CN100550337C - 薄片粘贴装置 - Google Patents

薄片粘贴装置 Download PDF

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Publication number
CN100550337C
CN100550337C CNB2006800243223A CN200680024322A CN100550337C CN 100550337 C CN100550337 C CN 100550337C CN B2006800243223 A CNB2006800243223 A CN B2006800243223A CN 200680024322 A CN200680024322 A CN 200680024322A CN 100550337 C CN100550337 C CN 100550337C
Authority
CN
China
Prior art keywords
sheet
wafer
mentioned
adhesive sheet
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006800243223A
Other languages
English (en)
Chinese (zh)
Other versions
CN101213646A (zh
Inventor
野中英明
小林贤治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN101213646A publication Critical patent/CN101213646A/zh
Application granted granted Critical
Publication of CN100550337C publication Critical patent/CN100550337C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1343—Cutting indefinite length web after assembly with discrete article
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNB2006800243223A 2005-07-07 2006-06-26 薄片粘贴装置 Expired - Fee Related CN100550337C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP198807/2005 2005-07-07
JP2005198807A JP4441451B2 (ja) 2005-07-07 2005-07-07 シート貼付装置

Publications (2)

Publication Number Publication Date
CN101213646A CN101213646A (zh) 2008-07-02
CN100550337C true CN100550337C (zh) 2009-10-14

Family

ID=37636929

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006800243223A Expired - Fee Related CN100550337C (zh) 2005-07-07 2006-06-26 薄片粘贴装置

Country Status (7)

Country Link
US (1) US7900677B2 (enExample)
JP (1) JP4441451B2 (enExample)
KR (1) KR101229857B1 (enExample)
CN (1) CN100550337C (enExample)
DE (1) DE112006001812T5 (enExample)
TW (1) TWI391981B (enExample)
WO (1) WO2007007532A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5430087B2 (ja) * 2008-06-26 2014-02-26 リンテック株式会社 シート貼付装置及び貼付方法
JP2011116486A (ja) * 2009-12-02 2011-06-16 Sharp Corp フィルム剥離装置
CN102723520B (zh) * 2011-03-29 2014-12-10 深圳市鑫力创自动化设备有限公司 一种电池贴面垫设备
JP6527817B2 (ja) * 2015-12-11 2019-06-05 リンテック株式会社 シート貼付装置および貼付方法
JP6796952B2 (ja) * 2016-05-31 2020-12-09 リンテック株式会社 シート貼付装置および貼付方法
US11014203B2 (en) * 2016-07-11 2021-05-25 Laird Technologies, Inc. System for applying interface materials
US10741519B2 (en) 2016-07-11 2020-08-11 Laird Technologies, Inc. Systems of applying materials to components
USD999405S1 (en) 2017-10-06 2023-09-19 Laird Technologies, Inc. Material having edging
USD881822S1 (en) 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
US11141823B2 (en) * 2018-04-28 2021-10-12 Laird Technologies, Inc. Systems and methods of applying materials to components
JP7415395B2 (ja) * 2019-09-25 2024-01-17 オムロン株式会社 保護シート剥離装置および保護シート剥離方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136306A (ja) * 2003-10-31 2005-05-26 Lintec Corp 貼合装置及び貼合方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04293253A (ja) * 1991-03-20 1992-10-16 Nitto Denko Corp 半導体ウエハの粘着テープ貼付け装置
JPH0632522A (ja) * 1992-07-16 1994-02-08 Nitto Denko Corp テープ自動貼付け装置
JPH06268047A (ja) * 1993-03-16 1994-09-22 Sharp Corp 半導体レーザチップの供給方法及び供給装置
JP3447518B2 (ja) 1996-08-09 2003-09-16 リンテック株式会社 接着シート貼付装置および方法
JP4502547B2 (ja) * 2000-08-07 2010-07-14 日東電工株式会社 半導体ウエハの保護テープ除去方法およびその装置
JP2003152058A (ja) * 2001-11-13 2003-05-23 Lintec Corp ウェハ転写装置
JP2004047976A (ja) 2002-05-21 2004-02-12 Nitto Denko Corp 保護テープ貼付方法およびその装置
JP4444619B2 (ja) * 2003-10-10 2010-03-31 リンテック株式会社 マウント装置及びマウント方法
JP4326519B2 (ja) * 2005-03-31 2009-09-09 日東電工株式会社 保護テープ剥離方法およびこれを用いた装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136306A (ja) * 2003-10-31 2005-05-26 Lintec Corp 貼合装置及び貼合方法

Also Published As

Publication number Publication date
KR101229857B1 (ko) 2013-02-05
JP2007019240A (ja) 2007-01-25
DE112006001812T5 (de) 2008-05-15
TWI391981B (zh) 2013-04-01
TW200721241A (en) 2007-06-01
CN101213646A (zh) 2008-07-02
WO2007007532A1 (ja) 2007-01-18
US7900677B2 (en) 2011-03-08
KR20080023319A (ko) 2008-03-13
JP4441451B2 (ja) 2010-03-31
US20090223638A1 (en) 2009-09-10

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Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091014