ATE485245T1 - Flachbildschirm und verfahren zum teilen des flachbildschirms - Google Patents
Flachbildschirm und verfahren zum teilen des flachbildschirmsInfo
- Publication number
- ATE485245T1 ATE485245T1 AT02745994T AT02745994T ATE485245T1 AT E485245 T1 ATE485245 T1 AT E485245T1 AT 02745994 T AT02745994 T AT 02745994T AT 02745994 T AT02745994 T AT 02745994T AT E485245 T1 ATE485245 T1 AT E485245T1
- Authority
- AT
- Austria
- Prior art keywords
- flat screen
- splitting
- scribed
- face
- substrates
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/076—Laminated glass comprising interlayers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001212169 | 2001-07-12 | ||
PCT/JP2002/007086 WO2003006391A1 (fr) | 2001-07-12 | 2002-07-12 | Panneau d'affichage plat et procede destine a separer un panneau d'affichage plat |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE485245T1 true ATE485245T1 (de) | 2010-11-15 |
Family
ID=19047373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02745994T ATE485245T1 (de) | 2001-07-12 | 2002-07-12 | Flachbildschirm und verfahren zum teilen des flachbildschirms |
Country Status (9)
Country | Link |
---|---|
US (1) | US7439665B2 (de) |
EP (1) | EP1415959B1 (de) |
JP (1) | JP3851903B2 (de) |
KR (1) | KR100671215B1 (de) |
CN (2) | CN1250468C (de) |
AT (1) | ATE485245T1 (de) |
DE (1) | DE60238061D1 (de) |
TW (1) | TWI226877B (de) |
WO (1) | WO2003006391A1 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004082911A1 (de) * | 2003-03-17 | 2004-09-30 | Baumann Gmbh | Brechvorrichtung für das vereinzeln von keramikleiterplatten |
JP4175636B2 (ja) * | 2003-10-31 | 2008-11-05 | 株式会社日本製鋼所 | ガラスの切断方法 |
KR101152763B1 (ko) * | 2003-12-29 | 2012-06-18 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 스크라이브 라인 형성기구, 스크라이브 헤드 및 스크라이브 장치 |
DE102004053598A1 (de) * | 2004-11-05 | 2006-05-11 | Hegla Fahrzeug- Und Maschinenbau Gmbh & Co. Kg | Verfahren und Vorrichtung zum Aufteilen einer Rohglastafel in Einzelglasscheiben |
US7768623B2 (en) * | 2006-07-31 | 2010-08-03 | Casio Computer Co., Ltd. | Liquid crystal display apparatus forming assembly, liquid crystal cell, and liquid crystal display apparatus, and manufacturing method thereof |
JP4682346B2 (ja) * | 2006-08-02 | 2011-05-11 | 株式会社 日立ディスプレイズ | 液晶表示装置及び液晶表示装置の製造方法 |
US20080070378A1 (en) * | 2006-09-19 | 2008-03-20 | Jong-Souk Yeo | Dual laser separation of bonded wafers |
TWI342302B (en) * | 2007-03-30 | 2011-05-21 | Au Optronics Corp | A substrate splitting apparatus and a mehtod for splitting a substrate |
JP4970299B2 (ja) * | 2008-01-31 | 2012-07-04 | 株式会社東芝 | 電子機器、電子部品の保持方法、および電子機器の製造方法 |
JP5192977B2 (ja) * | 2008-10-10 | 2013-05-08 | 三星ダイヤモンド工業株式会社 | 貼り合せ基板のスクライブ方法 |
JP2010243556A (ja) * | 2009-04-01 | 2010-10-28 | Hitachi Displays Ltd | 表示装置の製造方法 |
TWI385137B (zh) * | 2009-08-19 | 2013-02-11 | Chimei Innolux Corp | 面板製造方法、面板與顯示面板結構 |
TWI494284B (zh) * | 2010-03-19 | 2015-08-01 | Corning Inc | 強化玻璃之機械劃割及分離 |
US8864005B2 (en) | 2010-07-16 | 2014-10-21 | Corning Incorporated | Methods for scribing and separating strengthened glass substrates |
TW201902842A (zh) * | 2010-11-30 | 2019-01-16 | 美商康寧公司 | 玻璃帶以及將第一玻璃帶部分接合至第二部件之方法 |
CN102608811A (zh) * | 2012-03-22 | 2012-07-25 | 深圳市华星光电技术有限公司 | 液晶显示装置及其制造方法 |
US10351460B2 (en) | 2012-05-22 | 2019-07-16 | Corning Incorporated | Methods of separating strengthened glass sheets by mechanical scribing |
KR102026822B1 (ko) * | 2012-07-23 | 2019-10-01 | 삼성디스플레이 주식회사 | 표시 장치 셀 절단 장치 및 표시 장치 제조 방법 |
JP6140012B2 (ja) * | 2013-07-08 | 2017-05-31 | 三星ダイヤモンド工業株式会社 | 貼り合わせ基板のブレイク方法 |
JP6185813B2 (ja) * | 2013-09-30 | 2017-08-23 | 三星ダイヤモンド工業株式会社 | イメージセンサ用ウエハ積層体の分断方法並びに分断装置 |
CN103979786B (zh) * | 2014-05-16 | 2015-12-09 | 深圳市华星光电技术有限公司 | 单板玻璃基板的切割方法 |
JP2015221739A (ja) * | 2014-05-23 | 2015-12-10 | 株式会社ジャパンディスプレイ | 表示装置の製造方法 |
US10351461B2 (en) | 2014-05-30 | 2019-07-16 | MITSUBOSHI DIAMOND INDUSTRlAL CO., LTD. | Method for dividing brittle substrate |
JP6421472B2 (ja) | 2014-06-24 | 2018-11-14 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法および表示パネルの製造方法 |
JP6303861B2 (ja) * | 2014-06-25 | 2018-04-04 | 三星ダイヤモンド工業株式会社 | 単結晶基板の分断方法 |
CN106795035B (zh) * | 2014-09-25 | 2019-08-27 | 三星钻石工业股份有限公司 | 脆性衬底的分断方法 |
JP6432245B2 (ja) * | 2014-09-26 | 2018-12-05 | 三星ダイヤモンド工業株式会社 | 基板分断方法 |
KR101866824B1 (ko) | 2014-10-29 | 2018-07-17 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 기판의 분단 방법 |
JP2016104683A (ja) * | 2014-11-19 | 2016-06-09 | 坂東機工株式会社 | ガラス板の折割方法及びその折割装置 |
JP6413694B2 (ja) | 2014-11-25 | 2018-10-31 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
JP6413693B2 (ja) | 2014-11-25 | 2018-10-31 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
JP2016098154A (ja) | 2014-11-25 | 2016-05-30 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
KR20160064297A (ko) | 2014-11-27 | 2016-06-08 | 삼성디스플레이 주식회사 | 표시패널 제조방법 및 그에 의해 제조된 표시패널 |
JP6405968B2 (ja) * | 2014-12-10 | 2018-10-17 | 三星ダイヤモンド工業株式会社 | 基板分断方法およびスクライブ装置 |
CN107406295B (zh) * | 2015-03-11 | 2020-08-18 | 松下知识产权经营株式会社 | 玻璃面板单元的制造方法和玻璃窗的制造方法 |
TWI605024B (zh) | 2015-08-07 | 2017-11-11 | Mitsuboshi Diamond Ind Co Ltd | Breaking method of brittle substrate |
JP6555002B2 (ja) | 2015-08-19 | 2019-08-07 | 三星ダイヤモンド工業株式会社 | スクライブラインの検査方法 |
JP6544179B2 (ja) | 2015-09-25 | 2019-07-17 | 三星ダイヤモンド工業株式会社 | 脆性基板の分断方法 |
TWI609754B (zh) | 2015-09-29 | 2018-01-01 | 三星鑽石工業股份有限公司 | 脆性基板之分斷方法 |
CN106569359A (zh) * | 2015-10-07 | 2017-04-19 | 罗泽系统株式会社 | 粘合基板切断方法及利用该方法的粘合基板切断系统 |
CN105572944A (zh) * | 2016-03-02 | 2016-05-11 | 深圳市华星光电技术有限公司 | 调整显示器尺寸的方法 |
KR101796706B1 (ko) | 2016-03-08 | 2017-11-10 | 주식회사 토비스 | 스트레치드 디스플레이패널 및 이의 제조방법 |
KR101931735B1 (ko) | 2017-03-31 | 2018-12-21 | 주식회사 토비스 | 스트레치드 디스플레이패널 및 이의 제조방법 |
JP6297192B2 (ja) * | 2017-04-25 | 2018-03-20 | 三星ダイヤモンド工業株式会社 | 貼り合わせ基板のブレイク装置 |
CN111807697B (zh) * | 2020-06-29 | 2023-11-14 | 江苏亚威艾欧斯激光科技有限公司 | 显示面板切割装置 |
CN111875242B (zh) * | 2020-07-30 | 2021-10-08 | 惠科股份有限公司 | 一种用于切割基板的切割方法和切割机台 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5515173A (en) * | 1978-07-20 | 1980-02-02 | Casio Comput Co Ltd | Production of optical display cell |
JPS5667819A (en) * | 1979-11-07 | 1981-06-08 | Hitachi Ltd | Preparation for liquid crystal display element |
JPS5691216A (en) * | 1979-12-25 | 1981-07-24 | Sanyo Electric Co Ltd | Production of liquid crystal panel |
JPS5763247A (en) | 1980-10-02 | 1982-04-16 | Stanley Electric Co Ltd | Manufacture of liquid crystal cell |
JPS5919925A (ja) * | 1982-07-27 | 1984-02-01 | Stanley Electric Co Ltd | 2層式液晶セルの製造方法 |
JPH0256650A (ja) | 1988-08-23 | 1990-02-26 | Omron Tateisi Electron Co | メモリ装置 |
KR910003298B1 (ko) | 1988-09-29 | 1991-05-25 | 삼성전자 주식회사 | 교환장치에 있어서 순간 정전에 의한 리스타트시 국선 통화로 유지방법 |
JPH0539890A (ja) | 1991-08-01 | 1993-02-19 | Ishigaki Rubber Kogyo Kk | パイプジヨイント及びその製造方法 |
JPH063638A (ja) | 1992-06-23 | 1994-01-14 | Citizen Watch Co Ltd | 液晶表示パネルの製造方法 |
JPH07218883A (ja) * | 1994-02-01 | 1995-08-18 | Matsushita Electron Corp | 液晶表示装置の製造方法 |
JPH10301074A (ja) | 1997-04-25 | 1998-11-13 | Citizen Watch Co Ltd | 液晶表示パネルとこの液晶表示パネルの製造方法 |
JPH1184334A (ja) * | 1997-09-10 | 1999-03-26 | Advanced Display:Kk | 液晶パネルの製法 |
JP2000241822A (ja) | 1999-02-17 | 2000-09-08 | Seiko Epson Corp | 液晶パネルの製造方法 |
JP2000249999A (ja) | 1999-03-03 | 2000-09-14 | Seiko Epson Corp | 液晶パネルの製造方法 |
WO2002057192A1 (fr) * | 2001-01-17 | 2002-07-25 | Mitsuboshi Diamond Industrial Co., Ltd. | Separateur et systeme de separation |
WO2003011777A1 (fr) * | 2001-07-18 | 2003-02-13 | Mitsuboshi Diamond Industrial Co., Ltd. | Tete de decoupe, dispositif de decoupe et procede de decoupe utilisant cette tete de decoupe |
KR100509651B1 (ko) * | 2001-10-31 | 2005-08-23 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 반도체 웨이퍼의 스크라이브 라인의 형성방법 및스크라이브 라인의 형성장치 |
-
2002
- 2002-06-21 TW TW091113557A patent/TWI226877B/zh not_active IP Right Cessation
- 2002-07-12 AT AT02745994T patent/ATE485245T1/de not_active IP Right Cessation
- 2002-07-12 JP JP2003512165A patent/JP3851903B2/ja not_active Expired - Fee Related
- 2002-07-12 CN CNB028140060A patent/CN1250468C/zh not_active Expired - Fee Related
- 2002-07-12 DE DE60238061T patent/DE60238061D1/de not_active Expired - Lifetime
- 2002-07-12 CN CNA2006100037800A patent/CN1818753A/zh active Pending
- 2002-07-12 US US10/483,125 patent/US7439665B2/en not_active Expired - Fee Related
- 2002-07-12 EP EP02745994A patent/EP1415959B1/de not_active Expired - Lifetime
- 2002-07-12 WO PCT/JP2002/007086 patent/WO2003006391A1/ja active Application Filing
- 2002-07-12 KR KR1020037017073A patent/KR100671215B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI226877B (en) | 2005-01-21 |
EP1415959A1 (de) | 2004-05-06 |
JP3851903B2 (ja) | 2006-11-29 |
CN1250468C (zh) | 2006-04-12 |
EP1415959B1 (de) | 2010-10-20 |
KR100671215B1 (ko) | 2007-01-18 |
EP1415959A4 (de) | 2006-07-05 |
CN1818753A (zh) | 2006-08-16 |
US7439665B2 (en) | 2008-10-21 |
US20040245913A1 (en) | 2004-12-09 |
DE60238061D1 (de) | 2010-12-02 |
WO2003006391A1 (fr) | 2003-01-23 |
JPWO2003006391A1 (ja) | 2004-10-28 |
KR20040017819A (ko) | 2004-02-27 |
CN1527802A (zh) | 2004-09-08 |
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