WO2022148435A1 - 散热器及通信设备 - Google Patents
散热器及通信设备 Download PDFInfo
- Publication number
- WO2022148435A1 WO2022148435A1 PCT/CN2022/070742 CN2022070742W WO2022148435A1 WO 2022148435 A1 WO2022148435 A1 WO 2022148435A1 CN 2022070742 W CN2022070742 W CN 2022070742W WO 2022148435 A1 WO2022148435 A1 WO 2022148435A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- flow
- heat dissipation
- tooth
- heat sink
- substrate
- Prior art date
Links
- 238000004891 communication Methods 0.000 title claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims abstract description 273
- 239000000758 substrate Substances 0.000 claims abstract description 138
- 238000001816 cooling Methods 0.000 claims abstract description 122
- 239000002826 coolant Substances 0.000 claims abstract description 113
- 238000001704 evaporation Methods 0.000 claims description 68
- 230000008020 evaporation Effects 0.000 claims description 64
- 238000010438 heat treatment Methods 0.000 claims description 43
- 238000009833 condensation Methods 0.000 claims description 39
- 230000005494 condensation Effects 0.000 claims description 39
- 238000005452 bending Methods 0.000 claims description 25
- 230000003014 reinforcing effect Effects 0.000 claims description 16
- 239000007787 solid Substances 0.000 claims description 12
- 238000009423 ventilation Methods 0.000 claims description 9
- 230000002787 reinforcement Effects 0.000 claims description 8
- 239000007788 liquid Substances 0.000 description 41
- 239000007791 liquid phase Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 19
- 238000012546 transfer Methods 0.000 description 17
- 238000012545 processing Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 15
- 230000009286 beneficial effect Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 14
- 230000008016 vaporization Effects 0.000 description 13
- 230000001965 increasing effect Effects 0.000 description 12
- 238000009834 vaporization Methods 0.000 description 12
- 230000002708 enhancing effect Effects 0.000 description 10
- 230000005484 gravity Effects 0.000 description 10
- 230000007704 transition Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 230000009471 action Effects 0.000 description 8
- 230000008859 change Effects 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000004026 adhesive bonding Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 239000000835 fiber Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000009466 transformation Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000013021 overheating Methods 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- LVGUZGTVOIAKKC-UHFFFAOYSA-N 1,1,1,2-tetrafluoroethane Chemical compound FCC(F)(F)F LVGUZGTVOIAKKC-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- LDTMPQQAWUMPKS-OWOJBTEDSA-N (e)-1-chloro-3,3,3-trifluoroprop-1-ene Chemical compound FC(F)(F)\C=C\Cl LDTMPQQAWUMPKS-OWOJBTEDSA-N 0.000 description 1
- CDOOAUSHHFGWSA-UHFFFAOYSA-N 1,3,3,3-tetrafluoropropene Chemical compound FC=CC(F)(F)F CDOOAUSHHFGWSA-UHFFFAOYSA-N 0.000 description 1
- JRHNUZCXXOTJCA-UHFFFAOYSA-N 1-fluoropropane Chemical compound CCCF JRHNUZCXXOTJCA-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- MSSNHSVIGIHOJA-UHFFFAOYSA-N pentafluoropropane Chemical compound FC(F)CC(F)(F)F MSSNHSVIGIHOJA-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Definitions
- the present application relates to the technical field of heat dissipation, and in particular, to a radiator and a communication device.
- Communication equipment With the development of communication technology, communication equipment is developing in the direction of high speed and high power density, and the heat consumption density of communication hot backup is also getting higher and higher. Heat dissipation has become an important challenge in the design of communication equipment. The heat dissipation directly affects the working reliability and comprehensive performance of communication equipment. Communication equipment includes a radiator, and a corresponding heat dissipation design is usually required for the radiator. However, the traditional heat sink has low thermal conductivity and low heat dissipation reliability.
- the embodiments of the present application provide a heat sink and a communication device, which can improve the heat conduction capability of the heat sink and have good heat dissipation reliability.
- the present application provides a heat sink, the heat sink comprising:
- a heat dissipation structure the heat dissipation structure includes a connection part and a tooth part of an integrated structure, the connection part is connected with the base plate, the tooth part and the connection part are arranged at an angle, and the tooth root of the tooth part is connected to the connecting portion, the tooth tip of the tooth portion is far away from the connecting portion, a cooling flow channel is provided in the heat dissipation structure, and the cooling flow channel is at least partially located at the tooth portion;
- a cooling medium that flows in the cooling channel to dissipate heat from the substrate.
- the cooling flow channel extends from the connecting portion to the tooth portion, and extends between the tooth root and the tooth top.
- the cooling channel is only located in the tooth portion and extends between the tooth root and the tooth top.
- the heat dissipation structure can be a rib plate with cooling flow channels processed at one time, and the radiator formed by bending the rib plate with cooling flow channels at least once according to the actual heat dissipation requirements of the radiator.
- main cooling unit bending can also be understood as folding, that is, the rib with cooling flow channel is folded at least once, and the case of folding may include the case where one part and the other part are next to each other, or the case where one part and the other part have interval.
- the cooling channel can be folded along with the folding of the rib, that is, it follows the bending shape of the rib to present a bending shape.
- the heat dissipation structure can be processed and folded at one time to form an integrated structure, so that the heat dissipation structure, as the heat dissipation teeth of the radiator, that is, the main heat dissipation component, can well present the shape structure required for the heat dissipation of the heating element.
- the heat dissipation structure can be connected to the base plate as a whole, which effectively avoids the complex assembly process in the prior art that requires multiple heat dissipation teeth to be processed independently and assembled with the base plate in sequence, which is beneficial to save production time and cost and improve the performance of the heat sink. Processing productivity.
- the connecting portion of the heat dissipation structure can be connected to the base plate, it saves the need to provide a connecting member for fixing the heat dissipation teeth between the base plate and the heat dissipation teeth in the prior art, which greatly reduces the space occupied by the heat dissipation structure and reduces the The wind resistance of the radiator is conducive to the development trend of miniaturization of the radiator, making the radiator easy to handle and install.
- connection portion since the connection portion is connected to the substrate, the connection portion can be in contact with the substrate with a larger contact area, that is, the overall connection area between the connection portion and the substrate can be effectively increased, and the connection form in which the connection portion is connected to the substrate It is relatively simple and flat, which can effectively reduce the difficulty of connection.
- the connection area with the substrate while increasing the connection area with the substrate, the number of connecting parts to be connected to the substrate can be reduced, thereby reducing the pressure of the connection cost and the risk of cooling medium leakage caused by the large number of connecting parts, and the quality of the connection is reduced. obvious improvement.
- the tooth portion and the connecting portion are arranged at an included angle, that is, the tooth portion and the connecting portion are connected by bending. Therefore, the tooth portion can be regarded as a bent portion of the heat dissipation structure, that is, a portion protruding from the connecting portion and a portion protruding from the base plate.
- the continuous structure of the tooth part and the connecting part is simple and reliable, which can further increase the condensation area of the cooling medium, promote the return of the cooling medium, and also On the basis of satisfying the gravity direction gradient required for realizing the circulation of gas-liquid phase transition, the tooth height of the tooth portion is effectively reduced, thereby reducing the volume of the radiator and avoiding the high weight and wind resistance caused by the increase in the volume of the radiator. , It is not easy to carry and install the problem, and improve the heat dissipation capacity per unit volume of the radiator.
- the cooling flow channel is arranged inside the heat dissipation structure, so that the heat dissipation structure can innovatively have the heat dissipation characteristics of the two-phase temperature equalizing plate. On the one hand, it can effectively expand the heat of the high-power heat source conducted by the substrate, reduce the thermal resistance of the heat dissipation structure and the temperature of the substrate, so that the heat dissipation structure has a good thermal conductivity temperature difference and heat transfer efficiency, which greatly improves the thermal conductivity of the heat dissipation structure. performance.
- the thermal conductivity of the heat dissipation structure can be improved, so that the volume, weight and thermal resistance of the heat sink can be correspondingly reduced under the same conditions of heat dissipation, that is, the same heat dissipation target is achieved, which is conducive to saving heat dissipation
- the material management cost of the structure is good, and the heat dissipation reliability is good.
- the cooling channels are located in the tooth portion and extend between the tooth root and the tooth top, it can be understood that the cooling channels are only distributed in the tooth portion that is not in direct contact with the substrate.
- the heat dissipation structure can be rendered as a part of the cooling channel.
- the structure of road and part is solid, which is beneficial to the multi-scenario application of the radiator and has strong flexibility.
- the cooling runner extends from the connecting portion to the tooth portion, and extends between the tooth root and the tooth tip, it can be understood that the extension path of the cooling runner is the same as the bending path of the heat dissipation structure, that is, the cooling runner follows the heat dissipation structure.
- Extending in the extending direction of the cooling channel can make the cooling channel as a whole spread all over the heat dissipation structure, and only one liquid filling port is needed to fill the cooling channel with cooling medium, avoiding the need for each cooling tooth among the plurality of cooling teeth in the prior art.
- Each is provided with a flow channel, and a liquid filling port is opened to fill the flow channel with a complex structure of cooling medium, so that the cooling flow channel has the excellent characteristics of independent liquid filling, which is beneficial to improve the heat dissipation income of the radiator and the processing and manufacturing efficiency.
- the substrate and the heat dissipation structure are integral structures.
- the heat dissipation structure and the substrate may be connected to each other by welding, gluing, crimping or screwing to form an integrated structure. That is, the heat dissipation structure and the substrate are connected to form an integrated structure.
- the structure of the heat sink provided by the embodiments of the present application has a smaller volume than the structure of the prior art.
- the number of the connecting parts is plural, the number of the tooth parts is also plural, and the tooth roots of two adjacent tooth parts are connected by one of the connecting parts, and the teeth are connected with each other.
- a first air channel is formed between the spaced regions adjacent to the two tooth portions.
- the spaced area between two adjacent tooth portions forms the first air channel. That is, the cold air entering the radiator can continuously flow to the external environment of the radiator through the first air passage during the flow.
- the heated air in the first air duct can continuously flow to the external environment of the radiator, and the cold air in the external environment can continuously enter the first air duct, so that the heat on the heat dissipation structure can be quickly transferred.
- the convective heat transfer level of natural heat dissipation is improved, and the condensing area can be increased without occupying much of the substrate surface area, and the heat dissipation performance is excellent.
- it can cooperate with the cooling channels inside the heat dissipation structure to form a double-layer heat dissipation structure of air-cooled heat dissipation and liquid-cooled heat dissipation.
- the space between two adjacent tooth portions can form an air channel for air circulation.
- the space between two adjacent teeth can form a liquid channel for air circulation.
- the liquid may be water or oil.
- the base plate includes four side walls connected in sequence, and the ventilation direction of the first air duct intersects or is parallel to the extending direction of any one of the side walls.
- the heat at the bottom of the first air duct will be tilted and lifted with the direction of the first air duct, so that the hot air can flow from bottom to top along a certain angle based on the buoyancy force, and the cold air can also flow based on the buoyancy force. It flows from bottom to top along a certain included angle, so as to quickly take the heat away from the heat dissipation structure.
- This buoyancy force is not easy to affect the temperature of the lower area of the air duct and the upper area of the air duct, which can reduce the influence of the upper and lower heat series caused by the heat dissipation structure, improve the convection heat transfer performance of the heat dissipation structure, and effectively improve the cooling medium inside the heat dissipation structure. Condensing heat transfer.
- the tooth portion includes a first connecting segment, a second connecting segment and a third connecting segment;
- the first connection segment and the third connection segment are arranged at intervals and are respectively connected to two adjacent connection parts, and the first connection segment and the second connection segment are both connected to two adjacent connection parts.
- the connecting portion is arranged at an included angle, and the second connecting segment is connected between one end of the first connecting segment away from the connecting portion and an end of the third connecting segment away from the connecting portion;
- the junction of the first connecting section, the second connecting section and the third connecting section forms the tooth crest of the tooth, and the first connecting section and the third connecting section are adjacent to the two adjacent ones.
- the connection part of the connection part forms the tooth root of the tooth part;
- the spaced area between the first connecting section and the third connecting section forms a second air duct.
- the cross-sectional shape of the tooth portion along its height direction can be in the shape of a square. Or perpendicular to the direction of the substrate.
- the spaced area between the first connecting segment and the third connecting segment forms the second air duct. That is, the cold air entering the radiator can continuously flow to the external environment of the radiator through the second air duct during the flow.
- the heated air in the second air duct can continuously flow to the external environment of the radiator, and the cold air in the external environment can continuously enter into the second air duct, so that the heat on the heat dissipation structure can be quickly transferred.
- the convective heat transfer level of natural heat dissipation is improved, and the condensing area can be increased without occupying much of the substrate surface area, and the heat dissipation performance is excellent.
- it can cooperate with the cooling channel and the first air channel inside the heat dissipation structure to form a double-layer heat dissipation structure of air cooling and liquid cooling.
- the cooling flow channel includes a first evaporation area and a condensation area, the condensation area is located at the connection part and the tooth root of the tooth part, and the first evaporation area is located at the tooth At the top of the tooth, the cooling medium is vaporized in the first evaporation area, and liquefied in the condensation area to return to the first evaporation area.
- the cooling medium is a fluid working medium that can have the dual functions of gas-liquid phase transition and heat conduction, it can realize a complete working medium cycle through gas-liquid phase transition.
- the cooling medium flows only in the cooling flow channel, so the cooling flow channel needs to have a region capable of making the cooling medium undergo complete gas-liquid transformation. That is, the cooling channel has a first evaporation area and a condensation area, and the first evaporation area and the condensation area have a certain height gradient, which can make the cooling medium vaporize when it flows to the first evaporation area, and liquefy when it flows to the condensation area.
- the condensation zone is located at the root of the connecting portion and the tooth portion
- the first evaporation zone is located at the tip of the tooth portion.
- the heat generated by the heating element can be conducted to the first evaporation area of the heat dissipation structure through the substrate, the cooling medium in the first evaporation area is heated and evaporated in a low vacuum environment, and the gaseous cooling medium is heated and evaporated under the action of the pressure difference. It flows to the condensation zone along the extension direction of the tooth portion (that is, the direction from the tooth root to the tooth tip).
- the gaseous cooling medium flowing to the condensation zone can be condensed into a liquid cooling medium. Under the action of gravity, the liquid cooling medium flows back to the first evaporation along the direction opposite to the previous direction (ie, the direction from the top of the tooth to the root of the tooth). zone to form a complete working medium cycle, and this process will be repeated in the cooling channel to achieve continuous heat dissipation of the heating element.
- the substrate is a solid closed structure. That is, the substrate is a solid plate, and the cooling medium flows only in the cooling channels of the heat dissipation structure.
- the overall strength of the substrate is more excellent, and at the same time, the structure of the substrate is simple, and can be applied to scenarios where the heat dissipation performance is not high, so that the overall processing and production efficiency of the heat sink is improved.
- a cavity is provided in the substrate, and the cavity communicates with the cooling flow channel, so that the cooling medium flows in the cavity and the cooling flow channel.
- the entire substrate can be provided with a hollow structure.
- the cavity is communicated with the cooling flow channel, so that the cooling medium can flow in the cavity and the cooling flow channel.
- the cooling medium flows in the cavity and the cooling channel.
- the cavity is a second evaporation area
- the cooling medium is evaporated in the second evaporation area
- the cavity is the second evaporation area, that is, the cavity as a whole constitutes the second evaporation area of the substrate, so that the cooling medium is evaporated in the second evaporation area.
- the cooling channel has a first evaporation area and a condensation area, and there is a certain height gradient between the first evaporation area and the condensation area, which can make the cooling medium vaporize when it flows to the first evaporation area, and liquefy and reflux when it flows to the condensation area.
- the condensation zone is located at the root of the connecting portion and the tooth portion
- the first evaporation zone is located at the tip of the tooth portion.
- the connecting portion includes a contact surface
- the substrate includes a first surface
- the contact surface is disposed opposite to the first surface
- the cooling channel has a first through-flow structure, the first through-flow structure is arranged on the contact surface, the cavity has a second through-flow structure, and the second through-flow structure is arranged on the second through-flow structure surface;
- the second through-flow structure communicates with at least a portion of the first through-flow structure.
- the second through-flow structure communicates with a portion of the first through-flow structure. Therefore, the cooling medium in the cavity can have fluidity and smoothly flow into the cooling flow channel, and since the outlet of the cooling flow channel and the outlet of the cavity do not need to be completely connected, the manufacturing process of the radiator can be simplified.
- the second through-flow structure communicates with all of the first through-flow structure.
- the flow rate and flow rate of the cooling medium can be controlled by changing the degree of communication between the second through-flow structure and the first through-flow structure, so as to ensure the reliability and uniformity of the flow of the cooling medium in the substrate and the heat dissipation structure .
- the first flow-through structure includes one or more first sub-flow-through structures arranged at intervals
- the second flow-through structure includes the same number of first sub-flow-through structures as the first flow-through structure.
- the second sub-flow structures are connected one-to-one correspondingly.
- first sub-flow structure and the second sub-flow structure can form a one-to-many matching relationship.
- the first flow-through structure includes a plurality of first sub-flow-through structures arranged at intervals
- the second flow-through structure includes one of the sub-flow-through structures
- each of the first flow-through structures communicates with one of the second sub-flow structures.
- the first sub-flow structure and the second sub-flow structure can form a one-to-many matching relationship. Therefore, the discontinuous design of the plurality of first sub-flow structures can fully consider the risk of damage during actual use if the outlet of the cooling channel is too large, and the safety and reliability are good.
- the first flow-through structure includes a first sub-flow structure
- the second flow-through structure includes a plurality of second sub-flow structures arranged at intervals, and each of the second sub-flow structures is connected to One of the first sub-flow structures communicates with each other.
- the first sub-flow structure and the second sub-flow structure can form a one-to-many matching relationship. Therefore, the discontinuous design of the plurality of second sub-flow structures can fully consider the specific layout constraints of the devices and structural components in the substrate. For example, the space between adjacent second sub-flow structures can effectively avoid cavities.
- the structural support column or the solid column for installing the screw provided in the body has reasonable layout and strong practicability.
- the heat sink further includes a support structure, the cavity includes a top wall and a bottom wall oppositely disposed along the height direction of the substrate, and the top wall is closer to the bottom wall than the bottom wall. the heat dissipation structure;
- the support structure is supported between the top wall and the bottom wall;
- One of the two ends of the support structure abuts with one of the top wall and the bottom wall, and the other end is isolated from the other of the top wall and the bottom wall.
- the support structure can be fixed with either the top wall or the bottom wall, or with both the top wall and the bottom wall, and the support structure and the top wall and bottom wall can be adjusted according to the reliability and stress distribution of the support position to be supported. Design the connection of the wall.
- the support structure may be fixed to the top and/or bottom walls by welding or gluing.
- the support structure can also be integrally formed with the inner cavity of the housing, so that the support structure is not only firmly connected with the wall surface of the cavity, thereby simplifying the process of the heat sink.
- the support structure can maintain the shape of the substrate, deform the substrate under the action of external force, shorten the longitudinal interval between the top wall and the bottom wall, and minimize the possibility of affecting the reflow.
- the support structure can shorten the time required for the liquid cooling medium to be converted into the gaseous cooling medium, thereby enhancing the boiling and accelerating the reflux.
- grooves are provided on the bottom wall of the heat sink and/or the outer surface of the support structure.
- the process of converting the liquid cooling medium into the gaseous state can be accelerated, and the time required for the cooling medium to vaporize can be greatly shortened, so that the To strengthen the role of cooling medium evaporative vaporization.
- the heat sink further includes a first capillary structure, and the first capillary structure is located in the cavity and connected to the bottom wall.
- the first capillary structure may be a tow, a wire mesh, a sintered powder, or a fiber.
