NO20015735D0 - Barrierelag - Google Patents

Barrierelag

Info

Publication number
NO20015735D0
NO20015735D0 NO20015735A NO20015735A NO20015735D0 NO 20015735 D0 NO20015735 D0 NO 20015735D0 NO 20015735 A NO20015735 A NO 20015735A NO 20015735 A NO20015735 A NO 20015735A NO 20015735 D0 NO20015735 D0 NO 20015735D0
Authority
NO
Norway
Prior art keywords
memory
ferroelectric
electret
electrode
fatigue resistance
Prior art date
Application number
NO20015735A
Other languages
English (en)
Inventor
Per-Erik Nordal
Hans Gude Gudesen
Original Assignee
Thin Film Electronics Asa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thin Film Electronics Asa filed Critical Thin Film Electronics Asa
Priority to NO20015735A priority Critical patent/NO20015735D0/no
Publication of NO20015735D0 publication Critical patent/NO20015735D0/no
Priority to AT02803576T priority patent/ATE291273T1/de
Priority to KR1020047005847A priority patent/KR100603670B1/ko
Priority to DK02803576T priority patent/DK1446806T3/da
Priority to NO20025644A priority patent/NO317912B1/no
Priority to AU2002366187A priority patent/AU2002366187B2/en
Priority to CNB028232593A priority patent/CN100449640C/zh
Priority to CA002464082A priority patent/CA2464082C/en
Priority to PCT/NO2002/000437 priority patent/WO2003044801A1/en
Priority to JP2003546352A priority patent/JP2005510078A/ja
Priority to US10/301,790 priority patent/US6878980B2/en
Priority to DE60203321T priority patent/DE60203321T2/de
Priority to EP02803576A priority patent/EP1446806B1/en
Priority to RU2004117774/09A priority patent/RU2269830C1/ru
Priority to ES02803576T priority patent/ES2238638T3/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/101—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including resistors or capacitors only
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Memories (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Inorganic Insulating Materials (AREA)
NO20015735A 2001-11-23 2001-11-23 Barrierelag NO20015735D0 (no)

Priority Applications (15)

Application Number Priority Date Filing Date Title
NO20015735A NO20015735D0 (no) 2001-11-23 2001-11-23 Barrierelag
ES02803576T ES2238638T3 (es) 2001-11-23 2002-11-22 Circuito de memoria ferroelectrica o electret.
CNB028232593A CN100449640C (zh) 2001-11-23 2002-11-22 铁电或驻极体存储电路
PCT/NO2002/000437 WO2003044801A1 (en) 2001-11-23 2002-11-22 A ferroelectric or electret memory circuit
DK02803576T DK1446806T3 (da) 2001-11-23 2002-11-22 Et ferroelektrisk eller elektret hukommelseskredslöb
NO20025644A NO317912B1 (no) 2001-11-23 2002-11-22 Ferroelektrisk eller elektret minnekrets
AU2002366187A AU2002366187B2 (en) 2001-11-23 2002-11-22 A ferroelectric or electret memory circuit
AT02803576T ATE291273T1 (de) 2001-11-23 2002-11-22 Ferroelektrische oder electretspeicherschaltung
CA002464082A CA2464082C (en) 2001-11-23 2002-11-22 A ferroelectric or electret memory circuit
KR1020047005847A KR100603670B1 (ko) 2001-11-23 2002-11-22 강유전체 또는 일렉트릿 메모리 회로
JP2003546352A JP2005510078A (ja) 2001-11-23 2002-11-22 強誘電体又はエレクトレットメモリ回路
US10/301,790 US6878980B2 (en) 2001-11-23 2002-11-22 Ferroelectric or electret memory circuit
DE60203321T DE60203321T2 (de) 2001-11-23 2002-11-22 Ferroelektrische oder elektret-speicherschaltung
EP02803576A EP1446806B1 (en) 2001-11-23 2002-11-22 A ferroelectric or electret memory circuit
RU2004117774/09A RU2269830C1 (ru) 2001-11-23 2002-11-22 Ферроэлектрический или электретный запоминающий контур

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NO20015735A NO20015735D0 (no) 2001-11-23 2001-11-23 Barrierelag

Publications (1)

Publication Number Publication Date
NO20015735D0 true NO20015735D0 (no) 2001-11-23

Family

ID=19913059

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20015735A NO20015735D0 (no) 2001-11-23 2001-11-23 Barrierelag

Country Status (12)

