CN102036536B - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
CN102036536B
CN102036536B CN200910308042.0A CN200910308042A CN102036536B CN 102036536 B CN102036536 B CN 102036536B CN 200910308042 A CN200910308042 A CN 200910308042A CN 102036536 B CN102036536 B CN 102036536B
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radiating fin
fin group
absorber plate
heat
cooling
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CN102036536A (zh
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黄兆濬
熊晓燕
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Guangdong Winshare Thermal Technology Co ltd
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Wenzhou Hongchengxiang Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F28F1/325—Fins with openings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置，包括一散热鳍片组，该散热鳍片组包括相互堆叠的若干散热鳍片，所述各散热鳍片的大小由该散热鳍片组的底端向其顶端逐渐增大，每一散热鳍片上设有若干通孔，各散热鳍片上的通孔上下对应连通并于该散热鳍片组内形成若干对流通道，可不需要设置风扇，仅通过对流通道便可实现散热鳍片组周围的空气对流，从而实现与散热鳍片组的热交换，同时各散热鳍片由该散热鳍片组的底端向其顶端逐渐增大，可使较多的高温气流由该散热鳍片组的下方进入到气流通道内，从而提高该散热装置的散热性能。

Description

散热装置
技术领域
本发明涉及一种散热装置，特别是指一种对电子元件散热的散热装置。
背景技术
随着电子信息业不断发展，电子元件(尤为中央处理器)运行频率和速度在不断提升。由于高频高速将使电子元件产生的热量随之增多，使得其温度不断升高，严重威胁着电子元件运行时的性能，为确保电子元件能正常运作，必须及时排出电子元件所产生的大量热量。
为此，业界通常使用一种散热装置进行散热，现有的散热装置通常包括一吸热板、设于吸热板上方的一散热器及连接于该散热器与吸热板之间的多个热管。该吸热板贴设于电子元件的上表面，该热管的蒸发端接合于吸热板上，其冷凝端结合于散热器，该电子元件产生的热量通过该吸热板吸收后传导至热管，再进一步通过散热器散发出去。为增强散热器与周围空气的热对流，常在散热器的一侧设有一风扇以加快其热量的散发，但由于风扇常会产生噪音及振动，给使用者造成不便，同时风扇的设置也会增大散热装置的占用空间，不利于小型化发展的需求。
发明内容
有鉴于此，有必要提供一种不采用风扇即可实现较好地热对流效果的散热装置。
一种散热装置，包括一散热鳍片组，该散热鳍片组包括相互堆叠的若干散热鳍片，所述各散热鳍片的大小由该散热鳍片组的底端向其顶端逐渐增大，每一散热鳍片上设有若干通孔，各散热鳍片上的通孔上下对应连通并于该散热鳍片组内形成若干对流通道。
与现有技术相比，上述散热装置的散热鳍片组内形成若干对流通道，可不需要设置风扇，仅通过对流通道便可实现散热鳍片组周围的空气对流，从而实现与散热鳍片组的热交换，同时各散热鳍片由该散热鳍片组的底端向其顶端逐渐增大，可使较多的高温气流由该散热鳍片组的下方进入到气流通道内，从而提高该散热装置的散热性能。
附图说明
图1是本发明一较佳实施例散热装置的立体分解图。
图2是图1的立体组装图。
具体实施方式
以下参照附图，对本发明散热装置予以进一步说明。
如图1及图2所示，该散热装置10包括一吸热板12、一散热鳍片组14及四根热管16。
该吸热板12由导性热性能较好的金属如铜制成，其大致呈矩形板状。该吸热板12具有一平整的下表面120及一与该下表面120相对的上表面122。该上表面122上并排设有四个相互平行的横直沟槽124。所述四个横直沟槽124的横截面均呈半圆弧形，所述沟槽124分别延伸贯穿该吸热板12的左右两侧。
该散热鳍片组14平行设于该吸热板12的正上方。该散热鳍片组14由若干散热鳍片140沿竖直方向堆叠而成，所述各散热鳍片140相互平行，每相邻两散热鳍片140间形成一气流通道142。每一散热鳍片140呈矩形板状，且各散热鳍片140的大小由该散热鳍片组14的底端向其顶端逐渐增大，使该散热鳍片组14的整体呈一倒锥状。该散热鳍片组14上设有四个供热管16穿设的穿孔144。所述穿孔144由该散热鳍片组14的底端贯穿至其顶端。该散热鳍片组14的每一散热鳍片140上设有若干密集排布的通孔146，各散热鳍片140上的通孔146上下对应连通，从而于散热鳍片组14内形成若干对流通道148。所述对流通道148与该散热鳍片组10的散热鳍片140相垂直。
所述热管16设于该吸热板12的上方，连接设于该吸热板12与散热鳍片组14之间。所述热管16分别呈“L”形，每一热管16包括一水平的蒸发段160及一与该蒸发段160垂直的冷凝段162。
组装时，所述四根热管16的蒸发段160并排收容于该吸热板12的沟槽124内，并通过焊接与该吸热板12固定连接，其冷凝段162左右交错分别穿设于该散热鳍片组14的四个穿孔144内，组装后的该散热鳍片组14的底端与所述热管16的蒸发段160间保持一定的距离，以使热气流可由散热鳍片组14的底端进入。
使用时，该散热装置10通过吸热板12的下表面120与一发热电子元件接触，该发热电子元件产生的热量由该吸热板12吸收后传导至热管16的蒸发段160，再将热量传导至热管16的冷凝段162，所述热管16的冷凝段162进一步通过散热鳍片组14将热量散发到周围环境中。同时，该发热电子元件周围的高温气流沿该散热鳍片组14内的对流通道148上升，并在行进过程中与散热鳍片组14的散热鳍片140进行较大面积的接触而带走散热鳍片组14的热量，从而可不需要设置风扇，仅通过空气对流即可实现散热鳍片组14的热交换。另外，该散热鳍片组14的各散热鳍片140由下向上逐渐增大的设置，可以防止靠近发热电子元件附近的高温气流受散热鳍片组14的底端散热鳍片140的阻挡，使较多的高温气流由该散热鳍片组14的下方进入到气流通道148内，从而提高该散热装置10的散热性能。

