DE60310650D1 - Geschlitztes Substrat und dazugehöriges Herstellungsverfahren - Google Patents
Geschlitztes Substrat und dazugehöriges HerstellungsverfahrenInfo
- Publication number
- DE60310650D1 DE60310650D1 DE60310650T DE60310650T DE60310650D1 DE 60310650 D1 DE60310650 D1 DE 60310650D1 DE 60310650 T DE60310650 T DE 60310650T DE 60310650 T DE60310650 T DE 60310650T DE 60310650 D1 DE60310650 D1 DE 60310650D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- associated manufacturing
- slotted substrate
- slotted
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14032—Structure of the pressure chamber
- B41J2/1404—Geometrical characteristics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14145—Structure of the manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/209,408 US20040021741A1 (en) | 2002-07-30 | 2002-07-30 | Slotted substrate and method of making |
US209408 | 2002-07-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60310650D1 true DE60310650D1 (de) | 2007-02-08 |
DE60310650T2 DE60310650T2 (de) | 2007-10-04 |
Family
ID=30115221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60310650T Expired - Lifetime DE60310650T2 (de) | 2002-07-30 | 2003-07-17 | Geschlitztes Substrat und dazugehöriges Herstellungsverfahren |
Country Status (4)
Country | Link |
---|---|
US (3) | US20040021741A1 (de) |
EP (1) | EP1386741B1 (de) |
JP (1) | JP2004058678A (de) |
DE (1) | DE60310650T2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7494596B2 (en) * | 2003-03-21 | 2009-02-24 | Hewlett-Packard Development Company, L.P. | Measurement of etching |
EP1520717B1 (de) * | 2003-10-01 | 2012-03-07 | Canon Kabushiki Kaisha | Tintenstrahlaufzeichnungsgerät und Regelungsverfahren eines vorgenannten Gerätes |
US20050219327A1 (en) * | 2004-03-31 | 2005-10-06 | Clarke Leo C | Features in substrates and methods of forming |
JP6620318B2 (ja) * | 2014-11-27 | 2019-12-18 | パナソニックIpマネジメント株式会社 | シート状伸縮性構造体 |
US11666935B2 (en) | 2018-11-15 | 2023-06-06 | Hewlett-Packard Development Company, L.P. | Selectively lifting substrates |
Family Cites Families (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4096626A (en) * | 1976-12-27 | 1978-06-27 | International Business Machines Corporation | Method of making multi-layer photosensitive glass ceramic charge plate |
JPH0793291B2 (ja) | 1986-12-19 | 1995-10-09 | アプライド マテリアルズインコーポレーテッド | シリコンおよび珪化物のための臭素およびヨウ素エッチング方法 |
US4915718A (en) | 1988-09-28 | 1990-04-10 | On Target Technology, Inc. | Fabrication of ink jet nozzles and resulting product |
US5066357A (en) | 1990-01-11 | 1991-11-19 | Hewlett-Packard Company | Method for making flexible circuit card with laser-contoured vias and machined capacitors |
JPH03215043A (ja) | 1990-01-19 | 1991-09-20 | Canon Inc | インクジェット記録装置のワイパーブレード |
EP0484278B1 (de) * | 1990-11-01 | 1995-04-12 | Ciba-Geigy Ag | Vorrichtung zur Aufbereitung oder Vorbereitung von flüssigen Proben für eine chemische Analyse |
EP0495663B1 (de) | 1991-01-18 | 1997-04-23 | Canon Kabushiki Kaisha | Tintenstrahleinheit mit Öffnungen und Aufzeichnungsgerät, welches diese verwendet |
JP3053936B2 (ja) | 1991-12-04 | 2000-06-19 | キヤノン株式会社 | 液体噴射記録ヘッド用基体、該基体の製造方法、該基体を用いた液体噴射記録ヘッド、該記録ヘッドの製造方法及び該記録ヘッドを具備する記録装置 |
US5317346A (en) | 1992-03-04 | 1994-05-31 | Hewlett-Packard Company | Compound ink feed slot |
US5537133A (en) | 1992-04-02 | 1996-07-16 | Hewlett-Packard Company | Restraining element for a print cartridge body to reduce thermally induced stress |
US5300959A (en) * | 1992-04-02 | 1994-04-05 | Hewlett-Packard Company | Efficient conductor routing for inkjet printhead |
US5278584A (en) | 1992-04-02 | 1994-01-11 | Hewlett-Packard Company | Ink delivery system for an inkjet printhead |
EP0594310A3 (en) | 1992-10-23 | 1994-08-17 | Hewlett Packard Co | Ink jet printhead and method of manufacture thereof |
US5574486A (en) | 1993-01-13 | 1996-11-12 | Tektronix, Inc. | Ink jet print heads and methos for preparing them |
US5387314A (en) | 1993-01-25 | 1995-02-07 | Hewlett-Packard Company | Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining |
US5378137A (en) | 1993-05-10 | 1995-01-03 | Hewlett-Packard Company | Mask design for forming tapered inkjet nozzles |
JPH079682A (ja) | 1993-06-15 | 1995-01-13 | Ricoh Co Ltd | インクジェットヘッド |
