BR0213421A - método para formar uma camada de metal condutor em uma superfìcie não condutora - Google Patents

método para formar uma camada de metal condutor em uma superfìcie não condutora

Info

Publication number
BR0213421A
BR0213421A BRPI0213421-7A BR0213421A BR0213421A BR 0213421 A BR0213421 A BR 0213421A BR 0213421 A BR0213421 A BR 0213421A BR 0213421 A BR0213421 A BR 0213421A
Authority
BR
Brazil
Prior art keywords
forming
metal layer
conductive metal
nonconductive surface
conductive
Prior art date
Application number
BRPI0213421-7A
Other languages
English (en)
Inventor
Nayan H Joshi
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BR0213421A publication Critical patent/BR0213421A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

"MéTODO PARA FORMAR UMA CAMADA DE METAL CONDUTOR EM UMA SUPERFìCIE NãO CONDUTORA". Expõe-se um método para formar uma camada de metal condutor em uma superfície não condutora, o qual inclui proporcionar uma superfície não condutora; contactar a superfície não condutora com uma solução aquosa ou mistura que contém um sal estânico para formar uma superfície sensibilizada; contactar a superfície sensibilizada com uma solução aquosa ou mistura que contém um sal de prata dotado de um pH na faixa de cerca de 5 até cerca de 10 para formar uma superfície catalisada; e chapear sem eletrólise a superficie catalisada, mediante aplicação de uma solução de chapeamento sem eletrólise à superfície catalisada.
BRPI0213421-7A 2001-10-17 2002-09-25 método para formar uma camada de metal condutor em uma superfìcie não condutora BR0213421A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/981,587 US6645557B2 (en) 2001-10-17 2001-10-17 Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
PCT/US2002/030444 WO2003033764A2 (en) 2001-10-17 2002-09-25 Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions

Publications (1)

Publication Number Publication Date
BR0213421A true BR0213421A (pt) 2006-05-23

Family

ID=25528490

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0213421-7A BR0213421A (pt) 2001-10-17 2002-09-25 método para formar uma camada de metal condutor em uma superfìcie não condutora

Country Status (8)

