TWI261906B - Semiconductor device having a wire bond pad and method therefor - Google Patents

Semiconductor device having a wire bond pad and method therefor Download PDF

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Publication number
TWI261906B
TWI261906B TW092105327A TW92105327A TWI261906B TW I261906 B TWI261906 B TW I261906B TW 092105327 A TW092105327 A TW 092105327A TW 92105327 A TW92105327 A TW 92105327A TW I261906 B TWI261906 B TW I261906B
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Taiwan
Prior art keywords
layer
pad
wire
passivation layer
wire bond
Prior art date
Application number
TW092105327A
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English (en)
Chinese (zh)
Other versions
TW200305267A (en
Inventor
Susan H Downey
James W Miller
Geoffrey Hall
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Freescale Semiconductor Inc
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Publication of TW200305267A publication Critical patent/TW200305267A/zh
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Publication of TWI261906B publication Critical patent/TWI261906B/zh

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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