WO2022007721A1 - 一种散热器及通信设备 - Google Patents

一种散热器及通信设备 Download PDF

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Publication number
WO2022007721A1
WO2022007721A1 PCT/CN2021/104337 CN2021104337W WO2022007721A1 WO 2022007721 A1 WO2022007721 A1 WO 2022007721A1 CN 2021104337 W CN2021104337 W CN 2021104337W WO 2022007721 A1 WO2022007721 A1 WO 2022007721A1
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WO
WIPO (PCT)
Prior art keywords
rib
substrate
heat sink
plate
cavity
Prior art date
Application number
PCT/CN2021/104337
Other languages
English (en)
French (fr)
Inventor
洪宇平
惠晓卫
王萌
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP21837562.4A priority Critical patent/EP4174427A4/en
Publication of WO2022007721A1 publication Critical patent/WO2022007721A1/zh
Priority to US18/151,566 priority patent/US20230156970A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F28D1/0366—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by spaced plates with inserted elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings
    • H04B1/036—Cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/06—Hollow fins; fins with internal circuits

Definitions

  • the present application relates to the technical field of heat dissipation, and in particular, to a radiator and a communication device.
  • the heat dissipation scheme of the base station is usually a base station box with a radiator on one side or both sides. come out.
  • the heat-generating components of the base station such as power amplifier, intermediate frequency processing chip, baseband processing chip, and power supply wait for the cooling device to be attached to the radiator substrate, transfer heat to the radiator, and then dissipate to the external environment through natural convection and thermal radiation.
  • the convective heat transfer level of natural heat dissipation is low.
  • the required radiator volume is larger.
  • the increased volume of the radiator brings problems of high weight and wind resistance, and it is not easy to carry and install. Therefore, improving the heat dissipation capacity per unit volume of the radiator and reducing its weight are the key requirements for improving the installability and deployment of mobile communication base stations.
  • the present application provides a heat sink, the heat sink mainly includes a base plate and one or more ribs, wherein the base plate includes a base plate cavity, the base plate includes a first plate surface and a second plate surface, and the second plate surface is A plurality of slots are arranged on the plate surface, the plurality of slots are arranged in a one-to-one correspondence with one or more ribs, and the cavity of the substrate is filled with a liquid working medium.
  • the rib plate includes a rib plate cavity, and each rib plate is inserted into the base plate cavity through a corresponding slot.
  • Each rib includes at least one partition, the at least one partition divides the rib cavity into at least two chambers along the first direction, one end of the partition is located in the substrate cavity, and the at least two chambers are respectively connected with the substrate The cavity is connected.
  • the substrate of the radiator when the component to be radiated generates heat, the substrate of the radiator is heated, and at least a part of the liquid working medium in the substrate cavity is evaporated into a gaseous working medium and then enters at least one of the one or more ribs Inside each cavity of the rib cavity of the rib.
  • the part of the one or more ribs exposed to the external environment exchanges heat with the external medium, so that the gaseous working medium inside thereof is condensed into a liquid working medium.
  • the condensed liquid working medium flows back to the end of the rib close to the component to be radiated along at least one partition inside the rib, and can flow into the cavity of the substrate.
  • the liquid working medium due to the diversion effect of the baffles in the rib, the liquid working medium can be returned to various regions of the substrate, so as to facilitate the realization of high-efficiency two-phase heat dissipation of the heat sink.
  • a plurality of openings are further opened on the plate surface of the rib, and the plurality of openings are provided at the end of the rib which is inserted into the substrate cavity.
  • the chambers separated by the partitions can be communicated with the substrate chamber through the openings, and the liquid working medium condensed through the rib can also flow back into the substrate chamber through the openings.
  • the included angle between the baffle and the direction of gravity is greater than or equal to 1° and less than or equal to 90°.
  • the included angle between the separator and the direction of gravity may be set to be greater than or equal to 45° and less than or equal to 85°.
  • the partition plate can be made of metal material, so as to increase the heat dissipation area of the rib plate and improve the heat dissipation efficiency.
  • a rib in order to increase the heat exchange area of the rib, a rib may also be provided on the outer surface of the rib exposed to the external environment, the rib may be, but not limited to, welding, bonding, or Various forms such as perforated expansion joints are fixed to the rib.
  • the number of fins provided on each rib can be selected according to specific heat dissipation requirements.
  • a plurality of rib plates may be provided on the base plate of the heat sink, the plurality of rib plates may be arranged side by side at intervals, and the included angle between the arrangement direction of the plurality of rib plates and the direction of gravity is 90° °, or, the included angle between the arrangement direction of the plurality of ribs and the direction of gravity is greater than or equal to 10° and less than 90°.
  • the plurality of ribs may also be arranged in a V-shape.
  • the plurality of ribs are arranged in a figure-eight shape, or alternatively, the plurality of ribs are arranged in a W-shape.
  • a liquid injection port may be provided at one end of the substrate, and the liquid injection port may be used to realize the extraction of the cavity of the heat sink assembled by the substrate and the rib plate. Vacuum, and working fluid injection.
  • a confluence groove may also be provided on the inner surface of the first plate surface of the substrate, and the confluence groove may be designed according to the arrangement position of the components to be radiated.
  • the number of the confluence grooves may be, but not limited to, the same as the number of the components to be radiated.
  • the convective grooves may be arranged in a one-to-one correspondence with the components to be radiated. In this way, the liquid working medium can be more effectively concentrated in the arrangement area of the components to be radiated after passing through the confluence groove, so as to enhance the local evaporative phase change heat transfer of the components to be radiated.
  • the groove edges of the confluence grooves can also be convex structures, and the ends of the rib plates that are inserted into the substrate cavity are provided with openings.
  • the protruding structures can be embedded into the openings, so that the liquid working medium is condensed by the rib plates and condensed into the confluence grooves through the openings.
  • the end surface of the rib may be attached to the inner surface of the first plate surface of the base plate.
  • a capillary flow guiding structure may also be provided on the inner surface of the first plate surface of the substrate.
  • the structure may be at least one of a fine wire mesh, a fine groove, or a sintered powder.
  • the inner surface of the first board surface of the base plate may also be provided with a post, and the end of the post away from the first board surface may be connected to the second board surface of the base plate (for example, by welding or adhesive connection). ) to serve as a fastened connection to the two surfaces of the base plate, thereby improving the structural stability of the base plate.
  • the pillars can be formed by integral molding at the same time when the first board surface is manufactured, or can also be manufactured separately and then arranged on the first board surface by welding or the like.
  • the present application also provides a communication device, the communication device including a component to be radiated, and the heat sink of the first aspect.
  • the base plate of the heat sink is in contact with some or all of the components to be radiated.
  • the substrate of the radiator contacts the component to be radiated, the liquid working medium in the substrate cavity absorbs the heat and becomes a gaseous working medium, and the gaseous working medium passes through the ribs
  • the openings of the plate go into the various chambers of the rib.
  • the part of the rib exposed to the external environment exchanges heat with the external medium, so that the gaseous working medium in the rib is condensed into a liquid working medium.
  • the vaporized working medium enters into each chamber of the rib under the diversion effect of the partition, which can control the uniformity of the distribution of the vaporized chemical, which is conducive to the realization of the radiator in the Efficient two heat dissipation in the direction of gravity, and can achieve stable heat dissipation for the components to be dissipated in each area.
  • the liquid level height of the liquid working medium in the substrate can be adjusted according to the arrangement of the components to be radiated in the direction of gravity. It is beneficial to reduce the liquid filling height of the liquid working medium in the substrate, so as to increase the vapor space for heat exchange, thereby improving the heat exchange efficiency and the heat dissipation performance. On this basis, the volume of the heat sink can be reduced while meeting the heat dissipation requirements of the communication equipment. Moreover, with the reduction of the liquid filling height, the weight of the radiator can be effectively reduced and the cost can be reduced.