Country Link
US (1) US6645557B2 (pt)
EP (1) EP1453988B1 (pt)
JP (1) JP4729255B2 (pt)
CN (1) CN100338259C (pt)
AT (1) ATE512236T1 (pt)
AU (1) AU2002327725A1 (pt)
BR (1) BR0213421A (pt)
WO (1) WO2003033764A2 (pt)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4482744B2 (ja) * 2001-02-23 2010-06-16 株式会社日立製作所 無電解銅めっき液、無電解銅めっき方法、配線板の製造方法
US20030108751A1 (en) * 2001-11-16 2003-06-12 Yukitaka Hasegawa Plated articles and methods for producing the plated articles
JP3881614B2 (ja) * 2002-05-20 2007-02-14 株式会社大和化成研究所 回路パターン形成方法
FR2840761B1 (fr) * 2002-06-06 2004-08-27 Framatome Connectors Int Pieces en matieres plastique metallisees
JP4266310B2 (ja) * 2003-01-31 2009-05-20 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 感光性樹脂組成物および該組成物を用いた樹脂パターンの形成方法
EP1638699A4 (en) * 2003-05-02 2008-04-02 Noble Fiber Technologies Llc IMPROVED METALLION DELIVERABLES FOR ANTIMICROBIAL APPLICATIONS
TWI291322B (en) * 2003-05-20 2007-12-11 Laird Technologies Inc Method for manufacturing an EMI shielding element
US7049234B2 (en) * 2003-12-22 2006-05-23 Intel Corporation Multiple stage electroless deposition of a metal layer
US20050199587A1 (en) * 2004-03-12 2005-09-15 Jon Bengston Non-chrome plating on plastic
US6933231B1 (en) * 2004-06-28 2005-08-23 Micron Technology, Inc. Methods of forming conductive interconnects, and methods of depositing nickel
JP4805270B2 (ja) * 2004-08-23 2011-11-02 ノーブル ファイバー テクノロジーズ エルエルシー 抗微生物材料およびろ過材料製造用ポリマー発泡体の金属処理方法
US7332193B2 (en) * 2004-10-18 2008-02-19 Enthone, Inc. Cobalt and nickel electroless plating in microelectronic devices
US20060108227A1 (en) * 2004-11-23 2006-05-25 The Alfred E. Mann Foundation For Scientific Research Electroless plated nickel on zirconia
US7354354B2 (en) 2004-12-17 2008-04-08 Integran Technologies Inc. Article comprising a fine-grained metallic material and a polymeric material
US20060225605A1 (en) * 2005-04-11 2006-10-12 Kloeckener James R Aqueous coating compositions and process for treating metal plated substrates
JP5517275B2 (ja) * 2005-10-03 2014-06-11 奥野製薬工業株式会社 クロム酸−硫酸混液によるエッチング処理の後処理剤
EP1793013B1 (en) * 2005-12-05 2017-07-19 Rohm and Haas Electronic Materials LLC Metallization of dielectrics
JP4275157B2 (ja) 2006-07-27 2009-06-10 荏原ユージライト株式会社 プラスチック表面の金属化方法
JP5715748B2 (ja) * 2008-10-31 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 無電解めっき用コンディショナー
US20100159260A1 (en) * 2008-12-23 2010-06-24 E. I. Du Pont De Nemours And Company Chrome-free method of conditioning and etching of a thermoplastic substrate for metal plating
WO2010113715A1 (ja) * 2009-03-31 2010-10-07 日鉱金属株式会社 半導体装置の製造方法及び半導体装置
CN101928937B (zh) * 2009-06-22 2012-02-22 比亚迪股份有限公司 一种胶体钯活化液及其制备方法和一种非金属表面活化方法
JP4918123B2 (ja) * 2009-09-17 2012-04-18 トヨタ自動車株式会社 無電解めっき素材の製造方法
JP4930804B2 (ja) * 2009-09-17 2012-05-16 トヨタ自動車株式会社 無電解めっき素材の製造方法
CN103282545B (zh) * 2010-09-03 2015-08-26 Omg电子化学品有限责任公司 无电镍合金镀液及其沉积过程
