CN100396716C - 环氧官能的杂化共聚物 - Google Patents

环氧官能的杂化共聚物 Download PDF

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Publication number
CN100396716C
CN100396716C CNB2003801097786A CN200380109778A CN100396716C CN 100396716 C CN100396716 C CN 100396716C CN B2003801097786 A CNB2003801097786 A CN B2003801097786A CN 200380109778 A CN200380109778 A CN 200380109778A CN 100396716 C CN100396716 C CN 100396716C
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CN
China
Prior art keywords
epoxy
unit
radial
multipolymer
mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB2003801097786A
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English (en)
Chinese (zh)
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CN1747987A (zh
Inventor
D·E·赫尔
S·查普林斯基
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Henkel AG and Co KGaA
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National Starch and Chemical Investment Holding Corp
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Publication of CN1747987A publication Critical patent/CN1747987A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CNB2003801097786A 2002-12-20 2003-12-08 环氧官能的杂化共聚物 Expired - Fee Related CN100396716C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/327,353 2002-12-20
US10/327,353 US7034089B2 (en) 2002-12-20 2002-12-20 Epoxy-functional hybrid copolymers

Publications (2)

Publication Number Publication Date
CN1747987A CN1747987A (zh) 2006-03-15
CN100396716C true CN100396716C (zh) 2008-06-25

Family

ID=32594230

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2003801097786A Expired - Fee Related CN100396716C (zh) 2002-12-20 2003-12-08 环氧官能的杂化共聚物

Country Status (7)

Country Link
US (1) US7034089B2 (https=)
EP (1) EP1572781A1 (https=)
JP (1) JP4607600B2 (https=)
KR (1) KR20050085802A (https=)
CN (1) CN100396716C (https=)
AU (1) AU2003296306A1 (https=)
WO (1) WO2004060976A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111454689A (zh) * 2019-12-31 2020-07-28 武汉长盈鑫科技有限公司 一种高玻璃化温度的导热胶及其制备方法

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EP1679328A1 (en) * 2003-09-18 2006-07-12 Kaneka Corporation Photocuring resin composition containing organic polymer having epoxy group and/or oxethane group-containing silicon group at end, and method for producing same
US7365135B2 (en) * 2004-06-14 2008-04-29 Chung-Shan Institute Of Science & Technology Method for preparing a novolac phenolic resin/silica hybrid organic-inorganic nanocomposite
US20050282976A1 (en) * 2004-06-22 2005-12-22 Gelcore Llc. Silicone epoxy formulations
DE102005009066A1 (de) * 2005-02-28 2006-09-07 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optischen und eines strahlungsemittierenden Bauelementes und optisches sowie strahlungsemittierendes Bauelement
DE102005027404A1 (de) * 2005-06-13 2006-12-14 Schröders, Theo Brandschutzglas und Verfahren zu dessen Herstellung
EP2029653B1 (en) * 2006-06-07 2009-09-30 Showa Denko K.K. Novel epoxy compounds and process for their production
KR100779560B1 (ko) 2006-07-20 2007-11-29 연세대학교 산학협력단 유기 박막 트랜지스터용 자가 패턴성 유전체 박막, 그 제조 방법, 및 이를 구비한 유기 박막 트랜지스터
US8084765B2 (en) * 2007-05-07 2011-12-27 Xerox Corporation Electronic device having a dielectric layer
EP2228085A1 (en) * 2007-08-20 2010-09-15 Mallinckrodt Inc. Fluid driven medical injectors
US8604150B2 (en) * 2007-11-07 2013-12-10 Showa Denko K.K. Epoxy group-containing organosiloxane compound, curable composition for transfer materials and method for forming micropattern using the composition
US8426614B2 (en) * 2008-03-24 2013-04-23 Showa Denko K.K. Epoxy compound and process for producing the epoxy compound
US20100119796A1 (en) * 2008-11-12 2010-05-13 Brighten Engineering Co., Ltd. Anticorrosive Nanocomposite Coating Material, and a Preparation Process Thereof
EP2445028A1 (en) * 2010-10-25 2012-04-25 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Opto-electric device and method of manufacturing an opto-electric device
KR101252063B1 (ko) 2011-08-25 2013-04-12 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물과 경화물 및 이의 용도
US9777107B2 (en) * 2013-09-20 2017-10-03 Shin-Etsu Chemical Co., Ltd. Silicone-modified epoxy resin and composition and cured article thereof
KR102315127B1 (ko) * 2014-11-26 2021-10-20 에스케이이노베이션 주식회사 하드코팅층 형성용 조성물
KR102534679B1 (ko) * 2015-07-10 2023-05-19 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물, 그 제조 방법 및 해당 조성물의 용도
KR102512801B1 (ko) 2017-01-10 2023-03-23 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물
KR102459583B1 (ko) 2017-01-10 2022-10-28 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물
JP6530574B2 (ja) 2017-01-10 2019-06-12 住友精化株式会社 エポキシ樹脂組成物
EP3569654B1 (en) 2017-01-10 2023-08-23 Sumitomo Seika Chemicals Co., Ltd. Epoxy resin composition
KR102126045B1 (ko) * 2017-07-21 2020-06-23 삼성에스디아이 주식회사 유기발광소자 봉지용 조성물 및 이로부터 제조된 유기발광소자 표시장치
CN107814935B (zh) * 2017-10-31 2020-11-24 江南大学 一种poss基有机-无机杂化八臂环氧树脂及其制备方法
EP3578591A1 (en) 2018-06-04 2019-12-11 EMPA Eidgenössische Materialprüfungs- und Forschungsanstalt Polymeric liquid molecular building block (mbb) material and method for producing the same
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체
CN117003991A (zh) * 2022-04-29 2023-11-07 华为技术有限公司 环氧树脂及其制备方法和树脂组合物
CN121195033A (zh) * 2023-07-07 2025-12-23 株式会社力森诺科 黏合剂组合物