  • FIG. 1 is a schematic structural diagram of a heat sink provided by an embodiment of the application
  • FIG. 2 is a schematic structural diagram of a heat sink provided by another embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a substrate provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a rib provided by another embodiment of the present application.
  • Fig. 5 is the partial structure enlarged view of A place in Fig. 4;
  • FIG. 6 is a schematic structural diagram of a heat sink provided by another embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a heat sink provided by another embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a heat sink provided by another embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a heat sink provided by another embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a heat sink provided by another embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a communication device provided by an embodiment of the application.
  • FIG. 12 is a schematic structural diagram of a heat sink provided by another embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of a heat sink provided by another embodiment of the present application.
  • references in this specification to "one embodiment” or “some embodiments” and the like mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application.
  • appearances of the phrases “in one embodiment,” “in some embodiments,” “in other embodiments,” “in other embodiments,” etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean “one or more but not all embodiments” unless specifically emphasized otherwise.
  • the terms “including”, “including”, “having” and their conjugations all mean “including but not limited to” unless specifically emphasized otherwise.
  • base stations usually dissipate heat by arranging radiators on one side or both sides of their boxes.
  • the radiator can be profiled or die-casting, and then connected with the box body; the box body and the radiator can also be directly die-cast together.
  • the heating components of the base station such as power amplifier, intermediate frequency processing chip, baseband processing chip and power supply wait for the radiating components to pass on the substrate of the radiator, transfer the heat to the radiator, and then dissipate to the external environment through natural convection and thermal radiation.
  • the convective heat transfer level of natural heat dissipation is low, and the higher the heat consumption of the base station, the larger the required radiator volume.
  • the increased volume of the radiator brings problems of high weight and wind resistance, and it is not easy to carry and install.
  • the base plate of the heat sink is usually arranged vertically and parallel to the direction of gravity according to the hardware form and layout of the base station. If the base station is installed obliquely (usually within a 15-degree inclination angle) due to the installation component or the inclination angle coverage of the transmitted signal, the radiator base plate will form a certain angle with the direction of gravity.
  • the components to be radiated in the base station are arranged uniformly or non-uniformly from bottom to top along the height direction of the substrate.
  • heat sinks are usually machined from metallic materials such as aluminum and copper.
  • Aluminum has low density and good anti-corrosion properties, and is the most commonly used material for radiators.
  • the thermal conductivity of metal materials is limited.
  • the thermal conductivity of aluminum is 180W/(mK)
  • the thermal conductivity of copper is 400W/(mK).
  • the radiator reaches a certain size, the thermal conductivity of the radiator itself becomes the bottleneck.
  • the heat conduction of the radiator itself produces a heat conduction temperature difference of ten to tens of degrees, and there is not enough temperature difference to exchange heat with the external ambient air.
  • the heat sink provided by the embodiments of the present application aims to solve the above problems, so as to improve the heat conduction capability of the heat sink.
  • the welding structure of the present application will be described in detail below with reference to the accompanying drawings.
  • the heat sink 1 includes a base plate 101 and a rib plate 102 .
  • the substrate 101 includes a substrate cavity, and the substrate 101 has a first plate surface 1011 (not shown in FIG. 1 , refer to FIG. 2 ) and a second plate surface 1012 , which are oppositely arranged.
  • the radiating components (not shown in FIG. 1 ) are in contact with each other, a plurality of slots 10121 are formed on the second plate surface 1012, and the substrate cavity is filled with a liquid working medium, and the liquid working medium can be, but not limited to, water, a refrigerant refrigerant , inert fluorinated liquid or alcohols, etc.
  • the rib 102 includes a rib cavity, one end of the rib 102 can be inserted into the substrate cavity by the corresponding slot 10121 of the second plate surface 1012 of the substrate 101 , and the rib 102 is inserted into the substrate All or part of the end surface of one end of the rib 101 may be in contact with the inner surface of the first plate surface 1011 of the base plate 101. It can be understood that there may be a gap between the end surface of the rib 102 and the inner surface of the first plate surface 1011 due to certain factors. There is a gap due to the error.
  • the base plate 101 and the rib plate 102 can be made of two separate parts, and after the rib plate 102 is inserted into the base plate 101, the rib plate 102 and the base plate 101 can also be welded (for example, on the outer surface of the base plate 101). It can be fixed by welding, or by welding one end of the part where the rib is inserted to the inner surface of the base plate).
  • the rib 102 can be fixedly connected with the base plate 101.
  • a fixing portion 10122 protruding from the second plate surface 1012 can be provided on the peripheral side of the slot 10121.
  • the fixing portion 10122 can be but not limited to
  • the rib plate 102 can be connected to the opposite side of the fixing portion 10122 by means of bonding or welding.
  • the sealing requirement between the rib plate 102 and the substrate 101 can also be satisfied by adjusting the amount of adhesive or solder.
  • an additional sealing structure (a sealing ring or glue dispensing) may be additionally provided between the rib 102 and the substrate 101 to meet the sealing requirements between the two.
  • the shape of the slot 10121 on the substrate 101 can be, but not limited to, a strip-shaped slot, so that more slots 10121 can be opened on the substrate 101 for setting more Ribs 102 .
  • the contour shape of the slot 10121 can be matched with the contour of the end portion of the rib 102 for fixing with the base plate 101 .
  • the substrate cavity is connected, so that when the liquid working medium in the substrate 101 is heated and evaporated into a gaseous working medium, it can enter the rib plate cavity, and exchange heat with the environment through the rib plate 102, so as to realize the heat sink 1 to be radiated. of heat dissipation.
  • the substrate 101 when the substrate 101 is specifically arranged, the substrate 101 may be in a regular shape, such as a rectangular parallelepiped; the substrate 101 may also be in an irregular shape, such as a polyhedron.
  • the substrate 101 can be made of metal such as copper or aluminum, and it can also be made of non-metal with good heat dissipation performance such as ceramic or plastic.
  • a liquid injection port 1013 may be provided at one end of the substrate 101 , through which the cavity of the heat sink 1 assembled with the substrate 101 and the rib 102 can be evacuated and the working medium can be injected.
  • FIG. 3 shows a schematic diagram of the internal structure of the substrate 101 .
  • the inner surface of the first plate surface 1011 of the base plate 101 may further be provided with a confluence groove 10111, and the confluence groove 10111 may be designed according to the arrangement position of the components to be dissipated. In this way, the liquid working medium can be more effectively concentrated in the arrangement area of the components to be radiated after passing through the confluence groove, so as to enhance the local evaporative phase change heat transfer of the components to be radiated.
  • the number of the confluence grooves 10111 may be, but not limited to, the same as the number of the components to be radiated.
  • the convective grooves 10111 may be arranged in a one-to-one correspondence with the components to be radiated. In this way, the liquid working medium can be more effectively collected in the arrangement area of the components to be radiated after passing through the confluence grooves 10111, so as to enhance the local evaporative phase change heat transfer of the components to be radiated.
  • a column 10112 is provided on the inner side of the first plate surface 1011 of the substrate 101 , and the end of the column 10112 away from the first plate surface 1011 is connected to the second plate surface 1012 of the substrate 101 (refer to FIG. 2 )
  • the inner surfaces are in contact with each other, so as to play a supporting role for the two plate surfaces of the substrate 101 , so as to improve the structural stability of the substrate 101 .
  • the pillar 10112 when a pillar 10112 is provided on the inner surface of the first board surface 1011 of the substrate 101, the pillar 10112 can be integrally formed with the first board surface 1011, or can also be fixed to the first board by welding or gluing. face 1011.
  • the ribs 102 when the inner surface of the first board surface 1011 of the base plate 101 is provided with the pillars 10112 , the ribs 102 can be inserted between two adjacent pillars 10112 .
  • a capillary diversion structure 10113 may also be provided on the inner surface of the first plate surface 1011 of the substrate 101 to implement the diversion of the liquid working medium.
  • the capillary guide structure 10113 may be, but not limited to, at least one of a fine wire mesh, a fine groove, or a sintered powder.
