AU777067B2 - Method and device for isolating plate-like substrates - Google Patents
Method and device for isolating plate-like substrates Download PDFInfo
- Publication number
- AU777067B2 AU777067B2 AU11368/01A AU1136801A AU777067B2 AU 777067 B2 AU777067 B2 AU 777067B2 AU 11368/01 A AU11368/01 A AU 11368/01A AU 1136801 A AU1136801 A AU 1136801A AU 777067 B2 AU777067 B2 AU 777067B2
- Authority
- AU
- Australia
- Prior art keywords
- plate
- substrate
- baseplate
- substrates
- gripping apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Manipulator (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19950068A DE19950068B4 (de) | 1999-10-16 | 1999-10-16 | Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben |
DE19950068 | 1999-10-16 | ||
PCT/EP2000/010036 WO2001028745A1 (de) | 1999-10-16 | 2000-10-12 | Verfahren und einrichtung zum vereinzeln von scheibenförmigen substraten |
Publications (2)
Publication Number | Publication Date |
---|---|
AU1136801A AU1136801A (en) | 2001-04-30 |
AU777067B2 true AU777067B2 (en) | 2004-09-30 |
Family
ID=7925995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU11368/01A Ceased AU777067B2 (en) | 1999-10-16 | 2000-10-12 | Method and device for isolating plate-like substrates |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP1220739B1 (zh) |
JP (1) | JP4731077B2 (zh) |
CN (1) | CN1160177C (zh) |
AT (1) | ATE294056T1 (zh) |
AU (1) | AU777067B2 (zh) |
CA (1) | CA2388730A1 (zh) |
DE (2) | DE19950068B4 (zh) |
ES (1) | ES2240189T3 (zh) |
WO (1) | WO2001028745A1 (zh) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10108369A1 (de) * | 2001-02-21 | 2002-08-29 | B L E Lab Equipment Gmbh | Verfahren und Vorrichtung zum Ablösen eines Halbleiterwafers von einem Träger |
EP1690660A1 (en) * | 2003-12-04 | 2006-08-16 | Mitsuboshi Diamond Industrial Co., Ltd. | Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism |
DE102004060040B3 (de) * | 2004-12-14 | 2006-06-14 | Richter, Uwe, Dr. | Vorrichtung zum Vereinzeln und Sortieren scheibenförmiger Substrate |
DE102005016518B3 (de) * | 2005-04-08 | 2006-11-02 | Rena Sondermaschinen Gmbh | Vorrichtung zum Ablösen und Vereinzeln von Substraten, insbesondere Wafern hergestellt aus Substratblöcken |
DE102005016519B3 (de) * | 2005-04-08 | 2007-03-01 | Rena Sondermaschinen Gmbh | Vorrichtung zum Ablösen, Vereinzeln und Transportieren von in einer Halteeinrichtung sequenziell angeordneten Substraten |
DE102005023618B3 (de) * | 2005-05-21 | 2006-12-07 | Aci-Ecotec Gmbh & Co.Kg | Einrichtung zum Vereinzeln von Silizium-Wafern von einem Stapel |
DE102005028112A1 (de) * | 2005-06-13 | 2006-12-21 | Schmid Technology Systems Gmbh | Verfahren zur Positionierung und Lageerhaltung von Substraten, insbesondere von dünnen Siliziumwafern nach dem Drahtsägen zu deren Vereinzelung |
DE102006021647A1 (de) | 2005-11-09 | 2007-11-15 | Coenen, Wolfgang, Dipl.-Ing. | Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften |
CN101356047B (zh) * | 2006-07-06 | 2011-11-09 | Rena有限责任公司 | 用于分开和输送基片的装置和方法 |
PL1935599T3 (pl) * | 2006-12-15 | 2009-01-30 | Rena Sondermaschinen Gmbh | Urządzenie i sposób separacji i transportu substratów |
DE102006059809B4 (de) * | 2006-12-15 | 2008-08-21 | Rena Sondermaschinen Gmbh | Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten |
US20080146003A1 (en) * | 2006-12-19 | 2008-06-19 | Rec Scanwafer As | Method and device for separating silicon wafers |
DE102007020864A1 (de) * | 2007-05-02 | 2008-11-06 | Scolomatic Gmbh | Flächengreifereinheit |
ATE449021T1 (de) | 2007-05-04 | 2009-12-15 | Rena Sondermaschinen Gmbh | Vorrichtung und verfahren zur vereinzelung |
DE102007021512A1 (de) | 2007-05-04 | 2008-11-13 | Rena Sondermaschinen Gmbh | Vorrichtung und Verfahren zur Vereinzelung |
GB2465591B (en) * | 2008-11-21 | 2011-12-07 | Coreflow Ltd | Method and device for separating sliced wafers |
KR101066978B1 (ko) * | 2009-03-16 | 2011-09-23 | 주식회사 에스에프에이 | 태양전지용 웨이퍼의 분리 및 이송 장치 |
KR101127655B1 (ko) * | 2010-04-16 | 2012-07-16 | 금오공과대학교 산학협력단 | 워터젯을 이용한 태양전지용 실리콘 웨이퍼 박판 분리장치 및 이를 이용한 분리 방법 |
CN101950778A (zh) * | 2010-09-02 | 2011-01-19 | 董维来 | 太阳能硅片湿法自动分片方法 |
DE102010045098A1 (de) | 2010-09-13 | 2012-03-15 | Rena Gmbh | Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten |
CN102126616A (zh) * | 2010-12-16 | 2011-07-20 | 尹青 | 一种行走吸盘上下片台 |
JP2013004627A (ja) * | 2011-06-14 | 2013-01-07 | Shinryo Corp | ウエハの分離装置 |
CN102633118A (zh) * | 2012-04-25 | 2012-08-15 | 佛山市科利得机械有限公司 | 一种瓷砖自动分拣装置 |
JP5849201B2 (ja) * | 2013-05-28 | 2016-01-27 | パナソニックIpマネジメント株式会社 | 切り残し部除去装置 |
JP6450637B2 (ja) * | 2015-04-21 | 2019-01-09 | 株式会社ディスコ | リフトオフ方法及び超音波ホーン |
CN104986380B (zh) * | 2015-05-20 | 2017-07-18 | 杭州厚达自动化系统有限公司 | 厅门装箱机构 |
JP6682907B2 (ja) * | 2016-02-26 | 2020-04-15 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
CN106345926B (zh) * | 2016-11-01 | 2018-02-13 | 浙江大成智能装备股份有限公司 | 一种铝片冲压成型自动化上下料的自动分张机构 |
CN107082277B (zh) * | 2017-06-08 | 2023-10-27 | 江苏四达重工有限公司 | 一种缓存送料装置 |
JP6990720B2 (ja) * | 2018-01-09 | 2022-01-12 | 東京エレクトロン株式会社 | 洗浄装置、洗浄方法及びコンピュータ記憶媒体 |
CN109264416A (zh) * | 2018-09-20 | 2019-01-25 | 上海西重所重型机械成套有限公司 | 金属板板垛分板装置 |
CN111099368B (zh) * | 2020-01-13 | 2020-12-29 | 卢荣芳 | 一种建筑基材转运工序的恒量运输装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0762483A1 (en) * | 1995-09-06 | 1997-03-12 | Nippei Toyama Corporation | Wafer processing system |
DE19723078A1 (de) * | 1996-06-04 | 1997-12-11 | Mitsubishi Material Silicon | Verfahren und Vorrichtung zur Reinigung von Wafern |
DE19900671A1 (de) * | 1999-01-11 | 2000-07-20 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3729206A (en) * | 1971-10-21 | 1973-04-24 | Ibm | Vacuum holding apparatus |
US4252497A (en) * | 1977-08-22 | 1981-02-24 | Heico Inc. | Article handling system |
US4420909B2 (en) * | 1981-11-10 | 1997-06-10 | Silicon Technology | Wafering system |
DE3338897A1 (de) * | 1983-10-27 | 1985-05-09 | Messwandler-Bau Gmbh, 8600 Bamberg | Blechhubeinrichtung zum schichten von eisenkernen aus einzelblechen |
JPS6165750A (ja) * | 1984-09-04 | 1986-04-04 | Osaka Titanium Seizo Kk | ウエハ−の枚葉取出し装置 |
DE3609549A1 (de) * | 1986-03-21 | 1987-10-01 | Mabeg Maschinenbau Gmbh Nachf | Trennvorrichtung |
JPH02139148A (ja) * | 1988-11-14 | 1990-05-29 | Nippon Seiko Kk | 真空吸着テーブル |
JPH0851140A (ja) * | 1994-08-05 | 1996-02-20 | Dowa Mining Co Ltd | 積層薄板体の2枚取り防止装置及び防止方法 |
CH691169A5 (fr) * | 1996-04-16 | 2001-05-15 | Hct Shaping Systems Sa | Dispositif pour la mise en élément de stockage de tranches obtenues par découpage d'un bloc. |
JPH1022238A (ja) * | 1996-06-29 | 1998-01-23 | Komatsu Electron Metals Co Ltd | 半導体ウェハのエアーブロー装置 |
JP3209116B2 (ja) * | 1996-10-11 | 2001-09-17 | 株式会社東京精密 | スライスベース剥離装置 |
JP3870496B2 (ja) * | 1997-08-04 | 2007-01-17 | 株式会社東京精密 | スライスベース剥離装置 |
JP4022672B2 (ja) * | 1998-03-04 | 2007-12-19 | 株式会社東京精密 | スライスベース剥離装置 |
-
1999
- 1999-10-16 DE DE19950068A patent/DE19950068B4/de not_active Expired - Fee Related
-
2000
- 2000-10-12 AT AT00972741T patent/ATE294056T1/de not_active IP Right Cessation
- 2000-10-12 WO PCT/EP2000/010036 patent/WO2001028745A1/de active IP Right Grant
- 2000-10-12 CA CA002388730A patent/CA2388730A1/en not_active Abandoned
- 2000-10-12 DE DE50010186T patent/DE50010186D1/de not_active Expired - Lifetime
- 2000-10-12 EP EP00972741A patent/EP1220739B1/de not_active Expired - Lifetime
- 2000-10-12 CN CNB008143714A patent/CN1160177C/zh not_active Expired - Fee Related
- 2000-10-12 ES ES00972741T patent/ES2240189T3/es not_active Expired - Lifetime
- 2000-10-12 JP JP2001531562A patent/JP4731077B2/ja not_active Expired - Fee Related
- 2000-10-12 AU AU11368/01A patent/AU777067B2/en not_active Ceased
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0762483A1 (en) * | 1995-09-06 | 1997-03-12 | Nippei Toyama Corporation | Wafer processing system |
DE19723078A1 (de) * | 1996-06-04 | 1997-12-11 | Mitsubishi Material Silicon | Verfahren und Vorrichtung zur Reinigung von Wafern |
DE19900671A1 (de) * | 1999-01-11 | 2000-07-20 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung |
Also Published As
Publication number | Publication date |
---|---|
DE19950068B4 (de) | 2006-03-02 |
ATE294056T1 (de) | 2005-05-15 |
WO2001028745A1 (de) | 2001-04-26 |
CA2388730A1 (en) | 2001-04-26 |
DE50010186D1 (de) | 2005-06-02 |
JP2003512196A (ja) | 2003-04-02 |
EP1220739B1 (de) | 2005-04-27 |
DE19950068A1 (de) | 2001-04-26 |
EP1220739A1 (de) | 2002-07-10 |
AU1136801A (en) | 2001-04-30 |
CN1379708A (zh) | 2002-11-13 |
ES2240189T3 (es) | 2005-10-16 |
CN1160177C (zh) | 2004-08-04 |
JP4731077B2 (ja) | 2011-07-20 |
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