JP4714502B2 - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
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- JP4714502B2 JP4714502B2 JP2005128455A JP2005128455A JP4714502B2 JP 4714502 B2 JP4714502 B2 JP 4714502B2 JP 2005128455 A JP2005128455 A JP 2005128455A JP 2005128455 A JP2005128455 A JP 2005128455A JP 4714502 B2 JP4714502 B2 JP 4714502B2
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- 238000003384 imaging method Methods 0.000 title claims description 62
- 230000015572 biosynthetic process Effects 0.000 claims description 40
- 239000004065 semiconductor Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 5
- 229920005591 polysilicon Polymers 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 description 15
- 239000012535 impurity Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 13
- 239000011229 interlayer Substances 0.000 description 10
- 230000010354 integration Effects 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14806—Structural or functional details thereof
- H01L27/14812—Special geometry or disposition of pixel-elements, address lines or gate-electrodes
- H01L27/14818—Optical shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
- B60Q1/44—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating braking action or preparation for braking, e.g. by detection of the foot approaching the brake pedal
- B60Q1/444—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic for indicating braking action or preparation for braking, e.g. by detection of the foot approaching the brake pedal with indication of the braking strength or speed changes, e.g. by changing shape or intensity of the indication
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/0029—Spatial arrangement
- B60Q1/0035—Spatial arrangement relative to the vehicle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14831—Area CCD imagers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q2400/00—Special features or arrangements of exterior signal lamps for vehicles
- B60Q2400/20—Multi-color single source or LED matrix, e.g. yellow blinker and red brake lamp generated by single lamp
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
- B60Y2400/00—Special features of vehicle units
- B60Y2400/30—Sensors
- B60Y2400/306—Pressure sensors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
本発明の第1の実施形態に係る固体撮像装置について図面を参照して説明する。図1〜3は第1の実施形態に係る固体撮像装置であり、図1は平面構成を示しており、図2は図1を拡大して示しており、図3は図2のIIIa−IIIa線に沿った断面構成を示している。
以下に、本発明の第2の実施形態に係る固体撮像装置について図面を参照して説明する。図4〜6は第1の実施形態に係る固体撮像装置であり、図4は平面構成を示しており、図5は図4を拡大して示しており、図6は図5のVIa−VIa線に沿った断面構成を示している。図4〜6において図1〜3と同一の構成要素には同一の符号を附すことにより説明を省略する。
以下に、本発明の第3の実施形態に係る固体撮像装置について図面を参照して説明する。図7〜9は第1の実施形態に係る固体撮像装置であり、図7は平面構成を示しており、図8は図7を拡大して示しており、図9は図8のIXa−IXa線に沿った断面構成を示している。図7〜9において図1〜3と同一の構成要素には同一の符号を附すことにより説明を省略する。
