US20090071628A1 - Heat-radiating device with composite radiation efficiency - Google Patents

Heat-radiating device with composite radiation efficiency Download PDF

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Publication number
US20090071628A1
US20090071628A1 US11/855,034 US85503407A US2009071628A1 US 20090071628 A1 US20090071628 A1 US 20090071628A1 US 85503407 A US85503407 A US 85503407A US 2009071628 A1 US2009071628 A1 US 2009071628A1
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US
United States
Prior art keywords
heat
foundation
radiating
radiating device
radiation efficiency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/855,034
Inventor
Yung-Li JANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Forcecon Technology Co Ltd
Original Assignee
Forcecon Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to US11/855,034 priority Critical patent/US20090071628A1/en
Assigned to FORCECON TECHNOLOGY CO., LTD. reassignment FORCECON TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JANG, YUNG-LI
Publication of US20090071628A1 publication Critical patent/US20090071628A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates generally to a heat-radiating device, and more particularly to an innovative device with composite heat radiation efficiency.
  • the known heat-radiating device is widely applied to a heat sink of a computer's processor.
  • the heat generated will increase markedly with the continuous growth of operating speed of computer. Therefore, heat-radiating devices need to be improved functionally to realize enough a heat-radiation effect.
  • the known heat-radiating device is typically a plate made of materials (e.g. copper) of outstanding heat conductivity.
  • One side of the heat-radiating device is a heating surface, and the other side is a radiating surface.
  • the heating surface is adhered to the predefined heat source (e.g. CPU), and the radiating surface is generally provided with several rows of radiating fins.
  • the radiating fin aligns with the preset radiator fan, so, it can diffuse the heat absorbed by the heating surface when the heat-radiating device is operated. Then, air flow is blown by the radiator fan for heat radiation purposes.
  • the heat radiation effect of a conventional heat-radiating device is restrained to a certain degree when the operating speed of the existing computer improves quickly. If the area of said heat source remains still, the heat-radiation efficiency could be improved even if the heating surface of the heat-radiating device is increased.
  • the inventor has provided the present invention of practicability after deliberate design and evaluation based on years of experience in the production, development and design of related products.
  • the heat-radiating device of the present invention enables the heat absorbed by the foundation to be quickly guided out of the foundation through a heat pipe.
  • the radiation area is increased by said radiating fin set for improved heat radiation efficiency.
  • phase-changing material stored in the inner space of the foundation assists in heat absorption and storage by latent heat, thereby avoiding overheating of the foundation and also helping to control efficiently the heat peak of the foundation.
  • the heat-radiating device provides a composite heat radiation effect with improved applicability.
  • FIG. 1 shows a perspective view of the preferred embodiment of the present invention.
  • FIG. 2 shows a sectional view of the preferred embodiment of the present invention.
  • FIG. 3 shows another sectional view of the preferred embodiment of the present invention.
  • FIG. 4 shows another perspective view of the preferred embodiment of foundation of the present invention.
  • FIGS. 1-3 depict preferred embodiments of a heat-radiating device with composite radiation efficiency of the present invention. The embodiments are provided only for explanatory purposes. The claims set the scope of the present invention.
  • the heat-radiating device A comprises a foundation 10 , formed as a 3D block (e.g. rectangular) which defines a heating surface 11 and a radiating surface 12 .
  • the foundation 10 is provided with an inner space 13 .
  • the device A includes a phase-changing material 20 , arranged into the inner space 13 of the foundation 10 , and at least a heat pipe 30 .
  • the heat pipe 30 comprises a heat-absorbing end 31 and radiating end 32 .
  • the heat-absorbing end 31 is arranged into the foundation 10 opposite to the inner space 13 , while the radiating end 32 protrudes out of the foundation 10 at a predefined length.
  • the phase-changing material 20 enables change of physical shapes, e.g. solid phase to liquid phase conversion.
  • the solid phase is converted into a liquid phase, such that the heat is then consumed, namely, the heat is absorbed.
  • the substance is stored by means of latent heat as long as maintained in a liquid state, and said latent heat will be discharged, enabling conversion from liquid to solid phase in the case of solidification of the liquid substance.
  • Said phase-changing material 20 is made of paraffin, inorganic salt, salt water compounds and mixtures, carboxylic acid and sugar alcohol, etc.
  • radiating fins 14 are assembled onto the radiating surface 12 of the foundation 10 and are used to improve heat radiation effect of the radiating surface 12 .
  • the radiating surface 12 B of the foundation 10 is a plate.
  • the foundation 10 is provided internally with bore grooves 15 , wherein the heat-absorbing end 31 of the heat pipe 30 could be inserted.
  • the heat-radiating device of the present invention is employed as shown in FIG. 3 .
  • the heat radiation effect is achieved in two aspects.
  • the foundation 10 absorbs heat through the heating surface 11
  • the heat absorbed by the foundation 10 is quickly guided via the heat pipe 30 (namely, the heat is transferred to radiating end 32 of the heat pipe 30 ), then the radiation area is increased by said radiating fin set 40 for improved heat radiation efficiency.
  • phase-changing material 20 stored in the inner space 13 of the foundation 10 assists in heat absorption and storage by latent heat, thereby avoiding overheating of foundation 10 and also helping to control efficiently the heat peak of the foundation 10 .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The heat-radiating device with composite heat radiation efficiency includes a foundation with a heating surface and a radiating surface. The foundation has an inner space for inserting phase-changing materials. A heat pipe includes a heat-absorbing end placed into the foundation and a radiating end protruded out of the foundation. A radiating fin set is arranged onto the radiating end of the heat pipe. The heat-radiating device enables the heat absorbed by the foundation to be quickly guided out of the foundation through the heat pipe. The radiation area is increased by the radiating fin set for improved heat radiation efficiency. The phase-changing material assists in heat absorption and storage by latent heat, thereby avoiding overheating of foundation and also helping to control efficiently the heat peak of the foundation. Furthermore, the heat-radiating device has a composite heat radiation effect with improved applicability.

