Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28D—WORKING STONE OR STONE-LIKE MATERIALS
  • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
  • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
  • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28D—WORKING STONE OR STONE-LIKE MATERIALS
  • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
  • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
  • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
  • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type

Definitions

• the present invention relates to a method and a device for separating and detaching thin, fragile, disk-shaped substrates which have been cut from a substrate block, which is preferably fixed by means of adhesive on a base plate, according to the preamble of claim 1 and that of claim 10, respectively ,
• substrate blocks or columns made of, for example, silicon are used, which are sawn into thin disks.
• the substrate block or the substrate column is glued to a base plate and thereby fixed there.
• each disk-shaped substrate adheres to the underside of the base line via the adhesive line or seam on the base plate, the upper part of which is normally made of glass and has been sawn with it. This results in a comb-like structure after the substrate block or the substrate column has been completely divided, from which the very fragile, disc-shaped substrates are broken off by hand at the adhesive point.
• the features specified in claim 1 are provided in a method of the type mentioned and the features specified in claim 10 in a device of the type mentioned.
• the measures according to the invention make it possible to grasp the thin, fragile, disc-shaped substrates in sections over a substantial surface area and to shake them off the adhesive seam and thereby remove them safely.
• a preferred embodiment of the oscillating movement arises in accordance with the features of claim 2 and that of claim 11. In this way, an oscillating pivoting movement takes place around the adhesive seam or adhesive line, which leads to a fatigue fracture of this adhesive seam. In addition, this results in a force exertion that is limited to a minimum on the disk-shaped substrate itself.
• a preferred embodiment of the gripper device results from the features according to claim 12.
• the features according to claim 3 and those according to claim 13 are provided. Due to the pre-tension exerted on the disk-shaped substrate in the direction of lifting off the base plate, the size of which in any case prevents the disk-shaped substrate from breaking, the point in time at which the adhesive seam is sufficiently brittle can be ascertained or recognized quickly and easily. The disk-shaped substrate can then be safely removed for further processing and / or storage.
• adjacent disc-shaped substrates can also be separated and consequently detached from the base plate if they are at least partially due to moisture, which is unavoidable for technical reasons, and / or in an inclined state stick together.
• FIG. 1 shows a schematic, partially broken and sectioned side view of a device for separating and detaching disc-shaped substrates from a cut substrate block according to a preferred exemplary embodiment of the present invention
• FIG. 2 shows a partial top view according to arrow II of FIG. 1,
• Figure 3 is an end view of the gripper device
• the device 10 shown in the drawing serves for separating and detaching thin, fragile, disk-shaped substrates 11 which have been cut from a substrate block 13 held fixed on a base plate 12.
• a substrate block is, for example, a silicon block made of polycrystalline silicon, which is glued, for example, to a glass pane part of the base plate 12 using a two-component adhesive.
• the silicon block is cut into individual silicon wafers, for example serving as solar wafers, with the supply of liquid cutting agent.
• This cutting or sawing of the substrate block 13 into individual thin disk-shaped substrates or wafers is carried out into the glass plate part of the base plate 12 resting on a steel plate part.
• the individual disk-shaped substrates 11 are held fixed on their lower edge on the base plate 12 or the glass pane part thereof via an adhesive seam 15 indicated in FIG. 1.
• the individual disk-shaped substrates 11 are in particular in the area of Adhesive seam 15 arranged at a distance from one another corresponding to the width of the saw cut 14. Due to the use of the liquid cutting means, for example, it is possible for individual adjacent disk-shaped substrates 11 to adhere to one another in a parallel or oblique position.
• the disk-shaped substrates 11 have a thickness of approximately 0.7 to 0.8 mm as semiconductor wafers and a thickness in the range of 0.2 to 0.3 mm as solar wafers, wherein substrate wafer thicknesses in the range of 0.15 mm are also possible.
• the device 10 With the device 10 according to the invention, it is important to separate such thin, disc-shaped substrates 11 from the adjacent disc-shaped substrate and to detach them from the base plate 12 in an automatic, unbroken and otherwise undamaged manner in a simple manner and to carry them on for further storage and / or processing.
• the device 10 has a gripper device 20 which is driven to oscillate back and forth in the direction of the double arrow B and which serves on the one hand to detach the disk-shaped substrates 11 from the base plate 12 and on the other hand to remove and carry on the disk-shaped substrates 11.
• the gripper device 20 is fastened to a gripper holder 30.
• the gripper device 20 has a gripper plate 21, from which gripper arms 22 project vertically in a matrix-like arrangement.
• a matrix-like arrangement of the gripper arms 22 results, for example, in a modification from FIG. 3 shown in FIG. 1.
• the gripper arms 22 are arranged over the gripper plate 21, the areal dimension of which corresponds approximately to the areal dimension of the disk-shaped substrates 11, such that they are distributed in sections or points essentially over the entire outer surface 16 of a disk-shaped substrate 11 to be gripped.
• the gripper arms 22 have at their free ends facing away from the gripper plate 21 suction cups 23, which, as will be shown later, with a Vacuum device 50 are connected.
• the gripper plate 21 is connected at its upper end facing away from the base plate 12 and at its rear side facing away from the gripper arms 22 to an arcuate slide 24 which is held in a receptacle 32 of a holder 31 of the gripper holder 30 in the direction of the double arrow B.
