Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
  • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
  • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
  • H01C7/1006—Thick film varistors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
  • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
  • H01C7/1013—Thin film varistors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
  • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
  • H01C7/12—Overvoltage protection resistors; Arresters
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01C—RESISTORS
  • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
  • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/018—Dielectrics
  • H01G4/06—Solid dielectrics
  • H01G4/08—Inorganic dielectrics
  • H01G4/12—Ceramic dielectrics
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/228—Terminals
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/002—Details
  • H01G4/228—Terminals
  • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/30—Stacked capacitors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/35—Feed-through capacitors or anti-noise capacitors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
  • H01G4/385—Single unit multiple capacitors, e.g. dual capacitor in one coil
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
  • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
  • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
  • H10D84/206—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of combinations of capacitors and resistors

Definitions

• Multilayer ceramic devices such as multilayer ceramic capacitors or varistors, are sometimes constructed with a plurality of dielectric-electrode layers arranged in a stack. During manufacture, the layers may be pressed and formed into a monolithic stacked structure.
• an integrated component having capacitor and varistor functionality may include a multilayer capacitor including a first active termination, a second active termination, at least one ground termination, and a pair of capacitors connected in series between the first active termination and the second active termination.
• the integrated component may include a discrete varistor comprising a first external varistor termination connected with the first active termination and a second external varistor termination connected with the second active termination of the multilayer capacitor.
• a method for forming an integrated component having capacitor and varistor functionality may include providing a multilayer capacitor body including electrodes that form a pair of capacitors; forming a first active termination, a second active termination, and at least one ground termination external to the multilayer capacitor body such that the pair of capacitors are connected in series between the first active termination and the second active termination; and stacking a discrete varistor with the multilayer capacitor body such that a first varistor termination of the discrete varistor is connected with the first active termination and a second varistor termination is connected with the second active termination.
• Figure 1 A illustrates an external perspective view of an exemplary embodiment of a multiterminal multilayer device in accordance with presently disclosed subject matter, for use such as for an SMD configuration;
• Figure 1 B illustrates a first electrode layer of the device of Figure 1 A
• Figure 1 C illustrates a second electrode layer of the device of Figure 1A
• Figure 1 D illustrates a stack-up of alternating first and second electrode layers of the device of Figure 1 A;
• Figure 1 E illustrates the device of Figure 1 A further including leads connected with respective external terminals of the device;
• Figure 1 F is a schematic view of the device of Figure 1A;
• FIGs 2A and 2B illustrate alternative first and second electrode layers for the device of Figure 1 A in which the second electrode layer include T- electrodes;
• Figure 2C illustrates a stack-up of alternating first and second electrode layers as shown in Figures 2A and 2B;
• Figure 3A illustrates an integrated component including a multilayer capacitor and discrete varistor in a stacked configuration in accordance with presently disclosed subject matter;
• Figure 3B a schematic view of the device of Figure 3A;
• Figure 3C illustrates an external perspective view of another embodiment of an integrated component, in accordance with presently disclosed subject matter.
• the present invention is directed to an integrated device including a multilayer capacitor and a discrete varistor.
• a capacitor is an electrical component that stores electrical energy in an electric field.
• a varistor is an electrical component that has an electrical resistance that can vary with the applied voltage thereby rendering it a voltage-dependent resistor.
• the capacitor and varistor can provide filtering and EMI and/or EMI/ESD circuit protection in a single package, which may be especially useful when space is limited.
• the present invention may be particularly suitable for automotive applications, such as motor start-stop applications.
• the multilayer capacitor of the integrated component can have a split feedthrough type construction and include a first active termination, a second active termination, and a pair of capacitors connected in series between the first active termination and the second active termination.
• the capacitors can be formed by internal electrodes separated by dielectric layers.
• the discrete varistor can include a first external varistor termination connected with the first active termination and a second external varistor termination connected with the second active termination of the multilayer capacitor.
• the discrete varistor can multilayer capacitor can be stacked to form a single monolithic integrated component.
• leads can be connected with the external terminals and/or the integrated
• an over-molded layer can encapsulate the discrete varistor and the multilayer capacitor.
• the multilayer capacitor can include at least one ground termination located external to the ceramic body.
• a first plurality of electrode layers may be disposed within the body and connected with the first active termination.
• a second plurality of electrode layers disposed within the body and connected with the second active termination.
• a third plurality of electrode layers can be connected with the ground termination(s) and capacitively coupled with each of the first plurality of electrode layers and second plurality of electrode layers to form the split feedthrough type construction.
• the first capacitor can be formed at a first overlapping area between the first plurality and third plurality of electrode layers.
• the second capacitor can be formed at a second overlapping area between the second plurality and third plurality of electrode layers.
• the first capacitor may have a first capacitance
• the second capacitor may have a second capacitance.
