CN100344445C - 铜表面的对树脂粘接层 - Google Patents
铜表面的对树脂粘接层 Download PDFInfo
- Publication number
- CN100344445C CN100344445C CNB2004100341676A CN200410034167A CN100344445C CN 100344445 C CN100344445 C CN 100344445C CN B2004100341676 A CNB2004100341676 A CN B2004100341676A CN 200410034167 A CN200410034167 A CN 200410034167A CN 100344445 C CN100344445 C CN 100344445C
- Authority
- CN
- China
- Prior art keywords
- copper
- bonding layer
- resin
- resin bonding
- atom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 105
- 229920005989 resin Polymers 0.000 title claims abstract description 95
- 239000011347 resin Substances 0.000 title claims abstract description 95
- 239000010949 copper Substances 0.000 title claims abstract description 86
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 77
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 8
- 239000000956 alloy Substances 0.000 claims abstract description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 239000011651 chromium Substances 0.000 claims abstract description 4
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 4
- 239000010941 cobalt Substances 0.000 claims abstract description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 239000010931 gold Substances 0.000 claims abstract description 4
- 229910052742 iron Inorganic materials 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 239000004332 silver Substances 0.000 claims abstract description 4
- 239000010936 titanium Substances 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 239000011701 zinc Substances 0.000 claims abstract description 4
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 8
- 230000001070 adhesive effect Effects 0.000 abstract description 8
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 125000004429 atom Chemical group 0.000 description 30
- 239000011889 copper foil Substances 0.000 description 28
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 27
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 20
- 238000000034 method Methods 0.000 description 14
- 239000007864 aqueous solution Substances 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000001035 drying Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 9
- 238000005342 ion exchange Methods 0.000 description 9
- 238000003825 pressing Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- PNOXNTGLSKTMQO-UHFFFAOYSA-L diacetyloxytin Chemical compound CC(=O)O[Sn]OC(C)=O PNOXNTGLSKTMQO-UHFFFAOYSA-L 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 7
