CN101131927A - 增强等离子体蚀刻性能的方法 - Google Patents
增强等离子体蚀刻性能的方法 Download PDFInfo
- Publication number
- CN101131927A CN101131927A CNA2007101417360A CN200710141736A CN101131927A CN 101131927 A CN101131927 A CN 101131927A CN A2007101417360 A CNA2007101417360 A CN A2007101417360A CN 200710141736 A CN200710141736 A CN 200710141736A CN 101131927 A CN101131927 A CN 101131927A
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- Prior art keywords
- etching
- gas
- feature
- mask
- protective finish
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Links
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- 239000002245 particle Substances 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/508,725 US7977390B2 (en) | 2002-10-11 | 2006-08-22 | Method for plasma etching performance enhancement |
US11/508725 | 2006-08-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101131927A true CN101131927A (zh) | 2008-02-27 |
Family
ID=39129128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2007101417360A Pending CN101131927A (zh) | 2006-08-22 | 2007-08-21 | 增强等离子体蚀刻性能的方法 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5085997B2 (ja) |
KR (1) | KR101468213B1 (ja) |
CN (1) | CN101131927A (ja) |
MY (1) | MY148830A (ja) |
SG (1) | SG140538A1 (ja) |
TW (1) | TWI453814B (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102792428A (zh) * | 2010-03-31 | 2012-11-21 | 朗姆研究公司 | 用于硅蚀刻的无机快速交变处理 |
CN104616956A (zh) * | 2013-11-05 | 2015-05-13 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 等离子体刻蚀设备及方法 |
CN105210178A (zh) * | 2013-05-15 | 2015-12-30 | 东京毅力科创株式会社 | 等离子体蚀刻方法和等离子体蚀刻装置 |
CN105336665A (zh) * | 2014-06-19 | 2016-02-17 | 中芯国际集成电路制造(上海)有限公司 | 基于超低k电介质的互连结构的制造方法及制造的产品 |
CN106856163A (zh) * | 2016-11-22 | 2017-06-16 | 上海华力微电子有限公司 | 一种高深宽比图形结构的形成方法 |
CN107768233A (zh) * | 2016-08-23 | 2018-03-06 | 朗姆研究公司 | 用于半导体处理的硅基沉积 |
CN111801775A (zh) * | 2019-02-04 | 2020-10-20 | 株式会社日立高新技术 | 等离子处理方法以及等离子处理装置 |
CN114137803A (zh) * | 2016-12-02 | 2022-03-04 | Asml荷兰有限公司 | 改变蚀刻参数的方法 |
CN115513051A (zh) * | 2022-11-04 | 2022-12-23 | 合肥晶合集成电路股份有限公司 | 硬掩模层返工方法及dmos形成方法 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5662079B2 (ja) * | 2010-02-24 | 2015-01-28 | 東京エレクトロン株式会社 | エッチング処理方法 |
US9373521B2 (en) | 2010-02-24 | 2016-06-21 | Tokyo Electron Limited | Etching processing method |
JP6001940B2 (ja) * | 2012-07-11 | 2016-10-05 | 東京エレクトロン株式会社 | パターン形成方法及び基板処理システム |
US20140051256A1 (en) * | 2012-08-15 | 2014-02-20 | Lam Research Corporation | Etch with mixed mode pulsing |
JP6331452B2 (ja) * | 2014-02-19 | 2018-05-30 | 愛知製鋼株式会社 | 有機膜のエッチング方法 |
JP6549765B2 (ja) | 2014-06-16 | 2019-07-24 | 東京エレクトロン株式会社 | 処理方法 |
JP2017098478A (ja) | 2015-11-27 | 2017-06-01 | 東京エレクトロン株式会社 | エッチング方法 |
JP6584339B2 (ja) * | 2016-02-10 | 2019-10-02 | Sppテクノロジーズ株式会社 | 半導体素子の製造方法 |
KR102362462B1 (ko) | 2016-03-29 | 2022-02-14 | 도쿄엘렉트론가부시키가이샤 | 피처리체를 처리하는 방법 |
JP6784530B2 (ja) * | 2016-03-29 | 2020-11-11 | 東京エレクトロン株式会社 | 被処理体を処理する方法 |
JP6770848B2 (ja) | 2016-03-29 | 2020-10-21 | 東京エレクトロン株式会社 | 被処理体を処理する方法 |
KR102362282B1 (ko) | 2016-03-29 | 2022-02-11 | 도쿄엘렉트론가부시키가이샤 | 피처리체를 처리하는 방법 |
JP6415636B2 (ja) * | 2017-05-25 | 2018-10-31 | 東京エレクトロン株式会社 | プラズマエッチング方法及びプラズマエッチング装置 |
JP7037384B2 (ja) * | 2018-02-19 | 2022-03-16 | キオクシア株式会社 | 半導体装置の製造方法 |
JP2020064924A (ja) * | 2018-10-16 | 2020-04-23 | 東京エレクトロン株式会社 | 窒化膜の成膜方法および半導体装置の製造方法 |
