AU2001279163A1 - Method of controlling stress in gallium nitride films deposited on substrates - Google Patents

Method of controlling stress in gallium nitride films deposited on substrates

Info

Publication number
AU2001279163A1
AU2001279163A1 AU2001279163A AU7916301A AU2001279163A1 AU 2001279163 A1 AU2001279163 A1 AU 2001279163A1 AU 2001279163 A AU2001279163 A AU 2001279163A AU 7916301 A AU7916301 A AU 7916301A AU 2001279163 A1 AU2001279163 A1 AU 2001279163A1
Authority
AU
Australia
Prior art keywords
substrates
gallium nitride
nitride films
films deposited
controlling stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001279163A
Other languages
English (en)
Inventor
Hugues Marchand
Brendan J. Moran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of California San Diego UCSD
Original Assignee
University of California
University of California Berkeley
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of California, University of California Berkeley filed Critical University of California
Publication of AU2001279163A1 publication Critical patent/AU2001279163A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/562Protection against mechanical damage
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02378Silicon carbide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02455Group 13/15 materials
    • H01L21/02458Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02494Structure
    • H01L21/02496Layer structure
    • H01L21/0251Graded layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/0254Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/82Heterojunctions
    • H10D62/824Heterojunctions comprising only Group III-V materials heterojunctions, e.g. GaN/AlGaN heterojunctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503Nitride Group III-V materials, e.g. AlN or GaN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0137Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/815Bodies having stress relaxation structures, e.g. buffer layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Recrystallisation Techniques (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
AU2001279163A 2000-08-04 2001-08-03 Method of controlling stress in gallium nitride films deposited on substrates Abandoned AU2001279163A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22283700P 2000-08-04 2000-08-04
US60222837 2000-08-04
PCT/US2001/024347 WO2002013245A1 (en) 2000-08-04 2001-08-03 Method of controlling stress in gallium nitride films deposited on substrates

Publications (1)

Publication Number Publication Date
AU2001279163A1 true AU2001279163A1 (en) 2002-02-18

Family

ID=22833905

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001279163A Abandoned AU2001279163A1 (en) 2000-08-04 2001-08-03 Method of controlling stress in gallium nitride films deposited on substrates

Country Status (5)

Country Link
US (6) US7687888B2 (enrdf_load_stackoverflow)
EP (2) EP2276059A1 (enrdf_load_stackoverflow)
JP (3) JP5095064B2 (enrdf_load_stackoverflow)
AU (1) AU2001279163A1 (enrdf_load_stackoverflow)
WO (1) WO2002013245A1 (enrdf_load_stackoverflow)