• the rear end 26 of the slide 24 has a link opening 25, in which an eccentric disk 33 is immersed, which is mounted via an eccentric axis 34 on a flange 35 which projects from the holder 31 and is driven in rotation by a motor, not shown.
• the rotary movement of the eccentric disc 33 causes the slide 24 to oscillate in an arc-shaped manner in the direction of the double arrow B, as a result of which the gripper plate 21 is pivoted in an oscillating manner with the gripper arms 22.
• the orientation of the holder 31 is such that the imaginary extension of its central axis 36 intersects the adhesive seam 15. In this way, with the aid of the eccentric drive 33, 34, the gripper plate 21 is pivoted about the adhesive seam 15 between the disk-shaped substrate 11 and the base plate 12.
• the holder 31 is fastened to a holder plate 37 which can be moved linearly relative to a holder web 38 according to double arrow C.
• the holding web 38 is fixedly connected with spaced bolts 39 which penetrate the holding plate 37 in an axially movable manner and have a contact washer 41 at their end.
• Compression springs 40 are arranged between the contact disk 41 and the underside of the holding plate 37.
• the support web 38 can be moved or raised in a manner not shown in the direction of the arrow C1, which lifting movement the holder plate 37 connected to the holder 31 can or cannot follow, as will be shown later.
• the mounting web 38 is connected to a laterally protruding angle 42, at the downward end of which a motion detection sensor 43 is attached, which lies opposite an area between the mounting plate 37 and the contact disk 41 of the bolt 39.
• the gripper device 20 is provided with a positioning sensor 27 which lies opposite the disk-shaped substrate 11 to be gripped in each case.
• a spray nozzle 45 which is connected in a manner not shown to a liquid pressure container and whose slot-like nozzle opening 46 into the area of the saw cut 14, is arranged in a fixed manner in a side region of the base plate 12 in a high-altitude region between the disc-shaped substrate 11 and the base plate 12 is directed between two adjacent disc-shaped substrates 11.
• the base plate 12 with the cut substrate block 13 can be moved in the direction of the arrow A and thus in the direction of the oscillating gripper device 20.
• the process or the process of separating and detaching thin, break-sensitive disk-shaped substrates 11 from one another or from a substrate block 13 held adhesively on the base plate 12 and which has been cut into the disk-shaped substrates 11, proceeds as follows.
• the base plate 12 is moved in the direction of the arrow A until the positioning sensor 27 has recognized the correct position for docking the foremost disk-shaped substrate 11 to the gripper device 20, this positioning sensor 27 being provided in a lower region not far from the adhesive seam 15.
• the spray nozzle device 45 is acted on, so that a flat jet of liquid is brought into the saw cut 14 between the foremost and the subsequent disk-shaped substrate 11 via the slot opening 46, the liquid jet causing a possible adhesion of the subsequent disk-shaped substrate 11 to be dissolved, and / or that the disc-shaped substrate to be gripped is positioned (vertically).
• the vacuum device 50 is switched on, the first one to be taken disk-shaped substrate 11 is gripped by the suckers 23 attached to the gripper arms 22.
• the eccentric device 33, 34 is then put into operation, which results in an oscillating pivoting movement of the gripper device 20.
• the swivel oscillation has a small amplitude in the range between 2 and 6 °, preferably of 3 ° at a frequency range of approximately 5 to 10 Hz.
• This swivel oscillation is transmitted to the disk-shaped substrate 11 gripped by the gripper device 20.
• the pivotal oscillation of the disk-shaped substrate 11 continues until cracks in the adhesive seam 15 between the disk-shaped substrate 11 and the base plate 12 result to such an extent that the disk-shaped substrate 11 can be lifted off without damage.
• the holding web 38 of the gripping holder 30 Before or during the swing oscillation, but after the gripping device 20 has gripped the disk-shaped substrate 11 in question, the holding web 38 of the gripping holder 30 is moved slightly upward in the direction of the arrow C1, the holding plate 37, which is firmly connected to the gripping device 20 , remains in position. This means a prestressing of the gripper holder 30 corresponding to the spring tension in the direction of the arrow Cl, so that there is a tensile stress within the adhesive seam 15, which, however, is only chosen to be large enough to ensure that the disk-shaped substrate 11 is handled without damage. With the relative movement between the holder web 38 and the holder plate 37, the compression springs 40 are acted upon in the direction of the arrow C1 and the movement of the spring windings and / or that of the contact disk 41 is detected by the movement detection sensor 43.
• the oscillating swivel or Shaking movement of the disk-shaped substrate 11 continues, namely until the adhesive seam 15 is torn or worn so far that the disk-shaped substrate 11 is detached from the base plate 12 and lifted off under the aforementioned pretension or tensile force in the direction of the arrow C1.
• the holder plate 37 is moved upward in the direction of arrow C and the compression springs 40 are relaxed. This is determined by the motion detection sensor 43.
• the separated and detached disc-shaped substrate 11 can then be fed to a memory or further processing in a manner not shown.
• the matrix arrangement of the gripper arms 22 or their suction cup 23 is connected in a certain way.
• All suction cups 23 are constantly connected to a vacuum generator 51, for example in the form of an ejector nozzle.
• a vacuum generator 51 for example in the form of an ejector nozzle.
• n transducers 52 are provided, with which it can be evaluated whether and which suction cups 23 have gripped a corresponding surface of the assigned disk-shaped substrate 11. This allows conclusions to be drawn as to whether the disk-shaped substrate 11 in question is present as a whole or only in fragments. This also allows, for example, a good / bad sorting.
• the suction cups 23 are combined in two (or more) format-dependent circles 53, 54 and connected accordingly.
• disk-shaped substrates 11 of different outer surface or format 16 ′, 16 ′′, 16 ′′ ′′, 16 ′′ ′′ can be handled and also detected. It is possible to apply vacuum to these format-dependent circles differently, so that it is also possible to detect and remove fragments of disk-shaped substrates.
• the gripper device with only one and possibly larger suction cup.

Priority Applications (6)

Applications Claiming Priority (2)

Publications (1)

Family

ID=7925995

Family Applications (1)

Country Status (9)

Cited By (14)

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Citations (9)

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• 1999
  • 1999-10-16 DE DE19950068A patent/DE19950068B4/de not_active Expired - Fee Related
• 2000
  • 2000-10-12 AU AU11368/01A patent/AU777067B2/en not_active Ceased
  • 2000-10-12 CN CNB008143714A patent/CN1160177C/zh not_active Expired - Fee Related
  • 2000-10-12 EP EP00972741A patent/EP1220739B1/de not_active Expired - Lifetime
  • 2000-10-12 ES ES00972741T patent/ES2240189T3/es not_active Expired - Lifetime
  • 2000-10-12 JP JP2001531562A patent/JP4731077B2/ja not_active Expired - Fee Related
  • 2000-10-12 WO PCT/EP2000/010036 patent/WO2001028745A1/de active IP Right Grant
  • 2000-10-12 CA CA002388730A patent/CA2388730A1/en not_active Abandoned
  • 2000-10-12 DE DE50010186T patent/DE50010186D1/de not_active Expired - Lifetime
  • 2000-10-12 AT AT00972741T patent/ATE294056T1/de not_active IP Right Cessation

Patent Citations (11)

Non-Patent Citations (4)

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