JP7174634B2 (ja) * | 2019-01-18 | 2022-11-17 | 東京エレクトロン株式会社 | 膜をエッチングする方法 |
JP7235864B2 (ja) | 2019-02-11 | 2023-03-08 | 長江存儲科技有限責任公司 | 保護層のin-situ形成を伴う新規のエッチング処理 |
JP7422557B2 (ja) * | 2019-02-28 | 2024-01-26 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
JP7390199B2 (ja) | 2020-01-29 | 2023-12-01 | 東京エレクトロン株式会社 | エッチング方法、基板処理装置、及び基板処理システム |
JP2022150973A (ja) | 2021-03-26 | 2022-10-07 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
JPWO2023166613A1 (ja) * | 2022-03-02 | 2023-09-07 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4241045C1 (de) * | 1992-12-05 | 1994-05-26 | Bosch Gmbh Robert | Verfahren zum anisotropen Ätzen von Silicium |
US5545289A (en) * | 1994-02-03 | 1996-08-13 | Applied Materials, Inc. | Passivating, stripping and corrosion inhibition of semiconductor substrates |
JPH08195380A (ja) * | 1995-01-13 | 1996-07-30 | Sony Corp | コンタクトホールの形成方法 |
US7169695B2 (en) * | 2002-10-11 | 2007-01-30 | Lam Research Corporation | Method for forming a dual damascene structure |
US7169701B2 (en) * | 2004-06-30 | 2007-01-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Dual damascene trench formation to avoid low-K dielectric damage |
TWI255502B (en) * | 2005-01-19 | 2006-05-21 | Promos Technologies Inc | Method for preparing structure with high aspect ratio |
-
2007
- 2007-08-07 MY MYPI20071310A patent/MY148830A/en unknown
- 2007-08-07 SG SG200705771-4A patent/SG140538A1/en unknown
- 2007-08-08 TW TW096129259A patent/TWI453814B/zh active
- 2007-08-17 KR KR1020070082844A patent/KR101468213B1/ko not_active IP Right Cessation
- 2007-08-21 CN CNA2007101417360A patent/CN101131927A/zh active Pending
- 2007-08-21 JP JP2007214211A patent/JP5085997B2/ja active Active
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102792428B (zh) * | 2010-03-31 | 2015-08-05 | 朗姆研究公司 | 用于硅蚀刻的无机快速交变处理 |
CN102792428A (zh) * | 2010-03-31 | 2012-11-21 | 朗姆研究公司 | 用于硅蚀刻的无机快速交变处理 |
CN110729187A (zh) * | 2013-05-15 | 2020-01-24 | 东京毅力科创株式会社 | 等离子体蚀刻方法和等离子体蚀刻装置 |
CN105210178A (zh) * | 2013-05-15 | 2015-12-30 | 东京毅力科创株式会社 | 等离子体蚀刻方法和等离子体蚀刻装置 |
WO2015067125A1 (zh) * | 2013-11-05 | 2015-05-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 等离子体刻蚀设备及方法 |
CN104616956A (zh) * | 2013-11-05 | 2015-05-13 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 等离子体刻蚀设备及方法 |
CN105336665A (zh) * | 2014-06-19 | 2016-02-17 | 中芯国际集成电路制造(上海)有限公司 | 基于超低k电介质的互连结构的制造方法及制造的产品 |
CN105336665B (zh) * | 2014-06-19 | 2019-01-29 | 中芯国际集成电路制造(上海)有限公司 | 基于超低k电介质的互连结构的制造方法及制造的产品 |
CN107768233A (zh) * | 2016-08-23 | 2018-03-06 | 朗姆研究公司 | 用于半导体处理的硅基沉积 |
CN106856163A (zh) * | 2016-11-22 | 2017-06-16 | 上海华力微电子有限公司 | 一种高深宽比图形结构的形成方法 |
CN114137803A (zh) * | 2016-12-02 | 2022-03-04 | Asml荷兰有限公司 | 改变蚀刻参数的方法 |
CN111801775A (zh) * | 2019-02-04 | 2020-10-20 | 株式会社日立高新技术 | 等离子处理方法以及等离子处理装置 |
CN111801775B (zh) * | 2019-02-04 | 2024-03-22 | 株式会社日立高新技术 | 等离子处理方法以及等离子处理装置 |
CN115513051A (zh) * | 2022-11-04 | 2022-12-23 | 合肥晶合集成电路股份有限公司 | 硬掩模层返工方法及dmos形成方法 |
CN115513051B (zh) * | 2022-11-04 | 2023-02-10 | 合肥晶合集成电路股份有限公司 | 硬掩模层返工方法及dmos形成方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101468213B1 (ko) | 2014-12-03 |
JP2008060566A (ja) | 2008-03-13 |
TWI453814B (zh) | 2014-09-21 |
KR20080018110A (ko) | 2008-02-27 |
MY148830A (en) | 2013-06-14 |
TW200818313A (en) | 2008-04-16 |
JP5085997B2 (ja) | 2012-11-28 |
SG140538A1 (en) | 2008-03-28 |
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