Families Citing this family (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7335737B2 (en) 1998-10-28 2008-02-26 Baylor College Of Medicine Ovary-specific genes and proteins
US7687888B2 (en) * 2000-08-04 2010-03-30 The Regents Of The University Of California Method of controlling stress in gallium nitride films deposited on substrates
US6649287B2 (en) 2000-12-14 2003-11-18 Nitronex Corporation Gallium nitride materials and methods
JP2002185077A (ja) * 2000-12-14 2002-06-28 Mitsubishi Electric Corp 半導体レーザ装置及びその製造方法
US6956250B2 (en) * 2001-02-23 2005-10-18 Nitronex Corporation Gallium nitride materials including thermally conductive regions
JP2002284600A (ja) * 2001-03-26 2002-10-03 Hitachi Cable Ltd 窒化ガリウム結晶基板の製造方法及び窒化ガリウム結晶基板
US7030428B2 (en) 2001-12-03 2006-04-18 Cree, Inc. Strain balanced nitride heterojunction transistors
KR101167590B1 (ko) * 2002-04-15 2012-07-27 더 리전츠 오브 더 유니버시티 오브 캘리포니아 유기금속 화학기상 증착법에 의해 성장된 무극성 α면 질화갈륨 박막
US8809867B2 (en) * 2002-04-15 2014-08-19 The Regents Of The University Of California Dislocation reduction in non-polar III-nitride thin films
US6841001B2 (en) * 2002-07-19 2005-01-11 Cree, Inc. Strain compensated semiconductor structures and methods of fabricating strain compensated semiconductor structures
JP4823466B2 (ja) * 2002-12-18 2011-11-24 日本碍子株式会社 エピタキシャル成長用基板および半導体素子
US6818061B2 (en) * 2003-04-10 2004-11-16 Honeywell International, Inc. Method for growing single crystal GaN on silicon
US7135720B2 (en) * 2003-08-05 2006-11-14 Nitronex Corporation Gallium nitride material transistors and methods associated with the same
US7071498B2 (en) * 2003-12-17 2006-07-04 Nitronex Corporation Gallium nitride material devices including an electrode-defining layer and methods of forming the same
US20050145851A1 (en) * 2003-12-17 2005-07-07 Nitronex Corporation Gallium nitride material structures including isolation regions and methods
JP2005229055A (ja) * 2004-02-16 2005-08-25 Seiko Epson Corp 化合物半導体の結晶成長方法および化合物半導体装置の製造方法
US7956360B2 (en) * 2004-06-03 2011-06-07 The Regents Of The University Of California Growth of planar reduced dislocation density M-plane gallium nitride by hydride vapor phase epitaxy
US7361946B2 (en) * 2004-06-28 2008-04-22 Nitronex Corporation Semiconductor device-based sensors
US7339205B2 (en) * 2004-06-28 2008-03-04 Nitronex Corporation Gallium nitride materials and methods associated with the same
US7687827B2 (en) * 2004-07-07 2010-03-30 Nitronex Corporation III-nitride materials including low dislocation densities and methods associated with the same
WO2006050403A2 (en) * 2004-10-28 2006-05-11 Nitronex Corporation Gallium nitride/silicon based monolithic microwave integrated circuit
US7247889B2 (en) 2004-12-03 2007-07-24 Nitronex Corporation III-nitride material structures including silicon substrates
SG124417A1 (en) * 2005-02-02 2006-08-30 Agency Science Tech & Res Method and structure for fabricating III-V nitridelayers on silicon substrates
EP1876270B1 (en) 2005-04-04 2010-09-29 Tohoku Techno Arch Co., Ltd. Method for growth of GaN single crystals
US7365374B2 (en) * 2005-05-03 2008-04-29 Nitronex Corporation Gallium nitride material structures including substrates and methods associated with the same
US20060270201A1 (en) * 2005-05-13 2006-11-30 Chua Soo J Nano-air-bridged lateral overgrowth of GaN semiconductor layer
US7226850B2 (en) * 2005-05-19 2007-06-05 Raytheon Company Gallium nitride high electron mobility transistor structure
US20070202360A1 (en) * 2005-10-04 2007-08-30 Nitronex Corporation Gallium nitride material transistors and methods for wideband applications
EP1969635B1 (en) * 2005-12-02 2017-07-19 Infineon Technologies Americas Corp. Gallium nitride material devices and associated methods
US7566913B2 (en) 2005-12-02 2009-07-28 Nitronex Corporation Gallium nitride material devices including conductive regions and methods associated with the same
