ATE291273T1 - Ferroelektrische oder electretspeicherschaltung - Google Patents

Ferroelektrische oder electretspeicherschaltung

Info

Publication number
ATE291273T1
ATE291273T1 AT02803576T AT02803576T ATE291273T1 AT E291273 T1 ATE291273 T1 AT E291273T1 AT 02803576 T AT02803576 T AT 02803576T AT 02803576 T AT02803576 T AT 02803576T AT E291273 T1 ATE291273 T1 AT E291273T1
Authority
AT
Austria
Prior art keywords
memory
ferroelectric
electret
electrode
fatigue resistance
Prior art date
Application number
AT02803576T
Other languages
English (en)
Inventor
Hans Gude Gudesen
Per-Erik Nordal
Original Assignee
Thin Film Electronics Asa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thin Film Electronics Asa filed Critical Thin Film Electronics Asa
Application granted granted Critical
Publication of ATE291273T1 publication Critical patent/ATE291273T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/101Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including resistors or capacitors only
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B53/00Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Memories (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Inorganic Insulating Materials (AREA)
AT02803576T 2001-11-23 2002-11-22 Ferroelektrische oder electretspeicherschaltung ATE291273T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO20015735A NO20015735D0 (no) 2001-11-23 2001-11-23 Barrierelag
PCT/NO2002/000437 WO2003044801A1 (en) 2001-11-23 2002-11-22 A ferroelectric or electret memory circuit

Publications (1)

Publication Number Publication Date
ATE291273T1 true ATE291273T1 (de) 2005-04-15

Family

ID=19913059

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02803576T ATE291273T1 (de) 2001-11-23 2002-11-22 Ferroelektrische oder electretspeicherschaltung

Country Status (12)

Country Link
EP (1) EP1446806B1 (de)
JP (1) JP2005510078A (de)
KR (1) KR100603670B1 (de)
CN (1) CN100449640C (de)
AT (1) ATE291273T1 (de)
AU (1) AU2002366187B2 (de)
CA (1) CA2464082C (de)
DE (1) DE60203321T2 (de)
ES (1) ES2238638T3 (de)
NO (1) NO20015735D0 (de)
RU (1) RU2269830C1 (de)
WO (1) WO2003044801A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE58903298D1 (de) * 1989-06-29 1993-02-25 Siemens Ag Schaltungsanordnung zur identifikation integrierter halbleiterschaltkreise.
JP2005083961A (ja) * 2003-09-10 2005-03-31 ▲高▼木 敏行 歪センサー
NO321555B1 (no) * 2004-03-26 2006-05-29 Thin Film Electronics Asa Organisk elektronisk innretning og fremgangsmate til fremstilling av en slik innretning
US7205595B2 (en) * 2004-03-31 2007-04-17 Intel Corporation Polymer memory device with electron traps
NO20041733L (no) * 2004-04-28 2005-10-31 Thin Film Electronics Asa Organisk elektronisk krets med funksjonelt mellomsjikt og fremgangsmate til dens fremstilling.
NO321280B1 (no) * 2004-07-22 2006-04-18 Thin Film Electronics Asa Organisk, elektronisk krets og fremgangsmate til dens fremstilling
US7808024B2 (en) 2004-09-27 2010-10-05 Intel Corporation Ferroelectric polymer memory module
NO322202B1 (no) * 2004-12-30 2006-08-28 Thin Film Electronics Asa Fremgangsmate i fremstillingen av en elektronisk innretning
US7768014B2 (en) 2005-01-31 2010-08-03 Semiconductor Energy Laboratory Co., Ltd. Memory device and manufacturing method thereof
JP4749162B2 (ja) * 2005-01-31 2011-08-17 株式会社半導体エネルギー研究所 半導体装置
NO324809B1 (no) * 2005-05-10 2007-12-10 Thin Film Electronics Asa Fremgangsmate til dannelse av ferroelektriske tynnfilmer, bruk av fremgangsmaten og et minne med et minnemateriale av ferroelektrisk oligomer
US7868320B2 (en) 2005-05-31 2011-01-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP4939838B2 (ja) * 2005-05-31 2012-05-30 株式会社半導体エネルギー研究所 記憶装置
EP1798732A1 (de) * 2005-12-15 2007-06-20 Agfa-Gevaert Ferroelektrische passive Speicherzelle, Vorrichtung und Verfahren zu deren Herstellung
KR100994866B1 (ko) * 2006-02-09 2010-11-16 가부시키가이샤 히타치세이사쿠쇼 반도체 장치 및 그 제조 방법
KR100796643B1 (ko) 2006-10-02 2008-01-22 삼성전자주식회사 폴리머 메모리 소자 및 그 형성 방법
EP2286988A1 (de) * 2008-12-13 2011-02-23 Bayer MaterialScience AG Ferroelektret-Zwei- und Mehrschichtverbund und Verfahren zu dessen Herstellung
KR101042519B1 (ko) * 2008-12-30 2011-06-20 한국과학기술원 멀티 비트 저장 가능한 메모리 장치
JP4774130B1 (ja) * 2010-12-02 2011-09-14 株式会社サクラクレパス エレクトレット性微粒子又は粗粉の製造方法
RU2578305C2 (ru) * 2011-03-08 2016-03-27 Юбло Са, Женева Композиционный материал, содержащий благородный металл, способ получения и применение такого материала
US10242989B2 (en) * 2014-05-20 2019-03-26 Micron Technology, Inc. Polar, chiral, and non-centro-symmetric ferroelectric materials, memory cells including such materials, and related devices and methods
US10399166B2 (en) * 2015-10-30 2019-09-03 General Electric Company System and method for machining workpiece of lattice structure and article machined therefrom
WO2017090559A1 (ja) * 2015-11-25 2017-06-01 東レ株式会社 強誘電体記憶素子、その製造方法、ならびにそれを用いたメモリセルおよびそれを用いた無線通信装置
CN111403417B (zh) * 2020-03-25 2023-06-16 无锡舜铭存储科技有限公司 一种存储器件的结构及其制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02158173A (ja) * 1988-12-12 1990-06-18 Seiko Epson Corp 記憶装置
JPH03126275A (ja) * 1989-10-12 1991-05-29 Seiko Epson Corp 非線形2端子素子
JPH0418753A (ja) * 1990-05-11 1992-01-22 Olympus Optical Co Ltd 強誘電体メモリ
US5432731A (en) * 1993-03-08 1995-07-11 Motorola, Inc. Ferroelectric memory cell and method of sensing and writing the polarization state thereof
JPH0764107A (ja) * 1993-08-30 1995-03-10 Sharp Corp 非線形素子基板の製造方法
TW322578B (de) * 1996-03-18 1997-12-11 Matsushita Electron Co Ltd
JPH1022470A (ja) * 1996-07-02 1998-01-23 Hitachi Ltd 半導体記憶装置及びその製造方法
NO309500B1 (no) * 1997-08-15 2001-02-05 Thin Film Electronics Asa Ferroelektrisk databehandlingsinnretning, fremgangsmåter til dens fremstilling og utlesing, samt bruk av samme
US6284654B1 (en) * 1998-04-16 2001-09-04 Advanced Technology Materials, Inc. Chemical vapor deposition process for fabrication of hybrid electrodes
JP2000068465A (ja) * 1998-08-21 2000-03-03 Nec Corp 半導体装置及びその形成方法
JP3668079B2 (ja) * 1999-05-31 2005-07-06 忠弘 大見 プラズマプロセス装置
JP3956190B2 (ja) * 2000-01-28 2007-08-08 セイコーエプソン株式会社 強誘電体キャパシタアレイ及び強誘電体メモリの製造方法
NO20005980L (no) * 2000-11-27 2002-05-28 Thin Film Electronics Ab Ferroelektrisk minnekrets og fremgangsmåte ved dens fremstilling

Also Published As

Publication number Publication date
CN1589479A (zh) 2005-03-02
NO20015735D0 (no) 2001-11-23
KR100603670B1 (ko) 2006-07-20
ES2238638T3 (es) 2005-09-01
KR20040051614A (ko) 2004-06-18
DE60203321T2 (de) 2006-02-02
RU2004117774A (ru) 2006-01-10
WO2003044801A1 (en) 2003-05-30
RU2269830C1 (ru) 2006-02-10
JP2005510078A (ja) 2005-04-14
DE60203321D1 (de) 2005-04-21
CN100449640C (zh) 2009-01-07
CA2464082A1 (en) 2003-05-30
AU2002366187A1 (en) 2003-06-10
EP1446806B1 (de) 2005-03-16
EP1446806A1 (de) 2004-08-18
AU2002366187B2 (en) 2006-07-13
CA2464082C (en) 2007-03-27

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