- the cooling medium that is conducive to condensation flows back from the cooling area to the second evaporation area, avoiding the problem that the liquid-phase cooling medium in the second evaporation area is less and the heat generated by the heating element cannot be dissipated in time.
- the heat dissipation performance of the heat sink is improved.
- the process of converting the liquid cooling medium into a gaseous state can be accelerated, and the time required for the vaporization of the cooling medium can be greatly shortened, thereby enhancing the evaporation and vaporization of the cooling medium.
- the heat sink further includes a second capillary structure, the second capillary structure is located in the cavity, and one end of the second capillary structure is connected to the first capillary structure, the The other end of the second capillary structure is connected to the top wall.
- the second capillary structure may be tow, wire mesh, sintered powder or fiber.
- the cooling medium that is conducive to condensation flows back from the cooling area to the second evaporation area, avoiding the problem that the liquid-phase cooling medium in the second evaporation area is less and the heat generated by the heating element cannot be dissipated in time.
- the heat dissipation performance of the heat sink is improved.
- the process of converting the liquid cooling medium into a gaseous state can be accelerated, and the time required for the vaporization of the cooling medium can be greatly shortened, thereby enhancing the evaporation and vaporization of the cooling medium.
- the number of the heat dissipation structures is one; or,
- the number of the heat dissipation structures is multiple, and two adjacent heat dissipation structures are arranged at intervals and at an included angle.
- the radiator further includes a reinforcement structure, and the reinforcement structure is provided with a through-flow channel communicating with the cooling channel;
- the reinforcing structure is provided between the connecting portion and the substrate; or,
- the reinforcing structure is provided between the connecting portion and the tooth portion; or,
- the reinforcing structure is arranged between the tooth portion and the base plate.
- connection form of the reinforcing structure to the heat dissipation structure and the substrate may be, but not limited to, welding, bonding or through-hole expansion.
- the heat dissipation structure is a rib that is folded and formed by at least one bending; or,
- the heat dissipation structure is formed by splicing a plurality of rib plates and folded by at least one bending.
- the case where multiple rib plates are spliced and folded and formed by at least one bending includes the case where multiple rib plates are bent and then spliced together, and also includes the case where multiple rib plates are spliced together and then bent together.
- the layout of the heat dissipation structure formed by folding less rib plates while the heat dissipation requirements are relatively large and the space layout is relatively narrow.
- the layout is a heat dissipation structure formed by folding many rib plates. That is, the setting of the heat dissipation structure can adapt to the application requirements of multi-scenarios, has strong flexibility, and has a wide range of applications.
- the ground is used as a reference plane, and the base plate and the reference plane are arranged in parallel or at an included angle.
- the heat sink can be arranged in a horizontal direction, can also be arranged in a vertical direction, and can also be arranged obliquely within an included angle range between the horizontal direction and the vertical direction.
- the horizontal arrangement of the heat sink can be understood as taking the ground as the reference surface, the heat source surface of the heating element is arranged in parallel with the reference surface, so the substrate is arranged in parallel with the reference surface, so that the connection structure fixed to the substrate is also in the same position as the substrate. direction, and then make the overall radiator form a horizontal layout.
- the evaporation area and the condensation area of the radiator can be arranged up and down in the direction of gravity, so that the cooling medium absorbs heat in the evaporation area and becomes steam, and the steam flows to the condensation area under a highly gradient pressure difference, and in the condensation area Condensed into liquid, the condensed liquid can flow back to the evaporation area under the action of gravity, and form over and over again to form a complete working medium cycle, so that the radiator can improve the overall temperature uniformity of the radiator through the gas-liquid phase change, thereby enhancing the the overall thermal conductivity of the radiator.
- the vertical arrangement of the heat sink can be understood as taking the ground as the reference surface, the heat source surface of the heating element is arranged perpendicular to the reference surface, so the base plate is arranged perpendicular to the reference surface, so that the connection structure fixed to the base plate is also in the same direction as the base plate, and then Make the heat sink integrally formed in a vertically arranged layout. Therefore, the substrate vertically arranged at the bottom can make the wind enter from the bottom to exchange heat with air convection under natural heat dissipation conditions, which effectively meets the requirements of vertical arrangement of radiator substrates for base stations, power supplies, photovoltaic inverters, etc.
- the inclined arrangement of the radiator can be understood as taking the ground as the reference surface, the heat source surface of the heating element and the reference surface are arranged at an angle, so the base plate and the reference surface are arranged at an angle, so that the connection structure fixed to the base plate is also in the same direction as the base plate , and further make the overall shape of the heat sink in an obliquely arranged layout, wherein the included angle between the substrate and the reference plane may be in the range of 0° to 90°.
- the substrate will form a certain angle with the direction of gravity, and the bottom will be inclined.
- This structure can meet the needs of inclined arrangement due to the coverage of the inclination angle of the transmitted signal, and can meet the key of easy installation and flexible deployment of the radiator. demand, can effectively improve the core competitiveness of the radiator.
- the radiator can effectively adapt to different layout methods, so that the comprehensive performance can be improved on the basis of the continuous increase in transmit power and high integration, so as to fully adapt to the challenges of high power and high heat dissipation density, and meet the needs of multiple scenarios.
- Application requirements such as outdoor harsh environments with wind, snow, heat, sand and salt spray), and good reliability.
- the cross-sectional shape of the tooth portion along the height direction thereof includes a combination of one or more of a straight line, an L-shape, an arc shape or a serpentine shape, and the height direction of the tooth portion is perpendicular to the the orientation of the substrate.
- the present application further provides a communication device, the communication device includes a heating element and the above-mentioned heat sink, the heating element is provided on a side of the substrate away from the heat dissipation structure.
- FIG. 1 is a schematic structural diagram of a communication device provided by an embodiment of the present application.
- FIG. 2 is a schematic structural diagram of a heat sink provided by an embodiment of the present application.
- FIG. 3 is another schematic structural diagram of a heat sink provided by an embodiment of the present application.
- FIG. 4 is a schematic cross-sectional view of the heat sink provided by the first embodiment of the present application.
- FIG 5 is another schematic cross-sectional view of the heat sink provided by the first embodiment of the present application.
- FIG. 6 is a schematic structural diagram of a substrate of a heat sink provided by the first embodiment of the present application.
- FIG. 7 is a schematic structural diagram of a heat dissipation structure of a heat sink provided by an embodiment of the present application.
- FIG. 8 is a schematic cross-sectional view of a heat dissipation structure of a heat sink provided by an embodiment of the present application.
- FIG. 9 is another schematic cross-sectional view of a heat dissipation structure of a heat sink provided by an embodiment of the present application.
- FIG. 10 is a schematic structural diagram of a horizontally placed radiator provided by an embodiment of the present application.
- FIG. 11 is a schematic structural diagram of a vertically placed heat sink provided by an embodiment of the present application.
- FIG. 12 is a schematic structural diagram of a radiator placed obliquely according to an embodiment of the present application.
- FIG. 13 is a schematic cross-sectional view of the first embodiment of the heat dissipation structure of the heat sink provided by the first embodiment of the present application;
- FIG 14 is another schematic cross-sectional view of the first embodiment of the heat dissipation structure of the heat sink provided in the first embodiment of the present application;
- 15 is another schematic cross-sectional view of the first embodiment of the heat dissipation structure of the heat sink provided in the first embodiment of the present application;
- 16 is a schematic cross-sectional view of the second embodiment of the heat dissipation structure of the heat sink provided by the first embodiment of the present application;
- 17 is another schematic cross-sectional view of the second embodiment of the heat dissipation structure of the heat sink provided by the first embodiment of the present application;
- FIG. 18 is a schematic cross-sectional view of a third embodiment of the heat dissipation structure of the heat sink provided by the first embodiment of the present application;
- 19 is a first schematic cross-sectional view of the air duct of the radiator provided by the first embodiment of the present application.
- 20 is a second schematic cross-sectional view of the air duct of the radiator provided by the first embodiment of the present application.
- 21 is a third schematic cross-sectional view of the air duct of the radiator provided by the first embodiment of the present application.
- FIG. 22 is a fourth schematic cross-sectional view of the air duct of the radiator provided by the first embodiment of the present application.
- FIG. 23 is a fifth schematic cross-sectional view of the air duct of the radiator provided by the first embodiment of the present application.
- 24 is a sixth schematic cross-sectional view of the air duct of the radiator provided by the first embodiment of the present application.
- 25 is a schematic cross-sectional view of the reinforcing structure of the heat sink provided by the first embodiment of the present application.
- 26 is another schematic cross-sectional view of the reinforcing structure of the heat sink provided by the first embodiment of the present application.
- FIG. 27 is another schematic cross-sectional view of the reinforcing structure of the heat sink provided by the first embodiment of the present application.
- 29 is a first cross-sectional schematic diagram of the corresponding relationship between the first sub-flow structure and the second sub-flow structure of the heat sink provided by the second embodiment of the present application;
- FIG. 30 is a second cross-sectional schematic diagram of the correspondence between the first sub-flow structure and the second sub-flow structure of the heat sink provided by the second embodiment of the present application;
- 31 is a third cross-sectional schematic diagram of the corresponding relationship between the first sub-flow structure and the second sub-flow structure of the heat sink provided by the second embodiment of the present application;
- 32 is a fourth cross-sectional schematic diagram of the corresponding relationship between the first sub-flow structure and the second sub-flow structure of the heat sink provided by the second embodiment of the present application;
- 33 is a fifth cross-sectional schematic diagram of the corresponding relationship between the first sub-flow structure and the second sub-flow structure of the heat sink provided by the second embodiment of the present application;
- 35 is another schematic cross-sectional view of the substrate of the heat sink provided by the second embodiment of the present application.
- 36 is another schematic cross-sectional view of the substrate of the heat sink provided by the second embodiment of the present application.
- FIG. 37 is another schematic cross-sectional view of the substrate of the heat sink provided by the second embodiment of the present application.
- Plural means two or more than two.
- a and B are directly connected and the relative position after the connection does not change, or A and B are indirectly connected through an intermediate medium and the relative position after the connection does not change. Variety.
- Embodiments of the present application provide a communication device, which may be, but is not limited to, a device that can be applied to a communication base station, a photovoltaic inverter, a power supply, a vehicle power supply, and the like.
- the device that can be applied to the communication base station may be a wireless transceiver device in the communication base station, such as a remote radio unit (Remote Radio Unit, RRU), or a signal processing device.
- RRU Remote Radio Unit
- the communication device 1000 includes a fixedly connected heating element 200 and a heat sink 100 .
- the heating element 200 can be understood as a structural element that generates heat during the operation of the communication device 1000 , and can be attached to the radiator 100 to transfer heat to the radiator 100 , and then pass the heat radiation of the radiator 100 , A variety of natural convection or fan cooling to dissipate heat to the external environment.
- the heat balance of the heating element 200 will directly affect the working performance of the communication device 1000 , for example, overheating will cause the communication device 1000 to fail.
- the heat sink 100 can be understood as a structural member capable of conducting, diffusing or exchanging the heat generated by the heating element 200 to dissipate heat for the heating element 200 , which can cause the temperature of the heating element 200 to be too high and affect the normal operation of the communication device 1000 possibility is reduced to a minimum.
- the heating element 200 may be a combination of one or more of a circuit board, a chip, a power source, and the like.
- the number of the heating elements 200 can be selected according to the actual situation, and it can be one or more. That is, in the case where the number of the heat generating elements 200 is one, the heat sink 100 may be a single heat source heat sink. In the case where the number of heating elements 200 is multiple, the heat sink 100 may be a multi-heat source radiator, wherein the multiple heating elements 200 may be evenly arranged on one side of the substrate 10 at equal intervals, or may be non-uniform at unequal intervals. It is arranged on one side of the substrate 10 and can be flexibly adjusted according to the hardware form and layout of the communication device 1000 . Therefore, the heat sink 100 can take into account the heat dissipation requirements of a single heat source and multiple heat sources, and can be more suitable for multi-scenario applications, which is beneficial to improve the overall performance of the communication device 1000 .
- the communication device 1000 may be a wireless transceiver device.
- the number of the heating elements 200 may be multiple, and the multiple heating elements 200 are arranged on one side of the heat sink 100 at intervals, and the multiple heating elements 200 may be a duplexer (Dup), a power amplifier (Power Amplifier, PA, respectively). ), transmitter (Transceiver, TRX).
- the number of the heat sinks 100 may be one or more. Specifically, in practical application, the number of heat sinks 100 may be one and used alone. Alternatively, the number of heat sinks 100 may be more than one, and they may be used in series up and down.
- the form of the series connection may be simple physical stacking, or may be a series structure formed by welding, bonding or integrated processing, which is not strictly limited in the embodiments of the present application.
- FIG. 1 is only to schematically describe the connection relationship between the heating element 200 and the radiator 100 , and is not intended to specifically limit the connection position, specific structure and quantity of each device.
- the structures illustrated in the embodiments of the present application do not constitute a specific limitation on the communication device 1000 .
- the communication device 1000 may include more or less components than shown, or combine some components, or separate some components, or arrange different components.
- the illustrated components may be implemented in hardware, software, or a combination of software and hardware.
- the heat sink 100 includes a substrate 10 , a heat dissipation structure 20 and a cooling medium 30 .
- the substrate 10 can be understood as the carrier of the heat dissipation structure 20 and the heating element 200, which can provide the functions of electrical connection, protection, support, heat dissipation, assembly, etc.
- the substrate 10 may also be a component that constitutes the housing 110 of the heat sink 100 , and can form the housing structure of the heat sink 100 together with other housing components.
- the heat dissipation structure 20 can be understood as the main heat dissipation structure 20 of the heat sink 100 , that is, the heat dissipation teeth. Through the good heat dissipation effect of the heat dissipation structure 20 , the heat generated by the heating element 200 can be dissipated to the external environment in a timely and effective manner.
- the cooling medium 30 can be understood as a fluid working medium that can have the dual functions of gas-liquid phase transition and heat conduction, and can realize a complete working medium cycle through the gas-liquid phase transition.
- the cooling medium 30 may be water, inert fluorinated liquid, refrigerant R134a (1,1,1,2-tetrafluoroethane), refrigerant R245fa (1,1,1,3,3-pentafluoroethane) Fluoropropane), a combination of one or more of the refrigerant R1234ze (1,1,1,3-tetrafluoropropene) and the refrigerant R1233zd (1-chloro-3,3,3-trifluoropropene).
- the substrate 10 includes a first surface 101 , a second surface 102 and four sidewalls 103 connected between the first surface 101 and the second surface 102 , and the first surface 101 and the second surface 102 are arranged opposite to each other , the four side walls 103 are sequentially connected to form the peripheral side surface of the substrate 10 .
- the first surface 101 can be understood as the surface connected with the heat dissipation structure 20
- the second surface 102 can be understood as the surface connected with the heating element 200 . That is, the heat dissipation structure 20 is disposed on the first surface 101
- the heating element 200 is disposed on the second surface 102 , that is, the side of the substrate 10 away from the heat dissipation structure 20 .
- the thermal conductivity of the substrate 10 can be maximized, and the heat of the heating element 200 can be effectively transferred to the heat dissipation structure 20, and through
- the heat dissipation effect of the heat dissipation structure 20 dissipates the heat of the heating element 200 to the external environment, so as to realize the heat dissipation effect of the heat sink 100 .
- the material of the substrate 10 may include aluminum, aluminum alloy, copper, graphite, ceramics, or polymer plastics, and the material may be selected according to actual assembly requirements, which are not strictly limited in the embodiments of the present application.
- the heat dissipation structure 20 is fixedly connected to the substrate 10 , specifically, the heat dissipation structure 20 is connected to the first surface 101 of the substrate 10 .
- the substrate 10 and the heat dissipation structure 20 are integral structures.
- the heat dissipation structure 20 and the substrate 10 may be connected to each other by welding, gluing, crimping or screwing to form an integrated structure.
- the processing and production efficiency of the heat sink 100 can be improved.
- the tooth height of the fins of the heat sink 100 can be reduced due to the improvement of the heat dissipation performance, thereby reducing the overall heat dissipation performance in a disguised form.
- the volume and weight of the heat sink 100 that is, under the condition of the same heat dissipation requirement, the structure of the heat sink 100 provided by the embodiment of the present application is smaller than the structure of the prior art.
- the heat dissipation structure 20 is an integrated structure formed by at least one bending, and the heat dissipation structure 20 is provided with a cooling channel 40 therein.
- the cooling channels 40 may be distributed in multiple locations of the heat dissipation structure 20 .
- the cooling channels 40 may be distributed throughout the heat dissipation structure 20 , that is, the extending paths of the cooling channels 40 are the same as the extending paths of the heat dissipation structure 20 , and the cooling medium 30 flows in the cooling channels 40 to dissipate heat from the substrate 10 .
- the extending path of the cooling channel 40 is the same as the bending path of the heat dissipation structure 20 .
- the material of the heat dissipation structure 20 may include aluminum, aluminum alloy, copper, graphite, ceramic or polymer plastic, and the material may be selected according to actual assembly requirements, which is not strictly limited in the embodiments of the present application.
- the heat dissipation structure 20 can be a one-time processing of the rib plate 201 with the cooling flow channel 40, and according to the actual heat dissipation requirements of the radiator 100, the rib plate 201 with the cooling flow channel 40 is bent at least once The main heat dissipation component of the heat sink 100 is formed.
- bending can also be understood as folding, that is, the rib 201 with the cooling flow channel 40 is folded at least once, and the folding may include a case where one part and another part are next to each other, or a part and another part. Some cases have gaps.
- cooling channel 40 can be folded along with the folding of the rib plate 201 , that is, it follows the bending shape of the rib plate 201 to present a bending shape. That is, the cross-sectional shape of the heat dissipation structure 20 can present a sandwich-like shape of “plate body-flow channel-plate body”.
- the ribs 201 may be formed by inflation molding or stamping.
- the cooling channel 40 inside can also be formed by inflation molding or stamping molding.
- the heat dissipation structure 20 may be a rib 201 that is folded and formed by at least one bending.
- the heat dissipation structure 20 may be formed by splicing a plurality of rib plates 201 and folded by at least one bending.
- a plurality of rib plates 201 are spliced and folded and formed by at least one bending.
- the case where a plurality of rib plates 201 are spliced and folded and formed by at least one bending includes a situation where a plurality of rib plates 201 are spliced together after being bent, and also includes a plurality of rib plates 201 that are spliced together and then formed together. Bending condition.
- the heat dissipation structure 20 folded and formed by fewer ribs 201 can be laid out, while the heat dissipation requirement is relatively small.
- the heat dissipation structure 20 formed by folding many rib plates 201 is laid out. That is to say, the setting of the heat dissipation structure 20 can adapt to the application requirements of multiple scenarios, and has strong flexibility and wide application range.
- the heat dissipation structure 20 can be processed and folded at one time to form an integrated structure, so that the heat dissipation structure 20 can be used as the heat dissipation tooth of the heat sink 100, that is, the main heat dissipation component, and is well presented as the heat dissipation place of the heating element 200. required morphological structure.
- the heat dissipation structure 20 can be connected to the base plate 10 as a whole, which effectively avoids the complicated assembly process in the prior art that requires multiple heat dissipation teeth to be processed independently and assembled with the base plate 10 in sequence, which is beneficial to save production time and cost and improve the Processing productivity of the radiator 100 .
- the connecting portion of the heat dissipation structure 20 can be connected to the substrate 10, it saves the need to provide a connecting member for fixing the heat dissipation teeth between the substrate 10 and the heat dissipation teeth in the prior art, and greatly reduces the space occupied by the heat dissipation structure 20.
- the size of the space reduces the wind resistance of the radiator 100 , which is beneficial to the development trend of miniaturization of the radiator 100 , and makes the radiator 100 easy to carry and install.
