KR20050085802A - 에폭시 관능성 하이브리드 코폴리머 - Google Patents

에폭시 관능성 하이브리드 코폴리머 Download PDF

Info

Publication number
KR20050085802A
KR20050085802A KR1020057011443A KR20057011443A KR20050085802A KR 20050085802 A KR20050085802 A KR 20050085802A KR 1020057011443 A KR1020057011443 A KR 1020057011443A KR 20057011443 A KR20057011443 A KR 20057011443A KR 20050085802 A KR20050085802 A KR 20050085802A
Authority
KR
South Korea
Prior art keywords
copolymer
unit
bis
block
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020057011443A
Other languages
English (en)
Korean (ko)
Inventor
도날드 이 허르
샤론 채플린스키
Original Assignee
내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션 filed Critical 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션
Publication of KR20050085802A publication Critical patent/KR20050085802A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020057011443A 2002-12-20 2003-12-08 에폭시 관능성 하이브리드 코폴리머 Abandoned KR20050085802A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/327,353 2002-12-20
US10/327,353 US7034089B2 (en) 2002-12-20 2002-12-20 Epoxy-functional hybrid copolymers

Publications (1)

Publication Number Publication Date
KR20050085802A true KR20050085802A (ko) 2005-08-29

Family

ID=32594230

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057011443A Abandoned KR20050085802A (ko) 2002-12-20 2003-12-08 에폭시 관능성 하이브리드 코폴리머

Country Status (7)

Country Link
US (1) US7034089B2 (https=)
EP (1) EP1572781A1 (https=)
JP (1) JP4607600B2 (https=)
KR (1) KR20050085802A (https=)
CN (1) CN100396716C (https=)
AU (1) AU2003296306A1 (https=)
WO (1) WO2004060976A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140007340A (ko) * 2010-10-25 2014-01-17 네덜란제 오르가니자티에 포오르 토에게파스트-나투우르베텐샤펠리즈크 온데르조에크 테엔오 광전자 소자 및 광전자 소자의 제조 방법
KR20160063073A (ko) * 2014-11-26 2016-06-03 에스케이이노베이션 주식회사 하드코팅층 형성용 조성물

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1679328A1 (en) * 2003-09-18 2006-07-12 Kaneka Corporation Photocuring resin composition containing organic polymer having epoxy group and/or oxethane group-containing silicon group at end, and method for producing same
US7365135B2 (en) * 2004-06-14 2008-04-29 Chung-Shan Institute Of Science & Technology Method for preparing a novolac phenolic resin/silica hybrid organic-inorganic nanocomposite
US20050282976A1 (en) * 2004-06-22 2005-12-22 Gelcore Llc. Silicone epoxy formulations
DE102005009066A1 (de) * 2005-02-28 2006-09-07 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optischen und eines strahlungsemittierenden Bauelementes und optisches sowie strahlungsemittierendes Bauelement
DE102005027404A1 (de) * 2005-06-13 2006-12-14 Schröders, Theo Brandschutzglas und Verfahren zu dessen Herstellung
EP2029653B1 (en) * 2006-06-07 2009-09-30 Showa Denko K.K. Novel epoxy compounds and process for their production
KR100779560B1 (ko) 2006-07-20 2007-11-29 연세대학교 산학협력단 유기 박막 트랜지스터용 자가 패턴성 유전체 박막, 그 제조 방법, 및 이를 구비한 유기 박막 트랜지스터
US8084765B2 (en) * 2007-05-07 2011-12-27 Xerox Corporation Electronic device having a dielectric layer
EP2228085A1 (en) * 2007-08-20 2010-09-15 Mallinckrodt Inc. Fluid driven medical injectors
US8604150B2 (en) * 2007-11-07 2013-12-10 Showa Denko K.K. Epoxy group-containing organosiloxane compound, curable composition for transfer materials and method for forming micropattern using the composition
US8426614B2 (en) * 2008-03-24 2013-04-23 Showa Denko K.K. Epoxy compound and process for producing the epoxy compound
US20100119796A1 (en) * 2008-11-12 2010-05-13 Brighten Engineering Co., Ltd. Anticorrosive Nanocomposite Coating Material, and a Preparation Process Thereof
KR101252063B1 (ko) 2011-08-25 2013-04-12 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물과 경화물 및 이의 용도
US9777107B2 (en) * 2013-09-20 2017-10-03 Shin-Etsu Chemical Co., Ltd. Silicone-modified epoxy resin and composition and cured article thereof
KR102534679B1 (ko) * 2015-07-10 2023-05-19 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물, 그 제조 방법 및 해당 조성물의 용도
KR102512801B1 (ko) 2017-01-10 2023-03-23 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물
KR102459583B1 (ko) 2017-01-10 2022-10-28 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물
JP6530574B2 (ja) 2017-01-10 2019-06-12 住友精化株式会社 エポキシ樹脂組成物
EP3569654B1 (en) 2017-01-10 2023-08-23 Sumitomo Seika Chemicals Co., Ltd. Epoxy resin composition
KR102126045B1 (ko) * 2017-07-21 2020-06-23 삼성에스디아이 주식회사 유기발광소자 봉지용 조성물 및 이로부터 제조된 유기발광소자 표시장치
CN107814935B (zh) * 2017-10-31 2020-11-24 江南大学 一种poss基有机-无机杂化八臂环氧树脂及其制备方法
EP3578591A1 (en) 2018-06-04 2019-12-11 EMPA Eidgenössische Materialprüfungs- und Forschungsanstalt Polymeric liquid molecular building block (mbb) material and method for producing the same
KR102232340B1 (ko) 2019-11-15 2021-03-26 한국생산기술연구원 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체
CN111454689B (zh) * 2019-12-31 2021-10-15 武汉长盈鑫科技有限公司 一种高玻璃化温度的导热胶及其制备方法
CN117003991A (zh) * 2022-04-29 2023-11-07 华为技术有限公司 环氧树脂及其制备方法和树脂组合物
CN121195033A (zh) * 2023-07-07 2025-12-23 株式会社力森诺科 黏合剂组合物