ES2685177T3 (es) * 2010-11-26 2018-10-05 C. R. Bard, Inc. Deposición de una capa de plata sobre un sustrato no conductor
US20120295121A1 (en) * 2011-05-20 2012-11-22 S.T. Trading Company Limited Fabrication of mirror-like coatings
CN102296332A (zh) * 2011-09-05 2011-12-28 厦门华戎能源科技有限公司 一种聚乙烯表面直接镀导电金属的方法
US20130084395A1 (en) * 2011-09-29 2013-04-04 Roshan V. Chapaneri Treatment of Plastic Surfaces After Etching in Nitric Acid Containing Media
CN103088322A (zh) * 2011-11-01 2013-05-08 郑钧介 应用化学还原沉积金属于植物表面的镀膜方法
CN102367576B (zh) * 2011-11-17 2013-04-03 兰州陇能电力科技有限公司 一种edta低温清洗助剂及其应用
EP2610366A3 (en) 2011-12-31 2014-07-30 Rohm and Haas Electronic Materials LLC Plating catalyst and method
EP2610365B1 (en) 2011-12-31 2020-02-26 Rohm and Haas Electronic Materials LLC Electroless plating method
US10260000B2 (en) 2012-01-23 2019-04-16 Macdermid Acumen, Inc. Etching of plastic using acidic solutions containing trivalent manganese
US9752241B2 (en) 2012-01-23 2017-09-05 Macdermid Acumen, Inc. Electrolytic generation of manganese (III) ions in strong sulfuric acid using an improved anode
US9534306B2 (en) 2012-01-23 2017-01-03 Macdermid Acumen, Inc. Electrolytic generation of manganese (III) ions in strong sulfuric acid
JP6085833B2 (ja) * 2012-07-04 2017-03-01 福井県 紙への無電解めっき方法
US9364822B2 (en) 2013-06-28 2016-06-14 Rohm And Haas Electronic Materials Llc Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
RU2588918C1 (ru) * 2014-12-03 2016-07-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Саратовский государственный технический университет имени Гагарина Ю.А." Способ беспалладиевой активации поверхности пластмасс
US10151035B2 (en) 2016-05-26 2018-12-11 Rohm And Haas Electronic Materials Llc Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts
LT6518B (lt) * 2016-09-13 2018-04-25 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Būdas, skirtas elektrai laidžioms sritims ant polimerinio gaminio paviršiaus formuoti
CN106350788A (zh) * 2016-09-18 2017-01-25 电子科技大学 化学镀前表面修饰体系及有机聚合物基材的表面修饰方法
KR102456518B1 (ko) * 2016-10-27 2022-10-19 도쿄엘렉트론가부시키가이샤 도금 처리 방법, 도금 처리 장치 및 기억 매체
JP6580119B2 (ja) 2017-12-28 2019-09-25 石原ケミカル株式会社 ポリイミド樹脂上への金属皮膜形成方法
WO2020011813A1 (en) 2018-07-13 2020-01-16 Solvay Specialty Polymers Usa, Llc Article/part comprising a polymeric component and a metallic coating
US20210269909A1 (en) 2018-07-13 2021-09-02 Solvay Specialty Polymers Usa, Llc Article/part comprising a polymeric component and a metallic coating
CN109536934A (zh) * 2018-12-25 2019-03-29 杭州东方表面技术有限公司 一种用于非金属表面金属化调整工序的处理溶液
TR2021016395A2 (tr) * 2021-10-21 2021-11-22 A Plas Genel Otomotiv Mamuelleri Sanayi Ve Ticaret Anonim Sirketi Metal kaplanacak plasti̇k malzemeleri̇n yüzeyleri̇ni̇n kromsuz yaklaşimla ki̇myasal aşindirma yöntemi̇
CN114107965A (zh) * 2021-10-29 2022-03-01 北京卫星制造厂有限公司 一种聚酰亚胺表面金属层制备方法

