KR100979080B1 - 와이어 본드 패드를 가진 반도체 소자 및 그 제조 방법 - Google Patents

와이어 본드 패드를 가진 반도체 소자 및 그 제조 방법 Download PDF

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KR100979080B1
KR100979080B1 KR1020047014382A KR20047014382A KR100979080B1 KR 100979080 B1 KR100979080 B1 KR 100979080B1 KR 1020047014382 A KR1020047014382 A KR 1020047014382A KR 20047014382 A KR20047014382 A KR 20047014382A KR 100979080 B1 KR100979080 B1 KR 100979080B1
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bond pad
wire bond
passivation layer
layer
electrical conductor
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Korean (ko)
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KR20040088584A (ko
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다우니수잔에이치.
밀러제임스더블유.
홀지오프레이비.
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프리스케일 세미컨덕터, 인크.
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  • Wire Bonding (AREA)
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TW200305267A (en) 2003-10-16
AU2003218146A8 (en) 2003-09-29
WO2003079434A3 (en) 2004-03-11
JP2005520342A (ja) 2005-07-07
US20040036174A1 (en) 2004-02-26
US6846717B2 (en) 2005-01-25
US6614091B1 (en) 2003-09-02
EP1483789B1 (en) 2016-11-16
WO2003079434A2 (en) 2003-09-25

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