CN101866887B - 散热装置 - Google Patents

散热装置 Download PDF

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CN101866887B
CN101866887B CN200910301609.1A CN200910301609A CN101866887B CN 101866887 B CN101866887 B CN 101866887B CN 200910301609 A CN200910301609 A CN 200910301609A CN 101866887 B CN101866887 B CN 101866887B
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cavity
condensation
condensation cavity
horizontal part
evaporation
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CN101866887A (zh
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黄清白
孟劲功
洪锐彣
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Furui Precise Component Kunshan Co Ltd
Hon Hai Precision Industry Co Ltd
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Furui Precise Component Kunshan Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to JP2010091521A priority patent/JP2010251755A/ja
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

一种散热装置,包括一传热体及一散热体,该传热体内为中空结构且设有毛细结构及工作液体,该传热体包括中空且相互连通的蒸发腔体及冷凝腔体,该冷凝腔体自该蒸发腔体向上延伸,该毛细结构包括水平部及竖直部,该水平部贴设于该蒸发腔体的内壁,该竖直部自该水平部向上延伸至该冷凝腔体内并与冷凝腔体的内壁相间隔,该竖直部的外围与冷凝腔体的内壁之间形成蒸汽通道,该冷凝腔体穿设于该散热体内。

Description

散热装置
技术领域
本发明涉及一种散热装置,特别涉及一种适用于电子元件散热的散热装置。
背景技术
随着电脑产业的迅速发展,CPU追求高速度化,多功能化及小型化所衍生的散热问题越来越严重,因此,必须将热量及时有效地散发出去,否则会极大地影响电子元件的工作性能,同时还会缩减电子元件的使用寿命。
目前的散热装置大多采用实心金属吸热底板配合圆型热管与散热鳍片的组合,其中,热管的蒸发端与该吸热底板相连,冷凝端穿设于散热鳍片中。吸热底板吸收发热电子元件产生的热量,再通过热管将热量传导至散热鳍片上。然而,吸热底板的导热性能有限,且热管与吸热底板之间存在热阻,阻碍了热量传输,从而降低了散热装置的散热性能。
发明内容
有鉴于此,有必要提供一种高效率的散热装置。
一种散热装置,包括一传热体及一散热体,该传热体内为中空结构且设有毛细结构及工作液体,该传热体包括中空且相互连通的蒸发腔体及冷凝腔体,该冷凝腔体自该蒸发腔体向上延伸,该毛细结构包括水平部及竖直部,该水平部贴设于该蒸发腔体的内壁,该竖直部自该水平部向上延伸至该冷凝腔体内并与冷凝腔体的内壁相间隔,该竖直部的外围与冷凝腔体的内壁之间形成蒸汽通道,该冷凝腔体穿设于该散热体内。
上述散热装置中,该传热体的蒸发腔体与发热电子元件直接接触吸热,并通过其内工作液体的相变化迅速将热量带至冷凝腔体,与传统的散热装置相比,该传热体的吸热效果更好,且该传热体集成了传统散热装置的实心吸热底板和热管的功能,减少了传热部件,从而减少了热阻,提高了散热效率。
附图说明
图1为本发明散热装置较佳实施例的立体组合图。
图2为图1所示散热装置的立体分解图。
图3为图2所示传热体的立体分解图。
图4为图1沿IV-IV线的剖面示意图。
具体实施方式
请参阅图1及图2,该散热模组包括一传热体10及一散热体20。
