CN101131927A - 增强等离子体蚀刻性能的方法 - Google Patents

增强等离子体蚀刻性能的方法 Download PDF

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Publication number
CN101131927A
CN101131927A CNA2007101417360A CN200710141736A CN101131927A CN 101131927 A CN101131927 A CN 101131927A CN A2007101417360 A CNA2007101417360 A CN A2007101417360A CN 200710141736 A CN200710141736 A CN 200710141736A CN 101131927 A CN101131927 A CN 101131927A
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CN
China
Prior art keywords
etching
gas
feature
mask
protective finish
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CNA2007101417360A
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English (en)
Chinese (zh)
Inventor
B·纪
E·A·埃德尔伯格
T·亚纳加瓦
Z·黄
L·李
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Lam Research Corp
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Lam Research Corp
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Filing date
Publication date
Priority claimed from US11/508,725 external-priority patent/US7977390B2/en
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN101131927A publication Critical patent/CN101131927A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31144—Etching the insulating layers by chemical or physical means using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
CNA2007101417360A 2006-08-22 2007-08-21 增强等离子体蚀刻性能的方法 Pending CN101131927A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/508725 2006-08-22
US11/508,725 US7977390B2 (en) 2002-10-11 2006-08-22 Method for plasma etching performance enhancement

Publications (1)

Publication Number Publication Date
CN101131927A true CN101131927A (zh) 2008-02-27

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ID=39129128

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101417360A Pending CN101131927A (zh) 2006-08-22 2007-08-21 增强等离子体蚀刻性能的方法

Country Status (6)

Country Link
JP (1) JP5085997B2 (enExample)
KR (1) KR101468213B1 (enExample)
CN (1) CN101131927A (enExample)
MY (1) MY148830A (enExample)
SG (1) SG140538A1 (enExample)
TW (1) TWI453814B (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102792428A (zh) * 2010-03-31 2012-11-21 朗姆研究公司 用于硅蚀刻的无机快速交变处理
CN104616956A (zh) * 2013-11-05 2015-05-13 北京北方微电子基地设备工艺研究中心有限责任公司 等离子体刻蚀设备及方法
CN105210178A (zh) * 2013-05-15 2015-12-30 东京毅力科创株式会社 等离子体蚀刻方法和等离子体蚀刻装置
CN105336665A (zh) * 2014-06-19 2016-02-17 中芯国际集成电路制造(上海)有限公司 基于超低k电介质的互连结构的制造方法及制造的产品
CN106856163A (zh) * 2016-11-22 2017-06-16 上海华力微电子有限公司 一种高深宽比图形结构的形成方法
CN107768233A (zh) * 2016-08-23 2018-03-06 朗姆研究公司 用于半导体处理的硅基沉积
CN111801775A (zh) * 2019-02-04 2020-10-20 株式会社日立高新技术 等离子处理方法以及等离子处理装置
CN114137803A (zh) * 2016-12-02 2022-03-04 Asml荷兰有限公司 改变蚀刻参数的方法
CN115513051A (zh) * 2022-11-04 2022-12-23 合肥晶合集成电路股份有限公司 硬掩模层返工方法及dmos形成方法

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US9373521B2 (en) 2010-02-24 2016-06-21 Tokyo Electron Limited Etching processing method
JP5662079B2 (ja) * 2010-02-24 2015-01-28 東京エレクトロン株式会社 エッチング処理方法
JP6001940B2 (ja) * 2012-07-11 2016-10-05 東京エレクトロン株式会社 パターン形成方法及び基板処理システム
US20140051256A1 (en) * 2012-08-15 2014-02-20 Lam Research Corporation Etch with mixed mode pulsing
JP6331452B2 (ja) * 2014-02-19 2018-05-30 愛知製鋼株式会社 有機膜のエッチング方法
JP6549765B2 (ja) * 2014-06-16 2019-07-24 東京エレクトロン株式会社 処理方法
JP6373150B2 (ja) 2014-06-16 2018-08-15 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP2017098478A (ja) 2015-11-27 2017-06-01 東京エレクトロン株式会社 エッチング方法
US20170178899A1 (en) * 2015-12-18 2017-06-22 Lam Research Corporation Directional deposition on patterned structures
JP6584339B2 (ja) * 2016-02-10 2019-10-02 Ｓｐｐテクノロジーズ株式会社 半導体素子の製造方法
WO2017170405A1 (ja) 2016-03-29 2017-10-05 東京エレクトロン株式会社 被処理体を処理する方法
JP6770848B2 (ja) 2016-03-29 2020-10-21 東京エレクトロン株式会社 被処理体を処理する方法
JP6784530B2 (ja) 2016-03-29 2020-11-11 東京エレクトロン株式会社 被処理体を処理する方法
KR102549308B1 (ko) 2016-03-29 2023-06-30 도쿄엘렉트론가부시키가이샤 에칭 장치
JP6415636B2 (ja) * 2017-05-25 2018-10-31 東京エレクトロン株式会社 プラズマエッチング方法及びプラズマエッチング装置
JP7037384B2 (ja) * 2018-02-19 2022-03-16 キオクシア株式会社 半導体装置の製造方法
JP2020064924A (ja) * 2018-10-16 2020-04-23 東京エレクトロン株式会社 窒化膜の成膜方法および半導体装置の製造方法
US11640909B2 (en) * 2018-12-14 2023-05-02 Applied Materials, Inc. Techniques and apparatus for unidirectional hole elongation using angled ion beams
JP7174634B2 (ja) * 2019-01-18 2022-11-17 東京エレクトロン株式会社 膜をエッチングする方法
US10886136B2 (en) * 2019-01-31 2021-01-05 Tokyo Electron Limited Method for processing substrates
EP3853904B1 (en) * 2019-02-11 2024-04-03 Yangtze Memory Technologies Co., Ltd. Novel etching process with in-situ formation of protective layer
WO2020176582A1 (en) 2019-02-27 2020-09-03 Lam Research Corporation Semiconductor mask reshaping using a sacrificial layer
JP7422557B2 (ja) * 2019-02-28 2024-01-26 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP7339032B2 (ja) 2019-06-28 2023-09-05 東京エレクトロン株式会社 基板処理方法および基板処理装置
US11043394B1 (en) 2019-12-18 2021-06-22 Applied Materials, Inc. Techniques and apparatus for selective shaping of mask features using angled beams
JP7390199B2 (ja) * 2020-01-29 2023-12-01 東京エレクトロン株式会社 エッチング方法、基板処理装置、及び基板処理システム
US12261044B2 (en) 2020-02-28 2025-03-25 Lam Research Corporation Multi-layer hardmask for defect reduction in EUV patterning
JP7577012B2 (ja) 2021-03-26 2024-11-01 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP7320554B2 (ja) * 2021-04-27 2023-08-03 株式会社アルバック エッチング方法
JP7498313B2 (ja) * 2022-03-02 2024-06-11 株式会社日立ハイテク プラズマ処理方法
TW202431406A (zh) 2022-09-22 2024-08-01 日商東京威力科創股份有限公司 基板處理方法及基板處理裝置