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
NL296796A (pt) * 1962-08-20
US3532518A (en) 1967-06-28 1970-10-06 Macdermid Inc Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions
US3553085A (en) 1967-11-28 1971-01-05 Schering Ag Method of preparing surfaces of plastic for electro-deposition
DE1905097A1 (de) 1969-02-01 1970-08-06 Dynamit Nobel Ag Verfahren zur Metallisierung von Kunststoffen
DE2022109C3 (de) * 1970-05-06 1974-03-21 Celfa Ag, Seewen (Schweiz) Verfahren zur Herstellung von metallisierbaren Kunststofformkörpern
DE2206172A1 (de) * 1972-02-09 1973-08-30 Siemens Ag Verfahren zum galvanisieren von teilen aus haertbaren duroplastischen kunststoffen
US3969554A (en) 1972-08-07 1976-07-13 Photocircuits Division Of Kollmorgan Corporation Precious metal sensitizing solutions
US3902908A (en) 1973-03-21 1975-09-02 Macdermid Inc Catalyst system for activating surfaces prior to electroless deposition
US3932694A (en) * 1974-04-04 1976-01-13 Tatsuta Densen Kabushiki Kaisha Pre-treatment method for electroless plating for producing a metal film as resistor
CA1053994A (en) * 1974-07-03 1979-05-08 Amp Incorporated Sensitization of polyimide polymer for electroless metal deposition
US3954570A (en) * 1974-11-11 1976-05-04 Amp Incorporated Sensitized polyimides and circuit elements thereof
IT1041350B (it) * 1975-07-25 1980-01-10 Alfachimici Spa Soluzione attivante a base di argento per processi di ramatura anelettrica
US4273804A (en) 1975-10-23 1981-06-16 Nathan Feldstein Process using activated electroless plating catalysts
US4048354A (en) 1975-10-23 1977-09-13 Nathan Feldstein Method of preparation and use of novel electroless plating catalysts
US4338355A (en) 1975-10-23 1982-07-06 Nathan Feldstein Process using activated electroless plating catalysts
US4180600A (en) 1975-10-23 1979-12-25 Nathan Feldstein Process using activated electroless plating catalysts
US4171225A (en) 1976-01-23 1979-10-16 U.S. Philips Corporation Electroless copper plating solutions
US4066809A (en) 1976-06-28 1978-01-03 International Business Machines Corporation Method for preparing substrate surfaces for electroless deposition
US4182784A (en) 1977-12-16 1980-01-08 Mcgean Chemical Company, Inc. Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a hydroxy substituted organic acid
IT1107840B (it) 1978-07-25 1985-12-02 Alfachimici Spa Soluzione catalitica per la deposizione anelettrica di metalli
US4303443A (en) 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
US4863758A (en) 1982-05-26 1989-09-05 Macdermid, Incorporated Catalyst solutions for activating non-conductive substrates and electroless plating process
US4548644A (en) 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
US4608275A (en) 1983-07-01 1986-08-26 Macdermid, Incorporated Oxidizing accelerator
US4554182A (en) 1983-10-11 1985-11-19 International Business Machines Corporation Method for conditioning a surface of a dielectric substrate for electroless plating
DE3337856A1 (de) 1983-10-18 1985-04-25 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substraten fuer die stromlose metallisierung
EP0167326B1 (en) 1984-06-29 1989-11-15 Hitachi Chemical Co., Ltd. Sensitizing agent for electroless plating and method for sensitizing substrate with the agent
KR890004583B1 (ko) 1984-06-29 1989-11-16 히다찌가세이고오교 가부시끼가이샤 금속표면 처리공정
US4552626A (en) * 1984-11-19 1985-11-12 Michael Landney, Jr. Metal plating of polyamide thermoplastics
US4593016A (en) 1985-02-14 1986-06-03 International Business Machines Corporation Process for manufacturing a concentrate of a palladium-tin colloidal catalyst
US4751106A (en) 1986-09-25 1988-06-14 Shipley Company Inc. Metal plating process
JPH0686666B2 (ja) 1988-01-12 1994-11-02 清 岡林 化学メッキ用増感活性剤
US4948707A (en) 1988-02-16 1990-08-14 International Business Machines Corporation Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon
US4868253A (en) 1988-04-19 1989-09-19 International Business Machines Corporation β-diketone-polymer reaction product
DE68920149T2 (de) 1988-07-07 1995-05-24 Du Pont Metallisierte polymere und verfahren.
JP2794741B2 (ja) 1989-01-13 1998-09-10 日立化成工業株式会社 無電解銅めっき液
FI95816C (fi) * 1989-05-04 1996-03-25 Ad Tech Holdings Ltd Antimikrobinen esine ja menetelmä sen valmistamiseksi
US5160600A (en) 1990-03-05 1992-11-03 Patel Gordhanbai N Chromic acid free etching of polymers for electroless plating
US5110355A (en) * 1990-03-26 1992-05-05 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
EP0467199A3 (en) 1990-07-19 1992-11-25 Learonal, Inc. Preparation of printed circuit boards by metallization
DE4125601A1 (de) * 1991-08-02 1993-02-04 Basf Ag Metallbeschichtete melamin-formaldehyd-harz-fasern
JP3052515B2 (ja) 1991-11-28 2000-06-12 上村工業株式会社 無電解銅めっき浴及びめっき方法
JP3115095B2 (ja) 1992-04-20 2000-12-04 ディップソール株式会社 無電解メッキ液及びそれを使用するメッキ方法
ES2257987T3 (es) 1993-03-18 2006-08-16 Atotech Deutschland Gmbh Composicion y procedimiento para tratar una superficie revestida con un revestimiento de inmersion autoacelerante y autorenovador, sin formaldehido.
US5421989A (en) * 1993-08-31 1995-06-06 Atotech Deutschland Gmbh Process for the metallization of nonconductive substrates with elimination of electroless metallization
KR960005765A (ko) 1994-07-14 1996-02-23 모리시다 요이치 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법
JP3331261B2 (ja) 1994-08-19 2002-10-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液
US5466485A (en) * 1995-01-30 1995-11-14 E. I. Du Pont De Nemours And Company Process for batch-plating aramid fibers
US5648125A (en) 1995-11-16 1997-07-15 Cane; Frank N. Electroless plating process for the manufacture of printed circuit boards
US5770032A (en) 1996-10-16 1998-06-23 Fidelity Chemical Products Corporation Metallizing process
US5792248A (en) 1996-10-16 1998-08-11 Fidelity Chemical Products Corporation, A Division Of Auric Corporation Sensitizing solution
FR2754831B1 (fr) 1996-10-21 1998-11-20 Sgs Thomson Microelectronics Bain autocatalytique et procede de depot d'alliage nickel-phosphore sur un substrat
GB9722028D0 (en) 1997-10-17 1997-12-17 Shipley Company Ll C Plating of polymers
US6406750B1 (en) * 1999-05-28 2002-06-18 Osaka Municipal Government Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film

Also Published As

Publication number Publication date
US6645557B2 (en) 2003-11-11
WO2003033764A3 (en) 2004-06-24
EP1453988A2 (en) 2004-09-08
EP1453988B1 (en) 2011-06-08
WO2003033764A2 (en) 2003-04-24
JP2005537387A (ja) 2005-12-08
JP4729255B2 (ja) 2011-07-20
CN1592799A (zh) 2005-03-09
ATE512236T1 (de) 2011-06-15
US20030113452A1 (en) 2003-06-19
AU2002327725A1 (en) 2003-04-28
CN100338259C (zh) 2007-09-19

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