- the cooling channels 40 are arranged inside the heat dissipation structure 20, so that the heat dissipation structure 20 can innovatively have the heat dissipation characteristics of the two-phase temperature equalizing plate. On the one hand, it can effectively spread the heat of the high-power heat source conducted by the substrate 10, reduce the thermal conductivity and thermal resistance of the heat dissipation structure 20 and the temperature of the substrate 10, so that the heat dissipation structure 20 has a good thermal conductivity temperature difference and heat transfer efficiency, which greatly improves the Thermal conductivity of the heat dissipation structure 20 .
- the thermal conductivity of the heat dissipation structure 20 can be improved, so that the volume, weight and thermal resistance of the heat sink 100 can be reduced correspondingly under the same conditions of heat dissipation, that is, when the same heat dissipation target is achieved, which is beneficial to The material management cost of the heat dissipation structure 20 is saved, and the heat dissipation reliability is good.
- the cooling channels 40 may be distributed at multiple locations of the heat dissipation structure 20 , that is, the cooling channels 40 may be arranged intermittently in the heat dissipation structure 20 , and may be distributed at multiple locations of the heat dissipation structure 20 as required.
- the extending path of the cooling flow channel 40 is the same as the bending path of the heat dissipation structure 20 , that is, the cooling flow channel 40 extends along the extending direction of the heat dissipation structure 20 , so that the cooling flow channel 40 as a whole spreads over the heat dissipation structure 20 , and only A liquid filling port is required to fill the cooling channel 40 with the cooling medium 30, which avoids the need to set a flow channel in each of the plurality of heat dissipation teeth in the prior art, and open a liquid filling port to fill the flow channel with the cooling medium
- the complex structure of the radiator 30 makes the cooling channel 40 have the excellent characteristics of independent liquid filling, which is beneficial to improve the heat dissipation benefit and the processing and manufacturing efficiency of the radiator 100 .
- the heat sink 100 can be arranged in a horizontal direction, can also be arranged in a vertical direction, and can also be inclined within an angle range between the horizontal direction and the vertical direction layout.
- the horizontal arrangement of the heat sink 100 can be understood as taking the ground as the reference surface C, and the heat source surface of the heating element 200 (ie the second surface 102 of the substrate 10 ) is arranged in parallel with the reference surface C, so the substrate 10 is arranged in parallel with the reference plane C, so that the connection structure fixed to the substrate 10 is also in the same direction as the substrate 10 , so that the heat sink 100 is integrally formed into a horizontally arranged layout.
- the evaporation area and the condensation area of the radiator 100 can be arranged up and down in the direction of gravity, so that the cooling medium 30 absorbs heat in the evaporation area and becomes steam, and the steam flows to the condensation area under a highly gradient pressure difference, and is condensed
- the condensed liquid is condensed into liquid in the area, and the condensed liquid can flow back to the evaporation area under the action of gravity, and form over and over again to form a complete working fluid cycle, so that the radiator 100 can improve the overall temperature of the radiator 100 through the gas-liquid phase change performance, thereby enhancing the overall thermal conductivity of the heat sink 100 .
- the vertical arrangement of the heat sink 100 can be understood as taking the ground as the reference surface C, and the heat source surface of the heating element 200 (ie, the second surface 102 of the substrate 10 ) is perpendicular to the reference surface C, so the substrate 10 and the reference surface C are arranged vertically.
- the surface C is arranged vertically, so that the connection structure fixed to the substrate 10 is also in the same direction as the substrate 10 , so that the heat sink 100 is integrally formed in a vertically arranged layout.
- the substrate 10 arranged vertically at the bottom can allow the wind to enter from the bottom to exchange heat with air convection under the condition of natural heat dissipation, which effectively meets the requirements for the vertical arrangement of the substrate 10 of the radiator 100 of the base station, power supply, photovoltaic inverter, etc. .
- the inclined arrangement of the heat sink 100 can be understood as taking the ground as the reference surface C, and the heat source surface of the heating element 200 (ie, the second surface 102 of the substrate 10 ) and the reference surface C are arranged at an angle, so the substrate 10 and the reference surface C are arranged at an angle.
- the surface C is arranged at an included angle, so that the connection structure fixed to the substrate 10 is also in the same direction as the substrate 10, so that the heat sink 100 is formed as a whole in an inclined arrangement, wherein the included angle between the substrate 10 and the reference surface C can be in the range of within the range of 0° to 90°.
- the substrate 10 forms a certain angle with the direction of gravity and is inclined at the bottom.
- This structure can meet the requirement of inclined arrangement due to the coverage of the inclination angle of the transmitted signal, and can meet the requirements that the radiator 100 can be easily installed and flexibly deployed. It can effectively improve the core competitiveness of the radiator 100.
- the heat sink 100 can effectively adapt to different layout methods, so that the comprehensive performance can be improved on the basis of the continuous increase in transmit power and high integration, so that it can fully adapt to the challenges of high power and high heat dissipation density, and meet the needs of multiple scenarios. (such as the harsh outdoor environment of wind, snow, heat, sand and salt spray), and the reliability is good.
- connection position and specific structure of the substrate 10 and the heat sink 100 in the present application will be described in detail below through two specific embodiments.
- the substrate 10 is a solid closed structure. That is, the substrate 10 is a solid plate, and the cooling medium 30 flows only in the cooling channels 40 of the heat dissipation structure 20 . Therefore, the overall strength of the substrate 10 is more excellent, and at the same time, the structure of the substrate 10 is simple, and can be applied to scenarios with low requirements for heat dissipation performance, so that the overall processing and production efficiency of the heat sink 100 is improved.
- the heat dissipation structure 20 includes a connecting portion 21 and a tooth portion 22 , and the connecting portion 21 is connected to the substrate 10 .
- the tooth portion 22 is connected to the connecting portion 21 by bending, that is, the tooth portion 22 and the connecting portion 21 are arranged at an included angle, which is equivalent to the tooth portion 22 being arranged at an included angle with the base plate 10 .
- the range of the included angle between the teeth portion 22 and the base plate 10 may be in the range of 0° ⁇ 180°.
- the connecting portion 21 may be linear and the extending direction is parallel to the substrate 10 , or the connecting portion 21 may also be arc-shaped.
- the connecting portion 21 may be indirectly connected to the substrate 10 through a connecting member such as solder or glue, or may be directly connected to the substrate 10 by contacting and matching.
- connection portion 21 includes a contact surface 211
- the contact surface 211 is a surface of the connection portion 21 that is disposed opposite to the first surface 101 of the substrate 10 and is connected to each other.
- the tooth root 221 of the tooth portion 22 is connected to the connecting portion 21
- the tooth top 222 of the tooth portion 22 is far away from the connecting portion 21
- the cooling channel 40 extends from the connecting portion 21 to the tooth portion 22 , and is between the tooth root 221 and the tooth top 222 extend.
- the connection part 21 and the substrate 10 may be connected to each other by welding, gluing, crimping or screwing.
- connection portion 21 since the connecting portion 21 is connected to the substrate 10, the connecting portion 21 can be in contact with the substrate 10 with a larger area of the contact surface 211, that is, the overall connection area of the connecting portion 21 and the substrate 10 can be effectively increased,
- connection form in which the connection portion 21 is connected in parallel with the substrate 10 is relatively simple and flat, which can effectively reduce the difficulty of connection.
- the connection quality is significantly improved.
- the tooth portion 22 and the connecting portion 21 are arranged at an included angle, that is, the tooth portion 22 and the connecting portion 21 are connected by bending. Therefore, the tooth portion 22 can be regarded as a bent portion of the heat dissipation structure 20 , that is, a portion protruding from the connecting portion 21 and a portion protruding from the substrate 10 .
- the teeth 22 By arranging the teeth 22 , on the one hand, the external shape requirements of the radiator 100 can be met. On the other hand, it can effectively increase the heat dissipation area without occupying much board area.
- the continuous structure of the teeth portion 22 and the connecting portion 21 is one piece, compared with the structure in which the heat dissipation teeth are discontinuously disconnected in the prior art solution, the structure is simple and reliable, the condensation area of the cooling medium 30 can be further increased, and the cooling medium 30 can be further improved.
- the backflow can also effectively reduce the tooth height of the tooth portion 22 on the basis of satisfying the gravity direction gradient required to realize the circulation of the gas-liquid phase change, thereby reducing the volume of the radiator 100 and avoiding the increase in the volume of the radiator 100. Due to the high weight and wind resistance, the problems of being difficult to carry and install occur, and the heat dissipation capacity per unit volume of the radiator 100 is improved.
- the cooling channel 40 is only located in the tooth portion 22 and extends between the tooth root 221 and the tooth top 222 . That is to say, the cooling channels 40 are only distributed on the teeth 22 that are not in direct contact with the substrate 10 .
- the heat dissipation structure 20 can be partially formed with channels and partially solid, which is beneficial to the cooling of the heat sink 100 . Multi-scene application, strong flexibility.
- FIG. 4 only schematically illustrates the distribution possibility of the cooling flow channels 40 , and the cooling flow channels 40 may be distributed in one tooth portion 22 or a plurality of tooth portions among the plurality of tooth portions 22 as required.
- the cooling channel 40 can also be positioned slightly beyond the tooth root 221 into the connecting portion 21 or a certain distance away from the connecting portion 21 without touching the portion where the tooth root 221 and the connecting portion 21 are connected. The embodiments of the present application do not strictly limit this.
- the cooling channel 40 extends from the connecting portion 21 to the tooth portion 22 and between the tooth root 221 and the tooth top 222 , and the cooling channel 40 can supply cooling medium 30 flows within it.
- the cooling channel 40 is located at the connecting portion 21 and the tooth portion 22 .
- the cooling medium 30 is a fluid working medium capable of both gas-liquid phase transition and heat conduction, it can realize a complete working medium cycle through the gas-liquid phase transition.
- the cooling medium 30 only flows in the cooling flow channel 40 , so the cooling flow channel 40 needs to have a region capable of causing the cooling medium 30 to undergo complete gas-liquid transformation.
- the cooling channel 40 has the first evaporation area A1 and the condensation area B, and the first evaporation area A1 and the condensation area B have a certain height gradient, which can make the cooling medium 30 vaporize when it flows to the first evaporation area A1, When flowing to the condensation zone B, it liquefies and flows back to the first evaporation zone A1 to realize the gas-liquid phase change of the cooling medium 30 .
- the condensation area B is located at the connection part 21 and the tooth root 221 of the tooth part 22
- the first evaporation area A1 is located at the tooth top 222 of the tooth part 22 .
- the heat generated by the heating element 200 can be conducted to the first evaporation area A1 of the heat dissipation structure 20 through the substrate 10 , and the cooling medium 30 in the first evaporation area A1 is heated and vaporized in a low vacuum environment, and the gaseous cooling medium 30 Under the action of the pressure difference, it flows to the condensation zone B along the extending direction of the tooth portion 22 (ie, the direction from the tooth root 221 to the tooth top 222 ).
- the gaseous cooling medium 30 flowing to the condensation zone B can be condensed into a liquid cooling medium 30. Under the action of gravity, the liquid cooling medium 30 moves in the opposite direction to the aforementioned direction (that is, the direction from the tooth top 222 to the tooth root 221 ). ) back to the first evaporation area A1 to form a complete working medium cycle, and this process will be repeated in the cooling flow channel 40 to achieve continuous heat dissipation to the heating element 200 .
- the cooling medium 30 will avoid the aforementioned solid structure and flow along the road without the aforementioned solid structure when flowing in the cooling channel 40, so
- the number and shape of the support columns will affect the shape of the flow path of the cooling flow channel 40 , so that the flow path of the cooling flow channel 40 will present a diversified shape layout.
- the layout of the flow paths of the cooling flow channel 40 may include straight pipes, U-shaped pipes, right-angle mesh pipes, diamond mesh pipes, triangular mesh pipes, and circular mesh pipes A combination of one or more of roads and honeycomb grid-like pipelines.
- the heat dissipation principle of the heat dissipation structure 20 has been introduced as above, and the structure of the heat dissipation structure 20 will be described below with reference to FIGS. Possibilities are explained.
- the number of the connecting parts 21 can be one or more, and the number of the tooth parts 22 can also be one or more.
- the number of the connecting parts 21 and the tooth parts 22 can be matched according to the actual situation. This is not strictly limited.
- the number of the connecting portion 21 is one
- the number of the tooth portion 22 is also one
- one tooth portion 22 is connected to one connecting portion 21 by bending.
- the cross-sectional shape of the tooth portion 22 along its height direction can be linear, and the height direction of the tooth portion 22 can be understood as the tooth height of the tooth portion 22, that is, the direction from the tooth root 221 to the tooth top 222, or the tooth top.
- the direction from 222 to the tooth root 221 , or the direction perpendicular to the base plate 10 That is, the whole heat dissipation structure 20 is bent once, so as to form the heat dissipation structure 20 in the L-shape as shown in FIG. 13 .
- the cooling channel 40 extends from the connecting portion 21 to the tooth root 221 of the tooth portion 22 , and extends from the tooth root 221 of the tooth portion 22 to the tooth tip 222 of the tooth portion 22 .
- the cross-sectional shape of the tooth portion 22 along its height direction may present an inverted L shape, and the height direction of the tooth portion 22 may be understood as the tooth height of the tooth portion 22 , that is, the direction from the tooth root 221 to the tooth top 222 , or the tooth top 222 The direction to the tooth root 221 , or the direction perpendicular to the base plate 10 . That is, the whole heat dissipation structure 20 is bent twice, so as to form the heat dissipation structure 20 in the Z shape as shown in FIG. 14 .
- the cooling channel 40 extends from the connecting portion 21 to the tooth root 221 of the tooth portion 22 , and extends from the tooth root 221 of the tooth portion 22 to the tooth tip 222 of the tooth portion 22 .
- the cross-sectional shape of the tooth portion 22 along the height direction thereof may be in the shape of a square, and the height direction of the tooth portion 22 may be understood as the tooth height of the tooth portion 22, that is, the direction from the tooth root 221 to the tooth top 222, or the tooth top 222 to the tooth top 222.
- the direction of the tooth root 221 , or the direction perpendicular to the base plate 10 that is, the heat dissipation structure 20 is bent three times as a whole, so as to present the heat dissipation structure 20 in the form shown in FIG. 15 .
- the cooling channel 40 extends from the connecting portion 21 to the tooth root 221 of the tooth portion 22 , and extends from the tooth root 221 of the tooth portion 22 to the tooth crest 222 of the tooth portion 22 , and then extends from the tooth crest 222 of the tooth portion 22 to the tooth root 221 of the tooth portion 22 .
- the number of the connecting portion 21 is one, the number of the tooth portion 22 is two, and the tooth roots 221 of two adjacent tooth portions 22 are connected by one connecting portion 21 . It should be understood that when the number of teeth 22 is multiple, the cross-sectional shapes of two adjacent teeth 22 along the height direction may be the same or different, that is, the structural shapes of two adjacent teeth 22 may be the same , may be different, and this embodiment does not impose strict restrictions on this.
- the cross-sectional shape of one tooth portion 22 along its height direction may be in a straight shape, and the cross-sectional shape of the other tooth portion 22 along its height direction may be linear, and the height direction of the tooth portion 22 may be understood as the The tooth height, that is, the direction from the tooth root 221 to the tooth top 222 , or the direction from the tooth top 222 to the tooth root 221 , or the direction perpendicular to the base plate 10 . That is, the structures of the two adjacent teeth 22 are different, and the heat dissipation structure 20 is bent four times as a whole, so as to present the heat dissipation structure 20 in the S-shape as shown in FIG. 16 .
- each tooth portion 22 along its height direction can be linear, and the height direction of the tooth portion 22 can be understood as the tooth height of the tooth portion 22, that is, the direction from the tooth root 221 to the tooth top 222, or the tooth The direction from the top 222 to the tooth root 221 , or the direction perpendicular to the base plate 10 . That is, the structures of the two adjacent teeth 22 are the same, and the heat dissipation structure 20 is bent twice as a whole, so as to present the heat dissipation structure 20 in the U-shape as shown in FIG. 17 .
- the number of the connecting parts 21 is two, the number of the tooth parts 22 is one, and the two connecting parts 21 are respectively connected to two sides of the tooth root 221 of one tooth part 22 .
- the cross-sectional shape of a tooth portion 22 along its height direction may be a tang shape, and the height direction of the tooth portion 22 may be understood as the tooth height of the tooth portion 22, that is, the direction from the tooth root 221 to the tooth top 222, or the tooth height.
- the direction from the top 222 to the tooth root 221 , or the direction perpendicular to the base plate 10 That is, the entire heat dissipation structure 20 is bent four times, so as to present the heat dissipation structure 20 in the form shown in FIG. 18 .
- the number of connecting parts 21 is multiple (more than two), the number of tooth parts 22 is also multiple (two or more), and two adjacent ones
- the tooth roots 221 of the tooth portion 22 are connected by a connecting portion 21 .
- the cross-sectional shape of the tooth portion 22 along its height direction in this embodiment is not limited to the shapes described in the above-mentioned embodiments, and it may also be one of a straight line, an L shape, an arc shape or a serpentine shape. or a combination of more than one.
- the heat dissipation structure 20 can present a square wave or a wave shape as a whole, which can be flexibly adjusted according to practical applications, which is not strictly limited in this embodiment.
- the number of the connecting portion 21 is at least one, and the number of the tooth portion 22 is also at least one, and when the number of the tooth portion 22 is multiple, the structures of the adjacent two tooth portions 22 may be the same. , may be different, and this embodiment does not impose strict restrictions on this.
- the first air duct 50 is formed in the spaced area between two adjacent tooth portions 22 . That is, the cold air entering the radiator 100 can continuously flow to the external environment of the radiator 100 through the first air duct 50 during the flow.
- the heated air in the first air duct 50 can be continuously flowed to the external environment of the radiator 100, and the cold air in the external environment can be continuously entered into the first air duct 50, so as to rapidly dissipate heat
- the heat on the structure 20 is transferred to the external environment, so that the convective heat transfer level of natural heat dissipation is improved, and the condensing area can be increased without occupying much of the surface area of the substrate 10, and the heat dissipation performance is excellent.
- it can cooperate with the cooling channels 40 inside the heat dissipation structure 20 to form a double-layer heat dissipation structure 20 for air-cooled heat dissipation and liquid-cooled heat dissipation.
- the space between two adjacent tooth portions 22 can form an air duct for air circulation.
- the space between two adjacent teeth 22 can form a liquid channel for air circulation.
- the liquid may be water or oil. The embodiment of the present application does not strictly limit the external environment of the tooth portion 22 .
- the tooth portion 22 includes a first connecting segment 223 , a second connecting segment 224 and a third connecting segment 225 .
- the first connecting section 223 and the third connecting section 225 are arranged at intervals and are respectively connected to two adjacent connecting parts 21 , and the first connecting section 223 and the second connecting section 224 are arranged at an included angle with the two adjacent connecting parts 21 ,
- the second connection segment 224 is connected between one end of the first connection segment 223 away from the connection portion 21 and an end of the third connection segment 225 away from the connection portion 21 . That is, the first connecting section 223 and the second connecting section 224, and the second connecting section 224 and the third connecting section 225 are all connected by bending.
- the tooth top 222 of the tooth portion 22 is formed at the connection of the first connection segment 223 , the second connection segment 224 and the third connection segment 225 , and the connection between the first connection segment 223 and the third connection segment 225 and the adjacent two connection portions 21
- the tooth root 221 of the tooth portion 22 is formed there.
- the cross-sectional shape of the tooth portion 22 along its height direction can be in the shape of a square, and the height direction of the tooth portion 22 can be understood as the tooth height of the tooth portion 22, that is, the direction from the tooth root 221 to the tooth top 222, or the tooth top 222 The direction to the tooth root 221 , or the direction perpendicular to the base plate 10 .