该散热体20由若干相互平行的散热鳍片22自上而下堆叠而成,这些散热鳍片22相互间隔设置,从而于相邻散热鳍片22间形成空隙。每一散热鳍片22大致呈平板形,其中部设有两相邻的条形孔222,该两条形孔222大致呈“八”字形相对。所有散热鳍片22上的条形孔222位置自上而下相互对准,从而共同构成沿散热鳍片22堆叠方向贯穿整个散热体20的两贯穿孔。每一条形孔222的外围向上凸设一环缘224。
请同时参阅图3及图4,该传热体10内为中空结构,其内部设有毛细结构18及适量工作液体。该传热体10由导热性能良好的材料比如铜制成,可迅速地传递热量,使其内部和外部快速地进行热交换。所述工作液体为低沸点液体,比如水、酒精等,受热易蒸发汽化,遇冷易液化凝结。
该传热体10包括一水平的蒸发腔体14及两个竖直的冷凝腔体16,该蒸发腔体14与冷凝腔体16相互垂直。该蒸发腔体14大致呈中空的板型,包括上下相对的一上壳142及一下壳144,该上壳142和下壳144合围形成一中空的蒸发腔室。该蒸发腔体14具有上下相对的一顶面143及一底面145,该顶面143位于该上壳142的顶部,该底面145位于该下壳144的底部。该顶面143中部向上延伸形成两个呈条形环状的凸壁141,该两个凸壁141结构相似大致呈“八”字形相对。每一凸壁141包围形成一中空结构,并在其顶端形成开口140。该两个冷凝腔体16形状结构相同,都呈纵长的中空扁平状。该冷凝腔体16的顶端封闭,底端敞开,每一冷凝腔体16的内部形成一中空的冷凝腔室。该两个冷凝腔体16分别与该蒸发腔体14的顶面143垂直。该两个冷凝腔体16的底端分别插设于该蒸发腔体14的两个凸壁141的顶端的开口140内,并与凸壁141的内壁相贴合,从而可使该两个冷凝腔体16和蒸发腔体14的内部连通,从而该蒸发腔体14和冷凝腔体16共同构成一密闭腔室。
该毛细结构18的整体轮廓与传热体10的整体轮廓相似。该毛细结构18包括水平部181和两个竖直部182。该水平部181呈板状,铺设于该蒸发腔体14内。该水平部181贴设于该蒸发腔体14的底部,与该蒸发腔体14的顶部相间隔以形成供蒸汽运动的蒸汽空间147。该两个竖直部182分别自该水平部181的中部垂直向上延伸至该两个冷凝腔体16的顶部,并与冷凝腔体16的整个内壁相间隔,从而于竖直部182的外围与冷凝腔体16的内壁之间形成蒸汽通道148,使蒸汽可运动至冷凝腔体16的顶部。该蒸汽空间147与该蒸汽通道148相连通。该水平部181和竖直部182一体成型。所述工作液体蕴含在该毛细结构18中。该毛细结构18可由丝网等编织而成,该毛细结构18的内部可形成若干细小的孔隙以提供毛细力帮助工作液体回流。
成型该传热体10时,该两个冷凝腔体16的底端分别与该蒸发腔体14的上壳142的两个凸壁141密封接合,从而使该两个冷凝腔体16与蒸发腔体14的上壳142连接于一体,并通过开口140与蒸发腔体14相连通,该两个冷凝腔体16大致组合呈“八”字形。该毛细结构18的两个竖直部182分别收容于该两个冷凝腔体16内,最后蒸发腔体14的上壳142和下壳144接合密封,形成该传热体10。
组装该散热装置时,该两个冷凝腔体16分别与该散热体20内由该条形孔222形成的两个贯穿孔位置对准,并穿设于该两个贯穿孔内,固定时,可通过焊接等方式使该传热体10与散热体20牢固地连接在一起。
该散热装置工作时,该传热体10的蒸发腔体14的底面145与发热电子元件(图未示)接触,吸收发热电子元件产生的热量,并迅速地将热量传递至其内部,使位于水平部181内的工作液体受热蒸发汽化,释放至水平部181上部的蒸汽空间147内,并经由蒸汽通道148在冷凝腔体16内向上运动至冷凝腔体16的顶部,同时将热量通过冷凝腔体16传递给冷凝腔体16外围的散热鳍片22,利用散热鳍片22较大的散热面积将热量散发至外界,从而使冷凝腔体16的温度降低,进而使冷凝腔体16内的蒸气液化凝结,并在竖直部182的毛细力作用下回流到水平部181,最后至蒸发腔体14的底部,然后继续蒸发汽化、液化凝结如此循环工作,从而将发热电子元件产生的热量源源不断地散发出去。
该散热装置中,该传热体10用于直接与发热电子元件接触吸热,并通过其内部的毛细结构18和工作液体快速地传热,与传统散热装置所采用的实心吸热底板相比,该传热体10吸热能力更加优越;且该散热装置的传热体10集成了传统散热装置的实心吸热底板和热管的功能,减少了传热部件,从而减少了热阻,提高了散热效率;此外,该冷凝腔体16呈扁平状,且该两个条形孔222外围设有环缘224,大大增加了该冷凝腔体16与散热鳍片22的接触面积,有利于提高传热效率,进一步提高散热装置的散热效率。
另外,传热体10的两个冷凝腔体16呈八字形排列,在其他实施例中,当该散热体20的侧部设有散热风扇时,该两个冷凝腔体还具有导流的作用,进一步优化散热装置的性能。
本实施例中,该冷凝腔体16有两个,事实上,在其他实施例中,该冷凝腔体16的数量可依实际散热需求适当增减。

Claims (9)

1.一种散热装置,包括一传热体及一散热体,该传热体内为中空结构且设有毛细结构及工作液体,其特征在于:该传热体包括中空且相互连通的蒸发腔体及冷凝腔体,该冷凝腔体自该蒸发腔体向上延伸,该毛细结构包括水平部及竖直部,该水平部贴设于该蒸发腔体的内壁,该竖直部自该水平部向上延伸至该冷凝腔体内并与冷凝腔体的内壁相间隔,该竖直部的外围与冷凝腔体的内壁之间形成蒸汽通道,该冷凝腔体穿设于该散热体内,该蒸发腔体包括上下相对的一上壳及一下壳,该上壳和下壳合围形成一中空的蒸发腔室,该上壳向上延伸形成一环状的凸壁,该凸壁的顶端设有一开口,该冷凝腔体呈纵长的中空扁平状,该冷凝腔体的内部形成一中空的冷凝腔室,该冷凝腔体的顶端封闭,底端敞开,该冷凝腔体的底端插设于该开口内。
2.如权利要求1所述的散热装置,其特征在于:该蒸发腔体呈中空板形,该冷凝腔体呈纵长的中空扁平状。
3.如权利要求2所述的散热装置,其特征在于:该毛细结构的水平部呈板形,该水平部铺设于该蒸发腔体的内壁,并在蒸发腔体内于蒸发腔体与水平部之间形成蒸汽空间,该蒸汽空间与冷凝腔体内的蒸汽通道相连通。
4.如权利要求3所述的散热装置,其特征在于:该毛细结构的竖直部呈纵长的扁平状,该竖直部与该冷凝腔体的整个内壁相间隔。
5.如权利要求2所述的散热装置,其特征在于:该冷凝腔体有两个,该两个冷凝腔体呈八字形相对。
6.如权利要求1所述的散热装置,其特征在于:该毛细结构的竖直部与水平部垂直。
7.如权利要求1所述的散热装置,其特征在于:该毛细结构的水平部与竖直部一体成型。
8.如权利要求1至7中任意一项所述的散热装置,其特征在于:该散热体由若干散热鳍片堆叠而成,该传热体的冷凝腔体沿散热鳍片的堆叠方向穿设于该散热体内。
9.如权利要求8所述的散热装置,其特征在于:每一散热鳍片上形成供所述冷凝腔体穿设的条形孔,该条形孔的外围形成一环缘。
CN200910301609.1A 2009-04-16 2009-04-16 散热装置 Expired - Fee Related CN101866887B (zh)

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US12/512,953 US20100263834A1 (en) 2009-04-16 2009-07-30 Heat dissipation device
JP2010091521A JP2010251755A (ja) 2009-04-16 2010-04-12 放熱装置

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CN103900411B (zh) * 2014-03-26 2017-02-08 江苏项瑛农机有限公司 一种高效热管
CN203934263U (zh) * 2014-07-04 2014-11-05 讯凯国际股份有限公司 具有毛细构件的散热装置
TWI535990B (zh) * 2014-07-22 2016-06-01 A larger heat pipe at one end and a manufacturing method thereof
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