  • the rib plate 102 when the rib plate 102 is specifically provided, the rib plate 102 may include a rib plate cavity.
  • the rib 102 may be a flat structure, so that more ribs 102 are arranged on the substrate 101 , thereby improving the heat dissipation performance of the heat sink 1 .
  • the rib plate 102 can be made of metal such as copper or aluminum, and it can also be made of non-metal with good heat dissipation performance such as ceramic or plastic.
  • At least one partition plate 1021 is provided in the rib plate cavity, and the number of the partition plate 1021 can be exemplarily one, two, three or more.
  • the partition plate 1021 can be made of metal with better heat dissipation, or made of non-metal with better heat dissipation performance, so as to increase the heat dissipation area of the rib plate 102 and improve the heat dissipation efficiency of the rib plate 102 .
  • the one or more partitions 1021 divide the rib cavity into at least two cavities 1022, the at least two cavities 1022 can be respectively communicated with the substrate cavity shown in FIG. 1, and one of the partitions 1021 The ends are located within the substrate cavity.
  • the volumes of the chambers 1022 separated from the rib cavity by the partitions 1021 may be equal or unequal, which may be specifically set according to the distribution of the components to be radiated.
  • the plurality of partitions 1021 when a plurality of partitions 1021 are arranged in the rib cavity, the plurality of partitions 1021 may be arranged at intervals along the first direction, and the plurality of partitions 1021 may be arranged in parallel or at a predetermined angle.
  • the partition plate 1021 and the rib plate 102 can be an integrally formed structure formed by one processing process.
  • the rib 102 and the separator 1021 can also be processed separately, and the separator 1021 and the rib 102 can be fixed by welding or bonding.
  • the plane on which the plate surface of the partition plate 1021 is located may be perpendicular to the direction of gravity.
  • the included angle ⁇ between the plane on which the plate surface of the partition plate 1021 is located and the direction of gravity may be greater than or equal to 1° and less than or equal to 90°.
  • the included angle ⁇ may be greater than or equal to 45° and less than or equal to 85°. So that after the gaseous working medium is condensed into a liquid working medium at the end of the rib 102 in the external environment, it can flow back to the end of the rib 102 close to the component to be radiated along the separator 1021 .
  • a plurality of openings 1023 may also be provided on the plate surface of the rib 102 , and the plurality of openings 1023 are provided at the end of the rib 102 inserted into the substrate cavity, so that the partition plate can Each chamber 1022 separated by 1021 can communicate with the substrate cavity shown in FIG. 1 through the opening 1023 .
  • the plurality of openings 1023 may be arranged on one surface of the rib 102, or may be arranged on multiple surfaces of the rib 102, which may be evenly distributed, It can also be non-uniformly distributed.
  • the shape of the openings 1023 may be regular shapes such as circles, rectangles, and polygons, or irregular shapes such as special-shaped holes.
  • FIG. 5 shows an arrangement manner of the openings 1023 according to an embodiment of the present application.
  • the openings 1023 can be obtained by cutting three adjacent plate surfaces at the ends of the rib plate 102, and are opened corresponding to each cavity 1022 of the rib plate 102 shown in FIG. 4 .
  • There is at least one opening 1023 which can effectively simplify the formation process of the opening 1023 and make the structure of the rib 102 relatively simple.
  • the rib plate cavity can be inserted into one end of the substrate 101 as shown in FIG. 1 through the rib plate 102 to achieve communication with the substrate cavity, in some embodiments of the present application, the rib plate cavity can also be connected to the substrate cavity as shown in FIG. 4 .
  • the end of the chamber 1022 of the shown rib 102 close to the component to be radiated is in a fully open state, which is beneficial to improve the conversion efficiency of the vapor-liquid two-phase working medium in the radiator 1 , thereby improving the heat dissipation performance of the radiator 1 .
  • the groove edge of the bus groove 10111 may also be convex. up the structure.
  • the protruding structures can be embedded in the openings 1023 , so that the liquid working medium is condensed by the rib 102 and condensed into the confluence grooves 10111 through the openings 1023 .
  • the position where each rib is inserted may be located in the B area shown in the figure, that is, the B area between the capillary diversion structures on the first plate surface of the base plate may interfere with the inserted side plates.
  • the part of the rib 102 exposed to the environment may be in contact with the external air, water, or a heat exchange medium such as a non-flammable organic working medium to conduct natural convection. , forced convection or radiation cooling.
  • a heat exchange medium such as a non-flammable organic working medium to conduct natural convection. , forced convection or radiation cooling.
  • fins may also be processed on the outer surface of the part of the rib plate 102 exposed to the environment, so as to increase the heat exchange area of the radiator 1 .
  • the rib can be fixed to the rib 102 in various forms such as but not limited to welding, bonding, or perforation expansion.
  • the number of rib plates 102 may be one or more, which may be selected according to the number and distribution of components to be radiated.
  • the plurality of ribs 102 can be arranged side by side at intervals, and the included angle between the arrangement direction of the plurality of ribs 102 and the direction of gravity is 90° .
  • the distance between any two adjacent rib plates 102 may be equal or unequal.
  • the lengths of the plurality of ribs 102 may be equal or unequal, and may be set according to the heat dissipation requirements of the components to be radiated.
  • the ribs 102 in the above FIG. 6 is only an exemplary description given by a possible embodiment of the present application. In other embodiments of the present application, the ribs 102 may also adopt other arrangements. .
  • the included angle between the arrangement direction of the plurality of ribs 102 and the direction of gravity is greater than or equal to 10° and less than 90°, and the lengths of the plurality of ribs 102 may be unequal.
  • the plurality of ribs 102 are arranged in a V-shape.
  • the plurality of ribs 102 are arranged in a figure-eight shape.
  • the plurality of rib plates 102 are arranged in a W-shape, so as to reduce the thermal series effect of the rib plates 102 and improve the condensation heat transfer performance of the rib plates 102 through a reasonable arrangement of the rib plates 102 .
  • the liquid working medium in the substrate cavity of the substrate 101 of the heat sink 1 absorbs heat and becomes a gaseous working medium.
  • the mass enters each cavity 1022 of the rib 102 through the openings 1023 of the rib 102 .
  • the part of the rib 102 exposed to the external environment exchanges heat with the external medium, so that the gaseous working medium inside the rib 102 is condensed into a liquid working medium.
  • the condensed liquid working medium flows back along one or more partitions 1021 inside the rib 102 to the end of the rib 102 close to the device to be radiated, and can flow into the substrate cavity through the opening 1023 on the rib 102 .
  • the liquid working medium can return to various regions of the substrate 101 , so as to facilitate the realization of two efficient heat dissipation of the heat sink 1 .
  • the heat sink 1 in the embodiment of the present application can be used alone, or a plurality of heat sinks can be used in series, and the series connection mode can be, but not limited to, a simple stacking arrangement, or can be welded, bonded or integrated.
  • the present application further provides a communication device 2 , the communication device 2 includes a component 202 to be radiated, and the radiator 1 of any of the above embodiments.
  • the device 202 to be dissipated may be, but not limited to, a power amplifier, an intermediate frequency processing chip, a baseband processing chip, a TRX transmitter, or a power supply.
  • the communication device 2 provided in this embodiment of the present application may be, but is not limited to, a wireless communication base station RRU, a multi-antenna MIMO base station, an outdoor independent baseband processing module, and an outdoor wired broadband access module.
  • the radiator 1 of the present application can also be used in scenarios such as power supply devices that require heat dissipation, such as outdoor power supplies, small solar photovoltaic inverters, and the like.
  • the setting position of the radiator 1 can be adjusted according to the distribution of the components 202 to be radiated. choose.
  • the plane on which the first board surface 1011 of the substrate 101 of the heat sink 1 is located may be parallel to the direction of gravity; A set angle greater than 0°.
  • the outdoor communication equipment 2 or power supply equipment is relatively large in size.
