JP6117288B2 - 冷却装置 - Google Patents
冷却装置 Download PDFInfo
- Publication number
- JP6117288B2 JP6117288B2 JP2015140194A JP2015140194A JP6117288B2 JP 6117288 B2 JP6117288 B2 JP 6117288B2 JP 2015140194 A JP2015140194 A JP 2015140194A JP 2015140194 A JP2015140194 A JP 2015140194A JP 6117288 B2 JP6117288 B2 JP 6117288B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat pipe
- group
- radiating fin
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
11、211、311 第1のヒートパイプ
12、212、312 第1のヒートパイプ群
13、113、213 第2のヒートパイプ
14、114、214 第2のヒートパイプ群
21 第1の放熱フィン
22 第1の放熱フィン群
23 第2の放熱フィン
24 第2の放熱フィン群
25 第3の放熱フィン
26 第3の放熱フィン群
51 第1の開口部
52 第2の開口部
53 第3の開口部
Claims (13)
- 第1の発熱体と一方の端部が熱的に接続され、複数の第1の放熱フィンを有する第1の放熱フィン群及び複数の第2の放熱フィンを有する第2の放熱フィン群と他方の端部が熱的に接続された第1のヒートパイプと、
前記第1の発熱体よりも前記第2の放熱フィン群側に設けられた第2の発熱体と一方の端部が熱的に接続され、前記第2の放熱フィン群及び複数の第3の放熱フィンを有する第3の放熱フィン群と他方の端部が熱的に接続された第2のヒートパイプと、を有し、
前記第2の放熱フィン群は、前記第1のヒートパイプを介して前記第1の放熱フィン群と対向し、前記第2の放熱フィン群は、前記第2のヒートパイプを介して前記第3の放熱フィン群と対向することにより、前記第1の放熱フィン群、前記第2の放熱フィン群及び前記第3の放熱フィン群が積層構造を形成し、
前記第1のヒートパイプの他方の端部が、前記第2のヒートパイプの他方の端部よりも上方に位置する冷却装置。 - 第1のヒートパイプが、第1の放熱フィン間に形成された開口部側から導入されている請求項1に記載の冷却装置。
- 第2のヒートパイプが、第3の放熱フィン間に形成された開口部側から導入されている請求項1に記載の冷却装置。
- 前記第1のヒートパイプが、複数、並列に設けられることにより、第1のヒートパイプ群が形成されている請求項1乃至3のいずれか1項に記載の冷却装置。
- 前記第2のヒートパイプが、複数、並列に設けられることにより、第2のヒートパイプ群が形成されている請求項1乃至4のいずれか1項に記載の冷却装置。
- 前記第1のヒートパイプ群の少なくとも1つの前記第1のヒートパイプが、前記第2のヒートパイプが、複数、並列に設けられることにより形成されている第2のヒートパイプ群の少なくとも1つの前記第2のヒートパイプと平面視において重なり合う位置関係に配置されている請求項4に記載の冷却装置。
- 前記第1のヒートパイプ群を形成する前記第1のヒートパイプのいずれもが、前記第2のヒートパイプが、複数、並列に設けられることにより形成されている第2のヒートパイプ群の前記第2のヒートパイプのいずれとも、平面視において重なり合う位置関係に配置されていない請求項4に記載の冷却装置。
- 前記第1のヒートパイプの、前記第2の放熱フィン群と熱的に接続された部分に、曲げ部が形成されている請求項1乃至7のいずれか1項に記載の冷却装置。
- 前記第2のヒートパイプの、前記第2の放熱フィン群と熱的に接続された部分に、曲げ部が形成されている請求項1乃至8のいずれか1項に記載の冷却装置。
- 前記第1のヒートパイプ群の、前記第2の放熱フィン群と熱的に接続された部位が、左右対称に配置されている請求項4に記載の冷却装置。
- 前記第2のヒートパイプ群の、前記第2の放熱フィン群と熱的に接続された部位が、左右対称に配置されている請求項5に記載の冷却装置。
- 前記第1のヒートパイプの前記第2の放熱フィン群と熱的に接続された部位及び/または前記第2のヒートパイプの前記第2の放熱フィン群と熱的に接続された部位が、扁平加工されている請求項1乃至11のいずれか1項に記載の冷却装置。
- 演算素子冷却用である請求項1乃至12のいずれか1項に記載の冷却装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015140194A JP6117288B2 (ja) | 2015-07-14 | 2015-07-14 | 冷却装置 |
PCT/JP2016/070774 WO2017010536A1 (ja) | 2015-07-14 | 2016-07-14 | 冷却装置 |
TW105122342A TWI649530B (zh) | 2015-07-14 | 2016-07-14 | Cooling device |
CN201690000988.4U CN208269706U (zh) | 2015-07-14 | 2016-07-14 | 冷却装置 |
US15/866,688 US10571199B2 (en) | 2015-07-14 | 2018-01-10 | Cooling device with superimposed fin groups |
US16/797,501 US11150028B2 (en) | 2015-07-14 | 2020-02-21 | Cooling device with superimposed fin groups and parallel heatpipes |