US9406505B2 (en) 2006-02-23 2016-08-02 Allos Semiconductors Gmbh Nitride semiconductor component and process for its production
EP2016614A4 (en) 2006-04-25 2014-04-09 Univ Singapore METHOD OF A ZINC OXIDE FILM GROWN ON THE EPITAXIAL LATERAL AGGREGATE GALLIUM NITRIDE ORIGIN
US20080035143A1 (en) * 2006-08-14 2008-02-14 Sievers Robert E Human-powered dry powder inhaler and dry powder inhaler compositions
WO2008060349A2 (en) * 2006-11-15 2008-05-22 The Regents Of The University Of California Method for heteroepitaxial growth of high-quality n-face gan, inn, and ain and their alloys by metal organic chemical vapor deposition
CN102683376A (zh) 2007-01-22 2012-09-19 科锐公司 高压发光体、发光体及照明装置
US7745848B1 (en) 2007-08-15 2010-06-29 Nitronex Corporation Gallium nitride material devices and thermal designs thereof
JP5431667B2 (ja) * 2007-10-01 2014-03-05 富士電機株式会社 窒化ガリウム半導体装置
US9634191B2 (en) 2007-11-14 2017-04-25 Cree, Inc. Wire bond free wafer level LED
US8026581B2 (en) * 2008-02-05 2011-09-27 International Rectifier Corporation Gallium nitride material devices including diamond regions and methods associated with the same
US8343824B2 (en) * 2008-04-29 2013-01-01 International Rectifier Corporation Gallium nitride material processing and related device structures
US8568529B2 (en) * 2009-04-10 2013-10-29 Applied Materials, Inc. HVPE chamber hardware
CN102484070B (zh) * 2009-06-26 2014-12-10 康奈尔大学 用于铝-硅氮化物的化学气相沉积处理
US8465587B2 (en) * 2009-12-30 2013-06-18 Cbl Technologies, Inc. Modern hydride vapor-phase epitaxy system and methods
EP2565906A4 (en) * 2010-04-28 2013-12-04 Ngk Insulators Ltd EPITACTIC SUBSTRATE AND METHOD FOR PRODUCING THE EPITACTIC SUBSTRATE
KR20120032329A (ko) 2010-09-28 2012-04-05 삼성전자주식회사 반도체 소자
EP2695184B1 (en) * 2011-04-06 2018-02-14 Oxford University Innovation Limited Processing a wafer for an electronic circuit
US8835287B2 (en) 2011-05-13 2014-09-16 Varian Semiconductor Equipment Associates, Inc. Method of implanting a workpiece to improve growth of a compound semiconductor
US9023722B2 (en) * 2011-05-13 2015-05-05 Varian Semiconductor Equipment Associates, Inc. Compound semiconductor growth using ion implantation
US11160148B2 (en) 2017-06-13 2021-10-26 Ideal Industries Lighting Llc Adaptive area lamp
US11792898B2 (en) 2012-07-01 2023-10-17 Ideal Industries Lighting Llc Enhanced fixtures for area lighting
CN104412396B (zh) * 2012-07-05 2021-11-09 亮锐控股有限公司 具有含氮和磷的发光层的发光二极管
CN103578926B (zh) 2012-08-09 2018-01-02 三星电子株式会社 半导体缓冲结构、半导体器件和制造半导体器件的方法
US8946773B2 (en) 2012-08-09 2015-02-03 Samsung Electronics Co., Ltd. Multi-layer semiconductor buffer structure, semiconductor device and method of manufacturing the semiconductor device using the multi-layer semiconductor buffer structure
KR102002898B1 (ko) 2012-09-04 2019-07-23 삼성전자 주식회사 반도체 버퍼 구조체 및 이를 포함하는 반도체 소자
JP6322890B2 (ja) 2013-02-18 2018-05-16 住友電気工業株式会社 Iii族窒化物複合基板およびその製造方法、ならびにiii族窒化物半導体デバイスの製造方法
WO2014057748A1 (ja) * 2012-10-12 2014-04-17 住友電気工業株式会社 Iii族窒化物複合基板およびその製造方法、ならびにiii族窒化物半導体デバイスの製造方法
JP6085371B2 (ja) * 2012-12-18 2017-02-22 アールエフエイチアイシー コーポレイション 半導体デバイス用基板
WO2014125688A1 (ja) 2013-02-18 2014-08-21 住友電気工業株式会社 Iii族窒化物複合基板およびその製造方法、積層iii族窒化物複合基板、ならびにiii族窒化物半導体デバイスおよびその製造方法
GB2519338A (en) 2013-10-17 2015-04-22 Nanogan Ltd Crack-free gallium nitride materials
KR102098250B1 (ko) 2013-10-21 2020-04-08 삼성전자 주식회사 반도체 버퍼 구조체, 이를 포함하는 반도체 소자 및 반도체 버퍼 구조체를 이용한 반도체 소자 제조방법
DE112014005131T5 (de) * 2013-11-07 2016-07-28 Ngk Insulators, Ltd. GaN-Vorlagensubstrat und Einrichtungssubstrat
TWI570911B (zh) * 2014-05-19 2017-02-11 新世紀光電股份有限公司 半導體結構
EP2983195A1 (en) 2014-08-04 2016-02-10 EpiGan NV Semiconductor structure comprising an active semiconductor layer of the iii-v type on a buffer layer stack and method for producing semiconductor structure
CN105206714A (zh) * 2015-09-01 2015-12-30 映瑞光电科技(上海)有限公司 GaN基LED外延结构及其制备方法