Citations (5)

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US5378790A (en) * 1992-09-16 1995-01-03 E. I. Du Pont De Nemours & Co. Single component inorganic/organic network materials and precursors thereof
US5677410A (en) * 1995-05-16 1997-10-14 Bayer Ag Carbosilane-dendrimers, carbosilane-hybrid materials, methods for manufacturing them and a method for manufacturing coatings from the carbosilane-dendrimers
CN1267313A (zh) * 1997-08-22 2000-09-20 莱拉斯股份公司 新的嵌段共聚物及其制备
US6184313B1 (en) * 1999-07-08 2001-02-06 National Research Council Of Canada Hybrid silane dendrimer-star polymers
US6476174B1 (en) * 2001-06-15 2002-11-05 Industrial Technology Research Institute Process for preparing a silica-based organic-inorganic hybrid resin and the organic-inorganic hybrid resin prepared therefrom

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US2946701A (en) * 1957-11-12 1960-07-26 Dow Corning Method of treating glass with epoxysilanes and their epoxy-amine adducts, and the articles made thereby
US2970150A (en) * 1957-12-17 1961-01-31 Union Carbide Corp Processes for the reaction of silanic hydrogen-bonded siloxanes with unsaturated organic compounds with a platinum catalyst
US2997458A (en) * 1958-10-03 1961-08-22 Westinghouse Electric Corp Epoxy-substituted organosilicone compounds
US4150048A (en) * 1978-03-28 1979-04-17 Union Carbide Corporation Nonhydrolyzable siloxane block copolymers of organosiloxanes and organic ethers
US4477326A (en) * 1983-06-20 1984-10-16 Loctite Corporation Polyphotoinitiators and compositions thereof
US5037861A (en) * 1989-08-09 1991-08-06 General Electric Company Novel highly reactive silicon-containing epoxides
US5387698A (en) * 1992-06-11 1995-02-07 General Electric Company Rhodium containing selective catalysts for the synthesis of epoxysiloxane/epoxysilicone monomers and polymers
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US5169962A (en) * 1990-09-17 1992-12-08 General Electric Company Preparation of epoxysilicon compounds using rhodium catalysts
US5227410A (en) * 1991-12-05 1993-07-13 General Electric Company Uv-curable epoxysilicone-polyether block copolymers
JPH0774222B2 (ja) * 1991-12-24 1995-08-09 信越化学工業株式会社 シロキサン化合物
US5484950A (en) * 1992-12-21 1996-01-16 Polyset Company, Inc. Process for selective monoaddition to silanes containing two silicon-hydrogen bonds and products thereof
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JP4236342B2 (ja) * 1999-07-30 2009-03-11 東レ・ダウコーニング株式会社 カルボシロキサンデンドリマーおよびデンドリマー含有有機重合体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5378790A (en) * 1992-09-16 1995-01-03 E. I. Du Pont De Nemours & Co. Single component inorganic/organic network materials and precursors thereof
US5677410A (en) * 1995-05-16 1997-10-14 Bayer Ag Carbosilane-dendrimers, carbosilane-hybrid materials, methods for manufacturing them and a method for manufacturing coatings from the carbosilane-dendrimers
CN1267313A (zh) * 1997-08-22 2000-09-20 莱拉斯股份公司 新的嵌段共聚物及其制备
US6184313B1 (en) * 1999-07-08 2001-02-06 National Research Council Of Canada Hybrid silane dendrimer-star polymers
US6476174B1 (en) * 2001-06-15 2002-11-05 Industrial Technology Research Institute Process for preparing a silica-based organic-inorganic hybrid resin and the organic-inorganic hybrid resin prepared therefrom

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111454689A (zh) * 2019-12-31 2020-07-28 武汉长盈鑫科技有限公司 一种高玻璃化温度的导热胶及其制备方法
CN111454689B (zh) * 2019-12-31 2021-10-15 武汉长盈鑫科技有限公司 一种高玻璃化温度的导热胶及其制备方法

Also Published As

Publication number Publication date
US20040122186A1 (en) 2004-06-24
AU2003296306A1 (en) 2004-07-29
JP4607600B2 (ja) 2011-01-05
EP1572781A1 (en) 2005-09-14
JP2006511664A (ja) 2006-04-06
US7034089B2 (en) 2006-04-25
CN1747987A (zh) 2006-03-15
WO2004060976A1 (en) 2004-07-22
KR20050085802A (ko) 2005-08-29

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