JP2007016283A5 - - Google Patents
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- Publication number
- JP2007016283A5 JP2007016283A5 JP2005199589A JP2005199589A JP2007016283A5 JP 2007016283 A5 JP2007016283 A5 JP 2007016283A5 JP 2005199589 A JP2005199589 A JP 2005199589A JP 2005199589 A JP2005199589 A JP 2005199589A JP 2007016283 A5 JP2007016283 A5 JP 2007016283A5
- Authority
- JP
- Japan
- Prior art keywords
- palladium
- conductor layer
- plated
- plating method
- direct plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005199589A JP4662039B2 (ja) | 2005-07-08 | 2005-07-08 | ダイレクトプレーティング方法 |
TW95124528A TWI424099B (zh) | 2005-07-08 | 2006-07-05 | A direct plating method and a palladium conductor layer to form a solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005199589A JP4662039B2 (ja) | 2005-07-08 | 2005-07-08 | ダイレクトプレーティング方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007016283A JP2007016283A (ja) | 2007-01-25 |
JP2007016283A5 true JP2007016283A5 (pt) | 2008-07-31 |
JP4662039B2 JP4662039B2 (ja) | 2011-03-30 |
Family
ID=37753699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005199589A Active JP4662039B2 (ja) | 2005-07-08 | 2005-07-08 | ダイレクトプレーティング方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4662039B2 (pt) |
TW (1) | TWI424099B (pt) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5458758B2 (ja) * | 2009-09-11 | 2014-04-02 | 上村工業株式会社 | 触媒付与溶液並びにこれを用いた無電解めっき方法及びダイレクトプレーティング方法 |
JP5663886B2 (ja) * | 2010-02-08 | 2015-02-04 | 三菱電機株式会社 | 半導体装置の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62124280A (ja) * | 1985-08-21 | 1987-06-05 | Ishihara Yakuhin Kk | 無電解パラジウムメツキ液 |
FR2652822B1 (fr) * | 1989-10-11 | 1993-06-11 | Onera (Off Nat Aerospatiale) | Bain a l'hydrazine pour le depot chimique de platine et/ou de palladium, et procede de fabrication d'un tel bain. |
JPH05214551A (ja) * | 1991-06-19 | 1993-08-24 | Ishihara Chem Co Ltd | パラジウム系無電解メツキ液 |
JPH05218644A (ja) * | 1992-02-04 | 1993-08-27 | Fujitsu Ltd | 多層プリント配線板の製造方法 |
DE4206680C1 (de) * | 1992-02-28 | 1994-01-27 | Schering Ag | Verfahren zur Metallisierung von Nichtleiteroberflächen und die Verwendung von Hydroxymethansulfinsäure im Verfahren |
JPH05327187A (ja) * | 1992-05-18 | 1993-12-10 | Ishihara Chem Co Ltd | プリント配線板及びその製造法 |
-
2005
- 2005-07-08 JP JP2005199589A patent/JP4662039B2/ja active Active
-
2006
- 2006-07-05 TW TW95124528A patent/TWI424099B/zh active
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