US9806182B2 (en) 2015-09-08 2017-10-31 Macom Technology Solutions Holdings, Inc. Parasitic channel mitigation using elemental diboride diffusion barrier regions
US9704705B2 (en) 2015-09-08 2017-07-11 Macom Technology Solutions Holdings, Inc. Parasitic channel mitigation via reaction with active species
US9627473B2 (en) 2015-09-08 2017-04-18 Macom Technology Solutions Holdings, Inc. Parasitic channel mitigation in III-nitride material semiconductor structures
US9799520B2 (en) 2015-09-08 2017-10-24 Macom Technology Solutions Holdings, Inc. Parasitic channel mitigation via back side implantation
US9773898B2 (en) 2015-09-08 2017-09-26 Macom Technology Solutions Holdings, Inc. III-nitride semiconductor structures comprising spatially patterned implanted species
US9673281B2 (en) 2015-09-08 2017-06-06 Macom Technology Solutions Holdings, Inc. Parasitic channel mitigation using rare-earth oxide and/or rare-earth nitride diffusion barrier regions
US10211294B2 (en) 2015-09-08 2019-02-19 Macom Technology Solutions Holdings, Inc. III-nitride semiconductor structures comprising low atomic mass species
US20170069721A1 (en) 2015-09-08 2017-03-09 M/A-Com Technology Solutions Holdings, Inc. Parasitic channel mitigation using silicon carbide diffusion barrier regions
US11581866B2 (en) 2016-03-11 2023-02-14 Akoustis, Inc. RF acoustic wave resonators integrated with high electron mobility transistors including a shared piezoelectric/buffer layer and methods of forming the same
US10529696B2 (en) 2016-04-12 2020-01-07 Cree, Inc. High density pixelated LED and devices and methods thereof
US9960127B2 (en) 2016-05-18 2018-05-01 Macom Technology Solutions Holdings, Inc. High-power amplifier package
US10134658B2 (en) 2016-08-10 2018-11-20 Macom Technology Solutions Holdings, Inc. High power transistors
US9917156B1 (en) 2016-09-02 2018-03-13 IQE, plc Nucleation layer for growth of III-nitride structures
US10224426B2 (en) 2016-12-02 2019-03-05 Vishay-Siliconix High-electron-mobility transistor devices
US10381473B2 (en) 2016-12-02 2019-08-13 Vishay-Siliconix High-electron-mobility transistor with buried interconnect
US10141435B2 (en) * 2016-12-23 2018-11-27 Sixpoint Materials, Inc. Electronic device using group III nitride semiconductor and its fabrication method
TWI780195B (zh) 2017-08-03 2022-10-11 美商克里公司 高密度像素化發光二極體晶片和晶片陣列裝置以及製造方法
US10734363B2 (en) 2017-08-03 2020-08-04 Cree, Inc. High density pixelated-LED chips and chip array devices
US10529773B2 (en) 2018-02-14 2020-01-07 Cree, Inc. Solid state lighting devices with opposing emission directions
US10693288B2 (en) 2018-06-26 2020-06-23 Vishay SIliconix, LLC Protection circuits with negative gate swing capability
US11038023B2 (en) 2018-07-19 2021-06-15 Macom Technology Solutions Holdings, Inc. III-nitride material semiconductor structures on conductive silicon substrates
US10833063B2 (en) 2018-07-25 2020-11-10 Vishay SIliconix, LLC High electron mobility transistor ESD protection structures
US10903265B2 (en) 2018-12-21 2021-01-26 Cree, Inc. Pixelated-LED chips and chip array devices, and fabrication methods
WO2021087109A1 (en) 2019-10-29 2021-05-06 Cree, Inc. Texturing for high density pixelated-led chips
CN115280525A (zh) * 2020-01-21 2022-11-01 阿库斯蒂斯有限公司 与包括共用压电/缓冲层的高电子迁移率晶体管集成的rf声波谐振器及其形成方法
US12102010B2 (en) 2020-03-05 2024-09-24 Akoustis, Inc. Methods of forming films including scandium at low temperatures using chemical vapor deposition to provide piezoelectric resonator devices and/or high electron mobility transistor devices
US11437548B2 (en) 2020-10-23 2022-09-06 Creeled, Inc. Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods
CN113345798B (zh) * 2021-06-01 2022-07-12 中科汇通(内蒙古)投资控股有限公司 一种SiC基片外延制备GaN的方法
WO2024158874A2 (en) * 2023-01-24 2024-08-02 The Regents Of The University Of Michigan Ferroelectric iii-nitride layer thickness scaling
CN119698087B (zh) * 2025-02-21 2025-05-27 清华大学 一种氮化镓α粒子探测器及其制备方法

