2012-08-22 |
| KR20090004672A (ko) | 2009-01-12 |
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