CN101111575B - 聚硅氮烷处理溶剂及用该溶剂处理聚硅氮烷的方法 - Google Patents

聚硅氮烷处理溶剂及用该溶剂处理聚硅氮烷的方法 Download PDF

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Publication number
CN101111575B
CN101111575B CN2006800035343A CN200680003534A CN101111575B CN 101111575 B CN101111575 B CN 101111575B CN 2006800035343 A CN2006800035343 A CN 2006800035343A CN 200680003534 A CN200680003534 A CN 200680003534A CN 101111575 B CN101111575 B CN 101111575B
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polysilazane
solvent
treating
film
substrate
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Chinese (zh)
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CN101111575A (zh
Inventor
松尾英树
一山昌章
石川智规
青木宏幸
布鲁斯·凯克
约瑟夫·奥伯兰德
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Merck Patent GmbH
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AZ Electronic Materials Japan Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/54—Cleaning of wafer edges
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/16—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/24—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6687—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and nitrogen
    • H10P14/6689—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and nitrogen the compound being a silazane

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Paints Or Removers (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Formation Of Insulating Films (AREA)
CN2006800035343A 2005-02-02 2006-02-01 聚硅氮烷处理溶剂及用该溶剂处理聚硅氮烷的方法 Expired - Lifetime CN101111575B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP026818/2005 2005-02-02
JP2005026818A JP4578993B2 (ja) 2005-02-02 2005-02-02 ポリシラザン処理溶剤およびこの溶剤を用いるポリシラザンの処理方法
PCT/JP2006/301662 WO2006082848A1 (ja) 2005-02-02 2006-02-01 ポリシラザン処理溶剤およびこの溶剤を用いるポリシラザンの処理方法

Publications (2)

Publication Number Publication Date
CN101111575A CN101111575A (zh) 2008-01-23
CN101111575B true CN101111575B (zh) 2010-06-23

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Country Status (6)

Country Link
US (1) US20080102211A1 (https=)
JP (1) JP4578993B2 (https=)
KR (1) KR101152694B1 (https=)
CN (1) CN101111575B (https=)
TW (1) TWI466929B (https=)
WO (1) WO2006082848A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
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TWI619849B (zh) * 2014-12-16 2018-04-01 三星Sdi 股份有限公司 二氧化矽薄膜用的沖洗溶液及其生產方法
US10020185B2 (en) 2014-10-07 2018-07-10 Samsung Sdi Co., Ltd. Composition for forming silica layer, silica layer, and electronic device
US10093830B2 (en) 2014-12-19 2018-10-09 Samsung Sdi Co., Ltd. Composition for forming a silica based layer, method for manufacturing silica based layer, and electronic device including the silica based layer
US10106687B2 (en) 2015-07-31 2018-10-23 Samsung Sdi Co., Ltd. Composition for forming silica layer, method for manufacturing silica layer and silica layer
US10427944B2 (en) 2014-12-19 2019-10-01 Samsung Sdi Co., Ltd. Composition for forming a silica based layer, silica based layer, and electronic device

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10020185B2 (en) 2014-10-07 2018-07-10 Samsung Sdi Co., Ltd. Composition for forming silica layer, silica layer, and electronic device
TWI619849B (zh) * 2014-12-16 2018-04-01 三星Sdi 股份有限公司 二氧化矽薄膜用的沖洗溶液及其生產方法
US10093830B2 (en) 2014-12-19 2018-10-09 Samsung Sdi Co., Ltd. Composition for forming a silica based layer, method for manufacturing silica based layer, and electronic device including the silica based layer
US10427944B2 (en) 2014-12-19 2019-10-01 Samsung Sdi Co., Ltd. Composition for forming a silica based layer, silica based layer, and electronic device
US10106687B2 (en) 2015-07-31 2018-10-23 Samsung Sdi Co., Ltd. Composition for forming silica layer, method for manufacturing silica layer and silica layer

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Publication number Publication date
WO2006082848A1 (ja) 2006-08-10
US20080102211A1 (en) 2008-05-01
KR101152694B1 (ko) 2012-06-15
TW200632006A (en) 2006-09-16
JP4578993B2 (ja) 2010-11-10
JP2006216704A (ja) 2006-08-17
KR20070108214A (ko) 2007-11-08
TWI466929B (zh) 2015-01-01
CN101111575A (zh) 2008-01-23

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