- 239000002131 composite material Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- -1 silicon alkane Chemical class 0.000 description 7
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 7
- 229940071536 silver acetate Drugs 0.000 description 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 229910000906 Bronze Inorganic materials 0.000 description 5
- 239000010974 bronze Substances 0.000 description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229960004643 cupric oxide Drugs 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 229910000563 Arsenical copper Inorganic materials 0.000 description 1
- 238000000864 Auger spectrum Methods 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- ZTXONRUJVYXVTJ-UHFFFAOYSA-N chromium copper Chemical compound [Cr][Cu][Cr] ZTXONRUJVYXVTJ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical compound [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical class O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- LPUQAYUQRXPFSQ-DFWYDOINSA-M monosodium L-glutamate Chemical compound [Na+].[O-]C(=O)[C@@H](N)CCC(O)=O LPUQAYUQRXPFSQ-DFWYDOINSA-M 0.000 description 1
- 235000013923 monosodium glutamate Nutrition 0.000 description 1
- 239000004223 monosodium glutamate Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- KOECRLKKXSXCPB-UHFFFAOYSA-K triiodobismuthane Chemical compound I[Bi](I)I KOECRLKKXSXCPB-UHFFFAOYSA-K 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
- G09B19/00—Teaching not covered by other main groups of this subclass
- G09B19/06—Foreign languages
- G09B19/08—Printed or written appliances, e.g. text books, bilingual letter assemblies, charts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D5/00—Sheets united without binding to form pads or blocks
- B42D5/04—Calendar blocks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Business, Economics & Management (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Computational Linguistics (AREA)
- Entrepreneurship & Innovation (AREA)
- Physics & Mathematics (AREA)
- Educational Administration (AREA)
- Educational Technology (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明提供一种对树脂粘接层,是在铜表面上形成的对树脂粘接层,其中:含有由(a)铜、(b)锡、和(c)选自银、锌、铝、钛、铋、铬、铁、钴、镍、钯、金和铂中的至少一种金属(第三金属)构成的合金,上述铜为1~50原子%,上述锡为20~98原子%、上述第三金属为1~50原子%,厚度为0.001μm以上1μm以下。由此可提高铜与树脂的粘接力。
Description
技术领域
本发明涉及铜表面的对树脂粘接层。更详细讲,涉及在印刷布线基板、半导体安装件、液晶装置、电致发光等各种电子部件中使用的铜表面的对树脂粘接层。
背景技术
