FR2754831B1 - Bain autocatalytique et procede de depot d'alliage nickel-phosphore sur un substrat - Google Patents

Bain autocatalytique et procede de depot d'alliage nickel-phosphore sur un substrat

Info

Publication number
FR2754831B1
FR2754831B1 FR9612763A FR9612763A FR2754831B1 FR 2754831 B1 FR2754831 B1 FR 2754831B1 FR 9612763 A FR9612763 A FR 9612763A FR 9612763 A FR9612763 A FR 9612763A FR 2754831 B1 FR2754831 B1 FR 2754831B1
Authority
FR
France
Prior art keywords
depositing
nickel
self
substrate
phosphorus alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9612763A
Other languages
English (en)
Other versions
FR2754831A1 (fr
Inventor
Abdallah Tangi
Mohamed Elhark
Bachir Ali Ben
Abdallah Srhiri
Mohamed Cherkaoui
Mohamed Ebntouhami
El Mustapha Saaoudi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
SGS Thomson Microelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics SA filed Critical SGS Thomson Microelectronics SA
Priority to FR9612763A priority Critical patent/FR2754831B1/fr
Publication of FR2754831A1 publication Critical patent/FR2754831A1/fr
Priority to US09/157,737 priority patent/US6143059A/en
Application granted granted Critical
Publication of FR2754831B1 publication Critical patent/FR2754831B1/fr
Priority to US09/624,678 priority patent/US6281157B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
FR9612763A 1996-10-21 1996-10-21 Bain autocatalytique et procede de depot d'alliage nickel-phosphore sur un substrat Expired - Fee Related FR2754831B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR9612763A FR2754831B1 (fr) 1996-10-21 1996-10-21 Bain autocatalytique et procede de depot d'alliage nickel-phosphore sur un substrat
US09/157,737 US6143059A (en) 1996-10-21 1998-09-21 Self-catalytic bath and method for the deposition of a nickel-phosphorus alloy on a substrate
US09/624,678 US6281157B1 (en) 1996-10-21 2000-07-24 Self-catalytic bath and method for the deposition of a nickel-phosphorus alloy on a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9612763A FR2754831B1 (fr) 1996-10-21 1996-10-21 Bain autocatalytique et procede de depot d'alliage nickel-phosphore sur un substrat

Publications (2)

Publication Number Publication Date
FR2754831A1 FR2754831A1 (fr) 1998-04-24
FR2754831B1 true FR2754831B1 (fr) 1998-11-20

Family

ID=9496826

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9612763A Expired - Fee Related FR2754831B1 (fr) 1996-10-21 1996-10-21 Bain autocatalytique et procede de depot d'alliage nickel-phosphore sur un substrat

Country Status (2)

Country Link
US (2) US6143059A (fr)
FR (1) FR2754831B1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000024842A1 (fr) * 1998-10-23 2000-05-04 Arch Specialty Chemicals, Inc. Systeme de boue de polissage chimico-mecanique comprenant une solution activatrice
US6645557B2 (en) 2001-10-17 2003-11-11 Atotech Deutschland Gmbh Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
US20050123681A1 (en) * 2003-12-08 2005-06-09 Jar-Wha Lee Method and apparatus for the treatment of individual filaments of a multifilament yarn
US8137752B2 (en) * 2003-12-08 2012-03-20 Syscom Advanced Materials, Inc. Method and apparatus for the treatment of individual filaments of a multifilament yarn
JP5052806B2 (ja) * 2006-03-29 2012-10-17 古河電気工業株式会社 薄膜抵抗層付き導電性基材、薄膜抵抗層付き導電性基材の製造方法及び薄膜抵抗層付き回路基板
CN100529183C (zh) * 2007-06-21 2009-08-19 宋广山 多元合金催化液及其制品加工工艺
WO2012092505A1 (fr) 2010-12-29 2012-07-05 Syscom Advanced Materials Fil hybride constitué d'un métal et de fibres métallisées
CN102094192B (zh) * 2011-03-15 2012-10-31 北京交通大学 铝合金表面化学镀镍镀液的制备方法及废镀液的再生方法
US10731258B2 (en) 2014-10-27 2020-08-04 Surface Technology, Inc. Plating bath solutions
US10006126B2 (en) 2014-10-27 2018-06-26 Surface Technology, Inc. Plating bath solutions
US9962522B2 (en) 2014-10-29 2018-05-08 Professional Plating, Inc. Braid plating method for torsional stiffness
RU2605737C2 (ru) * 2015-05-26 2016-12-27 Открытое акционерное общество "Научно-исследовательский институт полупроводникового машиностроения" Способ химического никелирования алюминиевых контактных площадок перед иммерсионным золочением
CN105695962B (zh) * 2016-03-10 2017-12-29 中南大学 一种在非催化活性材质表面上化学镀镍的溶液及其施镀工艺
US10856905B2 (en) 2016-10-14 2020-12-08 Pacesetter, Inc. Catheter-based system for delivery and retrieval of a leadless pacemaker
US10960217B2 (en) 2017-03-31 2021-03-30 Pacesetter, Inc. Catheter-based delivery system for delivering a leadless pacemaker and employing a locking hub

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2329429A1 (de) * 1972-06-09 1973-12-20 Imasa Konzentrat und loesung sowie verfahren zur stromlosen vernickelung
US4019901A (en) 1973-06-18 1977-04-26 Bethlehem Steel Corporation Ultra-high strength steel having improved resistance to environmental stress corrosion cracking
US4019910A (en) * 1974-05-24 1977-04-26 The Richardson Chemical Company Electroless nickel polyalloy plating baths
US4038085A (en) * 1976-03-03 1977-07-26 Chromium Industries, Inc. Method of treating electroless nickel plating bath
US4152164A (en) * 1976-04-26 1979-05-01 Michael Gulla Electroless nickel plating
US5221328A (en) * 1991-11-27 1993-06-22 Mcgean-Rohco, Inc. Method of controlling orthophosphite ion concentration in hyphophosphite-based electroless plating baths
JPH06256963A (ja) * 1993-03-04 1994-09-13 Univ Waseda 無電解Ｎｉ−Ｓｎ−Ｐ合金めっき液
JP2901523B2 (ja) * 1995-08-09 1999-06-07 日本カニゼン株式会社 無電解黒色めっき浴組成と皮膜の形成方法
US5614003A (en) * 1996-02-26 1997-03-25 Mallory, Jr.; Glenn O. Method for producing electroless polyalloys

Also Published As

Publication number Publication date
FR2754831A1 (fr) 1998-04-24
US6281157B1 (en) 2001-08-28
US6143059A (en) 2000-11-07

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Effective date: 20070629