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DE4241045C1 (de) * 1992-12-05 1994-05-26 Bosch Gmbh Robert Verfahren zum anisotropen Ätzen von Silicium
US5545289A (en) * 1994-02-03 1996-08-13 Applied Materials, Inc. Passivating, stripping and corrosion inhibition of semiconductor substrates
JPH08195380A (ja) * 1995-01-13 1996-07-30 Sony Corp コンタクトホールの形成方法
US7169695B2 (en) * 2002-10-11 2007-01-30 Lam Research Corporation Method for forming a dual damascene structure
US7169701B2 (en) * 2004-06-30 2007-01-30 Taiwan Semiconductor Manufacturing Co., Ltd. Dual damascene trench formation to avoid low-K dielectric damage
TWI255502B (en) * 2005-01-19 2006-05-21 Promos Technologies Inc Method for preparing structure with high aspect ratio

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102792428A (zh) * 2010-03-31 2012-11-21 朗姆研究公司 用于硅蚀刻的无机快速交变处理
CN102792428B (zh) * 2010-03-31 2015-08-05 朗姆研究公司 用于硅蚀刻的无机快速交变处理
CN105210178A (zh) * 2013-05-15 2015-12-30 东京毅力科创株式会社 等离子体蚀刻方法和等离子体蚀刻装置
CN110729187A (zh) * 2013-05-15 2020-01-24 东京毅力科创株式会社 等离子体蚀刻方法和等离子体蚀刻装置
CN104616956A (zh) * 2013-11-05 2015-05-13 北京北方微电子基地设备工艺研究中心有限责任公司 等离子体刻蚀设备及方法
WO2015067125A1 (zh) * 2013-11-05 2015-05-14 北京北方微电子基地设备工艺研究中心有限责任公司 等离子体刻蚀设备及方法
CN105336665B (zh) * 2014-06-19 2019-01-29 中芯国际集成电路制造(上海)有限公司 基于超低k电介质的互连结构的制造方法及制造的产品
CN105336665A (zh) * 2014-06-19 2016-02-17 中芯国际集成电路制造(上海)有限公司 基于超低k电介质的互连结构的制造方法及制造的产品
CN107768233A (zh) * 2016-08-23 2018-03-06 朗姆研究公司 用于半导体处理的硅基沉积
CN106856163A (zh) * 2016-11-22 2017-06-16 上海华力微电子有限公司 一种高深宽比图形结构的形成方法
CN114137803A (zh) * 2016-12-02 2022-03-04 Asml荷兰有限公司 改变蚀刻参数的方法
CN114137803B (zh) * 2016-12-02 2024-12-17 Asml荷兰有限公司 改变蚀刻参数的方法
CN111801775A (zh) * 2019-02-04 2020-10-20 株式会社日立高新技术 等离子处理方法以及等离子处理装置
CN111801775B (zh) * 2019-02-04 2024-03-22 株式会社日立高新技术 等离子处理方法以及等离子处理装置
CN115513051A (zh) * 2022-11-04 2022-12-23 合肥晶合集成电路股份有限公司 硬掩模层返工方法及dmos形成方法
CN115513051B (zh) * 2022-11-04 2023-02-10 合肥晶合集成电路股份有限公司 硬掩模层返工方法及dmos形成方法

Also Published As

Publication number Publication date
TW200818313A (en) 2008-04-16
JP2008060566A (ja) 2008-03-13
TWI453814B (zh) 2014-09-21
KR20080018110A (ko) 2008-02-27
SG140538A1 (en) 2008-03-28
MY148830A (en) 2013-06-14
JP5085997B2 (ja) 2012-11-28
KR101468213B1 (ko) 2014-12-03

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Application publication date: 20080227