一般的多层布线板的制造,是表面上具有由铜形成的导电层的内层基板,夹着半固化片(prepreg),与其他内层基板、铜箔进行层压压制来实现的。导电层间,通过对孔壁进行镀铜的被称为‘通孔’的贯通孔,进行电连接。为了提高与半固化片的粘接性,在上述内层基板的铜表面,形成被称为‘黑色氧化物’、‘褐色氧化物’的针状的氧化铜。利用该方法,由于针状的氧化铜深入到半固化片中,产生锚的效果,从而可提高粘接性。
虽然上述氧化铜与半固化片的粘接性优异,但存在下述问题,即,在对通孔进行镀的工序中,在与酸性液接触时,溶解、变色,容易产生被称为‘耙地’的缺陷。
因此,作为取代黑色氧化物和褐色氧化物的方法,如EPC公开0216531A1号说明书和特开平4-233793号公报中所提出的方案那样,提出了在内层基板的铜表面上形成锡层的方法。另外,在特开平1-109796号公报中提出了下述方案,即,为了提高铜和树脂的粘接性,在铜表面上镀锡后,再用硅烷偶合剂进行处理。在特开2000-340948号公报中提出下述方案,即,为了提高铜和树脂的粘接性,在铜表面上形成铜锡合金层。另外,还提出了利用蚀刻使铜表面粗糙化,可实现锚的效果。
然而,如上所述,利用在铜表面上形成锡层或铜锡合金层的方法,在树脂的种类是玻璃化转变温度很高、所谓硬树脂的情况下,有时粘接性提高效果不充分。另外,利用上述专利文献3中所述的方法,由于镀锡,铜会溶到镀液中,使布线变细。而且,在使用硅烷偶合剂时,存在难以处理的问题,与树脂的粘接性也不充分。
发明内容
本发明就是为解决上述现有的问题,提供一种在铜表面上形成的提高铜与树脂和粘接力的对树脂粘接层。
本发明的对树脂粘接层,是在铜表面上形成的对树脂粘接层,其中:含有由(a)铜、(b)锡、和(c)选自银、锌、铝、钛、铋、铬、铁、钴、镍、钯、金和铂中的至少一种金属(第三金属)构成的合金,上述铜为1~50原子%,上述锡为20~98原子%、上述第三金属为1~50原子%,厚度为0.001μm以上1μm以下。
具体实施方式
本发明是,在铜表面上形成由铜、锡和第三金属的合金构成的对树脂粘接层。利用该对树脂粘接层,改进了铜和树脂的粘接性。
就铜表面来说,只要是与树脂进行粘接的铜表面就可以,没有特别限制。例如可举出使用于电子基板、标准框等电子部件、装饰品、建材等中的箔(电解铜箔、压延铜箔)、镀膜(无电解铜镀膜、电解铜镀膜)、线、棒、管、板等各种用途的铜表面。上述铜,可以是黄铜、青铜、白铜、砷铜、硅铜、钛铜、铬铜等根据其目的而含有其他元素的铜。
上述铜表面的形状,可以是平滑的,也可以是利用蚀刻等被粗糙化的表面。例如,为了在与树脂进行层压时获得锚的效果,优选是粗糙化的表面。另外,近年来,在高频电信号流过的铜布线的情况下,优选是中心线平均粗糙度Ra为0.1μm以下左右的平滑。在特别微细的铜布线的情况下,在本发明中,不必依靠表面粗糙化产生的锚效果,即使是平滑的表面,也能得到充分的粘接性,所以不用担心为了粗糙化进行蚀刻而造成的断线等问题。
对树脂的粘接层,是由铜、锡、和第三金属(选自银、锌、铝、钛、铋、铬、铁、钴、镍、钯、金和铂中的至少一种的金属)的合金形成的层,当铜表面上存在该层,在与树脂进行粘接时,可显著提高铜与树脂的粘接性。对树脂粘接层的组成是,铜为1~50原子%,优选为5~45原子%,更优选为10~40原子%。铜超过50原子%或不足1原子%时,与树脂的粘接性不充分。
对树脂粘接层的锡为20~98原子%,优选为30~90原子%,更优选为40~80原子%。锡超过98原子%或不足20原子%时,与树脂的粘接性不充分。
对树脂粘接层的第三金属为1~50原子%,优选为2~45原子%,更优选为3~40原子%。第三金属超过50原子%或不足1原子%时,与树脂的粘接性不充分。
就对树脂粘接层来说,由于基底是铜,所以通过原子扩散,铜的比率从表面到深处逐渐增加。本说明书中所说的所谓‘对树脂粘接层’,是指组成为上述范围的合金层。
该表面的金属的比率,可利用俄歇电子分光分析、ESCA(X射线光电子分光法)、EPMA(电子探针X射线微区分析器)等,进行测定。
另外,在铜锡合金中,通过与空气接触等而含有氧原子,即使存在氧原子,对与树脂的粘接性,也不会造成恶劣影响。因此,在经过促进粘接层氧化那样的加热等处理后,仍能保持本发明的效果。另外,粘接层中也可含有通常来自各种污染源的其他种类的原子。
对树脂粘接层的厚度为0.001~1μm,优选为0.001~0.5μm,更优选为0.001~0.1μm。超过1μm时或不足0.001μm时,与树脂的粘接性不充分。
就对树脂粘接层的形成方法来说,没有特别限制,例如,有在铜表面上形成锡和第三金属的合金层后、在铜表面上残留下铜、锡和第三金属的合金层以及除去锡和第三金属的合金的方法。
当在铜表面上形成锡和第三金属的合金层时,通过扩散,在铜和锡及第三金属的界面处,形成铜、锡和第三金属的合金层(粘接层)。
作为上述锡和第三金属的合金层的形成方法来说,例如,可举出下述方法,即,与含有:
a.硫酸等无机酸、乙酸等有机酸1~50质量%、
b.硫酸亚锡等亚锡盐0.05~10质量%(按锡浓度计)、
c.乙酸银等金属盐0.1~20质量%、
d.硫脲等反应促进剂1~50质量%、和
e.二乙二醇等扩散系保持溶剂1~80质量%的水溶液进行接触的方法。
上述反应促进剂,是指与基底的铜进行配位形成螯合物、提高对树脂粘接层在铜表面上的形成速度的物质。所谓上述扩散系保持溶剂,是指很容易在铜表面附近维持所需要的反应成分浓度的溶剂。
对于使上述对树脂粘接层形成液与铜表面接触时的条件,没有特别限定,例如,可利用浸渍法等,在10~70℃,接触5秒钟~5分钟。
由此,在铜表面上形成锡和第三金属的合金层时,可通过扩散,在铜和锡及第三金属的界面处,形成铜、锡及第三金属的合金层(粘接层)。
为了促进上述扩散,可以进行热处理等。
作为只除去上述锡及第三金属的合金层的方法来说,可以举出利用蚀刻液有选择地只蚀刻锡及第三金属的合金层的方法。
作为上述选择性蚀刻液来说,例如可使用美格株式会社(メツク社)制的商品名为“メツクリム一バ一S-651A”等。作为别的例子来说,也可使用含有硝酸等无机酸的水溶液。