Family Cites Families (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834798A (enrdf_load_stackoverflow) * 1971-09-06 1973-05-22
US4452646A (en) * 1981-09-28 1984-06-05 Mcdonnell Douglas Corporation Method of making planar III-V compound device by ion implantation
JPH01140850A (ja) * 1987-11-27 1989-06-02 Nec Corp 回線終端装置
US5276698A (en) * 1990-09-20 1994-01-04 Sumitomo Electric Ind., Ltd. Semiconductor laser having an optical waveguide layer including an AlGaInP active layer
US5290393A (en) 1991-01-31 1994-03-01 Nichia Kagaku Kogyo K.K. Crystal growth method for gallium nitride-based compound semiconductor
US5633192A (en) 1991-03-18 1997-05-27 Boston University Method for epitaxially growing gallium nitride layers
US5221413A (en) 1991-04-24 1993-06-22 At&T Bell Laboratories Method for making low defect density semiconductor heterostructure and devices made thereby
US5442205A (en) 1991-04-24 1995-08-15 At&T Corp. Semiconductor heterostructure devices with strained semiconductor layers
US5192987A (en) 1991-05-17 1993-03-09 Apa Optics, Inc. High electron mobility transistor with GaN/Alx Ga1-x N heterojunctions
JP3352712B2 (ja) 1991-12-18 2002-12-03 浩 天野 窒化ガリウム系半導体素子及びその製造方法
US5393993A (en) 1993-12-13 1995-02-28 Cree Research, Inc. Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
US5679152A (en) * 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
US6440823B1 (en) * 1994-01-27 2002-08-27 Advanced Technology Materials, Inc. Low defect density (Ga, Al, In)N and HVPE process for making same
JPH07326576A (ja) * 1994-05-30 1995-12-12 Nec Corp 3−5族化合物半導体の薄膜成長方法
US5838029A (en) 1994-08-22 1998-11-17 Rohm Co., Ltd. GaN-type light emitting device formed on a silicon substrate
US5523589A (en) 1994-09-20 1996-06-04 Cree Research, Inc. Vertical geometry light emitting diode with group III nitride active layer and extended lifetime
US5592501A (en) 1994-09-20 1997-01-07 Cree Research, Inc. Low-strain laser structures with group III nitride active layers
US5821555A (en) 1995-03-27 1998-10-13 Kabushiki Kaisha Toshiba Semicoductor device having a hetero interface with a lowered barrier
US5670798A (en) * 1995-03-29 1997-09-23 North Carolina State University Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact non-nitride buffer layer and methods of fabricating same
US5679965A (en) 1995-03-29 1997-10-21 North Carolina State University Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact, non-nitride buffer layer and methods of fabricating same
US5739554A (en) 1995-05-08 1998-04-14 Cree Research, Inc. Double heterojunction light emitting diode with gallium nitride active layer
WO1996041906A1 (en) 1995-06-13 1996-12-27 Advanced Technology Materials, Inc. Bulk single crystal gallium nitride and method of making same
JP2795226B2 (ja) 1995-07-27 1998-09-10 日本電気株式会社 半導体発光素子及びその製造方法
WO1997011518A1 (fr) 1995-09-18 1997-03-27 Hitachi, Ltd. Materiau semi-conducteur, procede de production de ce materiau semi-conducteur et dispositif a semi-conducteur
JP3604205B2 (ja) * 1995-09-18 2004-12-22 日亜化学工業株式会社 窒化物半導体の成長方法
JP3235440B2 (ja) * 1995-11-24 2001-12-04 日亜化学工業株式会社 窒化物半導体レーザ素子とその製造方法
JP3396356B2 (ja) 1995-12-11 2003-04-14 三菱電機株式会社 半導体装置,及びその製造方法
JP3409958B2 (ja) 1995-12-15 2003-05-26 株式会社東芝 半導体発光素子
US5874747A (en) * 1996-02-05 1999-02-23 Advanced Technology Materials, Inc. High brightness electroluminescent device emitting in the green to ultraviolet spectrum and method of making the same
US5923950A (en) * 1996-06-14 1999-07-13 Matsushita Electric Industrial Co., Inc. Method of manufacturing a semiconductor light-emitting device
US6039803A (en) 1996-06-28 2000-03-21 Massachusetts Institute Of Technology Utilization of miscut substrates to improve relaxed graded silicon-germanium and germanium layers on silicon
JP3179346B2 (ja) 1996-08-27 2001-06-25 松下電子工業株式会社 窒化ガリウム結晶の製造方法
US5955772A (en) 1996-12-17 1999-09-21 The Regents Of The University Of California Heterostructure thermionic coolers