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2946701A (en) * 1957-11-12 1960-07-26 Dow Corning Method of treating glass with epoxysilanes and their epoxy-amine adducts, and the articles made thereby
US2970150A (en) * 1957-12-17 1961-01-31 Union Carbide Corp Processes for the reaction of silanic hydrogen-bonded siloxanes with unsaturated organic compounds with a platinum catalyst
US2997458A (en) * 1958-10-03 1961-08-22 Westinghouse Electric Corp Epoxy-substituted organosilicone compounds
US4150048A (en) * 1978-03-28 1979-04-17 Union Carbide Corporation Nonhydrolyzable siloxane block copolymers of organosiloxanes and organic ethers
US4477326A (en) * 1983-06-20 1984-10-16 Loctite Corporation Polyphotoinitiators and compositions thereof
US5037861A (en) * 1989-08-09 1991-08-06 General Electric Company Novel highly reactive silicon-containing epoxides
US5387698A (en) * 1992-06-11 1995-02-07 General Electric Company Rhodium containing selective catalysts for the synthesis of epoxysiloxane/epoxysilicone monomers and polymers
US5260399A (en) * 1992-06-08 1993-11-09 General Electric Company Regiospecific catalyst for the synthesis of epoxysiloxane monomers and polymers
US5169962A (en) * 1990-09-17 1992-12-08 General Electric Company Preparation of epoxysilicon compounds using rhodium catalysts
US5227410A (en) * 1991-12-05 1993-07-13 General Electric Company Uv-curable epoxysilicone-polyether block copolymers
JPH0774222B2 (ja) * 1991-12-24 1995-08-09 信越化学工業株式会社 シロキサン化合物
US5378790A (en) * 1992-09-16 1995-01-03 E. I. Du Pont De Nemours & Co. Single component inorganic/organic network materials and precursors thereof
US5484950A (en) * 1992-12-21 1996-01-16 Polyset Company, Inc. Process for selective monoaddition to silanes containing two silicon-hydrogen bonds and products thereof
US5677410A (en) * 1995-05-16 1997-10-14 Bayer Ag Carbosilane-dendrimers, carbosilane-hybrid materials, methods for manufacturing them and a method for manufacturing coatings from the carbosilane-dendrimers
US5863970A (en) * 1995-12-06 1999-01-26 Polyset Company, Inc. Epoxy resin composition with cycloaliphatic epoxy-functional siloxane
FI103051B (fi) * 1997-08-22 1999-04-15 Schering Oy Uusia blokkikopolymeerejä ja niiden valmistus
US6184407B1 (en) * 1998-05-29 2001-02-06 Dow Corning Toray Silicone Co., Ltd. Carbosiloxane dendrimers
US6184313B1 (en) * 1999-07-08 2001-02-06 National Research Council Of Canada Hybrid silane dendrimer-star polymers
JP4236342B2 (ja) * 1999-07-30 2009-03-11 東レ・ダウコーニング株式会社 カルボシロキサンデンドリマーおよびデンドリマー含有有機重合体
US6476174B1 (en) * 2001-06-15 2002-11-05 Industrial Technology Research Institute Process for preparing a silica-based organic-inorganic hybrid resin and the organic-inorganic hybrid resin prepared therefrom