另外,通过选择上述水溶液的组成、与其接触的条件,可以在铜表面上直接形成由铜、锡及第三金属构成的粘接层。
如上述那样,在铜表面上形成的对树脂粘接层,显著提高了铜与各种树脂的粘接性。
成为粘接对象的树脂,例如有AS树脂、ABS树脂、氟树脂、聚酰胺、聚乙烯,聚对苯二甲酸乙二醇酯、聚偏氯乙烯、聚氯乙烯、聚碳酸酯、聚苯乙烯、聚砜、聚丙烯、液晶聚合物等热塑性树脂、和环氧树脂、酚醛树脂、聚酰亚胺、聚氨酯、二马来酸酐缩亚胺-三嗪树脂、聚苯醚、氰酸酯等热固性树脂等。这些树脂可利用官能基进行改性,也可用玻璃纤维、芳族聚酰胺纤维、其他纤维等进行强化。
在具有铜和树脂的界面的布线基板的铜表面上,形成本发明的对树脂粘接层时,作为导电层的铜与层间绝缘树脂(半固化片、无电解镀用粘接剂、膜状树脂、液状树脂、感光性树脂、热固性树脂、热塑性树脂)、焊料保护膜、蚀刻保护膜、导电性树脂、导电性糊、导电性粘接剂、介电体用树脂、埋孔用树脂、挠性包覆膜等的粘接性优异,所以成为可靠性高的布线基板。
特别适宜用作形成微细的铜布线和通孔的复合基板。在上述复合基板上,有总括层压方式的复合基板、和按序排列复合方式的复合基板。
另外,在所谓的被称为‘金属芯基板’的使用铜板作为心材的基板中,在铜板的表面成为上述对树脂粘接层的情况下,是再与铜板进行层压并且与绝缘树脂的粘接性优异的金属芯基板。
如上述所说明的那样,本发明,通过在铜表面上形成由铜、锡和第三金属的合金构成的树脂粘接层,可进一步提高铜与树脂的粘接力。
以下,列举实施例,进一步具体地说明本发明。
实施例1
对厚度为35μm的电解铜箔,在室温下,喷淋10秒钟的5%的盐酸,洗净后,进行水洗、干燥。接着,在由乙酸20%(质量%,以下相同)、乙酸亚锡2%(按Sn2+计)、乙酸银3%(按Ag+计)、硫脲15%、二乙二醇30%和其余为离子交换水构成的水溶液中,在30℃下,浸渍30秒钟后,进行水洗、干燥。
接着,在室温下,在美格株式会社(メツク社)制的商品名为“メツクリム一バ一S-651A”(以硝酸为主成分的水溶液)中,浸渍30秒钟后,进行水洗、干燥,在铜箔表面上形成了对树脂粘接层。利用俄歇分光分析仪测定所得到的表面的原子组成,结果示于表1中。对树脂粘接层的厚度也示于表1中。
接着,在得到的铜箔单面上,重叠上带铜箔的复合布线板用树脂(味の素(株)制的ABF-SHC带铜箔树脂),边加热边压制。按照JIS C 6481的标准,测定所得到的层压体的电解铜箔的剥离强度。结果示于表1中。
实施例2
将与实施例1同样地进行洗净的电解铜箔,在由乙酸17%、乙酸亚锡2%(按Sn2+计)、碘化铋1.5%(按Bi2+计)、硫脲21%、溶纤剂32%和其余为离子交换水构成的水溶液中,在30℃下,浸渍30秒钟后,进行水洗、干燥,除此之外,与实施例1同样,形成了对树脂粘接层。所得到的表面的原子组成、对树脂粘接层的厚度示于表1中。
接着,与实施例1同样,测定铜箔的剥离强度。其结果示于表1中。
实施例3
将与实施例1同样地进行洗净的电解铜箔,在由硫酸15%、硫酸亚锡1.5%(按Sn2+计)、硫酸镍3.5%(按Ni+计)、硫脲21%、二乙二醇30%和其余为离子交换水构成的水溶液中,在30℃下,浸渍30秒钟后,进行水洗、干燥,除此之外,与实施例1同样,形成了对树脂粘接层。所得到的表面的原子组成、对树脂粘接层的厚度示于表1中。
接着,与实施例1同样,测定铜箔的剥离强度。其结果示于表1中。
实施例4
将与实施例1同样地进行洗净的电解铜箔,在由乙酸20%、乙酸亚锡2%(按Sn2+计)、乙酸银0.1%(按Ag+计)、硫脲15%、二乙二醇30%和其余为离子交换水构成的水溶液中,在30℃下,浸渍30秒钟后,进行水洗、干燥,除此之外,与实施例1同样,形成了对树脂粘接层。所得到的表面的原子组成、对树脂粘接层的厚度示于表1中。
接着,与实施例1同样,测定铜箔的剥离强度。其结果示于表1中。
实施例5
将与实施例1同样地进行洗净的电解铜箔,在由乙酸20%、乙酸亚锡2%(按Sn2+计)、乙酸银10.0%(按Ag+计)、硫脲15%、二乙二醇30%和其余为离子交换水构成的水溶液中,在30℃下,浸渍30秒钟后,进行水洗、干燥,除此之外,与实施例1同样,形成了对树脂粘接层。所得到的表面的原子组成、对树脂粘接层的厚度示于表1中。
接着,与实施例1同样,测定铜箔的剥离强度。其结果示于表1中。
实施例6
除了将实施例1中在由乙酸20%、乙酸亚锡2%(按Sn2+计)、乙酸银3%(按Ag+计)、硫脲15%、二乙二醇30%和其余为离子交换水构成的水溶液中浸渍的时间变成5秒钟之外,其他与实施例1同样,形成了对树脂粘接层。所得到的表面的原子组成、对树脂粘接层的厚度示于表1中。接着,与实施例1同样,测定铜箔的剥离强度。结果示于表1中。
实施例7
除了将实施例1中在由乙酸20%、乙酸亚锡(按Sn2+计)、乙酸银3%(按Ag+计)、硫脲15%、二乙二醇30%和其余为离子交换水构成的水溶液中浸渍的时间变成5分钟、将温度变成45℃之外,其他与实施例1同样,形成了对树脂粘接层。所得到的表面的原子组成、对树脂粘接层的厚度示于表1中。
接着,与实施例1同样,测定铜箔的剥离强度。其结果示于表1中。
实施例8
将与实施例1同样地进行洗净的电解铜箔,在由乙酸20%、乙酸亚锡2%(按Sn2+计)、乙酸银20.0%(按Ag+计)、硫脲15%、二乙二醇30%和其余为离子交换水构成的水溶液中,在30℃下,浸渍30秒钟后,进行水洗、干燥,除此之外,与实施例1同样,形成了对树脂粘接层。所得到的表面的原子组成、对树脂粘接层的厚度示于表1中。
接着,与实施例1同样,测定铜箔的剥离强度。其结果示于表1中。
比较例1
对厚度为35μm的电解铜箔,在室温下,喷淋10秒钟的5%的盐酸,洗净后,进行水洗、干燥。接着,在由乙酸20%、乙酸亚锡2%(按Sn2+计)、硫脲15%、二乙二醇30%和其余为离子交换水构成的水溶液中,在30℃下,浸渍30秒钟后,进行水洗、干燥,在铜箔表面上形成了锡层。