• the first and second overlapping areas may be approximately equal such that the second capacitance may be approximately equal to the first capacitance. In other embodiments, however, the first and second overlapping areas may be different such the first capacitance may be greater than or less than the second
• the capacitance may range from about 10 nF to about 3 pF, in some embodiments from about 200 nF to about 2 pF, in some embodiments from about 400 nF to about 1.5 pF.
• the second capacitance may range from about 5% to about 500% of the first capacitance, in some embodiments from about 10% to about 300%, in some embodiments from about 25% to about 200%, and in some embodiments from about 50% to about 150%.
• the third plurality of electrode layers can generally be cross-shaped and can be connected with a pair of opposing ground terminals.
• the third plurality of electrode layers can each include a pair of opposite edges. One of the opposite edges can be connected with the first ground termination, and the other of the opposite edges can be connected with the second ground termination.
• the monolithic body may be free of any additional capacitors formed within the monolithic body.
• the first, second, and third pluralities of electrodes may be arranged in an electrode stack up that extends through a large portion of a thickness of the monolithic body.
• a ratio of a thickness of the electrode stack-up to a thickness of the monolithic body may range from about 0.5 to about 0.97, in some embodiments from about 0.6 to about 0.95, and in some embodiments from about 0.7 to about 0.9.
• the component may include one or leads connected with the external terminals.
• first and second leads may be respectively coupled with the first and second active terminations.
• a third lead and/or a fourth lead may be coupled with the ground termination(s).
• component can be over-molded such that the leads protrude from the over-molded package for connecting the component.
• At least one of the first active termination, the second active termination, or the at least one ground termination may be exposed along a bottom surface of the integrated component for surface mounting the component for example as a surface mount device (SMD) or using grid array type mounting (e.g., land grid array (LGA), ball grid array (BGA), etc.).
• SMD surface mount device
• grid array type mounting e.g., land grid array (LGA), ball grid array (BGA), etc.
• aspects of the present disclosure may simplify assembly and/or mounting of a leaded or SMD component by replacing multiple discrete capacitors with a single integrated capacitive device. For example, in an SMD configuration, multiple discrete components are avoided on a PCB, which saves space on the PCB and, in some instances, lowers inductance and/or equivalent series resistance (ESR). Additionally, the number of solder joints may be reduces, increasing reliability.
• the dielectric layers of the multilayer capacitor can be made of any material generally employed in the art.
• the dielectric layer can be made of a ceramic material including a titanate as a primary component.
• the titanate may include but is not limited to, barium titanate (BaTiCte).
• the ceramic material may also contain an oxide of a rare-earth metal and/or a compound of such acceptor type element as Mn, V, Cr, Mo, Fe, Ni, Cu, Co, or the like.
• the titanate may also contain MgO, CaO, M C , Y2O3, V2O5, ZnO, Zr02, Nb20s,
• the ceramic material may also include other additives, organic solvents, plasticizers, binders, dispersing agents, or the like in addition to ceramic powder.
• the internal electrodes of the multilayer capacitor can be made of any material generally employed in the art.
• the internal electrodes can be formed by sintering a conductive paste whose main component is a noble metal material.
• these materials can include, but are not limited to, palladium, palladium-silver alloy, nickel, and copper.
• the electrodes may be made of nickel or a nickel alloy.
• the alloy may contain one or more of Mn, Cr, Co, Al, W and the like, and a Ni content in the alloy is preferably 95% by weight or more.
• the Ni or Ni alloy may contain 0.1 % by weight or less of various micro-amount components such as P, C, Nb, Fe, Cl, B, Li, Na, K, F, S and the like.
• the ceramic body of the multilayer capacitor can be formed using any method generally known in the art.
• the ceramic body can be formed by forming a laminated body with alternately stacked ceramic sheets and patterned internal electrodes, removing a binder off the laminated body, sintering the binder removed laminated body in a non-oxidative atmosphere at a high temperature ranging from 1200° C to 1300° C, and re-oxidizing the sintered laminated body in the oxidative atmosphere.
• the varistor may be configured to divert electrical surges to ground.
• the varistor may have a clamping voltage that ranges from about 3 volts to about 150 volts, in some embodiments from about 5 volts to about 100 volts, in some embodiments from about 10 volts to about 50 volts, and in some embodiments from about 15 volts to about 30 volts.
• the varistor can include a ceramic body with external electrodes. The ceramic body is fabricated by sintering a laminated body formed of alternately stacked ceramic layers and internal electrodes. Each pair of neighboring internal electrodes faces each other with a ceramic layer therebetween and can be electrically coupled to different external electrodes, respectively.
• the dielectric layers may include any suitable dielectric material, such as, for instance, barium titanate, zinc oxide, or any other suitable dielectric material.
• Various additives may be included in the dielectric material, for example, that produce or enhance the voltage-dependent resistance of the dielectric material.