- the spaced area between the first connecting section 223 and the third connecting section 225 forms the second air duct 60 . That is, the cold air entering the radiator 100 can continuously flow to the external environment of the radiator 100 through the second air duct 60 during the flow.
- the heated air in the second air duct 60 can be continuously flowed to the external environment of the radiator 100, and the cold air in the external environment can be continuously entered into the second air duct 60, so as to rapidly dissipate heat
- the heat on the structure 20 is transferred to the external environment, so that the convective heat transfer level of natural heat dissipation is improved, and the condensing area can be increased without occupying much of the surface area of the substrate 10, and the heat dissipation performance is excellent.
- the cooling channel 40 and the first air channel 50 inside the heat dissipation structure 20 can cooperate with the cooling channel 40 and the first air channel 50 inside the heat dissipation structure 20 to form a double-layer heat dissipation structure 20 for air-cooled heat dissipation and liquid-cooled heat dissipation. 100 thermal conductivity.
- the spaced area between the first connecting segment 223 and the third connecting segment 225 can form an air duct for air circulation.
- the spaced area between the first connecting section 223 and the third connecting section 225 can form a liquid channel for air circulation.
- the liquid may be water or oil. The embodiment of the present application does not strictly limit the external environment of the tooth portion 22 .
- first air duct 50 and the second air duct 60 are both formed by the heat dissipation structure 20, the ventilation direction of the first air duct 50 and the ventilation direction of the second air duct 60 are the same.
- the ventilation direction of the duct 50 is taken as an example for description, and these descriptions can be applied to the ventilation direction of the second air duct 60 under the condition of no conflict.
- the ventilation direction of the first air duct 50 is parallel to the extending direction of the large-surface side walls 103 , wherein the large-surface side walls 103 refer to the four side walls 103 of the substrate 10 .
- 19 is a schematic view of the structure cut parallel to the reference plane C of the base plate 10 at the middle position of the tooth height.
- the ventilation direction of the first air duct 50 is perpendicular to the extending direction of the large-surface side walls 103 , wherein the large-surface side walls 103 refer to the four side walls of the substrate 10
- 20 is a schematic view of the structure cut parallel to the reference plane C of the base plate 10 at the middle position of the tooth height.
- the ventilation direction of the first air duct 50 intersects with the extension direction of the large-surface side wall 103 (excluding verticality), wherein,
- the large sidewall 103 refers to the sidewall 103 with the largest area among the four sidewalls 103 of the substrate 10 . That is, the placement direction of the heat dissipation structure 20 intersects with the extending direction of the large-surface sidewall 103 .
- 21-24 are schematic diagrams of the structure cut parallel to the reference plane C of the substrate 10 at the middle position of the tooth height.
- the heat at the bottom of the first air duct 50 will be inclined and lifted along with the orientation of the first air duct 50, so that the hot air can flow from bottom to top along a certain angle based on the buoyancy force, and the cold air can flow from the bottom to the top based on the buoyancy force. It can also flow from bottom to top along a certain included angle, so as to quickly take heat away from the heat dissipation structure 20 .
- This buoyancy force is not easy to affect the temperature of the lower area of the air duct and the upper area of the air duct, which can reduce the influence of the upper and lower heat series caused by the heat dissipation structure 20, improve the convective heat transfer performance of the heat dissipation structure 20, and effectively improve the cooling medium 30 inside the heat dissipation structure 20. Condensation heat exchange.
- the number of heat dissipation structures 20 is one, and one heat dissipation structure 20 is obliquely placed on the substrate 10 . Thereby, the inclined layout form as shown in FIG. 21 can be formed.
- the number of the heat dissipation structures 20 is two, the two heat dissipation structures 20 are inclined and symmetrically placed on the substrate 10 , the two adjacent heat dissipation structures 20 are arranged at intervals, and the spaced area between the two adjacent heat dissipation structures 20 can be formed
- the third air duct 70 communicates with the first air duct 50 and the second air duct 60 .
- a V-shaped layout as shown in FIG. 22 can be formed, or a figure-eight layout as shown in FIG. 23 can be formed.
- the cold air entering the radiator 100 flows in the third air duct 70
- the cold air enters the first air duct 50 and the second air duct 60 on both sides thereof, and the first air duct on both sides of the first air duct 50 and the second air duct 60
- the duct 50 and the second air duct 60 flow in and take away the heat of the two heat dissipation structures 20 respectively, thereby improving the heat dissipation effect of the communication device 1000 .
- the number of heat dissipation structures 20 is four, and every two adjacent heat dissipation structures 20 are inclined and symmetrically placed on the substrate 10 , two adjacent heat dissipation structures 20 are arranged at intervals, and the interval between two adjacent heat dissipation structures 20 is The area can form a third air duct 70 communicating with the first air duct 50 and the second air duct 60
- a W-shaped layout as shown in FIG. 24 can be formed.
- the cold air entering the radiator 100 flows in the third air duct 70
- the cold air enters the first air duct 50 and the second air duct 60 on both sides thereof, and the first air duct on both sides of the first air duct 50 and the second air duct 60
- the duct 50 and the second air duct 60 flow in and take away the heat of the two heat dissipation structures 20 respectively, thereby improving the heat dissipation effect of the communication device 1000 .
- the number of heat dissipation structures 20 may be one or more.
- the number of heat dissipation structures 20 By adjusting the number of heat dissipation structures 20, a variety of tooth layouts can be realized, and then the tooth layout can be fully utilized to achieve low thermal resistance, average temperature, heat conduction and better convective heat transfer performance of the teeth.
- the heat sink 100 may further include a reinforcing structure 80 disposed on the heat dissipation structure 20 or connected between the heat dissipation structure 20 and the substrate 10 . Therefore, by performing secondary processing on the heat dissipation structure 20 , the heat exchange area of the entire radiator 100 can be effectively increased, and the strength of the entire radiator 100 can be improved.
- the connection form of the reinforcing structure 80 to the heat dissipation structure 20 and the substrate 10 may be, but not limited to, welding, bonding or through-hole expansion.
- the reinforcing structure 80 is provided between the connecting portion 21 and the substrate 10 .
- the reinforcement structure 80 may be provided at the location shown in FIG. 25 .
- the reinforcing structure 80 is provided between the connecting portion 21 and the tooth portion 22 .
- the reinforcement structure 80 may be provided at the location shown in FIG. 26 .
- the reinforcing structure 80 is provided between the teeth portion 22 and the base plate 10 .
- the reinforcement structure 80 may be provided at the location shown in FIG. 27 .
- a through-flow channel 81 communicating with the cooling channel 40 may also be provided in the reinforcing structure 80 .
- the reinforcement structure 80 can be made of the same material as the heat dissipation structure 20 .
- it is beneficial to improve the structural rigidity of the radiator 100 so that the radiator 100 as a whole can have excellent structural reliability and stability.
- the heat dissipation area of the radiator 100 can be increased, the condensation effect of the cooling medium 30 can be improved, and the recirculation of the cooling medium 30 can be promoted.
- the structure of the heat sink 100 in the first embodiment can be applied to the heat sink 100 of the second embodiment as described below, as long as there is no conflict. structural form.
- the same content as that of the first embodiment will not be repeated.
- the difference from the first embodiment is that the substrate 10 is a hollow structure.
- the base plate 10 is provided with a cavity 11 , so that the base plate 10 has a hollow structure as a whole. And the cavity 11 communicates with the cooling channel 40 , so that the cooling medium 30 flows in the cavity 11 and the cooling channel 40 . In other words, in this embodiment, the cooling medium 30 flows in the cavity 11 and the cooling flow channel 40 . Therefore, the heat transfer temperature difference of the entire radiator 100 can be made small, which is beneficial to improve the heat transfer efficiency of the entire radiator 100 .
- the cooling medium 30 is a fluid working medium capable of both gas-liquid phase transition and heat conduction, it can realize a complete working medium cycle through the gas-liquid phase transition.
- the cooling medium 30 flows in the cavity 11 and the cooling flow channel 40 , so the cavity 11 and the cooling flow channel 40 need to have regions capable of allowing the cooling medium 30 to undergo gas-liquid transformation.
- the cavity 11 is the second evaporation area A2, that is, the cavity 11 as a whole constitutes the second evaporation area A2 of the substrate 10, so that the cooling medium 30 is evaporated in the second evaporation area A2.
- the cooling channel 40 has a first evaporation area A1 and a condensation area B, and there is a certain height gradient between the first evaporation area A1 and the condensation area B, so that the cooling medium 30 can be vaporized when it flows to the first evaporation area A1 and flow When it reaches the condensation zone B, it liquefies and flows back to the first evaporation zone A1 and the second evaporation zone A2 to realize the gas-liquid phase change of the cooling medium 30 .
- the condensation area B is located at the connection part 21 and the tooth root 221 of the tooth part 22
- the first evaporation area A1 is located at the tooth top 222 of the tooth part 22 .
- the cooling channel 40 has a first through-flow structure 41 .
- the first through-flow structure 41 is disposed on the contact surface 211 .
- the first through-flow structure 41 can be understood as the outlet of the cooling channel 40 .
- the cavity 11 has a second through-flow structure 12 , the second through-flow structure 12 is disposed on the second surface 102 , and the second through-flow structure 12 can be understood as an outlet of the cavity 11 .
- the second through-flow structure 12 communicates with at least part of the first through-flow structure 41 . Under this setting, the heat transfer path of the cooling medium 30 is short and the flow resistance is small, which can avoid a large temperature difference locally on the radiator 100 to the greatest extent possible.
- connection portion 21 communicating with the substrate 10
- the following description can also be applied to the communication between other connection portions 21 and the substrate 10 , unless there is conflict. That is, when the heat dissipation structure 20 has a plurality of connecting portions 21 , it may have a plurality of first flow-through structures 41 .
- the cavity 11 may also have a plurality of second flow structures 12 corresponding to the plurality of first flow structures 41 .
- the plurality of second flow-through structures 12 may be arranged at various positions on the substrate 10 at intervals, and the intervals between them may be equal or unequal.
- the heat dissipation difficulty when multiple heat sinks are provided at various positions of the second surface 102 of the substrate 10 can be effectively solved, that is, the heat dissipation difficulty when multiple heat sources are arranged.
- the cooling medium 30 can absorb the heat of the bottom heat source, and the heat in the middle and the top can pass through the first through-flow structure 41 and the second through-flow structure at the corresponding position.
- the flow structure 12 enters the cooling channel 40 , so that the heat dissipation structure 20 also participates in heat dissipation.
- the cooling medium 30 can absorb the heat of the bottom and middle heat sources, and the heat at the top can pass through the first through-flow structure 41 and the second through-flow structure at the corresponding position.
- the structure 12 enters the cooling channel 40 , so that the heat dissipation structure 20 also participates in heat dissipation.
- the technical solution provided in this embodiment can quickly and effectively conduct heat exchange and cooling in the risk area of the substrate 10 that is prone to overheating, so as to minimize the possibility of failure of the radiator 100 due to overheating, so that the radiator 100 It will not be damaged due to local over-temperature, and has strong reliability.
- the second through-flow structure 12 communicates with a part of the first through-flow structure 41 . Therefore, the cooling medium 30 located in the cavity 11 can have fluidity and smoothly flow into the cooling flow channel 40 , and since the outlet of the cooling flow channel 40 and the outlet of the cavity 11 do not need to be completely connected, the radiator 100 can be The processing and manufacturing process is simpler.
- the second through-flow structure 12 communicates with all of the first through-flow structure 41 .
- the flow rate and flow speed of the cooling medium 30 can be controlled by changing the degree of communication between the second through-flow structure 12 and the first through-flow structure 41, so as to ensure the cooling medium 30 in the substrate 10 and the heat dissipation structure 20. Flow reliability and uniformity.
- the shape of the first through-flow structure 41 can be adapted to the shape of the second through-flow structure 12 , so that the process of processing and assembling the heat sink 100 is relatively simple, which is beneficial to reduce the time and production cost of the heat sink 100 .
- the first through-flow structure 41 is a slot-like structure, and the second through-flow structure 12 is also a slot-like structure.
- the first through-flow structure 41 is a hole-like structure, and the second through-flow structure 12 is also a hole-like structure.
- first through-flow structure 41 may not be compatible with the shape of the second through-flow structure 12, as long as at least part of the second through-flow structure 12 and the first through-flow structure 41 communicate with each other. , which is not strictly limited in this embodiment.
- the cavity 11 and the cooling channel 40 can be communicated with each other due to the communication between the first through-flow structure 41 and the second through-flow structure 12, so that the cooling medium 30 can flow in the cavity 11 and the heat dissipation structure 20,
- the temperature uniformity performance of the radiator 100 is effectively improved, thereby further improving the overall heat dissipation capability of the radiator 100 .
- the first flow-through structure 41 includes a first sub-flow structure 411
- the second flow-through structure 12 includes a second sub-flow structure 121
- a first sub-flow structure 121 The flow structure 411 is in one-to-one correspondence with a second sub-flow structure 121 . That is, the first through-flow structure 41 and the second through-flow structure 12 can form a one-to-one matching relationship.
- the shape of the first sub-flow structure 411 can be matched with the shape of the second sub-flow structure 121 , so that the process of processing and assembling the heat sink 100 is relatively simple, which is beneficial to reduce the time and cost of the heat sink 100 .
- Cost of production for example, the first sub-flow structure 411 is a slot-like structure, and the second sub-flow structure 121 is also a slot-like structure.
- the first sub-flow structure 411 is a hole-like structure, and the second sub-flow structure 121 is also a hole-like structure.
- the shape of the first sub-flow structure 411 may not be compatible with the shape of the second sub-flow structure 121, and it only needs to satisfy the communication between the second sub-flow structure 121 and the first sub-flow structure 411 That is, this embodiment does not impose strict restrictions on this.
- the first flow-through structure 41 includes a first sub-flow-through structure 411
- the second flow-through structure 12 includes a plurality of intervals
- the second sub-flow structures 121 are provided, and each second sub-flow structure 121 communicates with one first sub-flow structure 411 . That is, the first sub-flow structure 411 and the second sub-flow structure 121 can form a one-to-many matching relationship.
- the discontinuous design of the plurality of second sub-flow structures 121 can fully consider the specific layout constraints of the devices and structural components in the substrate 10 , for example, the space between adjacent second sub-flow structures 121 can be The structural support column or the solid column for installing the screw in the cavity 11 is effectively avoided, the layout is reasonable, and the practicability is strong.
- the first through-flow structure 41 includes a plurality of first sub-flow-through structures 411 arranged at intervals, and the second through-flow structure 12 A sub-flow structure is included, and each first sub-flow structure 411 is communicated with a second sub-flow structure 121 . That is, the first sub-flow structure 411 and the second sub-flow structure 121 can form a one-to-many matching relationship.
- the intermittent design of the plurality of first sub-flow structures 411 can fully consider the risk of damage during actual use if the outlet of the cooling channel 40 is too large in size, safety and reliability good.
- the first through-flow structure 41 includes a plurality of first sub-flow-through structures 411 arranged at intervals
- the second The through-flow structure 12 includes a plurality of second through-flow sub-structures 121 arranged at intervals, and the plurality of first through-flow sub-structures 411 and the plurality of second through-flow sub-structures 121 are in one-to-one correspondence with each other. That is, the first through-flow structure 41 and the second through-flow structure 12 can form a one-to-one matching relationship.
- connection position and connection possibility of the first through-flow structure 41 and the second through-flow structure 12 are related to the resistance of the cooling medium 30 when it evaporates into a gaseous state and returns to the liquid.
- providing a variety of layout forms can increase the possibility of realizing gas phase transformation of the cooling medium 30 .
- the cavity 11 includes a top wall 111 and a bottom wall 112 that are oppositely disposed along the height direction of the substrate 10 , the bottom wall 112 is disposed on the same side as the first surface 101 , and the bottom wall 112 and the second surface 102 is disposed on the same side, and the top wall 111 is closer to the heat dissipation structure 20 than the bottom wall 112 .
- the cavity 11 is the second evaporation area A2
- a structure that can enhance the evaporation and vaporization of the cooling medium 30 may be arranged in the cavity 11, and the following embodiments will be specifically combined. Explain in detail.
- the heat sink 100 further includes a support structure 91 , and the support structure 91 is located in the cavity 11 .
- the support structure 91 is supported between the top wall 111 and the bottom wall 112 , or, one end of the two ends of the support structure 91 abuts with one of the top wall 111 and the bottom wall 112 , and the other end is in contact with the top wall 111 .
- the number of the support structures 91 may be one or more, and when the number of the support structures 91 is multiple, the multiple support structures 91 are arranged at intervals.
- the support structure 91 can be fixed either with the top wall 111 or the bottom wall 112, or with both the top wall 111 and the bottom wall 112, and the support structure can be adjusted according to the reliability and stress distribution of the support position to be supported. 91 and the connection of the top wall 111 and the bottom wall 112 are designed. Illustratively, the support structure 91 may be fixed to the top wall 111 and/or the bottom wall 112 by welding or gluing. Alternatively, the support structure 91 can also be integrally formed with the inner cavity of the housing, so that the support structure 91 and the wall surface of the cavity 11 are stably connected, thereby simplifying the process of the heat sink 100 .
- the outer surface of the support structure 91 may also be provided with grooves (not shown), and the grooves can speed up the process of converting the liquid cooling medium 30 into a gaseous state, thereby enhancing the boiling effect.
- the support structure 91 can maintain the shape of the substrate 10, deform the substrate 10 under the action of external force, shorten the longitudinal interval between the top wall 111 and the bottom wall 112, and reduce the possibility of affecting the reflow to the minimum.
- the support structure 91 can shorten the time required for the liquid cooling medium 30 to be converted into the gaseous cooling medium 30, thereby enhancing the boiling and accelerating the reflux.
- the bottom wall 112 of the heat sink 100 may be provided with a groove 92 . Therefore, by arranging the grooves 92 in the cavity 11 close to the wall surface of the heating element 200 , the process of converting the liquid cooling medium 30 into a gaseous state can be accelerated, and the time required for vaporizing the cooling medium 30 can be greatly shortened, thereby enhancing cooling. The effect of evaporation and vaporization of the medium 30 .
- the heat sink 100 further includes a first capillary structure 93 , and the first capillary structure 93 is located in the cavity 11 and connected to the bottom wall 112 .
- the first capillary structure 93 may be tow, wire mesh, sintered powder or fiber.
- the cooling medium 30 that is conducive to condensation flows back from the cooling area to the second evaporating area A2, which avoids that there is less liquid-phase cooling medium 30 in the second evaporating area A2 and the heat generated by the heating element 200 cannot be dissipated in time.
- the heat dissipation performance of the heat sink is improved.
- the process of converting the liquid cooling medium 30 into a gaseous state can be accelerated, and the time required for the vaporization of the cooling medium 30 can be greatly shortened, thereby enhancing the evaporation and vaporization of the cooling medium 30 .
- the heat sink 100 further includes a first capillary structure 93 and a second capillary structure 94 .
- the first capillary structure 93 is located in the cavity 11 and connected to the bottom wall 112 .
- the second capillary structure 94 is located in the cavity 11 , one end of the second capillary structure 94 is connected to the first capillary structure 93 , and the other end of the second capillary structure 94 is connected to the top wall 111 .
- the first capillary structure 93 and the second capillary structure 94 may be tow, wire mesh, sintered powder or fiber.
- the cooling medium 30 that is conducive to condensation flows back from the cooling area to the second evaporating area A2, which avoids that there is less liquid-phase cooling medium 30 in the second evaporating area A2 and the heat generated by the heating element 200 cannot be dissipated in time.
- the heat dissipation performance of the heat sink is improved.