接着,与实施例1同样,与复合布线板用树脂进行层压,评价了与电解铜箔的剥离强度,其结果示于表1中。
比较例2
与实施例1同样,在铜箔表面上形成了锡层。
接着,在美格株式会社(メツク社)制的メツクリム一バ一S-651A中,在室温下,浸渍30秒钟后,进行水洗、干燥,在铜箔表面上形成了对树脂粘接层。
接着,与实施例1同样,与复合布线板用树脂进行层压,评价了与电解铜箔的剥离强度,其结果示于表1中。
表1
实施例序号 | 对树脂粘接层原子组成(原子%) | 对树脂粘接层厚度(μm) | 剥离强度试验(kgf/cm) |
1 | Cu/Sn/Ag=33/58/9 | 0.009 | 1.15 |
2 | Cu/Sn/Bi=28/69/3 | 0.015 | 1.08 |
3 | Cu/Sn/Ni=39/50/11 | 0.007 | 1.00 |
4 | Cu/Sn/Ag=1/98/1 | 0.09 | 0.91 |
5 | Cu/Sn/Ag=50/20/30 | 0.008 | 0.89 |
6 | Cu/Sn/Ag=31/60/9 | 0.001 | 0.89 |
7 | Cu/Sn/Ag=15/75/10 | 1.000 | 0.83 |
8 | Cu/Sn/Ag=20/30/50 | 0.005 | 0.85 |
比较例1 | Sn=100 | (锡层的厚度)0.20 | 0.20 |
比较例2 | Cu/Sn=70/30 | (铜锡合金层的厚度)0.05 | 0.35 |
由表1可知,可以确认本实施例的对树脂粘接层,铜箔的剥离强度(粘接力)很高。
Claims (8)
1.一种在铜表面上形成的对树脂粘接层,其特征在于:
含有由
(a)铜、
(b)锡、和
(c)第三金属,选自银、锌、铝、钛、铋、铬、铁、钴、镍、钯、金和铂中的至少一种金属构成的合金,
所述铜为10~40原子%,所述锡为20~98原子%、所述第三金属为2~45原子%,而且所述铜、所述锡和所述第三金属的合计为100原子%,
厚度为0.001μm以上1μm以下。
2.根据权利要求1所述的对树脂粘接层,其特征在于:所述铜表面的形状是平滑的。
3.根据权利要求1所述的对树脂粘接层,其特征在于:所述铜表面的形状是粗糙的。
4.根据权利要求1所述的对树脂粘接层,其特征在于:所述对树脂粘接层的锡是在30~90原子%的范围。
5.根据权利要求4所述的对树脂粘接层,其特征在于:所述对树脂粘接层的锡是在40~80原子%的范围。
6.根据权利要求1所述的对树脂粘接层,其特征在于:所述对树脂粘接层的第三金属是在3~40原子%的范围,而且所述铜、所述锡和所述第三金属的合计为100原子%。
7.根据权利要求1所述的对树脂粘接层,其特征在于:所述对树脂粘接层的厚度是在0.001~0.5μm的范围。
8.根据权利要求7所述的对树脂粘接层,其特征在于:所述对树脂粘接层的厚度是在0.001~0.1μm的范围。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003125632 | 2003-04-30 | ||
JP2003125632 | 2003-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1542072A CN1542072A (zh) | 2004-11-03 |
CN100344445C true CN100344445C (zh) | 2007-10-24 |
Family
ID=33308178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100341676A Expired - Fee Related CN100344445C (zh) | 2003-04-30 | 2004-04-23 | 铜表面的对树脂粘接层 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7029761B2 (zh) |
JP (1) | JP5392732B2 (zh) |
KR (1) | KR20040094375A (zh) |
CN (1) | CN100344445C (zh) |
DE (1) | DE102004019877B4 (zh) |
TW (1) | TWI356850B (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7713859B2 (en) * | 2005-08-15 | 2010-05-11 | Enthone Inc. | Tin-silver solder bumping in electronics manufacture |
KR100717909B1 (ko) * | 2006-02-24 | 2007-05-14 | 삼성전기주식회사 | 니켈층을 포함하는 기판 및 이의 제조방법 |
DE102007045794A1 (de) * | 2006-09-27 | 2008-04-17 | MEC Co., Ltd., Amagasaki | Haftvermittler für Harz und Verfahren zur Erzeugung eines Laminates, umfassend den Haftvermittler |
JP4831783B2 (ja) * | 2008-02-01 | 2011-12-07 | メック株式会社 | 導電層及びこれを用いた積層体と、これらの製造方法 |
JP5317099B2 (ja) * | 2008-07-02 | 2013-10-16 | メック株式会社 | 接着層形成液 |
KR101412795B1 (ko) * | 2009-01-29 | 2014-06-27 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 전자 회로용 압연 동박 또는 전해 동박 및 이들을 사용한 전자 회로의 형성 방법 |
US9175400B2 (en) * | 2009-10-28 | 2015-11-03 | Enthone Inc. | Immersion tin silver plating in electronics manufacture |
US20140238741A1 (en) * | 2012-03-19 | 2014-08-28 | Delphi Technologies, Inc. | Hermetically sealed wire connector assembly and method of making same |
JP6084139B2 (ja) * | 2013-09-05 | 2017-02-22 | オリンパス株式会社 | 半導体基板およびその製造方法 |
CN103596381B (zh) * | 2013-11-08 | 2016-04-27 | 溧阳市江大技术转移中心有限公司 | 一种印刷电路板的制造方法 |
CN103596382A (zh) * | 2013-11-08 | 2014-02-19 | 溧阳市江大技术转移中心有限公司 | 一种印刷电路板 |
CN103596383B (zh) * | 2013-11-08 | 2016-08-17 | 溧阳市江大技术转移中心有限公司 | 一种具有交错间隔的合金柱的印刷电路板的制造方法 |
JP6522425B2 (ja) * | 2015-05-28 | 2019-05-29 | 石原ケミカル株式会社 | 銅表面処理用の置換ニッケルメッキ浴、当該メッキ浴を用いた銅張り部品の製造方法並びに当該銅張り部品 |
US10580567B2 (en) * | 2016-07-26 | 2020-03-03 | Samsung Electro-Mechanics Co., Ltd. | Coil component and method of manufacturing the same |
CN106939417B (zh) * | 2017-04-28 | 2018-01-09 | 深圳市创智成功科技有限公司 | 印制线路板的化学镀锡溶液 |
CN111864329A (zh) * | 2020-08-03 | 2020-10-30 | 江西沃格光电股份有限公司 | 介质谐振器及其制备方法、介质滤波器和通信设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2030176A (en) * | 1978-07-20 | 1980-04-02 | Mitsui Anaconda Electro Copper | Copper foil suitable for use in making printed circuits |
JPS5856758B2 (ja) * | 1975-12-17 | 1983-12-16 | ミツイアナコンダドウハク カブシキガイシヤ | ドウハクヒヨウメンシヨリホウホウ |
JPS63312830A (ja) * | 1987-06-16 | 1988-12-21 | Tanaka Kikinzoku Kogyo Kk | 基板への貴金属箔の圧着方法 |
TW231396B (en) * | 1994-02-15 | 1994-10-01 | Mitsui Mining & Smelting Co | Copper foil for PCB and its process |
CN1358409A (zh) * | 2000-01-28 | 2002-07-10 | 三井金属鉱业株式会社 | 表面处理的铜箔及其制备方法和使用该铜箔的覆铜层压物 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4715894A (en) | 1985-08-29 | 1987-12-29 | Techno Instruments Investments 1983 Ltd. | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
IL81530A0 (en) | 1987-02-10 | 1987-09-16 | Techno Chemica Ltd | Tin coating immersion solution and coating process using the same |
EP0310010B1 (en) | 1987-10-01 | 1994-01-12 | Mcgean-Rohco, Inc. | Multilayer printed circuit board formation |
JPH04284690A (ja) * | 1991-03-13 | 1992-10-09 | Furukawa Saakitsuto Foil Kk | 多層プリント配線板内層回路用銅箔及びその製造方法 |
CA2042739A1 (en) | 1990-07-31 | 1992-02-01 | Edward T. Donlon | Multilayer printed circuits and process for their fabrication |
KR930006103B1 (ko) * | 1991-03-11 | 1993-07-07 | 덕산금속 주식회사 | 인쇄회로용 전해동박 및 그 제조방법 |
US5491036A (en) * | 1992-03-27 | 1996-02-13 | The Louis Berkman Company | Coated strip |