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140007340A (ko) * 2010-10-25 2014-01-17 네덜란제 오르가니자티에 포오르 토에게파스트-나투우르베텐샤펠리즈크 온데르조에크 테엔오 광전자 소자 및 광전자 소자의 제조 방법
KR20160063073A (ko) * 2014-11-26 2016-06-03 에스케이이노베이션 주식회사 하드코팅층 형성용 조성물

Also Published As

Publication number Publication date
US20040122186A1 (en) 2004-06-24
CN100396716C (zh) 2008-06-25
AU2003296306A1 (en) 2004-07-29
JP4607600B2 (ja) 2011-01-05
EP1572781A1 (en) 2005-09-14
JP2006511664A (ja) 2006-04-06
US7034089B2 (en) 2006-04-25
CN1747987A (zh) 2006-03-15
WO2004060976A1 (en) 2004-07-22

Similar Documents

Publication Publication Date Title
KR20050085802A (ko) 에폭시 관능성 하이브리드 코폴리머
KR100287636B1 (ko) 경화가능하거나 경화된 유기규소 조성물
IE901940A1 (en) Novel highly reactive silicon-containing epoxides
WO2007074813A1 (ja) 硬化性組成物
JPH02248464A (ja) 架橋ポリオルガノシロキサンに対する硬化性を有する硬化性ノルボルネン官能基シリコーン組成物
KR101408006B1 (ko) 에폭시 실리콘 축합물, 그 축합물을 포함하는 경화성 조성물 및 그 경화물
TW202104199A (zh) 脂環式環氧化合物製品
KR101215736B1 (ko) 에폭시 화합물 및 그 제조 방법
WO2021230152A1 (ja) ポリオルガノシルセスキオキサン、それを含む硬化性組成物、及びその硬化物
JP5040510B2 (ja) エポキシ樹脂組成物及び電子部品装置
EP3623404A1 (en) Composition for forming insulating film, insulating film, and semiconductor device including insulating film
JP5653826B2 (ja) エポキシ化合物、エポキシ基含有シリコーン化合物および硬化性組成物
US12552759B2 (en) Diepoxy compound, curable composition, cured product, and optical member
JP5040509B2 (ja) エポキシ樹脂組成物及び電子部品装置
WO2018088485A1 (ja) 共変性シリコーン
JP5943104B2 (ja) 硬化性組成物、硬化膜、ポリシロキサンおよび光半導体装置
JP5807427B2 (ja) 硬化性組成物、硬化膜、ポリシロキサンおよび光半導体装置
Herr et al. Synthesis and study of new radial organic/inorganic hybrid epoxides
JP5077630B2 (ja) エポキシ樹脂用硬化剤とその製造方法、エポキシ樹脂組成物及び電子部品装置
JP2003128779A (ja) 熱硬化性組成物
CN115340821A (zh) 一种金属基高强度室温固化苯基酰胺酯基硅树脂防护涂料及其制备方法和应用
WO2024043038A1 (ja) カチオン硬化型組成物、硬化物、及び光半導体装置
JP2025125318A (ja) シリル化ポリシルセスキオキサン、その製造方法、及びその用途
JPH07224074A (ja) 有機珪素化合物
JP2014055296A (ja) 放射線−または熱−硬化性バリヤシーラント

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20050617

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20081208

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20100824

Patent event code: PE09021S01D

N231 Notification of change of applicant
PN2301 Change of applicant

Patent event date: 20101013

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

N231 Notification of change of applicant
PN2301 Change of applicant

Patent event date: 20101105

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

Comment text: Final Notice of Reason for Refusal

Patent event date: 20110125

Patent event code: PE09021S02D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20110829

NORF Unpaid initial registration fee
PC1904 Unpaid initial registration fee