Description

    CROSS-REFERENCE TO RELATED U.S. APPLICATIONS
  • Not applicable.
    • STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
  • Not applicable.
    • NAMES OF PARTIES TO A JOINT RESEARCH AGREEMENT
  • Not applicable.
    • REFERENCE TO AN APPENDIX SUBMITTED ON COMPACT DISC
  • Not applicable.
    • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates generally to a heat-radiating device, and more particularly to an innovative device with composite heat radiation efficiency.
  • 2. Description of Related Art Including Information Disclosed Under 37 CFR 1.97 and 37 CFR 1.98.
  • The known heat-radiating device is widely applied to a heat sink of a computer's processor. However, the heat generated will increase markedly with the continuous growth of operating speed of computer. Therefore, heat-radiating devices need to be improved functionally to realize enough a heat-radiation effect.
  • The known heat-radiating device is typically a plate made of materials (e.g. copper) of outstanding heat conductivity. One side of the heat-radiating device is a heating surface, and the other side is a radiating surface. The heating surface is adhered to the predefined heat source (e.g. CPU), and the radiating surface is generally provided with several rows of radiating fins. The radiating fin aligns with the preset radiator fan, so, it can diffuse the heat absorbed by the heating surface when the heat-radiating device is operated. Then, air flow is blown by the radiator fan for heat radiation purposes. However, the heat radiation effect of a conventional heat-radiating device is restrained to a certain degree when the operating speed of the existing computer improves quickly. If the area of said heat source remains still, the heat-radiation efficiency could be improved even if the heating surface of the heat-radiating device is increased.
  • Thus, to overcome the aforementioned problems of the prior art, it would be an advancement in the art to provide an improved structure that can significantly improve efficacy.
  • Therefore, the inventor has provided the present invention of practicability after deliberate design and evaluation based on years of experience in the production, development and design of related products.
    • BRIEF SUMMARY OF THE INVENTION
  • The heat-radiating device of the present invention enables the heat absorbed by the foundation to be quickly guided out of the foundation through a heat pipe. The radiation area is increased by said radiating fin set for improved heat radiation efficiency. Also, phase-changing material stored in the inner space of the foundation assists in heat absorption and storage by latent heat, thereby avoiding overheating of the foundation and also helping to control efficiently the heat peak of the foundation. Furthermore, the heat-radiating device provides a composite heat radiation effect with improved applicability.
  • Although the invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafter claimed.
    • BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
  • FIG. 1 shows a perspective view of the preferred embodiment of the present invention.
  • FIG. 2 shows a sectional view of the preferred embodiment of the present invention.
  • FIG. 3 shows another sectional view of the preferred embodiment of the present invention.
  • FIG. 4 shows another perspective view of the preferred embodiment of foundation of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • The features and the advantages of the present invention will be more readily understood upon a thoughtful deliberation of the following detailed description of a preferred embodiment of the present invention with reference to the accompanying drawings.
  • FIGS. 1-3 depict preferred embodiments of a heat-radiating device with composite radiation efficiency of the present invention. The embodiments are provided only for explanatory purposes. The claims set the scope of the present invention.
  • The heat-radiating device A comprises a foundation 10, formed as a 3D block (e.g. rectangular) which defines a heating surface 11 and a radiating surface 12. The foundation 10 is provided with an inner space 13. The device A includes a phase-changing material 20, arranged into the inner space 13 of the foundation 10, and at least a heat pipe 30. The heat pipe 30 comprises a heat-absorbing end 31 and radiating end 32. The heat-absorbing end 31 is arranged into the foundation 10 opposite to the inner space 13, while the radiating end 32 protrudes out of the foundation 10 at a predefined length.
  • There is also a radiating fin set 40, arranged at intervals onto the radiating end 32 of the heat pipe 30.
  • The phase-changing material 20 enables change of physical shapes, e.g. solid phase to liquid phase conversion. When a substance is melted, the solid phase is converted into a liquid phase, such that the heat is then consumed, namely, the heat is absorbed. The substance is stored by means of latent heat as long as maintained in a liquid state, and said latent heat will be discharged, enabling conversion from liquid to solid phase in the case of solidification of the liquid substance. Said phase-changing material 20 is made of paraffin, inorganic salt, salt water compounds and mixtures, carboxylic acid and sugar alcohol, etc.
  • Referring to FIGS. 1, 2, and 3, radiating fins 14 are assembled onto the radiating surface 12 of the foundation 10 and are used to improve heat radiation effect of the radiating surface 12.
  • Referring also to FIG. 4, the radiating surface 12B of the foundation 10 is a plate.
  • Referring to FIG. 3, the foundation 10 is provided internally with bore grooves 15, wherein the heat-absorbing end 31 of the heat pipe 30 could be inserted.
  • Based upon above-specified structures, the heat-radiating device of the present invention is employed as shown in FIG. 3. The heat radiation effect is achieved in two aspects. When the foundation 10 absorbs heat through the heating surface 11, the heat absorbed by the foundation 10 is quickly guided via the heat pipe 30 (namely, the heat is transferred to radiating end 32 of the heat pipe 30), then the radiation area is increased by said radiating fin set 40 for improved heat radiation efficiency. On the other hand, phase-changing material 20 stored in the inner space 13 of the foundation 10 assists in heat absorption and storage by latent heat, thereby avoiding overheating of foundation 10 and also helping to control efficiently the heat peak of the foundation 10.

Claims (4)

1. A heat-radiating device with composite radiation efficiency, comprising:
a foundation being formed by a 3D block and having a heating surface and a radiating surface said foundation having an inner space;
a phase-changing material, arranged into said inner space;
a heat pipe, having a heat-absorbing end and radiating end, said heat-absorbing end being arranged said foundation opposite said inner space, said radiating end being protruded out of said foundation at a predefined length; and
a radiating fin set, arranged onto said radiating end of said heat pipe.
2. The device defined in claim 1, wherein said phase-changing material is comprised of: paraffin, inorganic salt, salt water compound and mixture, carboxylic acid and sugar alcohol, etc.
3. The device defined in claim 1, wherein said radiating surface is provided with radiating fins.
4. The device defined in claim 1, wherein said foundation is provided internally with bore grooves, said heat-absorbing end of said heat pipe being inserted into said bore grooves.
US11/855,034 2007-09-13 2007-09-13 Heat-radiating device with composite radiation efficiency Abandoned US20090071628A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/855,034 US20090071628A1 (en) 2007-09-13 2007-09-13 Heat-radiating device with composite radiation efficiency

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US11/855,034 US20090071628A1 (en) 2007-09-13 2007-09-13 Heat-radiating device with composite radiation efficiency

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130327502A1 (en) * 2012-06-08 2013-12-12 Rung-An Chen Phase change type heat dissipating device
US20150096720A1 (en) * 2013-10-08 2015-04-09 Inventec Corporation Heat dissipation module
CN107044678A (en) * 2017-03-27 2017-08-15 天津城建大学 The buried direct Radiant Floor Heating System of gravity assisted heat pipe
CN107560005A (en) * 2017-09-13 2018-01-09 珠海格力电器股份有限公司 Radiating assembly and air conditioner

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2499736A (en) * 1946-09-06 1950-03-07 Kleen Nils Erland Af Aircraft refrigeration
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5651414A (en) * 1993-12-28 1997-07-29 Hitachi, Ltd. Heat-pipe type cooling apparatus
US20030000689A1 (en) * 2001-06-29 2003-01-02 Dah-Chyi Kuo Heat dissipater
US6631755B1 (en) * 2002-07-17 2003-10-14 Compal Electronics, Inc. Thermal module with temporary heat storage
US20030221812A1 (en) * 2002-05-31 2003-12-04 Quanta Computer Inc. Three-phase heat transfer structure
US6940717B2 (en) * 2002-05-13 2005-09-06 Shuttle Inc. CPU cooling using a heat pipe assembly
US20060032616A1 (en) * 2004-08-11 2006-02-16 Giga-Byte Technology Co., Ltd. Compound heat-dissipating device
US20060086484A1 (en) * 2004-10-21 2006-04-27 Shankar Hegde Twin fin arrayed cooling device with liquid chamber
US20060278372A1 (en) * 2005-06-08 2006-12-14 Cheng-Tien Lai Heat dissipation device
US7191820B2 (en) * 2001-01-26 2007-03-20 Enertron, Inc. Phase-change heat reservoir device for transient thermal management

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2499736A (en) * 1946-09-06 1950-03-07 Kleen Nils Erland Af Aircraft refrigeration
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5651414A (en) * 1993-12-28 1997-07-29 Hitachi, Ltd. Heat-pipe type cooling apparatus
US7191820B2 (en) * 2001-01-26 2007-03-20 Enertron, Inc. Phase-change heat reservoir device for transient thermal management
US20030000689A1 (en) * 2001-06-29 2003-01-02 Dah-Chyi Kuo Heat dissipater
US6940717B2 (en) * 2002-05-13 2005-09-06 Shuttle Inc. CPU cooling using a heat pipe assembly
US20030221812A1 (en) * 2002-05-31 2003-12-04 Quanta Computer Inc. Three-phase heat transfer structure
US6631755B1 (en) * 2002-07-17 2003-10-14 Compal Electronics, Inc. Thermal module with temporary heat storage
US20060032616A1 (en) * 2004-08-11 2006-02-16 Giga-Byte Technology Co., Ltd. Compound heat-dissipating device
US20060086484A1 (en) * 2004-10-21 2006-04-27 Shankar Hegde Twin fin arrayed cooling device with liquid chamber
US20060278372A1 (en) * 2005-06-08 2006-12-14 Cheng-Tien Lai Heat dissipation device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130327502A1 (en) * 2012-06-08 2013-12-12 Rung-An Chen Phase change type heat dissipating device
US9046305B2 (en) * 2012-06-08 2015-06-02 Foxconn Technology Co., Ltd. Phase change type heat dissipating device
US20150096720A1 (en) * 2013-10-08 2015-04-09 Inventec Corporation Heat dissipation module
CN107044678A (en) * 2017-03-27 2017-08-15 天津城建大学 The buried direct Radiant Floor Heating System of gravity assisted heat pipe
CN107560005A (en) * 2017-09-13 2018-01-09 珠海格力电器股份有限公司 Radiating assembly and air conditioner

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AS Assignment

Owner name: FORCECON TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:JANG, YUNG-LI;REEL/FRAME:019823/0816

Effective date: 20070907

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION