CN100461397C - 具有引线接合焊盘的半导体器件及其方法 - Google Patents

具有引线接合焊盘的半导体器件及其方法 Download PDF

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Publication number
CN100461397C
CN100461397C CNB038045214A CN03804521A CN100461397C CN 100461397 C CN100461397 C CN 100461397C CN B038045214 A CNB038045214 A CN B038045214A CN 03804521 A CN03804521 A CN 03804521A CN 100461397 C CN100461397 C CN 100461397C
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wire bond
aluminum wire
bond pad
passivation layer
electrical conductor
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Chinese (zh)
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CN1639865A (zh
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苏珊·H·多尼
詹姆斯·W·米勒
乔弗里·B·哈尔
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NXP USA Inc
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Freescale Semiconductor Inc
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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
CNB038045214A 2002-03-13 2003-03-12 具有引线接合焊盘的半导体器件及其方法 Expired - Lifetime CN100461397C (zh)

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