JP2018173193A - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
- Publication number
- JP2018173193A JP2018173193A JP2017070060A JP2017070060A JP2018173193A JP 2018173193 A JP2018173193 A JP 2018173193A JP 2017070060 A JP2017070060 A JP 2017070060A JP 2017070060 A JP2017070060 A JP 2017070060A JP 2018173193 A JP2018173193 A JP 2018173193A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- receiving plate
- container
- heat pipe
- heat receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】発熱体が熱的に接続される受熱板と、該受熱板と熱的に接続されたヒートパイプと、を備え、前記受熱板の熱伝導率が、前記ヒートパイプのコンテナの材料の熱伝導率よりも高いヒートシンク。
【選択図】図1
Description
・第1のヒートパイプ:50mm×100mm×厚さ0.6mmのステンレス鋼製コンテナ、作動流体は水。
・受熱板:20×30×厚さ0.1mmの銅(実施例1)、20×30×厚さ0.1mmのステンレス鋼(比較例2)、比較例1は受熱板なし。
・第2のヒートパイプ:φ6mm×T2mm×L100mmの銅製扁平型コンテナ、作動流体は水。
・放熱フィン:20mm×10mm×2mmの銅製、20枚
・発熱体:20W
10 受熱板
11、21 第1のヒートパイプ
16 コンテナ
Claims (8)
- 発熱体が熱的に接続される受熱板と、該受熱板と熱的に接続されたヒートパイプと、を備え、
前記受熱板の熱伝導率が、前記ヒートパイプのコンテナの材料の熱伝導率よりも高いヒートシンク。 - 前記コンテナの一部領域が、前記受熱板と熱的に接続された請求項1に記載のヒートシンク。
- 前記受熱板の熱伝導率が200W/(m・K)以上1500W/(m・K)以下であり、前記コンテナの材料の熱伝導率が10W/(m・K)以上450W/(m・K)以下である請求項1または2に記載のヒートシンク。
- 前記コンテナの材料が、ステンレス鋼、チタン、チタン合金、アルミニウム、アルミニウム合金、ニッケル、ニッケル合金、鉄、鉄合金、銅及び銅合金からなる群から選択された少なくとも1種である請求項1乃至3のいずれか1項に記載のヒートシンク。
- 前記受熱板が、銅、銅合金、アルミニウム、アルミニウム合金、銀、銀合金、グラファイト及びカーボン材からなる群から選択された少なくとも1種である請求項1乃至4のいずれか1項に記載のヒートシンク。
- 前記受熱板の長手方向の長さが、前記コンテナの長手方向の長さの0.10〜1.0倍である請求項1乃至5のいずれか1項に記載のヒートシンク。
- 前記受熱板の平面視の面積が、前記コンテナの平面視の面積の0.10〜1.0倍である請求項1乃至6のいずれか1項に記載のヒートシンク。
- 前記受熱板の厚さが、前記コンテナの厚さの0.1〜5.0倍である請求項1乃至7のいずれか1項に記載のヒートシンク。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017070060A JP2018173193A (ja) | 2017-03-31 | 2017-03-31 | ヒートシンク |
PCT/JP2018/013709 WO2018181933A1 (ja) | 2017-03-31 | 2018-03-30 | ヒートシンク |
CN201890000636.8U CN211575950U (zh) | 2017-03-31 | 2018-03-30 | 散热器 |
TW107111489A TWI656828B (zh) | 2017-03-31 | 2018-03-31 | heat sink |
US16/586,799 US20200025460A1 (en) | 2017-03-31 | 2019-09-27 | Heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017070060A JP2018173193A (ja) | 2017-03-31 | 2017-03-31 | ヒートシンク |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2018173193A true JP2018173193A (ja) | 2018-11-08 |
Family
ID=63676237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017070060A Pending JP2018173193A (ja) | 2017-03-31 | 2017-03-31 | ヒートシンク |
Country Status (5)
Country | Link |
---|---|
US (1) | US20200025460A1 (ja) |
JP (1) | JP2018173193A (ja) |
CN (1) | CN211575950U (ja) |
TW (1) | TWI656828B (ja) |
WO (1) | WO2018181933A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000018853A (ja) * | 1998-06-30 | 2000-01-18 | Furukawa Electric Co Ltd:The | 板型ヒートパイプを用いた冷却構造 |
JP2003336976A (ja) * | 2002-05-17 | 2003-11-28 | Furukawa Electric Co Ltd:The | ヒートシンクおよびその実装構造 |
JP2011002211A (ja) * | 2009-06-22 | 2011-01-06 | Toshiba Corp | 電子機器 |
US20110168358A1 (en) * | 2010-01-13 | 2011-07-14 | Asia Vital Components Co., Ltd. | Lap-joined heat pipe structure and thermal module using same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR930005490B1 (ko) * | 1989-02-06 | 1993-06-22 | 후루가와 덴기 고오교오 가부시기가이샤 | 히트 파이프식 반도체 냉각기의 제조방법 |
US7766691B2 (en) * | 2007-06-27 | 2010-08-03 | Intel Corporation | Land grid array (LGA) socket loading mechanism for mobile platforms |
JP2009076650A (ja) * | 2007-09-20 | 2009-04-09 | Sony Corp | 相変化型ヒートスプレッダ、流路構造体、電子機器及び相変化型ヒートスプレッダの製造方法 |
CN102768568B (zh) * | 2011-05-05 | 2015-09-02 | 华硕电脑股份有限公司 | 散热模块及其散热方法 |
JP6117288B2 (ja) * | 2015-07-14 | 2017-04-19 | 古河電気工業株式会社 | 冷却装置 |
-
2017
- 2017-03-31 JP JP2017070060A patent/JP2018173193A/ja active Pending
-
2018
- 2018-03-30 WO PCT/JP2018/013709 patent/WO2018181933A1/ja active Application Filing
- 2018-03-30 CN CN201890000636.8U patent/CN211575950U/zh active Active
- 2018-03-31 TW TW107111489A patent/TWI656828B/zh active
-
2019
- 2019-09-27 US US16/586,799 patent/US20200025460A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000018853A (ja) * | 1998-06-30 | 2000-01-18 | Furukawa Electric Co Ltd:The | 板型ヒートパイプを用いた冷却構造 |
JP2003336976A (ja) * | 2002-05-17 | 2003-11-28 | Furukawa Electric Co Ltd:The | ヒートシンクおよびその実装構造 |
JP2011002211A (ja) * | 2009-06-22 | 2011-01-06 | Toshiba Corp | 電子機器 |
US20110168358A1 (en) * | 2010-01-13 | 2011-07-14 | Asia Vital Components Co., Ltd. | Lap-joined heat pipe structure and thermal module using same |
Also Published As
Publication number | Publication date |
---|---|
TWI656828B (zh) | 2019-04-11 |
US20200025460A1 (en) | 2020-01-23 |
WO2018181933A1 (ja) | 2018-10-04 |
CN211575950U (zh) | 2020-09-25 |
TW201842834A (zh) | 2018-12-01 |
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