JP2007016283A5 - - Google Patents

Download PDF

Info

Publication number
JP2007016283A5
JP2007016283A5 JP2005199589A JP2005199589A JP2007016283A5 JP 2007016283 A5 JP2007016283 A5 JP 2007016283A5 JP 2005199589 A JP2005199589 A JP 2005199589A JP 2005199589 A JP2005199589 A JP 2005199589A JP 2007016283 A5 JP2007016283 A5 JP 2007016283A5
Authority
JP
Japan
Prior art keywords
palladium
conductor layer
plated
plating method
direct plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005199589A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007016283A (ja
JP4662039B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005199589A priority Critical patent/JP4662039B2/ja
Priority claimed from JP2005199589A external-priority patent/JP4662039B2/ja
Priority to TW95124528A priority patent/TWI424099B/zh
Publication of JP2007016283A publication Critical patent/JP2007016283A/ja
Publication of JP2007016283A5 publication Critical patent/JP2007016283A5/ja
Application granted granted Critical
Publication of JP4662039B2 publication Critical patent/JP4662039B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2005199589A 2005-07-08 2005-07-08 ダイレクトプレーティング方法 Active JP4662039B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005199589A JP4662039B2 (ja) 2005-07-08 2005-07-08 ダイレクトプレーティング方法
TW95124528A TWI424099B (zh) 2005-07-08 2006-07-05 A direct plating method and a palladium conductor layer to form a solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005199589A JP4662039B2 (ja) 2005-07-08 2005-07-08 ダイレクトプレーティング方法

Publications (3)

Publication Number Publication Date
JP2007016283A JP2007016283A (ja) 2007-01-25
JP2007016283A5 true JP2007016283A5 (pt) 2008-07-31
JP4662039B2 JP4662039B2 (ja) 2011-03-30

Family

ID=37753699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005199589A Active JP4662039B2 (ja) 2005-07-08 2005-07-08 ダイレクトプレーティング方法

Country Status (2)

Country Link
JP (1) JP4662039B2 (pt)
TW (1) TWI424099B (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5458758B2 (ja) * 2009-09-11 2014-04-02 上村工業株式会社 触媒付与溶液並びにこれを用いた無電解めっき方法及びダイレクトプレーティング方法
JP5663886B2 (ja) * 2010-02-08 2015-02-04 三菱電機株式会社 半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62124280A (ja) * 1985-08-21 1987-06-05 Ishihara Yakuhin Kk 無電解パラジウムメツキ液
FR2652822B1 (fr) * 1989-10-11 1993-06-11 Onera (Off Nat Aerospatiale) Bain a l'hydrazine pour le depot chimique de platine et/ou de palladium, et procede de fabrication d'un tel bain.
JPH05214551A (ja) * 1991-06-19 1993-08-24 Ishihara Chem Co Ltd パラジウム系無電解メツキ液
JPH05218644A (ja) * 1992-02-04 1993-08-27 Fujitsu Ltd 多層プリント配線板の製造方法
DE4206680C1 (de) * 1992-02-28 1994-01-27 Schering Ag Verfahren zur Metallisierung von Nichtleiteroberflächen und die Verwendung von Hydroxymethansulfinsäure im Verfahren
JPH05327187A (ja) * 1992-05-18 1993-12-10 Ishihara Chem Co Ltd プリント配線板及びその製造法

Similar Documents

Publication Publication Date Title
Chen et al. Effects of brighteners in a copper plating bath on throwing power and thermal reliability of plated through holes
JP2012518084A5 (pt)
KR100188481B1 (ko) 유전기질과 도금기질을 직접 전기도금 하는 방법
CN104780710B (zh) 印制线路板及其制作方法
US20160037651A1 (en) Process for producing three-dimensional conductive pattern structure, and material for three-dimensional molding for use therein
JP4857317B2 (ja) スルーホールの充填方法
JP2006161154A (ja) 電解アルミニウムめっき液
CN108118372A (zh) 一种高分散酸性镀铜添加剂及其制备方法与应用
JPS62211384A (ja) 機械的性質の優れた銅被膜の形成方法
BR112020005379B1 (pt) Eletrocatalisador e seu método de produção
JP2009218368A5 (pt)
JP3223829B2 (ja) 電気ニッケルめっき浴又は電気ニッケル合金めっき浴及びそれを用いためっき方法
CN113430594B (zh) 一种含氮小分子的应用及电镀液
JP2007056343A (ja) ポリイミド樹脂上の金属めっき皮膜形成方法
CN107557826A (zh) 一种酸性电化镀铜溶液
TWI683931B (zh) 電解鍍銅用陽極及使用其之電解鍍銅裝置
JP2007016283A5 (pt)
CN105177659B (zh) 一种提高铜箔耐腐蚀性能的表面处理工艺
JPH06330378A (ja) 非導電性材料表面に電気めっき層を直接形成する方法
CN101978100B (zh) 用于制造电解铜箔的电解液
CN107385487B (zh) 2,4,8,10-四氧杂-3,9-二磷杂螺环化合物在hdi板快速镀铜前处理溶液的应用及其前处理工艺
IE50821B1 (en) Process for the selective chemical deposition and/or electrodeposition of metal coatings,especially for the production of printed circuits
JP2006052441A5 (pt)
KR101681663B1 (ko) 전도성 패턴 적층체 및 이의 제조방법
JP3143707B2 (ja) 直接電気メッキ用温和塩基性促進液剤