- the process of converting the liquid cooling medium 30 into a gaseous state can be accelerated, and the time required for the vaporization of the cooling medium 30 can be greatly shortened, thereby enhancing the evaporation and vaporization of the cooling medium 30 .
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Human Computer Interaction (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本申请提供一种散热器及通信设备。包括基板、散热结构和冷却介质。所述散热结构包括一体式结构的连接部和齿部,所述连接部与所述基板连接,所述齿部与所述连接部呈夹角设置,且所述齿部的齿根连接至所述连接部,所述齿部的齿顶远离所述连接部,所述散热结构内设冷却流道,所述冷却流道至少部分位于所述齿部;所述冷却介质在所述冷却流道内流动以为所述基板散热。本申请的技术方案能够提高散热器的热传导能力,散热可靠性佳。
Description
本申请要求于2021年01月08日提交中国专利局、申请号为202110024923.0、申请名称为“散热器及通信设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
本申请涉及散热技术领域,尤其涉及一种散热器及通信设备。
随着通信技术的发展,通信设备朝着高速化、高功率密度的方向发展,通信热备的热耗密度也越来越高,散热成为通信设备设计的一个重要挑战,通信设备能否进行良好的散热直接影响通信设备的工作可靠性及综合性能。通信设备包括散热器,通常需要针对散热器做相应的散热设计,然而传统的散热器的热传导能力低下,散热可靠性低。
发明内容
本申请的实施例提供一种散热器及通信设备,能够提高散热器的热传导能力,散热可靠性佳。
第一方面,本申请提供一种散热器,所述散热器包括:
基板;
散热结构,所述散热结构包括一体式结构的连接部和齿部,所述连接部与所述基板连接,所述齿部与所述连接部呈夹角设置,且所述齿部的齿根连接至所述连接部,所述齿部的齿顶远离所述连接部,所述散热结构内设冷却流道,所述冷却流道至少部分位于所述齿部;及
冷却介质,所述冷却介质在所述冷却流道内流动以为所述基板散热。
一种可能的实施方式中,所述冷却流道自所述连接部延伸至所述齿部,并在所述齿根和所述齿顶之间延伸。
另一种可能的实施方式中,所述冷却流道仅位于所述齿部,并在所述齿根和所述齿顶之间延伸。
可以理解的是,散热结构可以为一次性加工出具有冷却流道的肋板,并根据散热器的实际散热需求,将具有冷却流道的肋板通过至少一次的折弯而形成的散热器的主散热部件。其中,折弯也可以理解为折叠,即对具有冷却流道的肋板进行至少一次的翻折,而折叠的情况可以包括一部分和另一部分挨在一起的情况,也可以包括一部分和另一部分具有间隔的情况。应当理解,冷却流道可随肋板的折叠而折叠,即跟随肋板的折弯形态而呈现折弯形态。
由此,散热结构能够通过一次性加工和折叠成型以形成一体式结构,使得散热结构作为散热器的散热齿也即主散热部件,良好的呈现为发热件散热所需的形态构造。一方面,能够将散热结构作为整体与基板连接,有效规避了现有技术中需将多个散热齿独立加工并依次与基板组装的复杂组装工序,有利于节省生产时间和成本,提高散热器的加 工生产效率。另一方面,由于散热结构的连接部可连接于基板,从而节省了现有技术中需在基板和散热齿之间设置固定散热齿的连接件,大大缩减了散热结构所占用的空间大小,降低散热器的风阻,有利于散热器的小型化的发展趋势,使得散热器易于搬运和安装。
具体而言,由于连接部与基板连接,故而连接部可以以较大的接触面积与基板接触,也即为,连接部和基板整体的连接面积能够有效增加,且连接部与基板连接的连接形式较为简单平整,能够使得连接难度有效降低。另外,还能够在增加与基板的连接面积的同时,减小需与基板连接的连接部的数量,从而降低了因连接成本的压力和连接部数量多所导致的冷却介质泄露的风险,连接质量显著提升。
而齿部与连接部呈夹角设置,也即为,齿部与连接部弯折连接。由此,齿部可看作散热结构中进行折弯的部分,也即为相对连接部凸伸的部分,也为相对基板凸伸的部分。通过设置齿部,一方面能够满足散热器的外部形态需求。另一方面能够在不多占用板面面积的情况下有效增加散热面积。而齿部与连接部一体式的连续结构,相对于现有技术方案中各散热齿断续不连接的结构,结构简单可靠,能够进一步提高冷却介质的冷凝面积,促进冷却介质的回流,还可在满足实现气液相变的循环所需的重力方向梯度的基础上,有效降低齿部的齿高,进而降低散热器的体积,避免因散热器的体积增加而带来的重量高、风阻高,不易于搬运和安装的问题发生,提高散热器的单位体积散热能力。
另外,在散热结构的内部设置冷却流道,能够使得散热结构创新性地具有两相均温板的散热特性。一方面,能够把基板所传导的高功率热源的热量有效拓展开,降低散热结构的导热热阻和基板的温度,使得散热结构具有良好的导热温差和传热效率,大大提高了散热结构的导热性能。另一方面,能够提高散热结构的热传导能力,使得在为同等条件的热耗散热,即达成同等散热目标的情况下,散热器的体积、重量和热阻均可相应减小,有利于节省散热结构的物料管理成本,散热可靠性佳。
而冷却流道位于齿部,且在齿根和齿顶之间延伸可理解为,冷却流道仅分布于不与基板直接接触的齿部,此设置下,能够使散热结构呈现为部分具有流道、部分为实体的结构,有利于散热器的多场景应用,灵活性强。或者,冷却流道自连接部延伸至齿部,并在齿根和齿顶之间延伸可理解为,冷却流道的延伸路径与散热结构的折弯路径相同,也即冷却流道跟随散热结构的延伸方向延伸,能够使得冷却流道作为整体而遍布散热结构,且仅需一个充液口以为冷却流道填充冷却介质,避免了现有技术中需在多个散热齿中的每一个散热齿均设置一个流道,并开设充液口为流道填充冷却介质的复杂结构,使得冷却流道具有独立充液的优良特性,有利于提高散热器的散热收益和加工制造效率。
一种可能的实施方式中,所述基板与所述散热结构为一体式结构。
示例性地,散热结构和基板可以通过焊接、胶粘、压接或螺钉固定等方式彼此连接而形成一体式结构。也即为,散热结构和基板连接构成一体式结构。
由此,一方面,能够节省生产时间和成本,提高散热器的加工生产效率。另一方面,散热器整体的散热性能提升后,在维持现有热耗水平的同时,散热器的齿部的齿高可以因散热性能的提升而降低,从而变相降低了整个散热器的体积和重量。也即为,同等散热需求的情况下,本申请的实施例所提供的散热器的结构,相对于现有技术的结构体积 更小。
一种可能的实施方式中,所述连接部的数量为多个,所述齿部的数量也为多个,相邻两个所述齿部的齿根通过一个所述连接部连接,且相邻两个所述齿部的间隔区域形成第一风道。
可以理解的是,相邻两个齿部的间隔区域形成第一风道。也即为,进入到散热器的冷空气能够在流动的过程中,不断的通过第一风道流向散热器的外部环境。一方面,能够使第一风道中被加热的空气不断流向散热器的外部环境中,并使外部环境中的冷空气不断的进入到第一风道中,进而能够快速的将散热结构上的热量传递至外部环境中,使得自然散热的对流换热水平提高,且还能够在不多占用基板板面面积的情况下,实现冷凝面积的增加,散热性能优异。另一方面,能够与散热结构内部的冷却流道配合形成风冷散热和液冷散热的双层散热结构,性能多元,应用范围广泛,还能够进一步提高散热器的热传导能力。
需说明的是,在齿部的外部环境为空气时,相邻两个齿部的间隔区域能够形成用于供空气流通的风道。而在齿部的外部环境为液体时,相邻两个齿部的间隔区域能够形成用于供空气流通的液道。示例性地,液体可以为水或油。本申请的实施例对于齿部的外部环境不做严格限制。
一种可能的实施方式中,所述基板包括四个依次连接的侧壁,所述第一风道的通风方向与任一所述侧壁的延伸方向相交或平行。
由此,第一风道底部的热量会随着第一风道的朝向而倾斜抬升,使得热空气基于浮升力作用而可以沿一定的夹角自下往上流动,冷空气基于浮升力也可以沿一定的夹角自下往上流动,从而快速把热量从散热结构中带走。此浮升力不易影响风道下部区域和风道上部区域的温度,能够降低散热结构带来的上下热串联的影响,提高散热结构的对流换热性能,有效改善散热结构内部冷却介质的冷凝换热。
一种可能的实施方式中,所述齿部包括第一连接段、第二连接段和第三连接段;
所述第一连接段和所述第三连接段间隔设置且分别连接至相邻两个所述连接部,且所述第一连接段和所述第二连接段均与相邻两个所述连接部呈夹角设置,所述第二连接段连接在所述第一连接段远离所述连接部的一端和所述第三连接段远离所述连接部的一端之间;
所述第一连接段、所述第二连接段和所述第三连接段的连接处形成所述齿部的齿顶,所述第一连接段和所述第三连接段与相邻两个所述连接部的连接处形成所述齿部的齿根;
所述第一连接段和所述第三连接段的间隔区域形成第二风道。
由此,齿部沿其高度方向的截面形状可呈现冂形,齿部的高度方向可理解为齿部的齿高,也即齿根到齿顶的方向,或齿顶到齿根的方向,或垂直于基板的方向。
此设置下,第一连接段和第三连接段的间隔区域形成第二风道。也即为,进入到散热器的冷空气能够在流动的过程中,不断的通过第二风道流向散热器的外部环境。一方面,能够使第二风道中被加热的空气不断流向散热器的外部环境中,并使外部环境中的冷空气不断的进入到第二风道中,进而能够快速的将散热结构上的热量传递至外部环境 中,使得自然散热的对流换热水平提高,且还能够在不多占用基板板面面积的情况下,实现冷凝面积的增加,散热性能优异。另一方面,能够与散热结构内部的冷却流道和第一风道配合形成风冷散热和液冷散热的双层散热结构,性能多元,应用范围广泛,还能够进一步提高散热器的热传导能力。
一种可能的实施方式中,所述冷却流道包括第一蒸发区和冷凝区,所述冷凝区位于所述连接部和所述齿部的齿根,所述第一蒸发区位于所述齿部的齿顶,所述冷却介质在所述第一蒸发区汽化,并在所述冷凝区液化而回流至所述第一蒸发区。
可以理解的是,由于冷却介质为能够兼具发生气液相变和导热的双重功效的流体工作介质,其能够通过气液相变作用而实现完整的工质循环。而在本实施例中,冷却介质仅在冷却流道内流动,故而冷却流道需具有能够使冷却介质发生完整气液变换的区域。也即为,冷却流道具有第一蒸发区和冷凝区,而第一蒸发区和冷凝区具有一定的高度梯度,能够使得冷却介质流动至第一蒸发区时汽化,流动至冷凝区时液化而回流至第一蒸发区,以实现冷却介质的气液相变。示例性地,冷凝区位于连接部和齿部的齿根,第一蒸发区位于齿部的齿顶。
由此,发热件产生的热量能够通过基板传导至散热结构的第一蒸发区,第一蒸发区内的冷却介质在低真空度的环境后受热汽化,气态的冷却介质在压力差的作用下沿着齿部的延伸方向(即齿根到齿顶的方向)流动至冷凝区。流动至冷凝区的气态的冷却介质能够凝结为液态的冷却介质,液态的冷却介质在重力的作用下,沿着与前述方向相反的方向(即齿顶到齿根的方向)回流至第一蒸发区,以形成完整的工质循环,而此过程将在冷却流道内周而复始的进行,以实现对发热件的持续散热。
一种可能的实施方式中,所述基板为实心封闭结构。也即为,基板为实体板材,冷却介质只在散热结构的冷却流道中进行流动。由此,基板整体的强度更为优异,同时,基板的结构简单,能够应用至散热性能需求不高的场景中,使得散热器整体的加工生产效率得以提升。
一种可能的实施方式中,所述基板内设有腔体,所述腔体与所述冷却流道连通,以使所述冷却介质在所述腔体和所述冷却流道内流动。
由此,能够使得基板整体呈现空心的结构设置。而腔体又与冷却流道连通,能够使冷却介质在腔体和冷却流道内流动。换言之,本实施例中,冷却介质在腔体和冷却流道中流动。由此,能够使得散热器整体的导热温差小,有利于提高散热器整体的传热效率。
一种可能的实施方式中,所述腔体为第二蒸发区,所述冷却介质在所述第二蒸发区汽化。
具体而言,腔体为第二蒸发区,也即,腔体整体构成基板的第二蒸发区,以使冷却介质在第二蒸发区内汽化。而冷却流道具有第一蒸发区和冷凝区,而第一蒸发区和冷凝区之间具有一定的高度梯度,能够使得冷却介质流动至第一蒸发区时汽化,流动至冷凝区时液化而回流至第一蒸发区和第二蒸发区,以实现冷却介质的气液相变。示例性地,冷凝区位于连接部和齿部的齿根,第一蒸发区位于齿部的齿顶。
一种可能的实施方式中,所述连接部包括接触面,所述基板包括第一表面,所述接触面与所述第一表面相对设置;
所述冷却流道具有第一通流结构,所述第一通流结构设于所述接触面,所述腔体具有第二通流结构,所述第二通流结构设于所述第二表面;
所述第二通流结构与所述第一通流结构的至少部分连通。
示例性地,第二通流结构与第一通流结构的部分连通。由此,位于腔体内的冷却介质能够具备流动性而顺利流入冷却流道中,且由于冷却流道的出口与腔体的出口不需要完全连通,能够使得散热器的加工制造过程更为简便。
或者,第二通流结构与第一通流结构的全部连通。
基于上述描述,应当理解,可以通过改变第二通流结构与第一通流结构的连通程度以控制冷却介质的流量和流动速度,以保证基板和散热结构中冷却介质的流动可靠性和均匀性。
一种可能的实施方式中,所述第一通流结构包括一个或多个间隔设置的第一子通流结构,所述第二通流结构包括与所述第一子通流结构数量相同的第二子通流结构,并一对一而对应连通。
由此,第一子通流结构与第二子通流结构能够形成一对多的配合关系。
一种可能的实施方式中,所述第一通流结构包括多个间隔设置的第一子通流结构,所述第二通流结构包括一个所述子通流结构,每一所述第一子通流结构均与一个所述第二子通流结构连通。
也即为,第一子通流结构与第二子通流结构能够形成一对多的配合关系。由此,多个第一子通流结构的断续式设计,能够充分考虑冷却流道的出口若尺寸过大的话,实际使用过程中会有损坏的风险的问题,安全性和可靠性佳。
或者,所述第一通流结构包括一个第一子通流结构,所述第二通流结构包括多个间隔设置的第二子通流结构,每一所述第二子通流结构均与一个所述第一子通流结构连通。
也即为,第一子通流结构与第二子通流结构能够形成一对多的配合关系。由此,多个第二子通流结构的断续式设计,能够充分考虑基板内器件和结构件的具体布局限制,比如相邻的第二子通流结构之间的间隔区域能够有效避让腔体内设置的结构支撑柱或者安装螺钉的实心柱,布局合理,实用性强。
一种可能的实施方式中,所述散热器还包括支撑结构,所述腔体包括沿所述基板的高度方向相对设置的顶壁和底壁,所述顶壁相对所述底壁更靠近所述散热结构;
所述支撑结构支撑在所述顶壁和所述底壁之间;或者,
所述支撑结构两端中的一端与所述顶壁和所述底壁中的其中一个抵接,另一端与所述顶壁和所述底壁中的另一个相隔离。
也即为,支撑结构既可与顶壁或底壁固定,也可与顶壁和底壁均固定,可根据所需支撑的支撑位置的可靠性和应力分布情况对支撑结构与顶壁和底壁的连接情况进行设计。示例性地,支撑结构可通过焊接或胶粘的方式与顶壁和/或底壁固定。或者,支撑结构也可与壳体的内腔一体成型,从而不仅使支撑结构与腔体的壁面稳固地连接,从而简化了散热器的工艺制程。
由此,一方面,支撑结构能够保持基板的形状,将基板在受外力作用下发生形变,使顶壁和底壁之间的纵向间隔变短,而影响回流的可能性降低到最小。另一方面,支撑 结构能够缩短液态的冷却介质转换为气态的冷却介质所需的时间,起到强化沸腾和加快回流的作用。
一种可能的实施方式中,所述散热器的底壁和/或所述支撑结构的外表面设有沟槽。
由此,通过在腔体中靠近发热件的壁面和/或支撑结构的外表面设置沟槽,能够加快液态的冷却介质转换为气态的进程,并将冷却介质汽化所需的时间大大缩短,起到强化冷却介质蒸发汽化的作用。
一种可能的实施方式中,所述散热器还包括第一毛细结构,所述第一毛细结构位于所述腔体并连接于所述底壁。示例性地,第一毛细结构可以为丝束、丝网、烧粉或纤维。
由此,一方面,有利于冷凝的冷却介质自冷却区回流至第二蒸发区,避免了第二蒸发区中液相冷却介质较少而无法及时将发热件产生的热量散去的问题发生,提高了散热件的散热性能。另一方面,能够加快液态的冷却介质转换为气态的进程,并将冷却介质汽化所需的时间大大缩短,起到强化冷却介质蒸发汽化的作用。
一种可能的实施方式中,所述散热器还包括第二毛细结构,所述第二毛细结构位于所述腔体,且所述第二毛细结构的一端连接所述第一毛细结构,所述第二毛细结构的另一端连接所述顶壁。示例性地,第二毛细结构可以为丝束、丝网、烧粉或纤维。
由此,一方面,有利于冷凝的冷却介质自冷却区回流至第二蒸发区,避免了第二蒸发区中液相冷却介质较少而无法及时将发热件产生的热量散去的问题发生,提高了散热件的散热性能。另一方面,能够加快液态的冷却介质转换为气态的进程,并将冷却介质汽化所需的时间大大缩短,起到强化冷却介质蒸发汽化的作用。
一种可能的实施方式中,所述散热结构的数量为一个;或者,
所述散热结构的数量为多个,相邻两个所述散热结构间隔且呈夹角设置。
由此,通过对散热结构的数量进行调整,可以实现多样化的齿片布局,进而可以充分利用齿片的布局,以实现齿片的低热阻均温导热和较好的对流换热性能。
一种可能的实施方式中,所述散热器还包括补强结构,所述补强结构内设与所述冷却流道连通的通流流道;
所述补强结构设于所述连接部和所述基板之间;或者,
所述补强结构设于所述连接部和所述齿部之间;或者,
所述补强结构设于所述齿部和所述基板之间。
由此,通过对散热结构进行二次加工,能够有效增加散热器整体的换热面积,提高散热器整体的强度。示例性地,补强结构与散热结构和基板的连接形式可以为但不仅限于为焊接、粘接或穿孔胀接。
一种可能的实施方式中,所述散热结构为一个肋板通过至少一次折弯而折叠成型;或者,
所述散热结构为多个肋板拼接并通过至少一次折弯而折叠成型。
需说明的是,多个肋板拼接并通过至少一次折弯而折叠成型的情况包括多个肋板折弯后拼接在一起的情况,也包括多个肋板拼接在一起后而共同折弯的情况。
由此,能够根据散热器的实际散热需求和空间布局,在散热需求相对较小和空间布局相对狭小的应用场景中,布局通过较少肋板折叠成型的散热结构,而在散热需求相对 较大和空间布局相对广阔的应用场景中,布局通过较多肋板折叠成型的散热结构。也即为,散热结构的设置能够适应多场景化的应用需求,灵活性强,应用范围广泛。
一种可能的实施方式中,以地面为参考面,所述基板与所述参考面平行或呈夹角设置。
也即为,散热器可以水平方向布置,也可以竖直方向布置,也可以在水平方向和竖直方向内的夹角范围内倾斜布置。
具体而言,散热器水平方向布置可理解为以地面为参考面,发热件的热源面与参考面平行设置,故而基板与参考面平行设置,从而使得固定至基板的连接结构也与基板处于同一方向,进而使散热器整体成型水平设置的布局。由此,散热器的蒸发区域和冷凝区域能够在重力方向上上下排列,使得冷却介质在蒸发区域内吸收热量变成蒸汽,蒸汽在高度梯度的压力差下流动到冷凝区域,并在冷凝区域内冷凝成液体,冷凝成的液体可在重力作用下回流至蒸发区域,周而复始形成以形成完整的工质循环,从而使得散热器可通过气液相变而提高散热器整体的均温性能,进而增强了散热器整体的热传导能力。
散热器竖直方向布置可理解为以地面为参考面,发热件的热源面与参考面垂直设置,故而基板与参考面垂直设置,从而使得固定至基板的连接结构也与基板处于同一方向,进而使散热器整体成型垂直设置的布局。由此,底部垂直设置的基板能够使得自然散热条件下,风从底部进入以与空气对流换热,有效满足基站、电源、光伏逆变器等的散热器基板竖直方向布置的需求。
散热器倾斜布置可理解为以地面为参考面,发热件的热源面与参考面呈夹角设置,故而基板与参考面呈夹角设置,从而使得固定至基板的连接结构也与基板处于同一方向,进而使散热器整体成型倾斜设置的布局,其中,基板与参考面的夹角范围可以在0°~90°的范围内。由此,基板会与重力方向呈一定夹角而呈现底部倾斜设置的形态,此结构能够适应因为发射信号倾角覆盖,而需倾斜布置的需求,能够满足散热器可便捷安装、可灵活部署的关键需求,能够有效提高散热器的核心竞争力。
基于上述描述,散热器能够有效适应不同的布局方式,以在发射功率和高集成度持续增加的基础上,综合性能得以提升,从而能够充分适应高功率和高散热密度的挑战,满足多场景的应用需求(如风雪暑热、风沙盐雾的户外恶劣环境),可靠性佳。
一种可能的实施方式中,所述齿部沿其高度方向的截面形状包括直线形、L形、弧形或蛇形中一种或多种的组合,所述齿部的高度方向为垂直于所述基板的方向。
第二方面,本申请还提供一种通信设备,所述通信设备包括发热件和如上所述的散热器,所述发热件设于所述基板远离所述散热结构的一侧。
图1是本申请实施例提供的通信设备的结构示意图;
图2是本申请实施例提供的散热器的一种结构示意图;
图3是本申请实施例提供的散热器的另一种结构示意图;
图4是本申请第一实施例提供的散热器的一种剖面示意图;
图5是本申请第一实施例提供的散热器的另一种剖面示意图;
图6是本申请第一实施例提供的散热器的基板的结构示意图;
图7是本申请实施例提供的散热器的散热结构的结构示意图;
图8是本申请实施例提供的散热器的散热结构的一种剖面示意图;
图9是本申请实施例提供的散热器的散热结构的另一种剖面示意图;
图10是本申请实施例提供的散热器水平放置的结构示意图;
图11是本申请实施例提供的散热器垂直放置的结构示意图;
图12是本申请实施例提供的散热器倾斜放置的结构示意图;
图13是本申请第一实施例提供的散热器的散热结构的第一种实施方式的一种剖面示意图;
图14是本申请第一实施例提供的散热器的散热结构的第一种实施方式的另一种剖面示意图;
图15是本申请第一实施例提供的散热器的散热结构的第一种实施方式的又一种剖面示意图;
图16是本申请第一实施例提供的散热器的散热结构的第二种实施方式的一种剖面示意图;
图17是本申请第一实施例提供的散热器的散热结构的第二种实施方式的另一种剖面示意图;
图18是本申请第一实施例提供的散热器的散热结构的第三种实施方式的一种剖面示意图;
图19是本申请第一实施例提供的散热器的风道的第一种剖面示意图;
图20是本申请第一实施例提供的散热器的风道的第二种剖面示意图;
图21是本申请第一实施例提供的散热器的风道的第三种剖面示意图;
图22是本申请第一实施例提供的散热器的风道的第四种剖面示意图;
图23是本申请第一实施例提供的散热器的风道的第五种剖面示意图;
图24是本申请第一实施例提供的散热器的风道的第六种剖面示意图;
图25是本申请第一实施例提供的散热器的补强结构的一种剖面示意图;
图26是本申请第一实施例提供的散热器的补强结构的另一种剖面示意图;
图27是本申请第一实施例提供的散热器的补强结构的又一种剖面示意图;
图28是本申请第二实施例提供的散热器的一种剖面示意图;
图29是本申请第二实施例提供的散热器的第一子通流结构和第二子通流结构对应关系的第一种剖面示意图;
图30是本申请第二实施例提供的散热器的第一子通流结构和第二子通流结构对应关系的第二种剖面示意图;
图31本申请第二实施例提供的散热器的第一子通流结构和第二子通流结构对应关系的第三种剖面示意图;
图32是本申请第二实施例提供的散热器的第一子通流结构和第二子通流结构对应关系的第四种剖面示意图;
图33是本申请第二实施例提供的散热器的第一子通流结构和第二子通流结构对应关系的第五种剖面示意图;
图34是本申请第二实施例提供的散热器的基板的一种剖面示意图;
图35是本申请第二实施例提供的散热器的基板的另一种剖面示意图;
图36是本申请第二实施例提供的散热器的基板的又一种剖面示意图;
图37是是本申请第二实施例提供的散热器的基板的再一种剖面示意图。
为了方便理解,首先对本申请的实施例所涉及的术语进行解释。
和/或:仅仅是一种描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B这三种情况。
多个:是指两个或多于两个。
固定:应做广义理解,例如,A固定于B,可以是A与B直接连接且连接后的相对位置不发生变化,也可以是A与B通过中间媒介间接连接且连接后的相对位置不发生变化。
下面将结合附图,对本申请的具体实施方式进行清楚地描述。
本申请的实施例提供一种通信设备,通信设备可以为但不仅限于为能够应用至通信基站的设备、光伏逆变器、电源、车载电源等设备。其中,能够应用至通信基站的设备可以为通信基站中的无线收发设备,如射频拉远单元(Remote Radio Unit,RRU),或者信号处理设备。
请参阅图1,通信设备1000包括固定连接的发热件200和散热器100。发热件200可理解为在通信设备1000的工作过程中会产生热量的结构件,其可以通过贴附在散热器100上,而把热量传递给散热器100,再通过散热器100的热辐射、自然对流或风扇的风冷散热中的多种而将热量散发至外部环境中。发热件200的热量平衡情况会直接影响通信设备1000的工作性能,如过热会使通信设备1000失效。散热器100可理解为能够对发热件200所产生的热量进行传导、扩散或交换,以为发热件200进行散热的结构件,其能够将发热件200的温度过高而影响通信设备1000的正常工作的可能性降低到最小。示例性地,发热件200可以为电路板、芯片、电源等中的一种或多种的组合。
可以理解的是,发热件200的数量可以根据实际情况进行选取,其可以为一个或多个。也即为,在发热件200的数量为一个的情况下,散热器100可以为单热源散热器。而在发热件200的数量为多个的情况下,散热器100可以为多热源散热器,其中,多个发热件200可以等间距均匀布置在基板10的一侧,也可不等间距的非均匀布置在基板10的一侧,可根据通信设备1000的硬件形态和布局灵活调整。由此,散热器100能够兼顾单热源和多热源的散热需求,能够更适于多场景应用,有利于提高通信设备1000的综合性能。
在一具体的应用场景中,通信设备1000可以为无线收发设备。发热件200的数量可以为多个,多个发热件200间隔排布在散热器100的一侧,多个发热件200可以分别为双工器(Duplexer,Dup)、功率放大器(Power Amplifier,PA)、发射机(Transceiver,TRX)。
另外,散热器100的数量可以为一个或多个。具体而言,实际应用时,散热器100的数量可以为一个而单体使用。或者,散热器100的数量也可以为多个,且上下串联起 来使用。串联的形式是可以简单的物理堆叠,也可以是通过焊接、粘接或者一体化加工形成的串联结构,本申请的实施例对此不做严格限制。
需说明的是,图1的目的仅在于示意性的描述发热件200和散热器100的连接关系,并非是对各个设备的连接位置、具体构造及数量做具体限定。而本申请实施例示意的结构并不构成对通信设备1000的具体限定。在本申请另一些实施例中,通信设备1000可以包括比图示更多或更少的部件,或者组合某些部件,或者拆分某些部件,或者不同的部件布置。图示的部件可以以硬件,软件或软件和硬件的组合实现。
请结合参阅图1、图2、图3、图4和图5,散热器100包括基板10、散热结构20和冷却介质30。基板10可理解为散热结构20和发热件200的载体,其即可以为发热件200提供电连接、保护、支撑、散热、组装等功效,也可以作为导热件而将发热件200的热量传导至散热结构20,进而使散热结构20实现其散热功效。同时,基板10还可以为构成散热器100的壳体110的零部件,能够同其他壳组件一起形成散热器100的壳体结构。散热结构20可理解为散热器100的主散热结构20也即散热齿,通过散热结构20良好的散热功效,能够及时有效的将发热件200产生的热量散发至外部环境。冷却介质30可理解为能够兼具发生气液相变和导热的双重功效的流体工作介质,其能够通过气液相变作用而实现完整的工质循环。示例性地,冷却介质30可以为水、惰性的氟化液、制冷剂R134a(1,1,1,2-四氟乙烷)、制冷剂R245fa(1,1,1,3,3-五氟丙烷)、制冷剂R1234ze(1,1,1,3-四氟丙烯)、制冷剂R1233zd(1-氯-3,3,3-三氟丙烯)中一种或多种的组合。
请参阅图6,基板10包括第一表面101、第二表面102和连接于第一表面101和第二表面102之间的四个侧壁103,第一表面101和第二表面102相背设置,四个侧壁103依次连接而构成基板10的周侧面。第一表面101可理解为与散热结构20连接的表面,第二表面102可理解为与发热件200连接的表面。也即为,散热结构20设于第一表面101,发热件200设于第二表面102,即基板10远离散热结构20的一侧。
由此,通过在第一表面101和第二表面102分别布局散热结构20和发热件200,能够最大限度的发挥基板10的导热作用,有效将发热件200的热量传递至散热结构20,并通过散热结构20的散热功效而将发热件200的热量散发至外部环境,以实现散热器100的散热作用。
示例性地,基板10的材质可以包括铝、铝合金、铜、石墨、陶瓷或高分子塑料,其材质可根据实际装联需要进行选取,本申请的实施例对此不做严格限制。
请再次参阅图2、图3、图4和图5,本申请的实施例中,散热结构20与基板10固定连接,具体为散热结构20连接于基板10的第一表面101。一种可能的实施方式中,基板10与散热结构20为一体式结构。示例性地,散热结构20和基板10可以通过焊接、胶粘、压接或螺钉固定等方式彼此连接而形成一体式结构。
由此,一方面,能够节省生产时间和成本,提高散热器100的加工生产效率。另一方面,散热器100整体的散热性能提升后,在维持现有热耗水平的同时,散热器100的齿部(fin)的齿高可以因散热性能的提升而降低,从而变相降低了整个散热器100的体积和重量。也即为,同等散热需求的情况下,本申请的实施例所提供的散热器100的结构,相对于现有技术的结构体积更小。
请结合参阅图4、图5和图7,本申请的实施例中,散热结构20为通过至少一次折弯形成的一体式结构,散热结构20内设冷却流道40。冷却流道40可以分布在散热结构20的多处位置。或者,冷却流道40可以遍布在散热结构20中,也即为,冷却流道40的延伸路径与散热结构20的延伸路径相同,冷却介质30在冷却流道40内流动以为基板10散热。也即为,冷却流道40的延伸路径与散热结构20的弯折路径相同。示例性地,散热结构20的材质可以包括铝、铝合金、铜、石墨、陶瓷或高分子塑料,其材质可根据实际装联需要进行选取,本申请的实施例对此不做严格限制。
可以理解的是,散热结构20可以为一次性加工出具有冷却流道40的肋板201,并根据散热器100的实际散热需求,将具有冷却流道40的肋板201通过至少一次的折弯而形成的散热器100的主散热部件。其中,折弯也可以理解为折叠,即对具有冷却流道40的肋板201进行至少一次的翻折,而折叠的情况可以包括一部分和另一部分挨在一起的情况,也可以包括一部分和另一部分具有间隔的情况。应当理解,冷却流道40可随肋板201的折叠而折叠,即跟随肋板201的折弯形态而呈现折弯形态。也即为,散热结构20的截面形态可呈现“板体-流道-板体”的类三明治形态。
示例性地,肋板201可通过吹胀成型或冲压成型制成。其内部的冷却流道40也可通过吹胀成型或冲压成型制成。
请参阅图8,一种可能的实施方式中,散热结构20可以为一个肋板201通过至少一次折弯而折叠成型。
请参阅图9,另一种可能的实施方式中,散热结构20可以为多个肋板201拼接并通过至少一次折弯而折叠成型。需说明的是,多个肋板201拼接并通过至少一次折弯而折叠成型的情况包括多个肋板201折弯后拼接在一起的情况,也包括多个肋板201拼接在一起后而共同折弯的情况。
由此,能够根据散热器100的实际散热需求和空间布局,在散热需求相对较小和空间布局相对狭小的应用场景中,布局通过较少肋板201折叠成型的散热结构20,而在散热需求相对较大和空间布局相对广阔的应用场景中,布局通过较多肋板201折叠成型的散热结构20。也即为,散热结构20的设置能够适应多场景化的应用需求,灵活性强,应用范围广泛。
基于上述描述,应当理解,散热结构20能够通过一次性加工和折叠成型以形成一体式结构,使得散热结构20作为散热器100的散热齿也即主散热部件,良好的呈现为发热件200散热所需的形态构造。一方面,能够将散热结构20作为整体与基板10连接,有效规避了现有技术中需将多个散热齿独立加工并依次与基板10组装的复杂组装工序,有利于节省生产时间和成本,提高散热器100的加工生产效率。另一方面,由于散热结构20的连接部可连接于基板10,从而节省了现有技术中需在基板10和散热齿之间设置固定散热齿的连接件,大大缩减了散热结构20所占用的空间大小,降低散热器100的风阻,有利于散热器100的小型化的发展趋势,使得散热器100易于搬运和安装。
另外,在散热结构20的内部设置冷却流道40,能够使得散热结构20创新性地具有两相均温板的散热特性。一方面,能够把基板10所传导的高功率热源的热量有效拓展开,降低散热结构20的导热热阻和基板10的温度,使得散热结构20具有良好的导热温差和 传热效率,大大提高了散热结构20的导热性能。另一方面,能够提高散热结构20的热传导能力,使得在为同等条件的热耗散热,即达成同等散热目标的情况下,散热器100的体积、重量和热阻均可相应减小,有利于节省散热结构20的物料管理成本,散热可靠性佳。
而冷却流道40可以分布在散热结构20的多处位置,也即,冷却流道40在散热结构20中断续设置,其可根据需要而分布在散热结构20的多处位置。或者,冷却流道40的延伸路径与散热结构20的折弯路径相同,也即冷却流道40跟随散热结构20的延伸方向延伸,能够使得冷却流道40作为整体而遍布散热结构20,且仅需一个充液口以为冷却流道40填充冷却介质30,避免了现有技术中需在多个散热齿中的每一个散热齿均设置一个流道,并开设充液口为流道填充冷却介质30的复杂结构,使得冷却流道40具有独立充液的优良特性,有利于提高散热器100的散热收益和加工制造效率。
请结合参阅图10、图11和图12,本申请的实施例中,散热器100可以水平方向布置,也可以竖直方向布置,也可以在水平方向和竖直方向内的夹角范围内倾斜布置。
具体而言,请参阅图10,散热器100水平方向布置可理解为以地面为参考面C,发热件200的热源面(即基板10的第二表面102)与参考面C平行设置,故而基板10与参考面C平行设置,从而使得固定至基板10的连接结构也与基板10处于同一方向,进而使散热器100整体成型水平设置的布局。由此,散热器100的蒸发区域和冷凝区域能够在重力方向上上下排列,使得冷却介质30在蒸发区域内吸收热量变成蒸汽,蒸汽在高度梯度的压力差下流动到冷凝区域,并在冷凝区域内冷凝成液体,冷凝成的液体可在重力作用下回流至蒸发区域,周而复始形成以形成完整的工质循环,从而使得散热器100可通过气液相变而提高散热器100整体的均温性能,进而增强了散热器100整体的热传导能力。
请参阅图11,散热器100竖直方向布置可理解为以地面为参考面C,发热件200的热源面(即基板10的第二表面102)与参考面C垂直设置,故而基板10与参考面C垂直设置,从而使得固定至基板10的连接结构也与基板10处于同一方向,进而使散热器100整体成型垂直设置的布局。由此,底部垂直设置的基板10能够使得自然散热条件下,风从底部进入以与空气对流换热,有效满足基站、电源、光伏逆变器等的散热器100基板10竖直方向布置的需求。
请参阅图12,散热器100倾斜布置可理解为以地面为参考面C,发热件200的热源面(即基板10的第二表面102)与参考面C呈夹角设置,故而基板10与参考面C呈夹角设置,从而使得固定至基板10的连接结构也与基板10处于同一方向,进而使散热器100整体成型倾斜设置的布局,其中,基板10与参考面C的夹角范围可以在0°~90°的范围内。由此,基板10会与重力方向呈一定夹角而呈现底部倾斜设置的形态,此结构能够适应因为发射信号倾角覆盖,而需倾斜布置的需求,能够满足散热器100可便捷安装、可灵活部署的关键需求,能够有效提高散热器100的核心竞争力。
基于上述描述,散热器100能够有效适应不同的布局方式,以在发射功率和高集成度持续增加的基础上,综合性能得以提升,从而能够充分适应高功率和高散热密度的挑战,满足多场景的应用需求(如风雪暑热、风沙盐雾的户外恶劣环境),可靠性佳。
如下将通过两个具体实施例对本申请中基板10和散热器100的连接位置、具体构造展开详细描述。
请再次参阅图4和图5,在本申请的第一实施例中,基板10为实心封闭结构。也即为,基板10为实体板材,冷却介质30只在散热结构20的冷却流道40中进行流动。由此,基板10整体的强度更为优异,同时,基板10的结构简单,能够应用至散热性能需求不高的场景中,使得散热器100整体的加工生产效率得以提升。
散热结构20包括连接部21和齿部22,连接部21与基板10连接。齿部22与连接部21弯折相连,也即为,齿部22与连接部21呈夹角设置,等同于齿部22与基板10呈夹角设置。其中,齿部22与基板10的夹角范围可以在0°~180°的范围内。示例性地,连接部21可呈线形而延伸方向平行于基板10,或者,连接部21也可呈弧形。另外,连接部21可通过焊料、胶水等连接件与基板10间接相连,也可以与基板10接触配合而直接连接。
具体而言,连接部21包括接触面211,接触面211即为连接部21中与基板10的第一表面101相对设置且配合连接的表面。齿部22的齿根221连接至连接部21,齿部22的齿顶222远离连接部21,冷却流道40自连接部21延伸至齿部22,并在齿根221和齿顶222之间延伸。示例性地,连接部21与基板10可通过焊接、胶粘、压接或螺钉固定方式彼此连接。
可以理解的是,由于连接部21与基板10连接,故而连接部21可以以较大的接触面211积与基板10接触,也即为,连接部21和基板10整体的连接面积能够有效增加,且连接部21与基板10平行连接的连接形式较为简单平整,能够使得连接难度有效降低。另外,还能够在增加与基板10的连接面积的同时,减小需与基板10连接的连接部21的数量,从而降低了因连接成本的压力和连接部21数量多所导致的冷却介质30泄露的风险,连接质量显著提升。
而齿部22与连接部21呈夹角设置,也即为,齿部22与连接部21弯折连接。由此,齿部22可看作散热结构20中进行折弯的部分,也即为相对连接部21凸伸的部分,也为相对基板10凸伸的部分。通过设置齿部22,一方面能够满足散热器100的外部形态需求。另一方面能够在不多占用板面面积的情况下有效增加散热面积。而齿部22与连接部21一体式的连续结构,相对于现有技术方案中各散热齿断续不连接的结构,结构简单可靠,能够进一步提高冷却介质30的冷凝面积,促进冷却介质30的回流,还可在满足实现气液相变的循环所需的重力方向梯度的基础上,有效降低齿部22的齿高,进而降低散热器100的体积,避免因散热器100的体积增加而带来的重量高、风阻高,不易于搬运和安装的问题发生,提高散热器100的单位体积散热能力。
一种可能的实施方式中,如图4所示,冷却流道40仅位于齿部22,并在齿根221和齿顶222之间延伸。也即为,冷却流道40仅分布于不与基板10直接接触的齿部22,此设置下,能够使散热结构20呈现为部分具有流道、部分为实体的结构,有利于散热器100的多场景应用,灵活性强。
需说明的是,图4仅为示意性的描述冷却流道40的分布可能性,冷却流道40可根据需要而分布在多个齿部22中的一个齿部22或多个齿部。而冷却流道40的位置也可稍 稍超出齿根221而进入连接部21或距离连接部21一定距离而未触及齿根221与连接部21相连接的部分。本申请的实施例对此不做严格限制。
另一种可能的实施方式中,如图5所示,冷却流道40自连接部21延伸至齿部22,并在齿根221和齿顶222之间延伸,冷却流道40能够供冷却介质30在其内流动。换言之,冷却流道40位于连接部21和齿部22。
可以理解的是,由于冷却介质30为能够兼具发生气液相变和导热的双重功效的流体工作介质,其能够通过气液相变作用而实现完整的工质循环。而在本实施例中,冷却介质30仅在冷却流道40内流动,故而冷却流道40需具有能够使冷却介质30发生完整气液变换的区域。也即为,冷却流道40具有第一蒸发区A1和冷凝区B,而第一蒸发区A1和冷凝区B具有一定的高度梯度,能够使得冷却介质30流动至第一蒸发区A1时汽化,流动至冷凝区B时液化而回流至第一蒸发区A1,以实现冷却介质30的气液相变。示例性地,冷凝区B位于连接部21和齿部22的齿根221,第一蒸发区A1位于齿部22的齿顶222。