• the additives may include oxides of cobalt, bismuth, manganese, or a combination thereof.
• the additives may include oxides of gallium, aluminum, antimony, chromium, boron, titanium, lead, barium, nickel, vanadium, tin, or combinations thereof.
• the dielectric material may be doped with the additive(s) ranging from about 0.5 mole percent to about 3 mole percent, and in some embodiments from about 1 mole percent to about 2 mole percent.
• the average grain size of the dielectric material may contribute to the non-linear properties of the dielectric material. In some embodiments, the average grain size may range from about 10 microns to 100 microns, in some embodiments, from about 20 microns to 80 microns.
• the varistor may also include two terminals, and each electrode may be connected with a respective terminals. Electrodes may provide resistance along the length of the electrodes and/or at the connection between the electrodes and terminals.
• the internal electrodes can be made of any material generally employed in the art.
• the internal electrodes can be formed by sintering a conductive paste whose main component is a noble metal material.
• these materials can include, but are not limited to, palladium, palladium-silver alloy, silver, nickel, and copper.
• the electrodes may be made of nickel or a nickel alloy.
• the alloy may contain one or more of Mn, Cr, Co, Al, W and the like, and a Ni content in the alloy is preferably 95% by weight or more.
• the Ni or Ni alloy may contain 0.1 % by weight or less of various micro amount components such as P, C, Nb, Fe, Cl, B, Li, Na, K, F, S and the like.
• the integrated component may have a variety of sizes.
• the integrated component may have a case size ranging from EIA 0504, or smaller to EIA 2920, or larger.
• Example case sizes include 0805, 1206, 1806, 2020, etc.
• the integrated component may be over-molded using a variety of suitable. Examples include a silicon rubber, a thermoplastic elastomer, or other similar polymer.
• FIG. 1 A illustrates an external perspective view of an exemplary embodiment of a multi-terminal multilayer device 100 generally in accordance with presently disclosed subject matter.
• the device 100 may include a body 102, such as a six-sided body.
• the device 100 may include a first end terminal 104, a second end terminal 106, a first side terminal 108, and a second side terminal 110. All such external terminations present on a designated bottom side 112 generally of device 100, for use such as in a surface mount device (SMD) configuration.
• SMD surface mount device
• the device 100 may include two formed capacitors in series between the two of the first and second terminals 104, 106.
• cooperating layers in the subject multilayer constructions comprise electrode layers which in turn form integrated capacitive structures.
• Figure 1 B illustrates a first electrode layer 120 of the device 100 of Figure 1A.
• the electrode arrangement 120 may include a cross-shaped electrode 122 having a pair of opposite edges 124, 126 respectively connected with the first and second side terminals 108, 110 (Figure 1A).
• Figure 1 C illustrates a second electrode layer 128 including a first electrode 130 connected with the first end terminal 104 and a second electrode 132 connected with the second end terminal 106.
• Figure 1 D illustrates an electrode stack-up 133 of alternating first and second electrode layers 120, 128. It should be understood that the electrode stack-up 133 may include any suitable number of electrode layer 120, 128.
• the cross-shape electrode 122 may overlap with the first electrode 130 along a first overlapping area 134 to form a first capacitor and may overlap with the second electrode 132 along a second overlapping area 136 to form a second capacitor.
• the monolithic body 102 ( Figure 1A) may be free of any additional capacitors (in addition to the first and second capacitors) within the monolithic body 102 ( Figure 1A).
• the electrode stack-up 133 described above with reference to Figure 1 D may extend through a large portion a thickness 138 of the monolithic body 102 ( Figure 1A) in a Z-direction 140 that is perpendicular to the electrodes 122, 130, 132.
• the 142 of the electrode stack-up 133 in the Z-direction 140 to the thickness 138 of the monolithic body 102 may range from about 0.4 to about 0.97.
• Figure 1 E illustrates a perspective view of another embodiment of a device 100 according to aspects of the present application.
• Figure 1A with added lead configuration. More specifically, leads 148, 150, and 152 are respectively attached to external terminations 104, 108, and 106. Leads 148 and 152 may constitute first and second leads respectively attached to the first pair of
• terminations 104 and 106 while lead 150 may constitute a third lead attached to at least one of the second pair of terminations 108 and 110.
• terminations 108 and 110 are both connected to layer 122, such that lead 150 may be connected with either such termination 108 or 110 with the same electrical circuitry consequences.
• the resulting configuration of application Figure 1 C is an over-molded three leaded component.
• Figure 1 F illustrates a schematic view of the device 100 of application
• FIG 1A in the connection/mounting configuration thereof as shown by application Figure 1 C. More specifically, leads 148, 150, and 152 are shown in respective contact with series and parallel capacitors. The indicated capacitance values are intended as exemplary only, rather than limiting.
• device 100 provides a single device solution for containing series and parallel capacitors.