2 素子形成領域
2A 画素形成領域
2B 水平転送レジスタ形成領域
3 配線領域
11 画素
12 垂直転送レジスタ
13 水平転送レジスタ
14 出力バッファ
20 垂直転送チャネル
21 垂直転送電極
23 水平転送チャネル
24 水平転送電極
28 バス配線
30 層間絶縁膜
31 外部接続用パッド
32 プラグ
33 ボンディングワイヤ
Claims (8)
- それぞれが半導体基板チップの画素形成領域の上に2次元マトリックス状に配列された複数の光電変換素子と、
垂直転送チャネル及び垂直転送電極からなり、前記各光電変換素子から読み出された信号電荷を垂直方向に転送する垂直転送レジスタと、
水平転送チャネル及び水平転送電極からなり、前記垂直転送レジスタから転送された前記信号電荷を水平方向に転送する水平転送レジスタと、
前記垂直転送電極及び前記水平転送電極と電気的に接続されたバス配線と、
前記バス配線と電気的に接続された外部接続用パッドとを備え、
前記外部接続用パッドは、前記画素形成領域と分離された領域の上における、前記バス配線及び前記水平転送電極の上方で且つ前記垂直転送電極の上方を除く部分に設けられていることを特徴とする固体撮像装置。 - それぞれが半導体基板チップの上に2次元マトリックス状に配列された複数の光電変換素子と、
垂直転送チャネル及び垂直転送電極からなり、前記各光電変換素子から読み出された信号電荷を垂直方向に転送する垂直転送レジスタと、
水平転送チャネル及び水平転送電極からなり、前記垂直転送レジスタから転送された前記信号電荷を水平方向に転送する水平転送レジスタと、
前記垂直転送電極及び前記水平転送電極と電気的に接続されたバス配線と、
前記バス配線と電気的に接続された外部接続用パッドとを備え、
前記外部接続用パッドは、前記バス配線及び前記水平転送電極の上方に設けられ、且つ前記半導体基板チップの主面に対して傾斜して設けられていることを特徴とする固体撮像装置。 - 前記外部接続用パッドは、前記水平転送チャネルの上方に位置していることを特徴とする請求項1又は2に記載の固体撮像装置。
- 前記水平転送電極は、導体層であり、前記外部接続用パッドは、金属層であることを特徴とする請求項3に記載の固体撮像装置。
- 前記導体層は、ポリシリコンからなることを特徴とする請求項4に記載の固体撮像装置。
- 前記外部接続用パッドは、前記バス配線とコンタクトプラグを介在させて電気的に接続されていることを特徴とする請求項1から5のいずれか1項に記載の固体撮像装置
- 前記光電変換素子、垂直転送レジスタ及び水平転送レジスタは、CCD型イメージセンサを構成していることを特徴とする請求項1から6のいずれか1項に記載の固体撮像装置。
- 前記外部接続用パッドは、前記バス配線の形成領域及び前記水平転送レジスタの形成領域の上に跨って形成されており、その一部のみが前記水平転送チャネルの上に形成されていることを特徴とする請求項1から7のいずれか1項に記載の固体撮像装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005128455A JP4714502B2 (ja) | 2005-04-26 | 2005-04-26 | 固体撮像装置 |
CNB2006100597060A CN100463206C (zh) | 2005-04-26 | 2006-03-03 | 固体摄像器件 |
KR1020060025330A KR100671102B1 (ko) | 2005-04-26 | 2006-03-20 | 고체촬상장치 |
US11/406,288 US7326958B2 (en) | 2005-04-26 | 2006-04-19 | Solid state imaging device |
TW095114180A TWI308388B (en) | 2005-04-26 | 2006-04-20 | Solid state imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005128455A JP4714502B2 (ja) | 2005-04-26 | 2005-04-26 | 固体撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006310407A JP2006310407A (ja) | 2006-11-09 |
JP4714502B2 true JP4714502B2 (ja) | 2011-06-29 |
Family
ID=37185934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005128455A Expired - Fee Related JP4714502B2 (ja) | 2005-04-26 | 2005-04-26 | 固体撮像装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7326958B2 (ja) |
JP (1) | JP4714502B2 (ja) |
KR (1) | KR100671102B1 (ja) |
CN (1) | CN100463206C (ja) |
TW (1) | TWI308388B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008160017A (ja) * | 2006-12-26 | 2008-07-10 | Toshiba Corp | 半導体パッケージ及びその製造方法 |
JP2009064982A (ja) * | 2007-09-06 | 2009-03-26 | Fujifilm Corp | 固体撮像素子 |
JP4609497B2 (ja) * | 2008-01-21 | 2011-01-12 | ソニー株式会社 | 固体撮像装置とその製造方法、及びカメラ |
JP5656611B2 (ja) * | 2010-12-20 | 2015-01-21 | キヤノン株式会社 | 半導体装置及び固体撮像装置 |
CN103698018B (zh) * | 2013-12-20 | 2016-06-29 | 北京理工大学 | 一种带电子倍增的铂硅红外焦平面探测器 |