Claims (4)

1.一种散热装置，包括一散热鳍片组及设于该散热鳍片组底部、与一发热电子组件接触的一吸热板，其特征在于：该散热鳍片组包括相互堆叠的若干散热鳍片，每一散热鳍片呈平板状，所述各散热鳍片的大小由该散热鳍片组靠近吸热板的底端向其远离吸热板的顶端逐渐增大，散热鳍片组的整体呈一倒锥状，每一散热鳍片上设有若干通孔，各散热鳍片上的通孔上下对应连通并于该散热鳍片组内形成若干对流通道。
2.如权利要求1所述的散热装置，其特征在于：所述对流通道与散热鳍片组的散热鳍片相垂直。
3.如权利要求1至2任意一项所述的散热装置，其特征在于：该散热鳍片组还包括一吸热板及连接于该吸热板与散热鳍片组之间的至少一热管，该吸热板与散热鳍片组的底端保持一定的距离。
4.如权利要求3所述的散热装置，其特征在于：该散热鳍片组的散热鳍片与该吸热板相平行。
CN200910308042.0A 2009-09-30 2009-09-30 散热装置 Active CN102036536B (zh)

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CN200910308042.0A CN102036536B (zh) 2009-09-30 2009-09-30 散热装置
US12/608,941 US20110073283A1 (en) 2009-09-30 2009-10-29 Heat dissipation device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9599274B2 (en) * 2012-12-31 2017-03-21 Raytheon Company Multi-stage thermal isolator for focal plane arrays and other devices
US11828549B2 (en) 2019-01-04 2023-11-28 Nvidia Corporation Integrated heat sink and air plenum for a heat-generating integrated circuit
US11711905B2 (en) * 2020-02-18 2023-07-25 Nvidia Corporation Heat sink with adjustable fin pitch

Citations (2)

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US7011144B2 (en) * 2004-03-31 2006-03-14 Hewlett-Packard Development Company, L.P. System and method for cooling electronic assemblies
TWM347607U (en) * 2008-05-12 2008-12-21 Cooler Master Co Ltd Heat sink device

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US2444220A (en) * 1944-09-30 1948-06-29 United Aircraft Corp Engine cylinder fin and baffle construction
JP3020790B2 (ja) * 1993-12-28 2000-03-15 株式会社日立製作所 ヒートパイプ式冷却装置とこれを用いた車両制御装置
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US7011144B2 (en) * 2004-03-31 2006-03-14 Hewlett-Packard Development Company, L.P. System and method for cooling electronic assemblies
TWM347607U (en) * 2008-05-12 2008-12-21 Cooler Master Co Ltd Heat sink device

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US20110073283A1 (en) 2011-03-31

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