US5741724A (en) 1996-12-27 1998-04-21 Motorola Method of growing gallium nitride on a spinel substrate
US5866925A (en) * 1997-01-09 1999-02-02 Sandia Corporation Gallium nitride junction field-effect transistor
US5880491A (en) 1997-01-31 1999-03-09 The United States Of America As Represented By The Secretary Of The Air Force SiC/111-V-nitride heterostructures on SiC/SiO2 /Si for optoelectronic devices
WO1998039827A1 (en) * 1997-03-07 1998-09-11 Sharp Kabushiki Kaisha Gallium nitride semiconductor light emitting element with active layer having multiplex quantum well structure and semiconductor laser light source device
KR19980079320A (ko) * 1997-03-24 1998-11-25 기다오까다까시 고품질 쥐에이엔계층의 선택성장방법, 고품질 쥐에이엔계층 성장기판 및 고품질 쥐에이엔계층 성장기판상에 제작하는 반도체디바이스
JP3491492B2 (ja) 1997-04-09 2004-01-26 松下電器産業株式会社 窒化ガリウム結晶の製造方法
CN1159750C (zh) 1997-04-11 2004-07-28 日亚化学工业株式会社 氮化物半导体的生长方法
US6069021A (en) 1997-05-14 2000-05-30 Showa Denko K.K. Method of growing group III nitride semiconductor crystal layer and semiconductor device incorporating group III nitride semiconductor crystal layer
JP3642157B2 (ja) * 1997-05-26 2005-04-27 ソニー株式会社 p型III族ナイトライド化合物半導体、発光ダイオードおよび半導体レーザ
US6261931B1 (en) 1997-06-20 2001-07-17 The Regents Of The University Of California High quality, semi-insulating gallium nitride and method and system for forming same
EP1007768A4 (en) * 1997-07-03 2003-07-16 Cbl Technologies ELEMENATION OF DEFECTS CAUSED BY THERMAL DIFFERENCES IN EPITAXIAL DEPOSITED FILMS BY SEPARATING THE SUBSTRATE FROM THE FILM AT GROWTH TEMPERATURE
JP3813740B2 (ja) 1997-07-11 2006-08-23 Tdk株式会社 電子デバイス用基板
JP3505357B2 (ja) 1997-07-16 2004-03-08 株式会社東芝 窒化ガリウム系半導体素子およびその製造方法
JP3606015B2 (ja) * 1997-07-23 2005-01-05 豊田合成株式会社 3族窒化物半導体素子の製造方法
JP3420028B2 (ja) * 1997-07-29 2003-06-23 株式会社東芝 GaN系化合物半導体素子の製造方法
JPH11340580A (ja) * 1997-07-30 1999-12-10 Fujitsu Ltd 半導体レーザ、半導体発光素子、及び、その製造方法
US6201262B1 (en) 1997-10-07 2001-03-13 Cree, Inc. Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure
JP3517867B2 (ja) 1997-10-10 2004-04-12 豊田合成株式会社 GaN系の半導体素子
JP3500281B2 (ja) 1997-11-05 2004-02-23 株式会社東芝 窒化ガリウム系半導体素子およびその製造方法
JP3036495B2 (ja) 1997-11-07 2000-04-24 豊田合成株式会社 窒化ガリウム系化合物半導体の製造方法
GB2332563A (en) * 1997-12-18 1999-06-23 Sharp Kk Growth of group III nitride or group III-V nitride layers
US6051849A (en) 1998-02-27 2000-04-18 North Carolina State University Gallium nitride semiconductor structures including a lateral gallium nitride layer that extends from an underlying gallium nitride layer
US6500257B1 (en) 1998-04-17 2002-12-31 Agilent Technologies, Inc. Epitaxial material grown laterally within a trench and method for producing same
TW413972B (en) * 1998-04-22 2000-12-01 Matsushita Electric Ind Co Ltd Semiconductor laser device
US6180270B1 (en) * 1998-04-24 2001-01-30 The United States Of America As Represented By The Secretary Of The Army Low defect density gallium nitride epilayer and method of preparing the same
US6064078A (en) 1998-05-22 2000-05-16 Xerox Corporation Formation of group III-V nitride films on sapphire substrates with reduced dislocation densities
US6218207B1 (en) * 1998-05-29 2001-04-17 Mitsushita Electronics Corporation Method for growing nitride semiconductor crystals, nitride semiconductor device, and method for fabricating the same
US6265289B1 (en) 1998-06-10 2001-07-24 North Carolina State University Methods of fabricating gallium nitride semiconductor layers by lateral growth from sidewalls into trenches, and gallium nitride semiconductor structures fabricated thereby
JP2000106348A (ja) * 1998-07-28 2000-04-11 Matsushita Electronics Industry Corp 化合物半導体層含有基板およびその製造方法ならびにこれを用いた半導体装置
JP4238385B2 (ja) * 1998-08-06 2009-03-18 昭和電工株式会社 化合物半導体素子およびその製造方法
SG94712A1 (en) * 1998-09-15 2003-03-18 Univ Singapore Method of fabricating group-iii nitride-based semiconductor device
US6177688B1 (en) 1998-11-24 2001-01-23 North Carolina State University Pendeoepitaxial gallium nitride semiconductor layers on silcon carbide substrates