US6080497A (en) * | 1992-03-27 | 2000-06-27 | The Louis Berkman Company | Corrosion-resistant coated copper metal and method for making the same |
US5597656A (en) * | 1993-04-05 | 1997-01-28 | The Louis Berkman Company | Coated metal strip |
DE4336664A1 (de) * | 1993-10-27 | 1995-05-04 | Demetron Gmbh | Werkstücke aus nichtkorrosionsbeständigen Metallen mit nach dem PVD-Verfahren aufgebrachten Überzügen |
JPH07314603A (ja) * | 1993-12-28 | 1995-12-05 | Nippon Denkai Kk | 銅張積層体、多層プリント回路板及びそれらの処理方法 |
JP3837622B2 (ja) | 1996-05-22 | 2006-10-25 | 石原薬品株式会社 | 無電解スズメッキ浴、及び当該メッキ浴を用いてスズメッキ皮膜を形成したtabのフィルムキャリア |
JP3408929B2 (ja) * | 1996-07-11 | 2003-05-19 | 同和鉱業株式会社 | 銅基合金およびその製造方法 |
JPH10144848A (ja) | 1996-11-07 | 1998-05-29 | Hitachi Cable Ltd | Loc用銅リードフレーム及びその製造方法 |
US6099713A (en) * | 1996-11-25 | 2000-08-08 | C. Uyemura & Co., Ltd. | Tin-silver alloy electroplating bath and tin-silver alloy electroplating process |
JPH1121673A (ja) | 1997-07-07 | 1999-01-26 | Ishihara Chem Co Ltd | 鉛フリーの無電解スズ合金メッキ浴及びメッキ方法、並びに当該無電解メッキ浴で鉛を含まないスズ合金皮膜を形成した電子部品 |
JP3359550B2 (ja) | 1997-10-08 | 2002-12-24 | イビデン株式会社 | 多層プリント配線板およびその製造方法 |
JP3816241B2 (ja) * | 1998-07-14 | 2006-08-30 | 株式会社大和化成研究所 | 金属を還元析出させるための水溶液 |
JP3142259B2 (ja) * | 1998-11-30 | 2001-03-07 | 三井金属鉱業株式会社 | 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法 |
JP2000340948A (ja) | 1999-06-01 | 2000-12-08 | Mec Kk | 銅と樹脂との接着性を向上させる方法およびそれを用いて製造される多層配線板 |
JP3433291B2 (ja) * | 1999-09-27 | 2003-08-04 | 石原薬品株式会社 | スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品 |
US6821323B1 (en) * | 1999-11-12 | 2004-11-23 | Enthone Inc. | Process for the non-galvanic tin plating of copper or copper alloys |
US6361823B1 (en) * | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
DE60226196T2 (de) * | 2001-05-24 | 2009-05-14 | Shipley Co., L.L.C., Marlborough | Zinn-Plattieren |
US6924044B2 (en) * | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
JP4698904B2 (ja) * | 2001-09-20 | 2011-06-08 | 株式会社大和化成研究所 | 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品 |
KR100495184B1 (ko) * | 2002-12-02 | 2005-06-14 | 엘지마이크론 주식회사 | 테이프기판 및 그의 주석도금방법 |
-
2004
- 2004-04-16 US US10/826,508 patent/US7029761B2/en not_active Expired - Lifetime
- 2004-04-20 TW TW93110949A patent/TWI356850B/zh active
- 2004-04-23 CN CNB2004100341676A patent/CN100344445C/zh not_active Expired - Fee Related
- 2004-04-23 DE DE200410019877 patent/DE102004019877B4/de not_active Expired - Fee Related
- 2004-04-30 KR KR1020040030618A patent/KR20040094375A/ko active Search and Examination
-
2012
- 2012-02-13 JP JP2012027913A patent/JP5392732B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5856758B2 (ja) * | 1975-12-17 | 1983-12-16 | ミツイアナコンダドウハク カブシキガイシヤ | ドウハクヒヨウメンシヨリホウホウ |
GB2030176A (en) * | 1978-07-20 | 1980-04-02 | Mitsui Anaconda Electro Copper | Copper foil suitable for use in making printed circuits |
JPS6152240B2 (zh) * | 1978-07-20 | 1986-11-12 | Mitsui Mining & Smelting Co | |
JPS63312830A (ja) * | 1987-06-16 | 1988-12-21 | Tanaka Kikinzoku Kogyo Kk | 基板への貴金属箔の圧着方法 |
TW231396B (en) * | 1994-02-15 | 1994-10-01 | Mitsui Mining & Smelting Co | Copper foil for PCB and its process |
CN1358409A (zh) * | 2000-01-28 | 2002-07-10 | 三井金属鉱业株式会社 | 表面处理的铜箔及其制备方法和使用该铜箔的覆铜层压物 |
Non-Patent Citations (1)
Title |
---|
乙二醇在电镀工业中的应用 吴水清,电镀与涂饰,第14卷第2期 1995 * |
Also Published As
Publication number | Publication date |
---|---|
DE102004019877A1 (de) | 2004-12-02 |
DE102004019877B4 (de) | 2009-06-25 |
TW200427851A (en) | 2004-12-16 |
US20040219375A1 (en) | 2004-11-04 |
JP2012094918A (ja) | 2012-05-17 |
US7029761B2 (en) | 2006-04-18 |
JP5392732B2 (ja) | 2014-01-22 |
CN1542072A (zh) | 2004-11-03 |
KR20040094375A (ko) | 2004-11-09 |
TWI356850B (en) | 2012-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100344445C (zh) | 铜表面的对树脂粘接层 | |
KR101506226B1 (ko) | 금속 표면 조화층을 갖는 금속층 적층체 및 그 제조 방법 | |
CN1825581A (zh) | 印刷电路板,倒装芯片球栅阵列板及其制造方法 | |
CN1723745A (zh) | 带有极薄粘接剂层的铜箔及其制造方法 | |
CN1302179A (zh) | 使用粘结膜的多层印刷电路板的制造方法 | |
CN101919008A (zh) | 表面处理促进金属镀覆的方法和形成的器件 | |
CN1777348A (zh) | 制造高密度印刷电路板的方法 | |
CN104904326A (zh) | 用于生产印制电路板的半成品、印制电路板及其生产方法 | |
CN1225950C (zh) | 电路板 | |
CN109252148B (zh) | 在感光性树脂的表面形成金属层的方法 | |
KR100691336B1 (ko) | 빌드업 방식에 의한 연성 반도체기판의 제조방법 | |
US7982138B2 (en) | Method of nickel-gold plating and printed circuit board | |
CN1542073A (zh) | 粘接层形成液、使用该液的铜和树脂的粘接层的制造方法及其层压体 | |
CN1770439A (zh) | Cof用敷铜箔板以及cof用载置带 | |
JP5074882B2 (ja) | 多層プリント配線板の製造方法及びその製造方法で得られた多層プリント配線板 | |
US7297757B2 (en) | Resin surface treating agent and resin surface treatment | |
CN1508286A (zh) | 金属膜形成方法、半导体器件和布线基板 | |
JP2828032B2 (ja) | 多層配線構造体の製造方法 | |
JP2016089112A (ja) | 樹脂組成物 | |
JPH09246716A (ja) | 表層プリント配線板(slc)の製造方法 | |
JP2004349693A (ja) | 銅表面の対樹脂接着層 | |
JP2001203464A (ja) | ビルドアップ多層プリント配線板及びその製造方法 | |
JPS5856386A (ja) | 印刷配線板の製造法 | |
CN1376018A (zh) | 多层印刷布线基板及其制造方法 | |
JPH06152126A (ja) | 配線板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071024 |
|
CF01 | Termination of patent right due to non-payment of annual fee |