US9781362B1 (en) * | 2016-03-22 | 2017-10-03 | Omnivision Technologies, Inc. | Flare-reducing imaging system and associated image sensor |
WO2020137188A1 (ja) * | 2018-12-25 | 2020-07-02 | パナソニックIpマネジメント株式会社 | 撮像装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6614091B1 (en) * | 2002-03-13 | 2003-09-02 | Motorola, Inc. | Semiconductor device having a wire bond pad and method therefor |
JP2004207804A (ja) * | 2002-12-24 | 2004-07-22 | Sony Corp | 固体撮像素子及びその駆動方法 |
Family Cites Families (13)
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JPS5787145A (en) | 1980-11-20 | 1982-05-31 | Seiko Epson Corp | Semiconductor device |
JPS63114222A (ja) | 1986-10-31 | 1988-05-19 | Texas Instr Japan Ltd | 半導体装置 |
SG63628A1 (en) * | 1990-03-02 | 1999-03-30 | Sony Corp | Solid state image sensor |
KR100281788B1 (ko) * | 1992-03-18 | 2001-02-15 | 이데이 노부유끼 | 고체 촬상 장치 |
JPH06275794A (ja) * | 1993-03-18 | 1994-09-30 | Matsushita Electric Ind Co Ltd | 半導体記憶装置およびその製造方法 |
JPH09219824A (ja) * | 1996-02-09 | 1997-08-19 | Sony Corp | 固体撮像装置 |
JPH1068960A (ja) * | 1996-08-28 | 1998-03-10 | Sharp Corp | 液晶パネルおよびその欠陥修正方法 |
JPH10335627A (ja) * | 1997-05-27 | 1998-12-18 | Sony Corp | 固体撮像装置 |
JP2000156489A (ja) * | 1998-11-20 | 2000-06-06 | Sony Corp | Ccd固体撮像素子 |
JP2003018458A (ja) * | 2001-04-23 | 2003-01-17 | Hitachi Ltd | Cmos型固体撮像素子を用いた撮像システム |
JP4246964B2 (ja) * | 2002-05-27 | 2009-04-02 | 浜松ホトニクス株式会社 | 固体撮像装置及び固体撮像装置アレイ |
KR101000600B1 (ko) * | 2003-04-30 | 2010-12-10 | 크로스텍 캐피탈, 엘엘씨 | 이온주입의 시트저항 측정용 테스트패턴 및 그가 내장된씨모스 이미지 센서 및 그의 제조 방법 |
US7138619B1 (en) * | 2004-09-28 | 2006-11-21 | Rockwell Collins, Inc. | Method and apparatus for coincident viewing at a plurality of wavelengths |
-
2005
- 2005-04-26 JP JP2005128455A patent/JP4714502B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-03 CN CNB2006100597060A patent/CN100463206C/zh not_active Expired - Fee Related
- 2006-03-20 KR KR1020060025330A patent/KR100671102B1/ko not_active IP Right Cessation
- 2006-04-19 US US11/406,288 patent/US7326958B2/en not_active Expired - Fee Related
- 2006-04-20 TW TW095114180A patent/TWI308388B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US6614091B1 (en) * | 2002-03-13 | 2003-09-02 | Motorola, Inc. | Semiconductor device having a wire bond pad and method therefor |
JP2004207804A (ja) * | 2002-12-24 | 2004-07-22 | Sony Corp | 固体撮像素子及びその駆動方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200638538A (en) | 2006-11-01 |
JP2006310407A (ja) | 2006-11-09 |
KR20060112205A (ko) | 2006-10-31 |
US20060237722A1 (en) | 2006-10-26 |
CN1855522A (zh) | 2006-11-01 |
TWI308388B (en) | 2009-04-01 |
CN100463206C (zh) | 2009-02-18 |
US7326958B2 (en) | 2008-02-05 |
KR100671102B1 (ko) | 2007-01-17 |
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