US17/355,647 US11867467B2 (en) | 2015-07-14 | 2021-06-23 | Cooling device with superimposed fin groups |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015140194A JP6117288B2 (ja) | 2015-07-14 | 2015-07-14 | 冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017020742A JP2017020742A (ja) | 2017-01-26 |
JP6117288B2 true JP6117288B2 (ja) | 2017-04-19 |
Family
ID=57758232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015140194A Active JP6117288B2 (ja) | 2015-07-14 | 2015-07-14 | 冷却装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US10571199B2 (ja) |
JP (1) | JP6117288B2 (ja) |
CN (1) | CN208269706U (ja) |
TW (1) | TWI649530B (ja) |
WO (1) | WO2017010536A1 (ja) |
Cited By (1)
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US20170303441A1 (en) * | 2016-04-15 | 2017-10-19 | Google Inc. | Cooling electronic devices in a data center |
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CN107172854B (zh) * | 2017-05-17 | 2019-04-02 | 南京林业大学 | 基于板翅式热管散热器的车载集成控制器冷却系统 |
CN107885295A (zh) | 2017-11-08 | 2018-04-06 | 北京图森未来科技有限公司 | 一种散热系统 |
CN107765795A (zh) | 2017-11-08 | 2018-03-06 | 北京图森未来科技有限公司 | 一种计算机服务器 |
WO2019142310A1 (ja) * | 2018-01-19 | 2019-07-25 | 住友精密工業株式会社 | 沸騰式冷却器 |
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2015
- 2015-07-14 JP JP2015140194A patent/JP6117288B2/ja active Active
-
2016
- 2016-07-14 CN CN201690000988.4U patent/CN208269706U/zh active Active
- 2016-07-14 WO PCT/JP2016/070774 patent/WO2017010536A1/ja active Application Filing
- 2016-07-14 TW TW105122342A patent/TWI649530B/zh active
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2018
- 2018-01-10 US US15/866,688 patent/US10571199B2/en active Active
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2020
- 2020-02-21 US US16/797,501 patent/US11150028B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170303441A1 (en) * | 2016-04-15 | 2017-10-19 | Google Inc. | Cooling electronic devices in a data center |
US10349561B2 (en) * | 2016-04-15 | 2019-07-09 | Google Llc | Cooling electronic devices in a data center |
Also Published As
Publication number | Publication date |
---|---|
US11150028B2 (en) | 2021-10-19 |
JP2017020742A (ja) | 2017-01-26 |
US20200191494A1 (en) | 2020-06-18 |
CN208269706U (zh) | 2018-12-21 |
US20180128552A1 (en) | 2018-05-10 |
TWI649530B (zh) | 2019-02-01 |
US10571199B2 (en) | 2020-02-25 |
TW201706553A (zh) | 2017-02-16 |
WO2017010536A1 (ja) | 2017-01-19 |
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