ZA9410324B - Heat-pipe type cooling apparatus - Google Patents

Heat-pipe type cooling apparatus

Info

Publication number
ZA9410324B
ZA9410324B ZA9410324A ZA9410324A ZA9410324B ZA 9410324 B ZA9410324 B ZA 9410324B ZA 9410324 A ZA9410324 A ZA 9410324A ZA 9410324 A ZA9410324 A ZA 9410324A ZA 9410324 B ZA9410324 B ZA 9410324B
Authority
ZA
South Africa
Prior art keywords
heat
cooling apparatus
pipe type
type cooling
pipe
Prior art date
Application number
ZA9410324A
Other languages
English (en)
Inventor
Osamu Suzuki
Heikichi Kuwahara
Kazumasa Fujioka
Syuuji Saitoo
Nobuo Suzuki
Koichi Isaka
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of ZA9410324B publication Critical patent/ZA9410324B/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936Liquid coolant with phase change
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00Fins
    • F28F2215/04Assemblies of fins having different features, e.g. with different fin densities
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00Fastening; Joining
    • F28F2275/04Fastening; Joining by brazing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00Fastening; Joining
    • F28F2275/12Fastening; Joining by methods involving deformation of the elements
    • F28F2275/125Fastening; Joining by methods involving deformation of the elements by bringing elements together and expanding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
ZA9410324A 1993-12-28 1994-12-27 Heat-pipe type cooling apparatus ZA9410324B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5334936A JP3020790B2 (ja) 1993-12-28 1993-12-28 ヒートパイプ式冷却装置とこれを用いた車両制御装置

Publications (1)

Publication Number Publication Date
ZA9410324B true ZA9410324B (en) 1995-09-13

Family

ID=18282892

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA9410324A ZA9410324B (en) 1993-12-28 1994-12-27 Heat-pipe type cooling apparatus

Country Status (8)

Country Link
US (1) US5651414A (zh)
EP (1) EP0661741B1 (zh)
JP (1) JP3020790B2 (zh)
KR (1) KR0159980B1 (zh)
CN (1) CN1066577C (zh)
AU (1) AU668664B2 (zh)
DE (1) DE69424761T2 (zh)
ZA (1) ZA9410324B (zh)

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JPH0714029B2 (ja) * 1990-02-07 1995-02-15 日本碍子株式会社 電力用半導体素子
AU659502B2 (en) * 1991-10-29 1995-05-18 Technisearch Limited Improvements in and relating to heat pipes

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Publication number Publication date
EP0661741B1 (en) 2000-05-31
EP0661741A1 (en) 1995-07-05
CN1115498A (zh) 1996-01-24
JP3020790B2 (ja) 2000-03-15
DE69424761T2 (de) 2000-12-28
US5651414A (en) 1997-07-29
AU8159494A (en) 1995-07-27
JPH07190655A (ja) 1995-07-28
DE69424761D1 (de) 2000-07-06
CN1066577C (zh) 2001-05-30
KR0159980B1 (ko) 1998-12-01
AU668664B2 (en) 1996-05-09
KR950021451A (ko) 1995-07-26

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