Country Link
EP (1) EP1446806B1 (no)
JP (1) JP2005510078A (no)
KR (1) KR100603670B1 (no)
CN (1) CN100449640C (no)
AT (1) ATE291273T1 (no)
AU (1) AU2002366187B2 (no)
CA (1) CA2464082C (no)
DE (1) DE60203321T2 (no)
ES (1) ES2238638T3 (no)
NO (1) NO20015735D0 (no)
RU (1) RU2269830C1 (no)
WO (1) WO2003044801A1 (no)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE84637T1 (de) * 1989-06-29 1993-01-15 Siemens Ag Schaltungsanordnung zur identifikation integrierter halbleiterschaltkreise.
JP2005083961A (ja) * 2003-09-10 2005-03-31 ▲高▼木 敏行 歪センサー
NO321555B1 (no) * 2004-03-26 2006-05-29 Thin Film Electronics Asa Organisk elektronisk innretning og fremgangsmate til fremstilling av en slik innretning
US7205595B2 (en) * 2004-03-31 2007-04-17 Intel Corporation Polymer memory device with electron traps
NO20041733L (no) * 2004-04-28 2005-10-31 Thin Film Electronics Asa Organisk elektronisk krets med funksjonelt mellomsjikt og fremgangsmate til dens fremstilling.
NO321280B1 (no) * 2004-07-22 2006-04-18 Thin Film Electronics Asa Organisk, elektronisk krets og fremgangsmate til dens fremstilling
US7808024B2 (en) 2004-09-27 2010-10-05 Intel Corporation Ferroelectric polymer memory module
NO322202B1 (no) * 2004-12-30 2006-08-28 Thin Film Electronics Asa Fremgangsmate i fremstillingen av en elektronisk innretning
US7768014B2 (en) 2005-01-31 2010-08-03 Semiconductor Energy Laboratory Co., Ltd. Memory device and manufacturing method thereof
JP4749162B2 (ja) * 2005-01-31 2011-08-17 株式会社半導体エネルギー研究所 半導体装置
NO324809B1 (no) * 2005-05-10 2007-12-10 Thin Film Electronics Asa Fremgangsmate til dannelse av ferroelektriske tynnfilmer, bruk av fremgangsmaten og et minne med et minnemateriale av ferroelektrisk oligomer
US7868320B2 (en) 2005-05-31 2011-01-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP4939838B2 (ja) * 2005-05-31 2012-05-30 株式会社半導体エネルギー研究所 記憶装置
EP1798732A1 (en) * 2005-12-15 2007-06-20 Agfa-Gevaert Ferroelectric passive memory cell, device and method of manufacture thereof.
KR100994866B1 (ko) * 2006-02-09 2010-11-16 가부시키가이샤 히타치세이사쿠쇼 반도체 장치 및 그 제조 방법
KR100796643B1 (ko) * 2006-10-02 2008-01-22 삼성전자주식회사 폴리머 메모리 소자 및 그 형성 방법
EP2286988A1 (de) * 2008-12-13 2011-02-23 Bayer MaterialScience AG Ferroelektret-Zwei- und Mehrschichtverbund und Verfahren zu dessen Herstellung
KR101042519B1 (ko) * 2008-12-30 2011-06-20 한국과학기술원 멀티 비트 저장 가능한 메모리 장치
JP4774130B1 (ja) * 2010-12-02 2011-09-14 株式会社サクラクレパス エレクトレット性微粒子又は粗粉の製造方法
US9096917B2 (en) * 2011-03-08 2015-08-04 Hublot Sa, Genève Composite material comprising a precious metal, manufacturing process and use of such material
US10242989B2 (en) * 2014-05-20 2019-03-26 Micron Technology, Inc. Polar, chiral, and non-centro-symmetric ferroelectric materials, memory cells including such materials, and related devices and methods
US10399166B2 (en) * 2015-10-30 2019-09-03 General Electric Company System and method for machining workpiece of lattice structure and article machined therefrom
CN108292630B (zh) * 2015-11-25 2023-04-25 东丽株式会社 铁电体存储元件、其制造方法、以及使用其的存储单元及使用其的无线通信装置
CN111403417B (zh) * 2020-03-25 2023-06-16 无锡舜铭存储科技有限公司 一种存储器件的结构及其制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02158173A (ja) * 1988-12-12 1990-06-18 Seiko Epson Corp 記憶装置
JPH03126275A (ja) * 1989-10-12 1991-05-29 Seiko Epson Corp 非線形２端子素子
JPH0418753A (ja) * 1990-05-11 1992-01-22 Olympus Optical Co Ltd 強誘電体メモリ
US5432731A (en) * 1993-03-08 1995-07-11 Motorola, Inc. Ferroelectric memory cell and method of sensing and writing the polarization state thereof
JPH0764107A (ja) * 1993-08-30 1995-03-10 Sharp Corp 非線形素子基板の製造方法
TW322578B (no) * 1996-03-18 1997-12-11 Matsushita Electron Co Ltd
JPH1022470A (ja) * 1996-07-02 1998-01-23 Hitachi Ltd 半導体記憶装置及びその製造方法
NO309500B1 (no) * 1997-08-15 2001-02-05 Thin Film Electronics Asa Ferroelektrisk databehandlingsinnretning, fremgangsmåter til dens fremstilling og utlesing, samt bruk av samme
US6284654B1 (en) * 1998-04-16 2001-09-04 Advanced Technology Materials, Inc. Chemical vapor deposition process for fabrication of hybrid electrodes
JP2000068465A (ja) * 1998-08-21 2000-03-03 Nec Corp 半導体装置及びその形成方法
JP3668079B2 (ja) * 1999-05-31 2005-07-06 忠弘 大見 プラズマプロセス装置
JP3956190B2 (ja) * 2000-01-28 2007-08-08 セイコーエプソン株式会社 強誘電体キャパシタアレイ及び強誘電体メモリの製造方法
NO20005980L (no) * 2000-11-27 2002-05-28 Thin Film Electronics Ab Ferroelektrisk minnekrets og fremgangsmåte ved dens fremstilling

Also Published As

Publication number Publication date
KR100603670B1 (ko) 2006-07-20
CA2464082A1 (en) 2003-05-30
RU2269830C1 (ru) 2006-02-10
AU2002366187B2 (en) 2006-07-13
ES2238638T3 (es) 2005-09-01
CN100449640C (zh) 2009-01-07
RU2004117774A (ru) 2006-01-10
CN1589479A (zh) 2005-03-02
AU2002366187A1 (en) 2003-06-10
JP2005510078A (ja) 2005-04-14
ATE291273T1 (de) 2005-04-15
EP1446806A1 (en) 2004-08-18
DE60203321D1 (de) 2005-04-21
DE60203321T2 (de) 2006-02-02
WO2003044801A1 (en) 2003-05-30
EP1446806B1 (en) 2005-03-16
CA2464082C (en) 2007-03-27
KR20040051614A (ko) 2004-06-18

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