DE4329728A1 (de) | 1993-09-03 | 1995-03-09 | Microparts Gmbh | Düsenplatte für Fluidstrahl-Druckkopf und Verfahren zu deren Herstellung |
US5449630A (en) | 1994-05-03 | 1995-09-12 | United Microelectronics Corp. | Method for fabricating a trench capacitor structure for dynamic random access memory integrated circuit |
JP3244946B2 (ja) | 1994-06-22 | 2002-01-07 | 株式会社リコー | インクジェットヘッド |
JPH0890769A (ja) | 1994-09-27 | 1996-04-09 | Sharp Corp | ひだ付きダイアフラム型インクジェットヘッド |
JPH08142327A (ja) | 1994-11-16 | 1996-06-04 | Canon Inc | インクジェット記録装置の記録ヘッド |
JPH08281960A (ja) | 1995-04-13 | 1996-10-29 | Canon Inc | インクジェット記録ヘッド |
US5658471A (en) | 1995-09-22 | 1997-08-19 | Lexmark International, Inc. | Fabrication of thermal ink-jet feed slots in a silicon substrate |
US5786988A (en) | 1996-07-02 | 1998-07-28 | Sandisk Corporation | Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture |
KR100205321B1 (ko) | 1996-12-30 | 1999-07-01 | 구본준 | 크랙방지 패턴을 갖는 반도체소자의 제조방법 |
JPH10193598A (ja) | 1997-01-14 | 1998-07-28 | Nec Niigata Ltd | インクジェットヘッド |
US5882982A (en) | 1997-01-16 | 1999-03-16 | Vlsi Technology, Inc. | Trench isolation method |
US5910725A (en) * | 1997-03-27 | 1999-06-08 | Digital Equipment Corporation | Integrated circuit output power supply transient voltage protection circuit |
US5988786A (en) | 1997-06-30 | 1999-11-23 | Hewlett-Packard Company | Articulated stress relief of an orifice membrane |
JP3821255B2 (ja) | 1997-07-07 | 2006-09-13 | 富士写真フイルム株式会社 | インクジェットヘッド用圧電素子の作製方法 |
US5847725A (en) | 1997-07-28 | 1998-12-08 | Hewlett-Packard Company | Expansion relief for orifice plate of thermal ink jet print head |
US6106096A (en) | 1997-12-15 | 2000-08-22 | Lexmark International, Inc. | Printhead stress relief |
US6271102B1 (en) | 1998-02-27 | 2001-08-07 | International Business Machines Corporation | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
US6204182B1 (en) | 1998-03-02 | 2001-03-20 | Hewlett-Packard Company | In-situ fluid jet orifice |
JPH11284060A (ja) | 1998-03-27 | 1999-10-15 | Hitachi Ltd | 半導体装置及びその製造方法 |
EP1046032A4 (de) * | 1998-05-18 | 2002-05-29 | Univ Washington | Patrone zur flüssigkeitsanalyse |
JP2000006409A (ja) | 1998-06-23 | 2000-01-11 | Casio Comput Co Ltd | サーマルインクジェットヘッド |
JP3678025B2 (ja) | 1998-11-06 | 2005-08-03 | セイコーエプソン株式会社 | インクジェット式記録ヘッド |
JP4494546B2 (ja) | 1999-03-02 | 2010-06-30 | 株式会社リコー | 打抜加工用基板、打抜基板及び該打抜基板の製造方法 |
US6331055B1 (en) | 1999-08-30 | 2001-12-18 | Hewlett-Packard Company | Inkjet printhead with top plate bubble management |
US6184570B1 (en) | 1999-10-28 | 2001-02-06 | Ericsson Inc. | Integrated circuit dies including thermal stress reducing grooves and microelectronic packages utilizing the same |
DE60114411T2 (de) * | 2000-05-25 | 2006-07-20 | Debiotech S.A. | Microbearbeitete fluidische vorrichtung und herstellungsverfahren |
US6536477B1 (en) * | 2000-10-12 | 2003-03-25 | Nanostream, Inc. | Fluidic couplers and modular microfluidic systems |
US6719404B2 (en) * | 2002-02-15 | 2004-04-13 | Brother Kogyo Kabushiki Kaisha | Method of fabricating ink-jet head |
US6979077B2 (en) * | 2002-02-20 | 2005-12-27 | Brother Kogyo Kabushiki Kaisha | Ink-jet head and ink-jet printer having ink-jet head |
-
2002
- 2002-07-30 US US10/209,408 patent/US20040021741A1/en not_active Abandoned
-
2003
- 2003-06-20 US US10/601,150 patent/US6938985B2/en not_active Expired - Lifetime
- 2003-07-17 DE DE60310650T patent/DE60310650T2/de not_active Expired - Lifetime
- 2003-07-17 EP EP03254539A patent/EP1386741B1/de not_active Expired - Lifetime
- 2003-07-25 JP JP2003279608A patent/JP2004058678A/ja active Pending
- 2003-08-15 US US10/641,423 patent/US20040032465A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20040021741A1 (en) | 2004-02-05 |
EP1386741B1 (de) | 2006-12-27 |
US6938985B2 (en) | 2005-09-06 |
US20040021743A1 (en) | 2004-02-05 |
US20040032465A1 (en) | 2004-02-19 |
JP2004058678A (ja) | 2004-02-26 |
EP1386741A1 (de) | 2004-02-04 |
DE60310650T2 (de) | 2007-10-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, US |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: SCHOPPE, ZIMMERMANN, STOECKELER & ZINKLER, 82049 P |
|
8364 | No opposition during term of opposition |