JP2010251755A - 放熱装置 - Google Patents

放熱装置 Download PDF

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Publication number
JP2010251755A
JP2010251755A JP2010091521A JP2010091521A JP2010251755A JP 2010251755 A JP2010251755 A JP 2010251755A JP 2010091521 A JP2010091521 A JP 2010091521A JP 2010091521 A JP2010091521 A JP 2010091521A JP 2010251755 A JP2010251755 A JP 2010251755A
Authority
JP
Japan
Prior art keywords
heat
container
heat dissipation
dissipation device
wick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010091521A
Other languages
English (en)
Japanese (ja)
Inventor
Ching-Bai Hwang
清白 黄
Jin-Gong Meng
勁功 孟
Jui-Wen Hung
鋭▲ウェン▼ 洪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furui Precise Component Kunshan Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Furui Precise Component Kunshan Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furui Precise Component Kunshan Co Ltd, Foxconn Technology Co Ltd filed Critical Furui Precise Component Kunshan Co Ltd
Publication of JP2010251755A publication Critical patent/JP2010251755A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2010091521A 2009-04-16 2010-04-12 放熱装置 Pending JP2010251755A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200910301609.1A CN101866887B (zh) 2009-04-16 2009-04-16 散热装置

Publications (1)

Publication Number Publication Date
JP2010251755A true JP2010251755A (ja) 2010-11-04

Family

ID=42958535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010091521A Pending JP2010251755A (ja) 2009-04-16 2010-04-12 放熱装置

Country Status (3)

Country Link
US (1) US20100263834A1 (zh)
JP (1) JP2010251755A (zh)
CN (1) CN101866887B (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106839845A (zh) * 2012-01-18 2017-06-13 张跃 热翅
CN103900411B (zh) * 2014-03-26 2017-02-08 江苏项瑛农机有限公司 一种高效热管
CN203934263U (zh) * 2014-07-04 2014-11-05 讯凯国际股份有限公司 具有毛细构件的散热装置
TWI535990B (zh) * 2014-07-22 2016-06-01 A larger heat pipe at one end and a manufacturing method thereof
CN106714509B (zh) * 2015-11-17 2019-06-07 奇鋐科技股份有限公司 散热装置
US10119766B2 (en) * 2015-12-01 2018-11-06 Asia Vital Components Co., Ltd. Heat dissipation device
CN105371214A (zh) * 2015-12-16 2016-03-02 广州共铸科技股份有限公司 一种led汽车头灯
CN107044790A (zh) * 2016-02-05 2017-08-15 讯凯国际股份有限公司 立体传热装置
CN107771003A (zh) * 2016-08-17 2018-03-06 奇鋐科技股份有限公司 散热组件
CN108151565B (zh) * 2016-12-02 2019-12-03 讯凯国际股份有限公司 立体均温装置
CN109780903A (zh) * 2017-11-10 2019-05-21 双鸿电子科技工业(昆山)有限公司 散热装置
US11039549B2 (en) * 2018-01-26 2021-06-15 Htc Corporation Heat transferring module
US20190343021A1 (en) * 2018-05-07 2019-11-07 Asia Vital Components Co., Ltd. Heat dissipation unit connection reinforcement structure
CN108633160B (zh) * 2018-07-28 2024-05-31 中国原子能科学研究院 一种质子加速器束流冷却装置
CN112304138B (zh) * 2019-08-02 2022-07-26 营邦企业股份有限公司 回路式热虹吸散热装置
US20210136956A1 (en) * 2020-12-18 2021-05-06 Intel Corporation Heat pipe for improved thermal performance at cold plate interface
CN113053841B (zh) * 2021-03-12 2022-11-25 深圳市飞荣达科技股份有限公司 一种立体式vc均温装置
CN214426509U (zh) * 2021-03-18 2021-10-19 广东英维克技术有限公司 散热装置
CN113340139A (zh) * 2021-07-07 2021-09-03 佛山宇仁智能科技有限公司 一种热壳构件
CN116263309A (zh) * 2021-12-15 2023-06-16 亚浩电子五金塑胶（惠州）有限公司 立体传热装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50113862A (zh) * 1974-02-18 1975-09-06
JPH08264694A (ja) * 1995-03-20 1996-10-11 Calsonic Corp 電子部品用冷却装置
JP2007317876A (ja) * 2006-05-25 2007-12-06 Fujitsu Ltd ヒートシンク

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629840A (en) * 1992-05-15 1997-05-13 Digital Equipment Corporation High powered die with bus bars
US5412535A (en) * 1993-08-24 1995-05-02 Convex Computer Corporation Apparatus and method for cooling electronic devices
JP3020790B2 (ja) * 1993-12-28 2000-03-15 株式会社日立製作所 ヒートパイプ式冷却装置とこれを用いた車両制御装置
JP3216770B2 (ja) * 1995-03-20 2001-10-09 カルソニックカンセイ株式会社 電子部品用冷却装置
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US20050173098A1 (en) * 2003-06-10 2005-08-11 Connors Matthew J. Three dimensional vapor chamber
US6793009B1 (en) * 2003-06-10 2004-09-21 Thermal Corp. CTE-matched heat pipe
US6938680B2 (en) * 2003-07-14 2005-09-06 Thermal Corp. Tower heat sink with sintered grooved wick
US7269013B2 (en) * 2006-01-09 2007-09-11 Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd. Heat dissipation device having phase-changeable medium therein
US20080017350A1 (en) * 2006-07-21 2008-01-24 Foxconn Technology Co., Ltd. Heat sink
CN101232794B (zh) * 2007-01-24 2011-11-30 富准精密工业(深圳)有限公司 均热板及散热装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50113862A (zh) * 1974-02-18 1975-09-06
JPH08264694A (ja) * 1995-03-20 1996-10-11 Calsonic Corp 電子部品用冷却装置
JP2007317876A (ja) * 2006-05-25 2007-12-06 Fujitsu Ltd ヒートシンク

Also Published As

Publication number Publication date
CN101866887B (zh) 2013-03-20
CN101866887A (zh) 2010-10-20
US20100263834A1 (en) 2010-10-21

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