由此,发热件200产生的热量能够通过基板10传导至散热结构20的第一蒸发区A1,第一蒸发区A1内的冷却介质30在低真空度的环境后受热汽化,气态的冷却介质30在压力差的作用下沿着齿部22的延伸方向(即齿根221到齿顶222的方向)流动至冷凝区B。流动至冷凝区B的气态的冷却介质30能够凝结为液态的冷却介质30,液态的冷却介质30在重力的作用下,沿着与前述方向相反的方向(即齿顶222到齿根221的方向)回流至第一蒸发区A1,以形成完整的工质循环,而此过程将在冷却流道40内周而复始的进行,以实现对发热件200的持续散热。
示例性地,由于冷却流道40内部还可设置支撑柱等实体结构,而冷却介质30在冷却流道40内流动时,会避让前述实体结构而沿未设有前述实体结构的道路流动,故而支撑柱的数量和形态会影响冷却流道40的流路形态,使得冷却流道40的流路会呈现多样化的形态布局。例如,冷却流道40的流路的布局形态可以包括直管路、U形管路、直角网格状管路、菱形网格状管路、三角形网格状管路、圆形网格状管路、蜂窝网格状管路中一种或多种的组合。
如上对散热结构20的散热原理进行了介绍,如下将结合图4、图5、图13-图18来对连接部21和齿部22的数量、连接位置和连接关系而对散热结构20的结构可能性进行说明。
应当理解,连接部21的数量可以为一个或多个,齿部22的数量也可以为一个或多个,连接部21和齿部22的数量可以根据实际情况进行搭配,本申请的实施例对此不做严格限制。
一种可能的实施方式中,连接部21的数量为一个,齿部22的数量也为一个,一个齿部22与一个连接部21弯折相连。
示例性地,齿部22沿其高度方向的截面形状可呈现直线形,齿部22的高度方向可理解为齿部22的齿高,也即齿根221到齿顶222的方向,或齿顶222到齿根221的方向,或垂直于基板10的方向。也即为,散热结构20整体折弯一次,从而形成如图13所示的L形形态的散热结构20。此时,冷却流道40自连接部21延伸至齿部22的齿根221,并 从齿部22的齿根221延伸至齿部22的齿顶222。
或者,齿部22沿其高度方向的截面形状可呈现倒L形,齿部22的高度方向可理解为齿部22的齿高,也即齿根221到齿顶222的方向,或齿顶222到齿根221的方向,或垂直于基板10的方向。也即为,散热结构20整体折弯两次,从而形成如图14所示的Z形形态的散热结构20。此时,冷却流道40自连接部21延伸至齿部22的齿根221,并从齿部22的齿根221延伸至齿部22的齿顶222。
或者,齿部22沿其高度方向的截面形状可呈现冂形,齿部22的高度方向可理解为齿部22的齿高,也即齿根221到齿顶222的方向,或齿顶222到齿根221的方向,或垂直于基板10的方向。也即为,散热结构20整体折弯三次,从而呈现如图15所示形态的散热结构20。此时,冷却流道40自连接部21延伸至齿部22的齿根221,并从齿部22的齿根221延伸至齿部22的齿顶222,再从齿部22的齿顶222延伸至齿部22的齿根221。
另一种可能的实施方式中,连接部21的数量为一个,齿部22的数量为两个,相邻两个齿部22的齿根221之间通过一个连接部21相连。应当理解,齿部22的数量为多个时,相邻两个齿部22沿其高度方向的截面形状可以相同,也可以不同,也即为,相邻两个齿部22的结构形态可以相同,也可以不同,本实施例对此不做严格限制。
示例性地,一个齿部22沿其高度方向的截面形状可呈现冂形,另一个齿部22沿其高度方向的截面形状可呈现直线形,齿部22的高度方向可理解为齿部22的齿高,也即齿根221到齿顶222的方向,或齿顶222到齿根221的方向,或垂直于基板10的方向。也即为,相邻两个齿部22的结构形态不同,而散热结构20整体折弯四次,从而呈现如图16所示S形形态的散热结构20。
或者,每一齿部22沿其高度方向的截面形状均可呈直线形,齿部22的高度方向可理解为齿部22的齿高,也即齿根221到齿顶222的方向,或齿顶222到齿根221的方向,或垂直于基板10的方向。也即为,相邻两个齿部22的结构形态相同,而散热结构20整体折弯两次,从而呈现如图17所示U形形态的散热结构20。
又一种可能的实施方式中,连接部21的数量为两个,齿部22的数量为一个,两个连接部21分别连接至一个齿部22的齿根221的两侧。
示例性地,一个齿部22沿其高度方向的截面形状可呈现冂形,齿部22的高度方向可理解为齿部22的齿高,也即齿根221到齿顶222的方向,或齿顶222到齿根221的方向,或垂直于基板10的方向。也即为,散热结构20整体折弯四次,从而呈现如图18所示形态的散热结构20。
请再次参阅图5,再一种可能的实施方式中,连接部21数量为多个(大于两个),齿部22的数量也为多个(两个或大于两个),相邻两个齿部22的齿根221通过一个连接部21连接。
需说明的是,本实施例中齿部22沿其高度方向的截面形态不局限于上述几种实施方式所描述的形态,其还可以为直线形、L形、弧形或蛇形中一种或多种的组合。而当连接部21和齿部22的数量均为多个时,散热结构20整体可呈现方波或波浪状形态,具体可根据实际应用灵活调整,本实施例对此不做严格限制。
基于上述描述,应当理解,连接部21的数量为至少一个,齿部22的数量也为至少 一个,而当齿部22的数量为多个时,相邻两个齿部22的结构形态可以相同,也可以不同,本实施例对此不做严格限制。
请再次参阅图5,本实施例中,相邻两个齿部22的间隔区域形成第一风道50。也即为,进入到散热器100的冷空气能够在流动的过程中,不断的通过第一风道50流向散热器100的外部环境。一方面,能够使第一风道50中被加热的空气不断流向散热器100的外部环境中,并使外部环境中的冷空气不断的进入到第一风道50中,进而能够快速的将散热结构20上的热量传递至外部环境中,使得自然散热的对流换热水平提高,且还能够在不多占用基板10板面面积的情况下,实现冷凝面积的增加,散热性能优异。另一方面,能够与散热结构20内部的冷却流道40配合形成风冷散热和液冷散热的双层散热结构20,性能多元,应用范围广泛,还能够进一步提高散热器100的热传导能力。
需说明的是,在齿部22的外部环境为空气时,相邻两个齿部22的间隔区域能够形成用于供空气流通的风道。而在齿部22的外部环境为液体时,相邻两个齿部22的间隔区域能够形成用于供空气流通的液道。示例性地,液体可以为水或油。本申请的实施例对于齿部22的外部环境不做严格限制。
请结合参阅图5和图18,一种可能的实施方式中,齿部22包括第一连接段223、第二连接段224和第三连接段225。第一连接段223和第三连接段225间隔设置且分别连接至相邻两个连接部21,第一连接段223和第二连接段224均与相邻两个连接部21呈夹角设置,第二连接段224连接在第一连接段223远离连接部21的一端和第三连接段225远离连接部21的一端之间。也即为,第一连接段223和第二连接段224,第二连接段224和第三连接段225之间均为弯折连接。第一连接段223、第二连接段224和第三连接段225的连接处形成齿部22的齿顶222,第一连接段223和第三连接段225与相邻两个连接部21的连接处形成齿部22的齿根221。
由此,齿部22沿其高度方向的截面形状可呈现冂形,齿部22的高度方向可理解为齿部22的齿高,也即齿根221到齿顶222的方向,或齿顶222到齿根221的方向,或垂直于基板10的方向。
此设置下,第一连接段223和第三连接段225的间隔区域形成第二风道60。也即为,进入到散热器100的冷空气能够在流动的过程中,不断的通过第二风道60流向散热器100的外部环境。一方面,能够使第二风道60中被加热的空气不断流向散热器100的外部环境中,并使外部环境中的冷空气不断的进入到第二风道60中,进而能够快速的将散热结构20上的热量传递至外部环境中,使得自然散热的对流换热水平提高,且还能够在不多占用基板10板面面积的情况下,实现冷凝面积的增加,散热性能优异。另一方面,能够与散热结构20内部的冷却流道40和第一风道50配合形成风冷散热和液冷散热的双层散热结构20,性能多元,应用范围广泛,还能够进一步提高散热器100的热传导能力。
需说明的是,在齿部22的外部环境为空气时,第一连接段223和第三连接段225的间隔区域能够形成用于供空气流通的风道。而在齿部22的外部环境为液体时,第一连接段223和第三连接段225的间隔区域能够形成用于供空气流通的液道。示例性地,液体可以为水或油。本申请的实施例对于齿部22的外部环境不做严格限制。
可以理解的是,由于第一风道50和第二风道60均由散热结构20形成,故而第一风 道50的通风方向和第二风道60的通风方向相同,如下将以第一风道50的通风方向为例进行说明,在不冲突的情况下,这些描述均可应用于第二风道60的通风方向。
一种可能的实施方式中,请参阅图19,第一风道50的通风方向与大面侧壁103的延伸方向平行,其中,大面侧壁103指的是基板10的四个侧壁103中面积最大的侧壁103。也即为,散热结构20的放置方向与大面侧壁103的延伸方向平行。其中,图19是以在齿高的中部位置以平行于基板10的参考面C剖开的结构示意图。
另一种可能的实施方式中,请参阅图20,第一风道50的通风方向与大面侧壁103的延伸方向垂直,其中,大面侧壁103指的是基板10的四个侧壁103中面积最大的侧壁103。也即为,散热结构20的放置方向与大面侧壁103的延伸方向垂直。其中,图20是以在齿高的中部位置以平行于基板10的参考面C剖开的结构示意图。
又一种可能的实施方式中,请结合参阅图21、图22、图23和图24,第一风道50的通风方向与大面侧壁103的延伸方向相交(不包括垂直),其中,大面侧壁103指的是基板10的四个侧壁103中面积最大的侧壁103。也即为,散热结构20的放置方向与大面侧壁103的延伸方向相交。其中,图21-图24是以在齿高的中部位置以平行于基板10的参考面C剖开的结构示意图。
由此,第一风道50底部的热量会随着第一风道50的朝向而倾斜抬升,使得热空气基于浮升力作用而可以沿一定的夹角自下往上流动,冷空气基于浮升力也可以沿一定的夹角自下往上流动,从而快速把热量从散热结构20中带走。此浮升力不易影响风道下部区域和风道上部区域的温度,能够降低散热结构20带来的上下热串联的影响,提高散热结构20的对流换热性能,有效改善散热结构20内部冷却介质30的冷凝换热。
示例性地,散热结构20的数量为一个,一个散热结构20倾斜放置在基板10上。由此,可以形成如图21所示的倾斜布局形态。
或者,散热结构20的数量为两个,两个散热结构20倾斜且对称放置在基板10上,相邻两个散热结构20间隔设置,且相邻两个散热结构20之间的间隔区域能够形成与第一风道50和第二风道60连通的第三风道70。
由此,可以形成如图22所示的V字形布局,或者,可以形成如图23所示的八字形布局。这样,进入到散热器100的冷空气在第三风道70中流动的过程中,冷空气进入到其两侧的第一风道50和第二风道60中,在两侧的第一风道50和第二风道60中流动,并分别带走两个散热结构20的热量,从而提高通信设备1000的散热效果。
或者,散热结构20的数量为四个,每相邻两个散热结构20倾斜且对称放置在基板10上,相邻两个散热结构20间隔设置,且相邻两个散热结构20之间的间隔区域能够形成与第一风道50和第二风道60连通的第三风道70
由此,可以形成如图24所示的W形布局。这样,进入到散热器100的冷空气在第三风道70中流动的过程中,冷空气进入到其两侧的第一风道50和第二风道60中,在两侧的第一风道50和第二风道60中流动,并分别带走两个散热结构20的热量,从而提高通信设备1000的散热效果。
基于上述描述,应当理解,散热结构20的数量可以为一个或多个。通过对散热结构20的数量进行调整,可以实现多样化的齿片布局,进而可以充分利用齿片的布局,以实 现齿片的低热阻均温导热和较好的对流换热性能。
请结合参阅图25、图26和图27,本实施例中,散热器100还可以包括补强结构80,补强结构80设置在散热结构20上或连接在散热结构20和基板10之间。由此,通过对散热结构20进行二次加工,能够有效增加散热器100整体的换热面积,提高散热器100整体的强度。示例性地,补强结构80与散热结构20和基板10的连接形式可以为但不仅限于为焊接、粘接或穿孔胀接。
一种可能的实施方式中,补强结构80设于连接部21和基板10之间。示例性地,补强结构80可设置于图25所示的位置处。
另一种可能的实施方式中,补强结构80设于连接部21和齿部22之间。示例性地,补强结构80可设置于图26所示的位置处。
又一种可能的实施方式中,补强结构80设于齿部22和基板10之间。示例性地,补强结构80可设置于图27所示的位置处。
补强结构80内还可设与冷却流道40连通的通流流道81。示例性地,补强结构80可与散热结构20的材质相同。一方面,有利于提高散热器100的结构刚度,从而能够使得散热器100整体具备优异的结构可靠性和稳定性。另一方面,能够增加散热器100的散热面积,提高冷却介质30的冷凝效果,促进冷却介质30的回流。
请参阅图28,在本申请的第二实施例中,第一实施例中散热器100的结构形态在不冲突的情况下,均可应用至如下所述的第二实施例的散热器100的结构形态。本实施例中,与第一实施例相同的内容不再赘述,与第一实施例不同的是,基板10为空心结构。
基板10内设有腔体11,从而使得基板10整体呈现空心的结构设置。而腔体11又与冷却流道40连通,以使冷却介质30在腔体11和冷却流道40内流动。换言之,本实施例中,冷却介质30在腔体11和冷却流道40中流动。由此,能够使得散热器100整体的导热温差小,有利于提高散热器100整体的传热效率。
可以理解的是,由于冷却介质30为能够兼具发生气液相变和导热的双重功效的流体工作介质,其能够通过气液相变作用而实现完整的工质循环。而在本实施例中,冷却介质30在腔体11和冷却流道40内流动,故而腔体11和冷却流道40需具有能够使冷却介质30发生气液变换的区域。
具体而言,腔体11为第二蒸发区A2,也即,腔体11整体构成基板10的第二蒸发区A2,以使冷却介质30在第二蒸发区A2内汽化。而冷却流道40具有第一蒸发区A1和冷凝区B,而第一蒸发区A1和冷凝区B之间具有一定的高度梯度,能够使得冷却介质30流动至第一蒸发区A1时汽化,流动至冷凝区B时液化而回流至第一蒸发区A1和第二蒸发区A2,以实现冷却介质30的气液相变。示例性地,冷凝区B位于连接部21和齿部22的齿根221,第一蒸发区A1位于齿部22的齿顶222。
请再次参阅图28,本实施例中,冷却流道40具有第一通流结构41,第一通流结构41设于接触面211,第一通流结构41可理解为冷却流道40的出口。腔体11具有第二通流结构12,第二通流结构12设于第二表面102,第二通流结构12可理解为腔体11的出口。第二通流结构12与第一通流结构41的至少部分连通。此设置下,冷却介质30的传热路径短、流阻小,能够最大可能的避免散热器100局部产生较大的温差。
需说明的是,如下将只以一个连接部21和基板10连通的形态进行描述,但在不冲突的情况下,如下描述还可适用于其他连接部21和基板10的连通的形态。也即为,散热结构20具有多个连接部21的情况下,可具有多个第一通流结构41。相应地,腔体11也可对应于多个第一通流结构41而具有多个第二通流结构12。多个第二通流结构12可间隔排布在基板10的各个位置,其之间的间距可以相等,也可以不等。
由此,能够在散热器100垂直布置时,有效解决基板10的第二表面102的各个位置处设有多个散热件情况下的散热难度,也即多个热源布置情况下的散热难度。使得当腔体11内填充的冷却介质30的液位较低时,冷却介质30能吸收底部热源的热量,而中部和顶部的热量可以通过相应位置处的第一通流结构41和第二通流结构12而进入冷却流道40,使得散热结构20也参与散热。而当腔体11内填充的冷却介质30的液位中等时,冷却介质30能够吸收底部和中部热源的热量,而顶部的热量可以通过相应位置处的第一通流结构41和第二通流结构12而进入冷却流道40,使得散热结构20也参与散热。
基于上述描述,本实施例提供的技术方案能够快速对易发生过热的基板10的风险区域进行有效的换热降温,将散热器100因过热而导致失效的可能性降低到最小,使得散热器100不会因局部超温而损坏,可靠性强。
一种可能的实施方式中,第二通流结构12与第一通流结构41的部分连通。由此,位于腔体11内的冷却介质30能够具备流动性而顺利流入冷却流道40中,且由于冷却流道40的出口与腔体11的出口不需要完全连通,能够使得散热器100的加工制造过程更为简便。
另一种可能的实施方式中,第二通流结构12与第一通流结构41的全部连通。
基于上述描述,应当理解,可以通过改变第二通流结构12与第一通流结构41的连通程度以控制冷却介质30的流量和流动速度,以保证基板10和散热结构20中冷却介质30的流动可靠性和均匀性。
示例性地,第一通流结构41的形状能够与第二通流结构12的形状相适配,从而使散热器100加工和组装过程都较为简便,有利于减少散热器100的时间和生产成本。例如:第一通流结构41为槽类结构,第二通流结构12也为槽类结构。或者,第一通流结构41为孔类结构,第二通流结构12也为孔类结构。当然,应当理解,第一通流结构41的形状也可不与第二通流结构12的形状相适配,仅需满足第二通流结构12与第一通流结构41的至少部分连通即可,本实施例对此不做严格限制。
由此,能够使得腔体11和冷却流道40因第一通流结构41和第二通流结构12的连通而相贯通,而使冷却介质30能够在腔体11和散热结构20内流动,有效提高散热器100的均温性能,从而进一步提高散热器100整体的散热能力。
请参阅图29,一种可能的实施方式中,第一通流结构41包括一个第一子通流结构411,第二通流结构12包括一个第二子通流结构121,一个第一子通流结构411与一个第二子通流结构121一对一而对应连通。也即为,第一通流结构41和第二通流结构12能够形成一对一的配合关系。
示例性地,第一子通流结构411的形状能够与第二子通流结构121的形状相适配,从而使散热器100加工和组装过程都较为简便,有利于减少散热器100的时间和生产成 本。例如:第一子通流结构411为槽类结构,第二子通流结构121也为槽类结构。或者,第一子通流结构411为孔类结构,第二子通流结构121也为孔类结构。当然,应当理解,第一子通流结构411的形状也可不与第二子通流结构121的形状相适配,仅需满足第二子通流结构121与第一子通流结构411的连通即可,本实施例对此不做严格限制。
请参阅图30,另一种可能的实施方式中,与第一种实施方式不同的是,第一通流结构41包括一个第一子通流结构411,第二通流结构12包括多个间隔设置的第二子通流结构121,每一第二子通流结构121均与一个第一子通流结构411连通。也即为,第一子通流结构411与第二子通流结构121能够形成一对多的配合关系。
由此,多个第二子通流结构121的断续式设计,能够充分考虑基板10内器件和结构件的具体布局限制,比如相邻的第二子通流结构121之间的间隔区域能够有效避让腔体11内设置的结构支撑柱或者安装螺钉的实心柱,布局合理,实用性强。
请参阅图31,又一种可能的实施方式中,与第一种实施方式不同的是,第一通流结构41包括多个间隔设置的第一子通流结构411,第二通流结构12包括一个子通流结构,每一第一子通流结构411均与一个第二子通流结构121连通。也即为,第一子通流结构411与第二子通流结构121能够形成一对多的配合关系。
由此,多个第一子通流结构411的断续式设计,能够充分考虑冷却流道40的出口若尺寸过大的话,实际使用过程中会有损坏的风险的问题,安全性和可靠性佳。
请结合参阅图32和图33,再一种可能的实施方式中,与第一种实施方式不同的是,第一通流结构41包括多个间隔设置的第一子通流结构411,第二通流结构12包括多个间隔设置的第二子通流结构121,多个第一子通流结构411与多个第二子通流结构121一对一而对应连通。也即为,第一通流结构41和第二通流结构12能够形成一对一的配合关系。
基于上述描述,应当理解,第一通流结构41和第二通流结构12的连接位置和连接可能性关系到冷却介质30蒸发成气态和回液时的阻力,在确保流阻不影响回液性能的基础上,提供多样化的布局形式能够增加冷却介质30气相变换的实现可能性。
请参阅图34,本实施例中,腔体11包括沿基板10的高度方向相对设置的顶壁111和底壁112,底壁112与第一表面101同侧设置,底壁112与第二表面102同侧设置,且顶壁111相对底壁112更靠近散热结构20。
可以理解的是,由于腔体11为第二蒸发区A2,为保证冷却介质30的汽化可靠性,腔体11内可设置能够强化冷却介质30蒸发汽化的结构,具体将结合如下几种实施方式进行详细说明。
一种可能的实施方式中,如图34所示,散热器100还包括支撑结构91,支撑结构91位于腔体11内。示例性地,支撑结构91支撑在顶壁111和底壁112之间,或者,支撑结构91两端中的一端与顶壁111和底壁112中的其中一个抵接,另一端与顶壁111和底壁112中的另一个相隔离(间隔)。其中,支撑结构91的数量可以为一个或多个,当支撑结构91的数量为多个时,多个支撑结构91间隔设置。
也即为,支撑结构91既可与顶壁111或底壁112固定,也可与顶壁111和底壁112均固定,可根据所需支撑的支撑位置的可靠性和应力分布情况对支撑结构91与顶壁111 和底壁112的连接情况进行设计。示例性地,支撑结构91可通过焊接或胶粘的方式与顶壁111和/或底壁112固定。或者,支撑结构91也可与壳体的内腔一体成型,从而不仅使支撑结构91与腔体11的壁面稳固地连接,从而简化了散热器100的工艺制程。
另外,支撑结构91的外表面还可设有沟槽(图未示),沟槽能够加快液态的冷却介质30转换为气态的进程,起到强化沸腾的作用。
由此,一方面,支撑结构91能够保持基板10的形状,将基板10在受外力作用下发生形变,使顶壁111和底壁112之间的纵向间隔变短,而影响回流的可能性降低到最小。另一方面,支撑结构91能够缩短液态的冷却介质30转换为气态的冷却介质30所需的时间,起到强化沸腾和加快回流的作用。
请参阅图35,另一种可能的实施方式中,散热器100的底壁112可设有沟槽92。由此,通过在腔体11中靠近发热件200的壁面设置沟槽92,能够加快液态的冷却介质30转换为气态的进程,并将冷却介质30汽化所需的时间大大缩短,起到强化冷却介质30蒸发汽化的作用。
请参阅图36,又一种可能的实施方式中,散热器100还包括第一毛细结构93,第一毛细结构93位于腔体11并连接于底壁112。示例性地,第一毛细结构93可以为丝束、丝网、烧粉或纤维。
由此,一方面,有利于冷凝的冷却介质30自冷却区回流至第二蒸发区A2,避免了第二蒸发区A2中液相冷却介质30较少而无法及时将发热件200产生的热量散去的问题发生,提高了散热件的散热性能。另一方面,能够加快液态的冷却介质30转换为气态的进程,并将冷却介质30汽化所需的时间大大缩短,起到强化冷却介质30蒸发汽化的作用。
请参阅图37,再一种可能的实施方式中,散热器100还包括第一毛细结构93和第二毛细结构94,第一毛细结构93位于腔体11并连接于底壁112。第二毛细结构94位于腔体11,且第二毛细结构94的一端连接第一毛细结构93,第二毛细结构94的另一端连接顶壁111。示例性地,第一毛细结构93和第二毛细结构94可以为丝束、丝网、烧粉或纤维。
由此,一方面,有利于冷凝的冷却介质30自冷却区回流至第二蒸发区A2,避免了第二蒸发区A2中液相冷却介质30较少而无法及时将发热件200产生的热量散去的问题发生,提高了散热件的散热性能。另一方面,能够加快液态的冷却介质30转换为气态的进程,并将冷却介质30汽化所需的时间大大缩短,起到强化冷却介质30蒸发汽化的作用。
以上对本申请实施例进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的方法及其核心思想;同时,对于本领域的一般技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。
Claims (23)
- 一种散热器,其特征在于,所述散热器包括:基板;散热结构,所述散热结构包括一体式结构的连接部和齿部,所述连接部与所述基板连接,所述齿部与所述连接部呈夹角设置,且所述齿部的齿根连接至所述连接部,所述齿部的齿顶远离所述连接部,所述散热结构内设冷却流道,所述冷却流道至少部分位于所述齿部;及冷却介质,所述冷却介质在所述冷却流道内流动以为所述基板散热。
- 如权利要求1所述的散热器,其特征在于,所述冷却流道自所述连接部延伸至所述齿部,并在所述齿根和所述齿顶之间延伸;或者,所述冷却流道仅位于所述齿部,并在所述齿根和所述齿顶之间延伸。
- 如权利要求1或2任一项所述的散热器,其特征在于,所述基板与所述散热结构为一体式结构。
- 如权利要求1或2任一项所述的散热器,其特征在于,所述连接部的数量为多个,所述齿部的数量也为多个,相邻两个所述齿部的齿根通过一个所述连接部连接,且相邻两个所述齿部的间隔区域形成第一风道。
- 如权利要求4所述的散热器,其特征在于,所述基板包括四个依次连接的侧壁,所述第一风道的通风方向与任一所述侧壁的延伸方向相交或平行。
- 如权利要求1-5任一项所述的散热器,其特征在于,所述齿部包括第一连接段、第二连接段和第三连接段;所述第一连接段和所述第三连接段间隔设置且分别连接至相邻两个所述连接部,且所述第一连接段和所述第二连接段均与相邻两个所述连接部呈夹角设置,所述第二连接段连接在所述第一连接段远离所述连接部的一端和所述第三连接段远离所述连接部的一端之间;所述第一连接段、所述第二连接段和所述第三连接段的连接处形成所述齿部的齿顶,所述第一连接段和所述第三连接段与相邻两个所述连接部的连接处形成所述齿部的齿根;所述第一连接段和所述第三连接段的间隔区域形成第二风道。
- 如权利要求2所述的散热器,其特征在于,所述冷却流道包括第一蒸发区和冷凝区,所述冷凝区位于所述连接部和所述齿部的齿根,所述第一蒸发区位于所述齿部的齿顶,所述冷却介质在所述第一蒸发区汽化,并在所述冷凝区液化而回流至所述第一蒸发区。
- 如权利要求1-7任一项所述的散热器,其特征在于,所述基板为实心封闭结构。
- 如权利要求1-7任一项所述的散热器,其特征在于,所述基板内设有腔体,所述腔体与所述冷却流道连通,以使所述冷却介质在所述腔体和所述冷却流道内流动。
- 如权利要求9所述的散热器,其特征在于,所述腔体为第二蒸发区,所述冷却介质在所述第二蒸发区汽化。
- 如权利要求9所述的散热器,其特征在于,所述连接部包括接触面,所述基板包 括第一表面,所述接触面与所述第一表面相对设置;所述冷却流道具有第一通流结构,所述第一通流结构设于所述接触面,所述腔体具有第二通流结构,所述第二通流结构设于所述第二表面;所述第二通流结构与所述第一通流结构的至少部分连通。
- 如权利要求11所述的散热器,其特征在于,所述第一通流结构包括一个或多个间隔设置的第一子通流结构,所述第二通流结构包括与所述第一子通流结构数量相同的第二子通流结构,并一对一而对应连通。
- 如权利要求11所述的散热器,其特征在于,所述第一通流结构包括多个间隔设置的第一子通流结构,所述第二通流结构包括一个所述子通流结构,每一所述第一子通流结构均与一个所述第二子通流结构连通;或者,所述第一通流结构包括一个第一子通流结构,所述第二通流结构包括多个间隔设置的第二子通流结构,每一所述第二子通流结构均与一个所述第一子通流结构连通。
- 如权利要求9所述的散热器,其特征在于,所述散热器还包括支撑结构,所述腔体包括沿所述基板的高度方向相对设置的顶壁和底壁,所述顶壁相对所述底壁更靠近所述散热结构;所述支撑结构支撑在所述顶壁和所述底壁之间;或者,所述支撑结构两端中的一端与所述顶壁和所述底壁中的其中一个抵接,另一端与所述顶壁和所述底壁中的另一个相隔离。
- 如权利要求14所述的散热器,其特征在于,所述散热器的底壁和/或所述支撑结构的外表面设有沟槽。
- 如权利要求14所述的散热器,其特征在于,所述散热器还包括第一毛细结构,所述第一毛细结构位于所述腔体并连接于所述底壁。
- 如权利要求16所述的散热器,其特征在于,所述散热器还包括第二毛细结构,所述第二毛细结构位于所述腔体,且所述第二毛细结构的一端连接所述第一毛细结构,所述第二毛细结构的另一端连接所述顶壁。
- 如权利要求1所述的散热器,其特征在于,所述散热结构的数量为一个;或者,所述散热结构的数量为多个,相邻两个所述散热结构间隔且呈夹角设置。
- 如权利要求1所述的散热器,其特征在于,所述散热器还包括补强结构,所述补强结构内设与所述冷却流道连通的通流流道;所述补强结构设于所述连接部和所述基板之间;或者,所述补强结构设于所述连接部和所述齿部之间;或者,所述补强结构设于所述齿部和所述基板之间。
- 如权利要求1所述的散热器,其特征在于,所述散热结构为一个肋板通过至少一次折弯而折叠成型;或者,所述散热结构为多个肋板拼接并通过至少一次折弯而折叠成型。
- 如权利要求1所述的散热器,其特征在于,以地面为参考面,所述基板与所述参考面平行或呈夹角设置。
- 如权利要求1所述的散热器,其特征在于,所述齿部沿其高度方向的截面形状包 括直线形、L形、弧形或蛇形中一种或多种的组合,所述齿部的高度方向为垂直于所述基板的方向。
- 一种通信设备,其特征在于,所述通信设备包括发热件和如权利要求1-22任一项所述的散热器,所述发热件设于所述基板远离所述散热结构的一侧。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP22736596.2A EP4266847A4 (en) | 2021-01-08 | 2022-01-07 | RADIATOR AND COMMUNICATION DEVICE |
US18/348,396 US20230354557A1 (en) | 2021-01-08 | 2023-07-07 | Heat sink and communication device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110024923.0 | 2021-01-08 | ||
CN202110024923.0A CN114760803A (zh) | 2021-01-08 | 2021-01-08 | 散热器及通信设备 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US18/348,396 Continuation US20230354557A1 (en) | 2021-01-08 | 2023-07-07 | Heat sink and communication device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022148435A1 true WO2022148435A1 (zh) | 2022-07-14 |
Family
ID=82325275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2022/070742 WO2022148435A1 (zh) | 2021-01-08 | 2022-01-07 | 散热器及通信设备 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230354557A1 (zh) |
EP (1) | EP4266847A4 (zh) |
CN (1) | CN114760803A (zh) |
WO (1) | WO2022148435A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117641824A (zh) * | 2022-08-15 | 2024-03-01 | 中兴通讯股份有限公司 | 散热装置、电路板、通信设备、电子设备及通信基站 |
CN116489943A (zh) * | 2023-03-30 | 2023-07-25 | 华为数字能源技术有限公司 | 散热器及功率变换器件 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005229102A (ja) * | 2004-01-13 | 2005-08-25 | Fuji Electric Systems Co Ltd | ヒートシンク |
CN102338584A (zh) * | 2010-07-23 | 2012-02-01 | 奇鋐科技股份有限公司 | 散热结构改良 |
CN110505791A (zh) * | 2019-07-31 | 2019-11-26 | 联想(北京)有限公司 | 一种散热装置及电子设备 |
CN111256505A (zh) * | 2020-03-13 | 2020-06-09 | 上海合辰科新材料有限公司 | 一种异形多维相变散热器 |
CN112188792A (zh) * | 2019-07-03 | 2021-01-05 | 伊顿智能动力有限公司 | 散热器 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151636A (ja) * | 2000-11-10 | 2002-05-24 | Ts Heatronics Co Ltd | ヒートシンク |
US7420810B2 (en) * | 2006-09-12 | 2008-09-02 | Graftech International Holdings, Inc. | Base heat spreader with fins |
TW201945682A (zh) * | 2018-04-26 | 2019-12-01 | 泰碩電子股份有限公司 | 透過分隔牆分隔汽態及液態工作流體通道的迴路式均溫裝置 |
US11143460B2 (en) * | 2018-07-11 | 2021-10-12 | Asia Vital Components Co., Ltd. | Vapor chamber structure |
WO2020225981A1 (ja) * | 2019-05-08 | 2020-11-12 | 株式会社日立製作所 | 自励振動ヒートパイプ冷却装置および当該冷却装置を搭載した鉄道車両 |
CN110446398B (zh) * | 2019-07-19 | 2024-09-06 | 深圳兴奇宏科技有限公司 | 散热装置 |
CN114096108B (zh) * | 2020-08-24 | 2023-03-24 | 华为技术有限公司 | 散热装置及其制造方法 |
-
2021
- 2021-01-08 CN CN202110024923.0A patent/CN114760803A/zh active Pending
-
2022
- 2022-01-07 EP EP22736596.2A patent/EP4266847A4/en active Pending
- 2022-01-07 WO PCT/CN2022/070742 patent/WO2022148435A1/zh unknown
-
2023
- 2023-07-07 US US18/348,396 patent/US20230354557A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005229102A (ja) * | 2004-01-13 | 2005-08-25 | Fuji Electric Systems Co Ltd | ヒートシンク |
CN102338584A (zh) * | 2010-07-23 | 2012-02-01 | 奇鋐科技股份有限公司 | 散热结构改良 |
CN112188792A (zh) * | 2019-07-03 | 2021-01-05 | 伊顿智能动力有限公司 | 散热器 |
CN110505791A (zh) * | 2019-07-31 | 2019-11-26 | 联想(北京)有限公司 | 一种散热装置及电子设备 |
CN111256505A (zh) * | 2020-03-13 | 2020-06-09 | 上海合辰科新材料有限公司 | 一种异形多维相变散热器 |
Non-Patent Citations (1)
Title |
---|
See also references of EP4266847A4 |
Also Published As
Publication number | Publication date |
---|---|
EP4266847A4 (en) | 2024-06-26 |
EP4266847A1 (en) | 2023-10-25 |
CN114760803A (zh) | 2022-07-15 |
US20230354557A1 (en) | 2023-11-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2022148435A1 (zh) | 散热器及通信设备 | |
EP2431701B1 (en) | Heat dissipation device and radio frequency module with same | |
CN109673139B (zh) | 散热系统及具有散热系统的飞行器 | |
JP5290355B2 (ja) | ハイパワー放熱モジュール | |
CN210070062U (zh) | 一种散热器、空调室外机和空调器 | |
WO2022007721A1 (zh) | 一种散热器及通信设备 | |
CN100468707C (zh) | 循环热管散热器 | |
CN111473670A (zh) | 热超导传热板及散热器 | |
US20120217630A1 (en) | Heatsink, heatsink assembly, semiconductor module, and semiconductor device with cooling device | |
CN213777945U (zh) | 散热器及空调室外机 | |
CN210014475U (zh) | 一种散热器、空调室外机和空调器 | |
CN210014478U (zh) | 一种散热器、空调室外机和空调器 | |
CN210014477U (zh) | 一种散热器、空调室外机和空调器 | |
CN210014476U (zh) | 一种散热器、空调室外机和空调器 | |
CN110043974A (zh) | 一种散热器、空调室外机和空调器 | |
WO2022083365A1 (zh) | 一种设备散热方法及散热设备 | |
CN108419416A (zh) | 一种igbt用的高散热量热管散热器 | |
WO2021077631A1 (zh) | 散热器和空调器 | |
CN210900093U (zh) | 鳍片散热器 | |
CN210399239U (zh) | 一种散热构件、散热器、空调室外机和空调器 | |
EP3723463B1 (en) | Heat exchanger with integrated two-phase heat spreader | |
CN111578392A (zh) | 散热器和空调室外机 | |
CN210663104U (zh) | 一种散热器、空调室外机和空调器 | |
CN214155153U (zh) | 立体散热器 | |
CN220897051U (zh) | 一种散热器及由其组成的电路板组件 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22736596 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2022736596 Country of ref document: EP Effective date: 20230720 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |