DE69424761D1 - Kühlungsapparat vom Wärmerohrtyp - Google Patents

Kühlungsapparat vom Wärmerohrtyp

Info

Publication number
DE69424761D1
DE69424761D1 DE69424761T DE69424761T DE69424761D1 DE 69424761 D1 DE69424761 D1 DE 69424761D1 DE 69424761 T DE69424761 T DE 69424761T DE 69424761 T DE69424761 T DE 69424761T DE 69424761 D1 DE69424761 D1 DE 69424761D1
Authority
DE
Germany
Prior art keywords
heat pipe
cooling apparatus
pipe type
type cooling
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69424761T
Other languages
English (en)
Other versions
DE69424761T2 (de
Inventor
Osamu Suzuki
Heikichi Kuwahara
Kazumasa Fujioka
Syuuji Saitoo
Nobuo Suzuki
Koichi Isaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE69424761D1 publication Critical patent/DE69424761D1/de
Publication of DE69424761T2 publication Critical patent/DE69424761T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936Liquid coolant with phase change
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00Fins
    • F28F2215/04Assemblies of fins having different features, e.g. with different fin densities
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00Fastening; Joining
    • F28F2275/04Fastening; Joining by brazing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00Fastening; Joining
    • F28F2275/12Fastening; Joining by methods involving deformation of the elements
    • F28F2275/125Fastening; Joining by methods involving deformation of the elements by bringing elements together and expanding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geometry (AREA)
  • Sustainable Development (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69424761T 1993-12-28 1994-12-19 Kühlungsapparat vom Wärmerohrtyp Expired - Lifetime DE69424761T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5334936A JP3020790B2 (ja) 1993-12-28 1993-12-28 ヒートパイプ式冷却装置とこれを用いた車両制御装置

Publications (2)

Publication Number Publication Date
DE69424761D1 true DE69424761D1 (de) 2000-07-06
DE69424761T2 DE69424761T2 (de) 2000-12-28

Family

ID=18282892

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69424761T Expired - Lifetime DE69424761T2 (de) 1993-12-28 1994-12-19 Kühlungsapparat vom Wärmerohrtyp

Country Status (8)

Country Link
US (1) US5651414A (de)
EP (1) EP0661741B1 (de)
JP (1) JP3020790B2 (de)
KR (1) KR0159980B1 (de)
CN (1) CN1066577C (de)
AU (1) AU668664B2 (de)
DE (1) DE69424761T2 (de)
ZA (1) ZA9410324B (de)

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EP0661741A1 (de) 1995-07-05
AU8159494A (en) 1995-07-27
JPH07190655A (ja) 1995-07-28
KR950021451A (ko) 1995-07-26
KR0159980B1 (ko) 1998-12-01
ZA9410324B (en) 1995-09-13
EP0661741B1 (de) 2000-05-31
CN1115498A (zh) 1996-01-24
CN1066577C (zh) 2001-05-30
AU668664B2 (en) 1996-05-09
US5651414A (en) 1997-07-29
JP3020790B2 (ja) 2000-03-15
DE69424761T2 (de) 2000-12-28

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