US6255198B1 (en) 1998-11-24 2001-07-03 North Carolina State University Methods of fabricating gallium nitride microelectronic layers on silicon layers and gallium nitride microelectronic structures formed thereby
US6329063B2 (en) 1998-12-11 2001-12-11 Nova Crystals, Inc. Method for producing high quality heteroepitaxial growth using stress engineering and innovative substrates
US6328796B1 (en) * 1999-02-01 2001-12-11 The United States Of America As Represented By The Secretary Of The Navy Single-crystal material on non-single-crystalline substrate
JP3770014B2 (ja) * 1999-02-09 2006-04-26 日亜化学工業株式会社 窒化物半導体素子
US20010042503A1 (en) 1999-02-10 2001-11-22 Lo Yu-Hwa Method for design of epitaxial layer and substrate structures for high-quality epitaxial growth on lattice-mismatched substrates
JP3432444B2 (ja) * 1999-02-25 2003-08-04 シャープ株式会社 半導体発光素子
TW449937B (en) * 1999-02-26 2001-08-11 Matsushita Electronics Corp Semiconductor device and the manufacturing method thereof
US6525932B1 (en) * 1999-08-18 2003-02-25 Fujitsu Limited Expansion unit and electronic apparatus
WO2001027980A1 (en) 1999-10-14 2001-04-19 Cree, Inc. Single step pendeo- and lateral epitaxial overgrowth of group iii-nitride layers
US6521514B1 (en) 1999-11-17 2003-02-18 North Carolina State University Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on sapphire substrates
AU2430401A (en) 1999-12-13 2001-06-18 North Carolina State University Methods of fabricating gallium nitride layers on textured silicon substrates, and gallium nitride semiconductor structures fabricated thereby
US6291319B1 (en) * 1999-12-17 2001-09-18 Motorola, Inc. Method for fabricating a semiconductor structure having a stable crystalline interface with silicon
US6380108B1 (en) 1999-12-21 2002-04-30 North Carolina State University Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on weak posts, and gallium nitride semiconductor structures fabricated thereby
US6403451B1 (en) 2000-02-09 2002-06-11 Noerh Carolina State University Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts
KR100865600B1 (ko) 2000-02-09 2008-10-27 노쓰 캐롤라이나 스테이트 유니버시티 갈륨 나이트라이드 반도체 구조물 및 그 제조 방법, 및 반도체 구조물 및 그 제조 방법
JP2001230447A (ja) 2000-02-16 2001-08-24 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体素子の製造方法
US6261929B1 (en) 2000-02-24 2001-07-17 North Carolina State University Methods of forming a plurality of semiconductor layers using spaced trench arrays
US6741724B1 (en) * 2000-03-24 2004-05-25 Siemens Dematic Postal Automation, L.P. Method and system for form processing
JP3626423B2 (ja) * 2000-05-22 2005-03-09 日本碍子株式会社 フォトニックデバイスの製造方法
FR2810159B1 (fr) * 2000-06-09 2005-04-08 Centre Nat Rech Scient Couche epaisse de nitrure de gallium ou de nitrure mixte de gallium et d'un autre metal, procede de preparation, et dispositif electronique ou optoelectronique comprenant une telle couche
US6707074B2 (en) * 2000-07-04 2004-03-16 Matsushita Electric Industrial Co., Ltd. Semiconductor light-emitting device and apparatus for driving the same
US6610144B2 (en) * 2000-07-21 2003-08-26 The Regents Of The University Of California Method to reduce the dislocation density in group III-nitride films
US7687888B2 (en) 2000-08-04 2010-03-30 The Regents Of The University Of California Method of controlling stress in gallium nitride films deposited on substrates
US6391748B1 (en) * 2000-10-03 2002-05-21 Texas Tech University Method of epitaxial growth of high quality nitride layers on silicon substrates
US6548333B2 (en) * 2000-12-01 2003-04-15 Cree, Inc. Aluminum gallium nitride/gallium nitride high electron mobility transistors having a gate contact on a gallium nitride based cap segment
US6649287B2 (en) * 2000-12-14 2003-11-18 Nitronex Corporation Gallium nitride materials and methods
US6611002B2 (en) 2001-02-23 2003-08-26 Nitronex Corporation Gallium nitride material devices and methods including backside vias
US6956250B2 (en) 2001-02-23 2005-10-18 Nitronex Corporation Gallium nitride materials including thermally conductive regions