  • the components 202 to be radiated can be arranged on the inner surface of the side plate of the box 201 of the communication device 2, and arranged in the direction of gravity. cloth.
  • the radiator 1 can be fixed on the outer surface of the side plate of the box body 201 of the communication device 2.
  • the plane on which the first board surface 1011 of the base plate 101 of the radiator 1 is located can be parallel to the direction of gravity, or
  • the included angle with the direction of gravity is greater than 0° and less than or equal to 90°, and the included angle is slanted.
  • the included angle can be greater than or equal to 5° and less than or equal to 15°.
  • the rib The plate 102 is located at the upper part of the gravitational direction of the substrate 101 , so that the liquid working medium condensed by the rib 102 of the radiator 1 can flow back to the substrate 101 .
  • the communication device 2 may include a case 201 , so that the radiator 1 can be disposed in the case 201 .
  • the substrate 101 of the heat sink 1 can also be used as a side plate of the box 201 of the communication device 2 to realize the integrated design of the communication device 2 and the substrate 101 .
  • the component to be radiated 202 can be directly fixed on the outer surface of the first plate surface 1011 of the substrate 101 , which is beneficial to improve the heat exchange efficiency between the component to be radiated 202 and the heat sink 1 .
  • the partitions 1021 in the rib cavity can be arranged along the direction of gravity.
  • the partition plate 1021 can be inclined, so that the included angle between the plane where the plate surface of the partition plate 1021 is located and the direction of gravity is greater than or equal to 1° and less than or equal to 90°. It is equal to 45° and less than or equal to 85°, so that the liquid working medium condensed after passing through the rib 102 can flow back along the partition plate 1021 to its end close to the device to be radiated 202 .
  • the liquid working medium at one end (evaporating end) of the radiator 1 close to the component 202 to be radiated absorbs heat and becomes a gaseous working medium.
  • the working fluid enters each chamber 1022 of the rib plate 102 through the openings 1023 of the rib plate 102 .
  • the part (condensing end) of the rib 102 exposed to the external environment exchanges heat with the external medium, so that the gaseous working medium in the rib 102 is condensed into a liquid working medium.
  • the heat sink 1 in the embodiment of the present application is used to dissipate heat from the component to be radiated 202 in the communication device 2, the liquid working medium located near the heater of the component to be radiated 202 in the bottom area of the gravity direction, the liquid working medium in the middle area and the upper area
  • the components to be dissipated 202 can also dissipate heat through the rib 102 without overheating.
  • the vaporized working medium enters into each chamber 1022 of the rib 102 under the guiding action of the separator 1021, which can control the uniformity of the distribution of the vaporized chemical, which is beneficial to
  • the two items of efficient heat dissipation of the heat sink 1 in the direction of gravity are realized, and the stable heat dissipation of the components 202 to be radiated in various regions can be realized. It can be understood that, when the plane on which the first plate surface 1011 of the substrate 101 is located is parallel to the direction of gravity, the liquid level height of the liquid working medium in the substrate 101 can be determined according to the arrangement of the components to be radiated in the direction of gravity. adjust.
  • the liquid filling height of the liquid working medium in the substrate 101 it is beneficial to reduce the liquid filling height of the liquid working medium in the substrate 101 to increase the vapor space for heat exchange, thereby improving the heat exchange efficiency and the heat dissipation performance.
  • the volume of the heat sink 1 can be reduced while satisfying the heat dissipation requirements of the communication device 2 .
  • the weight of the radiator 1 can be effectively reduced, and the cost can be reduced.
  • the power-on sequence of the devices to be cooled 202 can be controlled by software . For example, first heat the device to be radiated 202 at the bottom, wait until a certain working fluid condenses back to the device to be radiated 202 in the middle region and the device to be radiated 202 in the upper region, and then heat the device to be radiated 202 in the middle region and the upper region. The device to be cooled 202 is powered on.
  • the following describes the manufacturing method of the radiator 1 of the present application by taking the example that the base plate 101 and the rib 102 of the radiator 1 are both made of aluminum.
  • a rectangular cavity is machined by means of stamping forging or welding of aluminum sheets.
  • the first plate surface 1011 of the rectangular cavity is used for contacting with the component to be radiated 202, and the second plate surface of the rectangular cavity has a plurality of parallel strip-shaped grooves, and the grooves can be processed by stamping to form the figure. 13 substrate shown.
  • one end of one or more flat aluminum tubes (ribs 102 ) with parallel flow channels inside is inserted into the rectangular cavity of the base plate 101 through a strip-shaped slot, and is aligned with the first plate surface 1011 of the rectangular cavity.
  • the inner walls are mechanically contacted or welded.
  • the aluminum flat tube is sealed at one end of one end away from the rectangular cavity.
  • the opening 1023 enters into the aluminum flat tube.
  • the position of the opening 1023 can be one side or both sides of the aluminum flat tube; the shape of the opening 1023 can be various, such as round hole, rectangular hole, hexagonal hole and so on.
  • the area distribution of the aluminum flat tube for arranging the openings 1023 may be uneven, and may be that one end has a large opening area and one end has a small opening area; it can also make the openings 1023 evenly distributed.
  • the parallel flow channel in the flat aluminum tube forms an included angle of 1° or more and less than or equal to 90° with the direction of gravity.
  • the included angle is greater than or equal to 45° and less than or equal to 85°.
  • the formation of this angle can be achieved by arranging the first plate surface 1011 of the rectangular cavity along the gravitational direction, and arranging the parallel flow channel to form an angle greater than or equal to 1° and less than or equal to 90° with the direction of gravity. .
  • first plate surface 1011 of the rectangular cavity at a certain angle to the direction of gravity
  • parallel flow channel to be perpendicular to the first plate surface 1011 to realize that the parallel flow channel and the direction of gravity are greater than or equal to 1° , and the requirement of an included angle less than or equal to 90°.
  • the liquid working medium in the flow channel of the flat aluminum tube can flow back to the inner wall surface of the first plate surface 1011 of the rectangular cavity along the parallel flow channel inside the flat aluminum tube under the action of gravity.
  • the rectangular cavity and the flat aluminum tube are welded and sealed by vacuum brazing or continuous furnace brazing to form a radiator.
  • a liquid injection port for vacuum extraction and working medium injection can be reserved on the radiator.
  • the radiator is evacuated through the liquid injection port, and a certain quality of liquid working medium is injected.
  • the manufacturing method of the radiator may further include providing a confluence groove on the inner wall surface of the rectangular cavity, so that the liquid working medium condensed by the aluminum flat tube can be collected and flowed to the place where the components to be radiated need to be dissipated. Area.
  • rib grooves or welding fins can also be formed by stamping on the inner wall surface of the first plate surface of the rectangular cavity used for contacting the components to be radiated, so as to promote the boiling heat transfer of the liquid working medium in the area where the components to be radiated are arranged, and reduce the Boiling temperature difference.

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Abstract

一种散热器及通信设备，该散热器包括基板（101）和肋板（102），基板（101）包括基板腔体，且肋板（102）包括肋板腔体。其中：基板（101）包括第一板面（1011）和第二板面（1012），第二板面（1012）上设置有开槽（10121），基板腔体内填充有液态工质。肋板（102）包括至少一个隔板（1021），至少一个隔板（1021）将肋板腔体分隔为至少两个腔室，至少两个腔室分别与基板腔体相通；肋板（102）的一端由开槽（10121）插设于基板（101），隔板（1021）的一端位于基板（101）内。当基板（101）内的液态工质吸收热量变成气态工质时，气态工质进入肋板（102）各个腔室内。同时，肋板（102）与外部的媒介进行换热，使得其内部气态工质冷凝为液态工质。液态工质沿着隔板（1021）回流至基板（101）的各个区域位置，以有利于实现散热器的高效的两相均温散热。

Description

一种散热器及通信设备
相关申请的交叉引用
本申请要求在2020年07月10日提交中国专利局、申请号为202010663973.9、申请名称为“一种散热器及通信设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到散热技术领域，尤其涉及到一种散热器及通信设备。
背景技术
移动通信基站视频拉远单元(radio remote unit，RRU)，大规模多输入多输出天线(massive multiple-input multiple-output antenna，Massive MIMO Antenna)等，随着发射功率、集成度持续增加，其面临着高功率高热密度散热的挑战。为了满足冰雪暑热、风沙盐雾等各种户外恶劣环境的可靠运行，这类设备通常采用无风扇自然散热，避免因为风扇故障导致基站过热宕机。
目前，基站的散热方案通常是基站箱体的单侧或两侧背着散热器，散热器可以是型材或压铸加工，然后与箱体连接在一起；也可以把箱体和散热器一起直接压铸出来。基站的发热器件如功率放大器，中频处理芯片、基带处理芯片、电源等待散热器件通过贴在散热器基板上，把热量传递给散热器，再通过自然对流和热辐射散发到外界环境中。自然散热的对流换热水平低，当基站的热耗越高，所需的散热器体积也就越大。散热器的体积增加带来了重量高，风阻大的问题，并且其不易于搬运和安装。因此，提高散热器的单位体积的散热能力，减轻其重量是提升移动通信基站可安装、可部署的关键需求。
发明内容
第一方面，本申请提供了一种散热器，该散热器主要包括基板和一个或多个肋板，其中，基板包括基板腔体，基板包括第一板面和第二板面，在第二板面上设置有多个开槽，该多个开槽与一个或多个肋板一一对应设置，在基板腔体内填充有液态工质。肋板包括肋板腔体，每个肋板由与之对应的开槽插设于基板腔体内。每个肋板包括至少一个隔板，该至少一个隔板将肋板腔体沿第一方向分隔为至少两个腔室，隔板的一端位于基板腔体内，且至少两个腔室分别与基板腔体相连通。
采用本申请实施例的散热器，当待散热器件产生热量时，散热器的基板受热，基板腔体内的至少一部分液态工质蒸发成气态工质后进入到一个或者多个肋板中的至少一个肋板的肋板腔体的各个腔室内。同时，一个或多个肋板的暴露在外部环境中的部分与外部的媒介进行换热，使得其内部的气态工质冷凝为液态工质。冷凝的液态工质沿着肋板内部的至少一个隔板回流至肋板的靠近待散热器件的一端，并可流到基板腔体内部。另外，由于肋板内的隔板的导流作用，液态工质可以返回到基板的各个区域位置，以有利于实现散热器的高效的两项均温散热。
在一种可能的实现方式中，在肋板的板面上还开设有多个开孔，该多个开孔设置于肋板的插设于基板腔体内的端部。这样可使由隔板分隔出的各个腔室能够通过开孔与基板腔体连通，并且，通过肋板冷凝后的液态工质也可通过该开孔回流至基板腔体内。
在一种可能的实现方式中，隔板与重力方向之间的夹角大于等于1°，且小于等于90°。示例性的，隔板与重力方向的夹角可设置为大于等于45°，且小于等于85°。这样，便于气态工质在肋板的处于外部环境的一端冷凝为液态工质后，能够沿隔板回流到肋板的靠近待散热器件的一端。另外，隔板可以由金属材料制成，以用于增大肋板的散热面积，提高散热效率。
在一种可能的实现方式中，为了增加肋板的换热面积，还可以在肋板的暴露于外部环境中的外部表面设置肋片，该肋片可以但不限于通过焊接，粘接，或者穿孔胀接等多种形式固定于肋板。另外，每个肋板上设置的肋片的数量可根据具体散热需求进行选择。
在一种可能的实现方式中，散热器的基板上可以设置有多个肋板，该多个肋板可并排间隔设置，该多个肋板的排列方向与重力方向之间的夹角为90°，或，该多个肋板的排列方向与重力方向之间的夹角大于等于10°，且小于90°。
另外，该多个肋板还可呈V字型布局。或者，多个肋板呈八字型布局，又或者，多个肋板呈W型布局。
在一种可能的实现方式中，在具体设置基板时，在基板的一个端部可以设置有注液口，该注液口可用于实现对基板和肋板组装成的散热器的腔体进行抽真空，以及工质注入。
在一种可能的实现方式中，在基板的第一板面的内侧表面还可以设置有汇流槽，该汇流槽可根据待散热器件的布置位置进行设计。另外，汇流槽的数量可以但不限于与待散热器件的数量相同，这时可使汇流槽与待散热器件一一对应设置。这样可让液态工质经过汇流槽后能够更有效地聚集到待散热器件的布置区域，以增强待散热器件的局部的蒸发相变传热。
在一种可能的实现方式中，还可以使汇流槽的槽边为凸起结构，并使肋板的插设于基板腔体内的端部开设有开孔。此时，可将凸起结构嵌入至开孔，以在液态工质经肋板冷凝后经开孔汇流于汇流槽。另外，还可以使肋板的端面与基板的第一板面的内侧表面相贴合。
另外，还可以在基板的第一板面的内侧表面设置毛细导流结构。示例性的，该结构可以为细丝网、细沟槽或者烧结粉末等中的至少一个。
在一种可能的实现方式中，基板的第一板面的内侧表面还可以设置有柱子，该柱子远离第一板面的一端可与基板的第二板面相连接(如焊接或者粘接方式连接)，以用于起到对基板的两个板面的紧固连接作用，从而提高基板的结构稳定性。柱子可以通过一体成型的方式在制造第一板面时同时形成柱子，或者也可以单独制造，然后通过焊接等方式设置在扎述第一板面。
第二方面，本申请还提供了一种通信设备，该通信设备包括待散热器件，以及第一方面的散热器。其中，散热器的基板与部分或者全部待散热器件进行接触。
在本申请实施例的通信设备中，当待散热器件产生热量时，散热器的基板与待散热器件接触，基板腔体内的液态工质吸收热量，变成气态工质，该气态工质通过肋板的开孔进入肋板的各个腔室内。同时，肋板的暴露在外部环境中的部分与外部的媒介进行换热，使得其内部的气态工质冷凝为液态工质。
另外，通过在肋板内设置隔板，汽化的工质在隔板的导流作用下进入到肋板的各个腔 室内，其可控制汽化工质的分布均匀性，从而有利于实现散热器在重力方向上的高效的两项均温散热，并可实现对各个区域的待散热器件的稳定散热。可以理解的是，可根据待散热器件在重力方向上的排布，对基板内的液态工质的液面高度进行调整。其有利于降低基板内的液态工质的充液高度，以增加进行换热的蒸汽空间，从而可提高换热效率，提高散热性能。在此基础上，可在满足通信设备的散热要求的同时，减小散热器的体积。并且，随着充液高度的降低，可有效的减小散热器的重量，降低成本。
附图说明
图1为本申请一实施例提供的散热器的结构示意图；
图2为本申请另一实施例提供的散热器的结构示意图；
图3为本申请一实施例提供的基板的结构示意图；
图4为本申请另一实施例提供的肋板的结构示意图；
图5为图4中A处的局部结构放大图；
图6为本申请另一实施例提供的散热器的结构示意图；
图7为本申请另一实施例提供的散热器的结构示意图；
图8为本申请另一实施例提供的散热器的结构示意图；
图9为本申请另一实施例提供的散热器的结构示意图；
图10为本申请另一实施例提供的散热器的结构示意图；
图11为本申请一实施例提供的通信设备的结构示意图；
图12为本申请另一实施例提供的散热器的结构示意图；
图13为本申请另一实施例提供的散热器的结构示意图。
附图标记：
1-散热器；101-基板；1011-第一板面；10111-汇流槽；10112-柱子；
10113-毛细导流结构；1012-第二板面；10121-开槽；10122-固定部；1013-注液口；
102-肋板；1021-隔板；1022-腔室；1023-开孔；2-通信设备；201-箱体；
202-待散热器件。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
以下实施例中所使用的术语只是为了描述特定实施例的目的，而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样，单数表达形式“一个”、“一种”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式，除非其上下文中明确地有相反指示。
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所有的实施例”，除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意 味着“包括但不限于”，除非是以其他方式另外特别强调。
为了方便理解本申请实施例提供的散热器，下面首先说明一下其应用场景。目前，基站通常采用在其箱体的单侧或两侧布置散热器的方式进行散热。其中，散热器可以是型材或压铸加工，然后与箱体连接在一起；也可以把箱体和散热器一起直接压铸出来。基站的发热器件如功率放大器，中频处理芯片、基带处理芯片、电源等待散热器件通过贴在散热器的基板上，把热量传递给散热器，再通过自然对流和热辐射散发到外界环境中。但是，自然散热的对流换热水平低，当基站的热耗越高，所需的散热器体积也就越大。散热器的体积增加带来了重量高，风阻大的问题，并且其不易于搬运和安装。
散热器的基板通常是根据基站的硬件形态和布局，竖直布置且与重力方向平行。如果基站因为安装件因素或发射信号倾角覆盖的要求进行倾斜安装(通常15度倾角以内)，散热器基板会与重力方向成一定夹角。基站里的待散热器件沿着基板的高度方向，从下到上均匀或非均匀布置。
另外，散热器通常是采用金属材料加工，例如铝和铜。铝的密度低，防腐蚀特性好，是散热器的最常用材料。金属材料的导热系数是有限的，铝的导热系数为180W/(mK)，铜的导热系数为400W/(mK)，当散热器达到一定的尺寸，散热器本身导热能力成为瓶颈。特别是当散热器上安装高功率密度待散热器件时，散热器本身导热产生了十到数十度的导热温差，其已经没有足够的温差与外部环境空气进行换热。
本申请实施例提供的散热器旨在解决上述问题，以提升散热器的热传导能力。下面结合附图对本申请的焊接结构进行详细介绍。
参照图1，在本申请提供的一个实施例中，散热器1包括基板101和肋板102。其中，基板101包括基板腔体，该基板101具有相对设置的第一板面1011(图1中未示出，可参照图2)和第二板面1012，第一板面1011可用于与待散热器件(图1中未示出)进行接触，第二板面1012上开设有多个开槽10121，基板腔体内填充有液态工质，该液态工质可以但不限于为水、制冷剂冷媒、惰性的氟化液或者醇类等。继续参照图1，肋板102包括肋板腔体，肋板102的一端可由基板101的第二板面1012的与其对应的开槽10121插设于基板腔体内，并且肋板102插设于基板101的一端的端面的全部或者部分可与基板101的第一板面1011的内表面相抵接，可以理解的是，肋板102的端面与第一板面1011的内侧表面之间可能会因为一定的误差而存在间隙。另外，基板101和肋板102可为分别制成的两个部件，并在将肋板102插设于基板101后，还可以将肋板102与基板101采用焊接(如在基板的外表面进行焊接，或者还可以再将肋板插入的部分的一端与基板的内表面进行焊接)等方式进行固定。
另外，肋板102可与基板101固定连接，示例性的，参照图1，可在开槽10121的周侧设置凸出于第二板面1012的固定部10122，该固定部10122可以但不限于为环形结构，这样可通过粘接或者焊接等方式将肋板102与固定部10122相对的侧面进行连接。在将肋板102的板面与固定部10122进行连接时，还可通过对粘接剂或者焊料的用量的调整来满足肋板102与基板101之间的密封要求。在另一些实施例中，还可以通过在肋板102与基板101之间额外设置密封结构(设置密封圈或者点胶)来满足二者之间的密封要求。
继续参照图1，在该实施例中，基板101上的开槽10121的形状可以但不限于为条形槽，以便于在基板101上开设较多的开槽10121，以用来设置较多的肋板102。另外，开槽10121的轮廓形状可与肋板102的用于与基板101固定的端部的轮廓相匹配，在肋板102 插设于基板101组装成的散热器1中，肋板腔体与基板腔体相连通，以使基板101内的液态工质受热蒸发为气态工质时，能够进入肋板腔体，并通过肋板102与环境进行换热，来实现该散热器1对待散热器件的散热。
参照图1和图2，在具体设置基板101时，基板101可以是规则形状，如长方体等；基板101也可以是不规则形状，如多面体等。基板101可由铜或者铝等金属制成，其也可由陶瓷或者塑料等散热性能较好的非金属制成。另外，在基板101的一个端部可以设置有注液口1013，通过该注液口1013可对基板101和肋板102组装成的散热器1的腔体进行抽真空，以及工质注入。
另外，参照图3，图3展示了基板101的内部结构示意图。在基板101的第一板面1011的内侧表面还可以设置有汇流槽10111，该汇流槽10111可根据待散热器件的布置位置进行设计。这样可让液态工质经过汇流槽后能够更有效地聚集到待散热器件的布置区域，以增强待散热器件的局部的蒸发相变传热。
在本申请一个可能的实施例中，汇流槽10111的数量可以但不限于与待散热器件的数量相同，这时可使汇流槽10111与待散热器件一一对应设置。这样可让液态工质经过汇流槽10111后能够更有效地聚集到待散热器件的布置区域，以增强待散热器件的局部的蒸发相变传热。
继续参照图3，在基板101的第一板面1011的内侧面设置柱子10112，该柱子10112的远离第一板面1011的一端，与基板101的第二板面1012(可参照图2)的内侧表面相抵接，以用于起到对基板101的两个板面的支撑作用，从而提高基板101的结构稳定性。
可以理解的是，在基板101的第一板面1011的内侧表面设置柱子10112时，该柱子10112可与第一板面1011一体成型，或者还可以通过焊接或者粘接等方式固定于第一板面1011。另外，当基板101的第一板面1011的内侧表面设置有柱子10112时，肋板102可以插设于相邻的两个柱子10112之间。
另外，还可以在基板101的第一板面1011的内侧表面还可以设置有毛细导流结构10113，以用于实现液体工质的导流。示例性的，该毛细导流结构10113可以但不限于为细丝网、细沟槽或者烧结粉末等中的至少一个。
参照图1，在本申请一些实施例中，具体设置肋板102时，肋板102可以包括肋板腔体。示例性的，肋板102可为扁平型结构，以便于在基板101上布置较多的肋板102，从而提升散热器1的散热性能。另外，肋板102可由铜或者铝等金属制成，其也可由陶瓷或者塑料等散热性能较好的非金属制成。
参照图4，在肋板腔体内设置有至少一个隔板1021，隔板1021的数量示例性的可为一个、两个、三个或者更多个。隔板1021可以由散热性较好的金属制成，或者由散热性能较好的非金属制成，以增加肋板102的散热面积，提高肋板102的散热效率。该一个或者多个隔板1021将肋板腔体分隔为至少两个腔室1022，该至少两个腔室1022可分别与图1中所示的基板腔体相连通，且隔板1021的一个端部位于基板腔体内。其中，可以理解的是，肋板腔体被隔板1021分隔出的各个腔室1022的容积可以相等，也可以不等，其可以根据待散热器件的分布方式进行具体设置。另外，当肋板腔体内设置有多个隔板1021时，该多个隔板1021可沿第一方向间隔设置，该多个隔板1021可平行设置，或者呈设定角度设置。
在具体将隔板1021设置于肋板腔体内时，可以使隔板1021与肋板102为通过一次加 工工艺形成的一体成型结构。也可以使肋板102与隔板1021分别加工制成，并使隔板1021与肋板102之间通过焊接或者粘接等工艺进行固定。
继续参照图4，在本申请一些实施例中，在具体设置隔板1021时，隔板1021的板面所在的平面可与重力方向垂直。在另外一些实施例中，还可使隔板1021的板面所在的平面与重力方向之间的夹角α大于等于1°，且小于等于90°，示例性的，该夹角α可大于等于45°，且小于等于85°。以便于气态工质在肋板102的处于外部环境的一端冷凝为液态工质后，能够沿隔板1021回流到肋板102的靠近待散热器件的一端。
参照图4，在肋板102的板面上还可以设置有多个开孔1023，该多个开孔1023设置于肋板102的插设于基板腔体内的端部，这样可使由隔板1021分隔出的各个腔室1022能够通过开孔1023与图1所示的基板腔体连通。可以理解的是，在本申请实施例中，该多个开孔1023可以设置于肋板102的一个板面上，也可以设置于肋板102的多个板面上，其可以均匀的分布，也可以非均匀的分布。开孔1023的形状可为圆形、矩形、多边形等规则形状，也可为异形孔等不规则形状。
参照图5，图5示出了本申请一种实施例的开孔1023的设置方式。在该实施例中，开孔1023可通过对肋板102的端部的三个相邻的板面进行切割得到，并且对应于图4中所示的肋板102的每个腔室1022均开设有至少一个开孔1023，这样可有效的简化开孔1023的形成工艺，并使肋板102的结构较为简洁。
继续参照图5，由于肋板腔体可通过肋板102插入如图1所示的基板101的一端来实现与基板腔体的连通，在本申请一些实施例中，还可使如图4所示的肋板102的腔室1022的靠近待散热器件的端部呈全开的状态，其有利于提高散热器1内汽液两相工质的转换效率，从而提高散热器1的散热性能。
在本申请另外一些实施例中，一并参照图3和图4，在肋板102的插设于基板腔体内的端部设置有开孔1023时，还可以使汇流槽10111的槽边为凸起结构。此时，可将凸起结构嵌入至开孔1023，以在液态工质经肋板102冷凝后经开孔1023汇流于汇流槽10111。参见图3，每个肋板插设的位置可位于图中所示的B区域，即在基板的第一板面的毛细导流结构之间的B区域可与插设的胁板相抵触。
在本申请各实施例中，可参照图1或图2，肋板102的暴露在环境中的部分可以与外部的空气、水，或者不可燃的有机工质等换热媒介接触，进行自然对流、强迫对流或辐射散热。在本申请一个可能的实施例中，在肋板102的暴露在环境中的部分的外部表面还可以加工肋片(图中未示出)，以用于增加散热器1的换热面积。另外，该肋片可以但不限于通过焊接，粘接，或者穿孔胀接等多种形式固定于肋板102。
参照图6，在本申请实施例的散热器1中，肋板102的数量可以为一个或者多个，其可根据待散热器件的数量以及分布方式进行选择。另外，当肋板102的数量为多个时，继续参照图6，该多个肋板102可并排间隔设置，且该多个肋板102的排列方向与重力方向之间的夹角为90°。另外，任意相邻两个肋板102之间的间距可以相等，也可以不等。该多个肋板102的长度可以相等，也可以不等，其可根据待散热器件的散热需求进行设置。上述图6中的肋板102的排布方式只是本申请一个可能的实施例给出的一种示例性的说明，在本申请另外一些实施例中，肋板102还可以采用其它的排布方式。例如，参照图7，多个肋板102的排列方向与重力方向之间的夹角大于等于10°，且小于90°，并且该多个肋板102的长度可以不等。又例如，在图8所示的实施例中，多个肋板102呈V字型布局。又 如图9，多个肋板102呈八字型布局。或者，如图10中，多个肋板102呈W型布局，以通过对肋板102的合理布局来降低肋板102的热串联影响，改善肋板102的冷凝换热性能。
参照图1至图4，采用本申请实施例的散热器1，当待散热器件产生热量时，散热器1的基板101的基板腔体内液态工质吸收热量，变成气态工质，该气态工质通过肋板102的开孔1023进入肋板102的各个腔室1022内。同时，肋板102的暴露在外部环境中的部分与外部的媒介进行换热，使得其内部的气态工质冷凝为液态工质。冷凝的液态工质沿着肋板102内部的一个或多个隔板1021回流至肋板102的靠近待散热器件的一端，并可通过肋板102上的开孔1023，流到基板腔体内部。另外，由于肋板102内的隔板1021的导流作用，液态工质可以返回到基板101的各个区域位置，以有利于实现散热器1的高效的两项均温散热。可以理解的是，本申请实施例的散热器1可单独使用，也可以多个串联起来使用，其串联的方式可以但不限于为简单的堆叠设置，也可以是通过焊接、粘接或者一体化加工等形成的串联结构。
参照图11，基于相同的发明构思，本申请还提供了一种通信设备2，该通信设备2包括待散热器件202，以及上述任一实施例的散热器1。其中，该待散热器件202可以但不限于为功率放大器、中频处理芯片、基带处理芯片、TRX发射机，或者电源等。
本申请实施例提供的通信设备2可以但不限于为无线通信基站RRU，多天线MIMO基站，户外独立的基带处理模块，户外型有线宽带接入模块。本申请的散热器1除了用于上述的通信设备2，其也可用于电源设备等需要进行散热的场景，例如户外型电源，小型太阳能光伏逆变器等。
由于本申请实施例的散热器1在使用时，其基板101需要与待散热器件202接触(直接或者间接接触)，因此，可根据待散热器件202的分布方式，对散热器1的设置位置进行选择。在本申请一些实施例中，散热器1的基板101的第一板面1011所在的平面可与重力方向平行；或者，散热器1的基板101的第一板面1011所在的平面与重力方向呈大于0°的设定角度。
参照图11，通常情况下，户外的通信设备2或者电源设备等的体积较大。以通信设备2为例，为便于实现对通信设备2内的待散热器件202进行散热，可将待散热器件202设置于通信设备2的箱体201的侧板内表面，并沿重力方向进行排布。在该应用场景下，散热器1可固定于通信设备2的箱体201的侧板外表面，此时，散热器1的基板101的第一板面1011所在的平面可与重力方向平行，或者与重力方向呈大于0°，且小于等于90°的夹角倾斜设置，示例性的，该夹角可为大于等于5°，且小于等于15°，可以理解的是，在该实施例中肋板102位于基板101的重力方向的上部，以便于经散热器1的肋板102冷凝后的液态工质回流到基板101处。
参照图11，在一些实施例中，通信设备2可以包括箱体201，以使散热器1能够设置于箱体201。另外，参照图12，在本申请一些实施例中，还可以将散热器1的基板101作为通信设备2的箱体201的一个侧板，以实现通信设备2与基板101的集成设计。在该实施例中，可将待散热器件202直接固定在基板101的第一板面1011的外侧表面，其有利于提高待散热器件202与散热器1的热交换效率。
参照图13，在基板101的第一板面1011所在的平面与重力方向平行时，在具体设置肋板102时，肋板腔体内的隔板1021可沿重力方向进行排列。另外，隔板1021可倾斜设置，以使隔板1021的板面所在的平面，与重力方向之间的夹角为大于等于1°，且小于等 于90°，示例性的，该夹角可大于等于45°，且小于等于85°，从而使经过肋板102冷凝后的液态工质可沿隔板1021回流到其靠近待散热器件202的一端。
在本申请实施例的通信设备2中，当待散热器件202产生热量时，散热器1的靠近待散热器件202的一端(蒸发端)的液态工质吸收热量，变成气态工质，该气态工质通过肋板102的开孔1023进入肋板102的各个腔室1022内。同时，肋板102的暴露在外部环境中的部分(冷凝端)与外部的媒介进行换热，使得其内部的气态工质冷凝为液态工质。
由于在肋板102的每个腔室1022内同时存在气态工质和液态工质的流通通道，并且每个腔室1022内的蒸发端和冷凝端位于同一水平高度，或者存在很小的重力梯度。这样，可使通过肋板102的冷凝端冷凝得到的液态工质沿着一个或多个隔板1021回流至肋板102的蒸发端，并可通过肋板102上的开孔1023，回流到基板腔体内部。
另外，采用本申请实施例的散热器1对通信设备2内的待散热器件202进行散热时，位于重力方向的底部区域的待散热器件202加热器附近的液态工质，中部区域和上部区域的待散热器件202也可通过肋板102进行散热，并且不会过热。通过在肋板102内设置隔板1021，汽化的工质在隔板1021的导流作用下进入到肋板102的各个腔室1022内，其可控制汽化工质的分布均匀性，从而有利于实现散热器1在重力方向上的高效的两项均温散热，并可实现对各个区域的待散热器件202的稳定散热。可以理解的是，当基板101的第一板面1011所在的平面与重力方向平行时，可根据待散热器件202在重力方向上的排布，对基板101内的液态工质的液面高度进行调整。其有利于降低基板101内的液态工质的充液高度，以增加进行换热的蒸汽空间，从而可提高换热效率，提高散热性能。在此基础上，可在满足通信设备2的散热要求的同时，减小散热器1的体积。并且，随着充液高度的降低，可有效的减小散热器1的重量，降低成本。
对于极端的中部区域的待散热器件202，以及上部区域的待散热器件202的热耗远高于底部区域的待散热器件202的热耗的场景，可以通过软件控制待散热器件202的上电顺序。例如，先对底部待散热器件202加热，等到有一定工质冷凝回流到中部区域的待散热器件202，以及上部区域的待散热器件202时，再对中部区域的待散热器件202，以及上部区域的待散热器件202上电。
在上述实施例中，只给出了基板101的第一板面1011所在的平面与重力方向平行设置时，散热器1对通信设备2内的待散热器件202进行散热的一种应用场景。可以理解的是，当需要将基板101的第一板面1011所在的平面与重力方向呈一定角度进行设置的应用场景下，可将图13中的散热器1按要求旋转相应的角度即可，此时，基板101或者肋板102的设置方式与上述实施例相类似，此处不进行赘述。
为了进一步了解本申请实施例的散热器1，参照图13，接下来以散热器1的基板101和肋板102的材质均为铝为例，对本申请的散热器1的制造方法进行说明。
首先，采用冲压锻造或铝板焊接的方式加工一个矩形空腔。矩形空腔的第一板面1011用于与待散热器件202接触，矩形空腔的第二板面上有多个平行的条状开槽，开槽可以通过冲压方式加工而成，以形成图13所示的基板。
然后，把一个或多个内部具有平行流道的铝扁管(肋板102)的一端通过条状开槽插入到基板101的矩形空腔内，并与矩形空腔的第一板面1011的内壁面机械接触或焊接。其中，铝扁管远离矩形空腔一端的端部密封设置。
之后，对铝扁管夹在矩形空腔的第一板面1011的内壁面和矩形空腔的第二板面1012 的内壁面之间的部分进行开孔，以使得后续气态工质可以通过该开孔1023进入到铝扁管内。开孔1023的位置可以是铝扁管的单侧或两侧；开孔1023的形状可以是圆孔，矩形性，六角形孔等多种。铝扁管的用于设置开孔1023的面积分布可以是不均匀的，可以是一端开孔面积多，一端开孔面积少；其也可以使开孔1023呈均匀分布。
再，铝扁管内的平行流道与重力方向成大于等于1°，且小于等于90°的夹角，示例性的，该夹角为大于等于45°，且小于等于85°。该角度的形成，一方面可通过将矩形空腔的第一板面1011沿重力方向设置，且将平行流道设置为与重力方向成大于等于1°，且小于等于90°的夹角来实现。另外，还可以通过将矩形空腔的第一板面1011与重力方向呈一定角度进行设置，且使平行流道与第一板面1011垂直设置来实现平行流道与重力方向成大于等于1°，且小于等于90°的夹角的要求。这样，铝扁管流道内的液态工质可以在重力作用下，沿着铝扁管内部的平行流道回流至矩形空腔的第一板面1011的内壁面上。
最后，把矩形空腔和铝扁管通过真空钎焊或连续炉钎焊的方式焊接密封好，形成散热器。其中，可在散热器上预留一个抽真空和工质注入的注液口。以通过该注液口对散热器抽真空，并注入一定质量的液态工质。
在一些实施例中，散热器的制造方法还可以包括在矩形空腔的内壁面上，设置有汇流槽，以使得经铝扁管冷凝的液态工质可以汇集流到需要散热的待散热器件所在的区域。
另外，还可以在矩形空腔用于与待散热器件接触的第一板面的内壁面上，冲压形成肋槽或焊接肋片，促进待散热器件设置区域的液态工质的沸腾换热，降低沸腾温差。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (16)

  1. 一种散热器，其特征在于，包括基板和一个或多个肋板，所述基板包括基板腔体，且每个所述肋板包括肋板腔体，其中：
    所述基板，包括第一板面和第二板面，所述第二板面上设置有与所述一个或多个肋板一一对应的多个开槽，所述基板腔体内填充有液态工质；
    每个所述肋板的一端由与之对应的所述开槽插设于所述基板腔体内，所述基板腔体与每个所述肋板的所述肋板腔体连通；每个所述肋板包括至少一个隔板，所述至少一个隔板将所述肋板腔体分隔为至少两个腔室，所述隔板的一端位于所述基板腔体内，且所述至少两个腔室分别与所述基板腔体相连通；
    所述基板在受热时，所述基板腔体内的至少一部分所述液态工质蒸发成气态工质后进入到所述一个或多个所述肋板中的至少一个所述肋板的所述肋板腔体内；
    所述一个或多个肋板用于对所述气态工质进行冷凝，使之重新变成所述液态工质后沿所述隔板回流到所述基板腔体。
  2. 根据权利要求1所述的散热器，其特征在于，所述肋板的板面上开设有多个开孔，多个所述开孔设置于所述肋板的插设于所述基板腔体内的端部。
  3. 根据权利要求1或2所述的散热器，其特征在于，所述隔板与重力方向之间的夹角大于等于1°，且小于等于90°。
  4. 根据权利要求3所述的散热器，其特征在于，所述隔板与重力方向的夹角大于等于45°，且小于等于85°。
  5. 根据权利要求1～4任一项所述的散热器，其特征在于，所述隔板的材质为金属。
  6. 根据权利要求1～5任一项所述的散热器，其特征在于，所述肋板的外部表面还设置有肋片。
  7. 根据权利要求1～6任一项所述的散热器，其特征在于，所述肋板为多个，多个所述肋板并排间隔布置，且多个所述肋板的排列方向与重力方向的夹角为90°，或多个所述肋板的排列方向与重力方向的夹角大于等于10°，且小于90°；或，多个所述肋板呈V型布置；或，多个所述肋板呈八字型布置；或，多个所述肋板呈W型布置。
  8. 根据权利要求1～7任一项所述的散热器，其特征在于，所述基板的所述第一板面的内侧表面设置有汇流槽。
  9. 根据权利要求8所述的散热器，其特征在于，所述汇流槽的数量与待散热器件的数量相同，且所述汇流槽与所述待散热器件一一对应设置。
  10. 根据权利要求8或9所述的散热器，其特征在于，所述汇流槽的槽边为凸起结构，所述肋板的插设于所述基板腔体内的端部开设有开孔；所述凸起结构嵌入至所述开孔。
  11. 根据权利要求1～10任一项所述的散热器，其特征在于，每个所述肋板插设于所述基板腔体后，与所述第一板面的内侧表面相抵接。
  12. 根据权利要求1～11任一项所述的散热器，其特征在于，所述基板的所述第一板面的内侧表面还设置有毛细导流结构。
  13. 根据权利要求1～12任一项所述的散热器，其特征在于，所述基板的所述第一板面的内侧表面还设置有柱子。
  14. 根据权利要求13所述的散热器，其特征在于，所述柱子远离所述第一板面的一端 与所述第二板面的内侧表面相抵接。
  15. 根据权利要求1～14任一项所述的散热器，其特征在于，所述基板的一个端部设置有注液口。
  16. 一种通信设备，其特征在于，包括待散热器件，以及如权利要求1～15任一项所述的散热器，其中，所述散热器的所述基板与所述待散热器件接触。
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