CA2388730A1 - Method and device for isolating plate-like substrates - Google Patents

Method and device for isolating plate-like substrates Download PDF

Info

Publication number
CA2388730A1
CA2388730A1 CA002388730A CA2388730A CA2388730A1 CA 2388730 A1 CA2388730 A1 CA 2388730A1 CA 002388730 A CA002388730 A CA 002388730A CA 2388730 A CA2388730 A CA 2388730A CA 2388730 A1 CA2388730 A1 CA 2388730A1
Authority
CA
Canada
Prior art keywords
plate
substrate
baseplate
substrates
gripping apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002388730A
Other languages
English (en)
French (fr)
Inventor
Josef Gentischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schmid Technology Systems GmbH
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2388730A1 publication Critical patent/CA2388730A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Manipulator (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
CA002388730A 1999-10-16 2000-10-12 Method and device for isolating plate-like substrates Abandoned CA2388730A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19950068A DE19950068B4 (de) 1999-10-16 1999-10-16 Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben
DE19950068.1 1999-10-16
PCT/EP2000/010036 WO2001028745A1 (de) 1999-10-16 2000-10-12 Verfahren und einrichtung zum vereinzeln von scheibenförmigen substraten

Publications (1)

Publication Number Publication Date
CA2388730A1 true CA2388730A1 (en) 2001-04-26

Family

ID=7925995

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002388730A Abandoned CA2388730A1 (en) 1999-10-16 2000-10-12 Method and device for isolating plate-like substrates

Country Status (9)

Country Link
EP (1) EP1220739B1 (zh)
JP (1) JP4731077B2 (zh)
CN (1) CN1160177C (zh)
AT (1) ATE294056T1 (zh)
AU (1) AU777067B2 (zh)
CA (1) CA2388730A1 (zh)
DE (2) DE19950068B4 (zh)
ES (1) ES2240189T3 (zh)
WO (1) WO2001028745A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104986380A (zh) * 2015-05-20 2015-10-21 杭州厚达自动化系统有限公司 厅门装箱机构
CN111566784A (zh) * 2018-01-09 2020-08-21 东京毅力科创株式会社 清洗装置、清洗方法以及计算机存储介质

Families Citing this family (30)

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DE10108369A1 (de) * 2001-02-21 2002-08-29 B L E Lab Equipment Gmbh Verfahren und Vorrichtung zum Ablösen eines Halbleiterwafers von einem Träger
EP1690660A1 (en) * 2003-12-04 2006-08-16 Mitsuboshi Diamond Industrial Co., Ltd. Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism
DE102004060040B3 (de) * 2004-12-14 2006-06-14 Richter, Uwe, Dr. Vorrichtung zum Vereinzeln und Sortieren scheibenförmiger Substrate
DE102005016518B3 (de) * 2005-04-08 2006-11-02 Rena Sondermaschinen Gmbh Vorrichtung zum Ablösen und Vereinzeln von Substraten, insbesondere Wafern hergestellt aus Substratblöcken
DE102005016519B3 (de) * 2005-04-08 2007-03-01 Rena Sondermaschinen Gmbh Vorrichtung zum Ablösen, Vereinzeln und Transportieren von in einer Halteeinrichtung sequenziell angeordneten Substraten
DE102005023618B3 (de) * 2005-05-21 2006-12-07 Aci-Ecotec Gmbh & Co.Kg Einrichtung zum Vereinzeln von Silizium-Wafern von einem Stapel
DE102005028112A1 (de) * 2005-06-13 2006-12-21 Schmid Technology Systems Gmbh Verfahren zur Positionierung und Lageerhaltung von Substraten, insbesondere von dünnen Siliziumwafern nach dem Drahtsägen zu deren Vereinzelung
DE102006021647A1 (de) 2005-11-09 2007-11-15 Coenen, Wolfgang, Dipl.-Ing. Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
CN101356047B (zh) * 2006-07-06 2011-11-09 Rena有限责任公司 用于分开和输送基片的装置和方法
PL1935599T3 (pl) * 2006-12-15 2009-01-30 Rena Sondermaschinen Gmbh Urządzenie i sposób separacji i transportu substratów
DE102006059809B4 (de) * 2006-12-15 2008-08-21 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
US20080146003A1 (en) * 2006-12-19 2008-06-19 Rec Scanwafer As Method and device for separating silicon wafers
DE102007020864A1 (de) * 2007-05-02 2008-11-06 Scolomatic Gmbh Flächengreifereinheit
ATE449021T1 (de) 2007-05-04 2009-12-15 Rena Sondermaschinen Gmbh Vorrichtung und verfahren zur vereinzelung
DE102007021512A1 (de) 2007-05-04 2008-11-13 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zur Vereinzelung
GB2465591B (en) * 2008-11-21 2011-12-07 Coreflow Ltd Method and device for separating sliced wafers
KR101066978B1 (ko) * 2009-03-16 2011-09-23 주식회사 에스에프에이 태양전지용 웨이퍼의 분리 및 이송 장치
KR101127655B1 (ko) * 2010-04-16 2012-07-16 금오공과대학교 산학협력단 워터젯을 이용한 태양전지용 실리콘 웨이퍼 박판 분리장치 및 이를 이용한 분리 방법
CN101950778A (zh) * 2010-09-02 2011-01-19 董维来 太阳能硅片湿法自动分片方法
DE102010045098A1 (de) 2010-09-13 2012-03-15 Rena Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
CN102126616A (zh) * 2010-12-16 2011-07-20 尹青 一种行走吸盘上下片台
JP2013004627A (ja) * 2011-06-14 2013-01-07 Shinryo Corp ウエハの分離装置
CN102633118A (zh) * 2012-04-25 2012-08-15 佛山市科利得机械有限公司 一种瓷砖自动分拣装置
JP5849201B2 (ja) * 2013-05-28 2016-01-27 パナソニックＩｐマネジメント株式会社 切り残し部除去装置
JP6450637B2 (ja) * 2015-04-21 2019-01-09 株式会社ディスコ リフトオフ方法及び超音波ホーン
JP6682907B2 (ja) * 2016-02-26 2020-04-15 三星ダイヤモンド工業株式会社 脆性基板の分断方法
CN106345926B (zh) * 2016-11-01 2018-02-13 浙江大成智能装备股份有限公司 一种铝片冲压成型自动化上下料的自动分张机构
CN107082277B (zh) * 2017-06-08 2023-10-27 江苏四达重工有限公司 一种缓存送料装置
CN109264416A (zh) * 2018-09-20 2019-01-25 上海西重所重型机械成套有限公司 金属板板垛分板装置
CN111099368B (zh) * 2020-01-13 2020-12-29 卢荣芳 一种建筑基材转运工序的恒量运输装置

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US3729206A (en) * 1971-10-21 1973-04-24 Ibm Vacuum holding apparatus
US4252497A (en) * 1977-08-22 1981-02-24 Heico Inc. Article handling system
US4420909B2 (en) * 1981-11-10 1997-06-10 Silicon Technology Wafering system
DE3338897A1 (de) * 1983-10-27 1985-05-09 Messwandler-Bau Gmbh, 8600 Bamberg Blechhubeinrichtung zum schichten von eisenkernen aus einzelblechen
JPS6165750A (ja) * 1984-09-04 1986-04-04 Osaka Titanium Seizo Kk ウエハ−の枚葉取出し装置
DE3609549A1 (de) * 1986-03-21 1987-10-01 Mabeg Maschinenbau Gmbh Nachf Trennvorrichtung
JPH02139148A (ja) * 1988-11-14 1990-05-29 Nippon Seiko Kk 真空吸着テーブル
JPH0851140A (ja) * 1994-08-05 1996-02-20 Dowa Mining Co Ltd 積層薄板体の２枚取り防止装置及び防止方法
US5950643A (en) * 1995-09-06 1999-09-14 Miyazaki; Takeshiro Wafer processing system
CH691169A5 (fr) * 1996-04-16 2001-05-15 Hct Shaping Systems Sa Dispositif pour la mise en élément de stockage de tranches obtenues par découpage d'un bloc.
KR100471936B1 (ko) * 1996-06-04 2005-09-09 미쓰비시 마테리알 가부시키가이샤 웨이퍼의세정·박리방법및장치
JPH1022238A (ja) * 1996-06-29 1998-01-23 Komatsu Electron Metals Co Ltd 半導体ウェハのエアーブロー装置
JP3209116B2 (ja) * 1996-10-11 2001-09-17 株式会社東京精密 スライスベース剥離装置
JP3870496B2 (ja) * 1997-08-04 2007-01-17 株式会社東京精密 スライスベース剥離装置
JP4022672B2 (ja) * 1998-03-04 2007-12-19 株式会社東京精密 スライスベース剥離装置
DE19900671C2 (de) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104986380A (zh) * 2015-05-20 2015-10-21 杭州厚达自动化系统有限公司 厅门装箱机构
CN111566784A (zh) * 2018-01-09 2020-08-21 东京毅力科创株式会社 清洗装置、清洗方法以及计算机存储介质
CN111566784B (zh) * 2018-01-09 2024-03-26 东京毅力科创株式会社 清洗装置、清洗方法以及计算机存储介质

Also Published As

Publication number Publication date
DE19950068B4 (de) 2006-03-02
ATE294056T1 (de) 2005-05-15
WO2001028745A1 (de) 2001-04-26
AU777067B2 (en) 2004-09-30
DE50010186D1 (de) 2005-06-02
JP2003512196A (ja) 2003-04-02
EP1220739B1 (de) 2005-04-27
DE19950068A1 (de) 2001-04-26
EP1220739A1 (de) 2002-07-10
AU1136801A (en) 2001-04-30
CN1379708A (zh) 2002-11-13
ES2240189T3 (es) 2005-10-16
CN1160177C (zh) 2004-08-04
JP4731077B2 (ja) 2011-07-20

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Legal Events

Date Code Title Description
FZDE Discontinued