Also Published As

Publication number Publication date
US8525230B2 (en) 2013-09-03
US20140367698A1 (en) 2014-12-18
WO2002013245A1 (en) 2002-02-14
JP2013216573A (ja) 2013-10-24
US20080102610A1 (en) 2008-05-01
JP2012109583A (ja) 2012-06-07
JP5331868B2 (ja) 2013-10-30
US7816764B2 (en) 2010-10-19
US7655090B2 (en) 2010-02-02
US20110108886A1 (en) 2011-05-12
US20120068191A1 (en) 2012-03-22
US9129977B2 (en) 2015-09-08
US20090242898A1 (en) 2009-10-01
US20020020341A1 (en) 2002-02-21
EP2276059A1 (en) 2011-01-19
US7687888B2 (en) 2010-03-30
US9691712B2 (en) 2017-06-27
JP2004506323A (ja) 2004-02-26
JP5095064B2 (ja) 2012-12-12
EP1307903A1 (en) 2003-05-07

Similar Documents

Publication Publication Date Title
AU2001279163A1 (en) Method of controlling stress in gallium nitride films deposited on substrates
AU7926800A (en) Method of depositing transition metal nitride thin films
AU2003230876A1 (en) Dislocation reduction in non-polar gallium nitride thin films
AU2001247389A1 (en) Iii-v nitride substrate boule and method of making and using the same
AU2001294534A1 (en) Method of epitaxial growth of high quality nitride layers on silicon substrates
AU2001279746A1 (en) Device and method for the deposition of, in particular, crystalline layers on, in particular, crystalline substrates
AU2001266131A1 (en) Preparation method of a coating of gallium nitride
AU2002366860A1 (en) Method and device for depositing crystalline layers on crystalline substrates
AU2001236602A1 (en) Apparatus and method for deposition of thin films
AU2002343062A1 (en) Method for depositing items of value
AU2001279847A1 (en) Method of growing a thin film onto a substrate
AU2003287710A1 (en) Composition and method for low temperature deposition of silicon-containing films
AU2002354254A1 (en) Method for making nitride semiconductor substrate and method for making nitride semiconductor device
AU2001241479A1 (en) Method and apparatus for depositing films
AU2003296904A1 (en) Wafer coating and singulation method
AU2001236076A1 (en) Production method of iii nitride compound semiconductor substrate and semiconductor device
AU2000240180A1 (en) Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
EP1182271B8 (en) Apparatus and method for coating substrate
AU2003292744A1 (en) Diamond film-forming silicon and its manufacturing method
AU2002236383A1 (en) Method for formation of titanium nitride films
AU2002346963A1 (en) Method for diamond coating substrates
AU1815802A (en) Method for the epitaxy of (indium, aluminum, gallium) nitride on foreign substrates
AU2002366177A1 (en) Method of forming narrow trenches in semiconductor substrates
AU2001250694A1 (en) System and method for deposition of coatings on a substrate
AU1196001A (en) Method and apparatus for etching and deposition using micro-plasmas