JP4578993B2 - ポリシラザン処理溶剤およびこの溶剤を用いるポリシラザンの処理方法 - Google Patents

ポリシラザン処理溶剤およびこの溶剤を用いるポリシラザンの処理方法 Download PDF

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Publication number
JP4578993B2
JP4578993B2 JP2005026818A JP2005026818A JP4578993B2 JP 4578993 B2 JP4578993 B2 JP 4578993B2 JP 2005026818 A JP2005026818 A JP 2005026818A JP 2005026818 A JP2005026818 A JP 2005026818A JP 4578993 B2 JP4578993 B2 JP 4578993B2
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JP
Japan
Prior art keywords
polysilazane
solvent
substrate
film
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2005026818A
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English (en)
Japanese (ja)
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JP2006216704A (ja
JP2006216704A5 (https=
Inventor
尾 英 樹 松
山 昌 章 一
川 智 規 石
木 宏 幸 青
ブルース、カイカー
ジョセフ、オーバーランダー
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AZ Electronic Materials Japan Co Ltd
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AZ Electronic Materials Japan Co Ltd
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Filing date
Publication date
Application filed by AZ Electronic Materials Japan Co Ltd filed Critical AZ Electronic Materials Japan Co Ltd
Priority to JP2005026818A priority Critical patent/JP4578993B2/ja
Priority to TW95103289A priority patent/TWI466929B/zh
Priority to PCT/JP2006/301662 priority patent/WO2006082848A1/ja
Priority to CN2006800035343A priority patent/CN101111575B/zh
Priority to KR1020077020028A priority patent/KR101152694B1/ko
Priority to US11/795,100 priority patent/US20080102211A1/en
Publication of JP2006216704A publication Critical patent/JP2006216704A/ja
Publication of JP2006216704A5 publication Critical patent/JP2006216704A5/ja
Application granted granted Critical
Publication of JP4578993B2 publication Critical patent/JP4578993B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/54—Cleaning of wafer edges
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/16—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/24—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6687—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and nitrogen
    • H10P14/6689—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and nitrogen the compound being a silazane

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Paints Or Removers (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Formation Of Insulating Films (AREA)
JP2005026818A 2005-02-02 2005-02-02 ポリシラザン処理溶剤およびこの溶剤を用いるポリシラザンの処理方法 Expired - Lifetime JP4578993B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005026818A JP4578993B2 (ja) 2005-02-02 2005-02-02 ポリシラザン処理溶剤およびこの溶剤を用いるポリシラザンの処理方法
TW95103289A TWI466929B (zh) 2005-02-02 2006-01-27 聚矽氮烷處理溶劑及用此溶劑之聚矽氮烷之處理方法
CN2006800035343A CN101111575B (zh) 2005-02-02 2006-02-01 聚硅氮烷处理溶剂及用该溶剂处理聚硅氮烷的方法
KR1020077020028A KR101152694B1 (ko) 2005-02-02 2006-02-01 폴리실라잔 처리용 용매 및 당해 용매를 사용하는폴리실라잔의 처리방법
PCT/JP2006/301662 WO2006082848A1 (ja) 2005-02-02 2006-02-01 ポリシラザン処理溶剤およびこの溶剤を用いるポリシラザンの処理方法
US11/795,100 US20080102211A1 (en) 2005-02-02 2006-02-01 Polysilazane-Treating Solvent and Method for Treating Polysilazane by Using Such Solvent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005026818A JP4578993B2 (ja) 2005-02-02 2005-02-02 ポリシラザン処理溶剤およびこの溶剤を用いるポリシラザンの処理方法

Publications (3)

Publication Number Publication Date
JP2006216704A JP2006216704A (ja) 2006-08-17
JP2006216704A5 JP2006216704A5 (https=) 2008-01-31
JP4578993B2 true JP4578993B2 (ja) 2010-11-10

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Country Status (6)

Country Link
US (1) US20080102211A1 (https=)
JP (1) JP4578993B2 (https=)
KR (1) KR101152694B1 (https=)
CN (1) CN101111575B (https=)
TW (1) TWI466929B (https=)
WO (1) WO2006082848A1 (https=)

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Also Published As

Publication number Publication date
WO2006082848A1 (ja) 2006-08-10
US20080102211A1 (en) 2008-05-01
KR101152694B1 (ko) 2012-06-15
TW200632006A (en) 2006-09-16
JP2006216704A (ja) 2006-08-17
KR20070108214A (ko) 2007-11-08
TWI466929B (zh) 2015-01-01
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