• a first capacitor 154 may be formed between the cross-shaped electrode 122 and the first electrode 130 at the first overlapping area
• a second capacitor 156 may be formed between the cross-shaped electrode
• the first overlapping area 134 may be approximately equal to the second overlapping area
• the 134 may be greater than or less than the second overlapping area 136 such that the first capacitance may be greater than or less than the second capacitance.
• One or both of the first capacitance and the second capacitance may range from about 10 nF to about 3 pF.
• FIGS 2A and 2B illustrate an electrode configuration of another embodiment according to aspects of the present disclosure.
• a first electrode layer 220 may include a cross-shaped electrode 222 having a pair of opposite edges 224, 226 that may be respectively connected with the first and second side terminals 108, 110 (Figure 1A).
• Figure 1 C illustrates a second electrode layer 228 including a first electrode 230 connected with the first end terminal 104 and a second electrode 232 connected with the second end terminal 106.
• the first electrode 230 and/or second electrode 232 may be a T-electrode such that the electrode(s) 230, 232 extend to side edges 235, 237 of the electrode layer 227 and connect with respective end terminals 104, 106 ( Figure 1A) along at least one side surface 239 of the monolithic body 102.
• Figure 2C illustrates an electrode stack-up 233 of alternating first and second electrode layers 220, 228.
• the electrode stack-up 233 may have a thickness 242 in the Z-direction 140.
• a ratio of the thickness 242 of the electrode stack-up 233 in the Z- direction 140 to the thickness 138 of the monolithic body 102 may range from about 0.4 to about 0.97.
• the cross-shape electrode 222 may overlap with the first electrode 230 along a first overlapping area 234 and may overlap with the second electrode 232 along a second overlapping area 236.
• Figure 3A illustrates an external perspective view of an exemplary embodiment of a multiterminal multilayer device 600 generally in accordance with presently disclosed subject matter, for use in a stacked configuration with a varistor device 660 with respective added leads 648, 650, and 652, as illustrated.
• Figure 3B illustrates a schematic view of the exemplary embodiment 600 of application Figure 3A.
• a varistor 660 may have external varistor terminations 662, 664.
• a lead configuration arrangement may be used to place device 600 and varistor 660 in parallel relative to each other. More specifically, leads 648, 650, and 652 may be respectively attached to external (capacitor device) terminations 604, 608, and 606 of device 600, while leads 648 and 652 and respectively connected as shown to external side (varistor) terminations 662 and 664 of varistor 660.
• the resulting configuration of application Figure 3A may be over-molded.
• Figure 3B illustrates a schematic view of the exemplary embodiment 600 generally of application Figure 3A, in the connection/mounting configuration thereof as shown by application Figure 3A. More specifically, leads 648, 650, and 652 are shown in respective contact with series and parallel capacitors. The indicated capacitance values are intended as exemplary only, rather than limiting. Varistor 660 is likewise in contact with leads 648 and 652 as illustrated, so as to be in parallel relationship with device 600. The indicated varistor characteristics are intended as exemplary only, rather than limiting.
• Figure 3C illustrates a perspective view of integrated component having capacitor and varistor functionality according to aspects of the present disclosure.
• Figure 3C illustrates the device of Figure 3A in another perspective.
• the embodiment of Figure 3C provides device 600, such as a multilayer ceramic device, on bottom with varistor 660 on top.
• device 600 such as a multilayer ceramic device
• varistor 660 on top.
• Such a configuration can allow for use as a surface mount device after combining, such as via soldering, device 600 and varistor 660 together.
• the embodiment as illustrated in Figure 3C is provided without the leads illustrated in Figure 3A. Flowever, it should be understood that leads may also be employed when in such a configuration.
• device 600 provides a single device solution for containing series and parallel capacitors.
• Device 600 shows two representative capacitors 654 and 656, such as may be formed by a split feedthrough configuration of multiple layers in an isolated region of device 600.
• device 600 and varistor 660 may be regarded as being representative of a standard MLC case size, for example, a 1206 case size.
• a standard MLC case size for example, a 1206 case size.
• various sizes may be practiced in various embodiments, as needed or desired for a particular application. All such variations and variations of exemplary capacitance values are intended to come with the spirit and scope of the presently disclosed subject matter.
• the presently disclosed subject matter may result in replacement of multiple discrete components on a printed circuit board (PCB), thereby saving space and, in some instances, lowering inductance. All of such presently disclosed exemplary embodiments may in some uses thereof by packaged in over-molded three leaded components. Per presently disclosed subject matter, a substantial reduction in device size is obtained, which results in reduction in the number of solder joints, which correspondingly increases reliability.
• PCB printed circuit board
• FIG. 4 is a flowchart of a method 400 for forming an integrated circuit
• FIG. 4 depicts steps performed in a particular order for purposes of illustration and discussion, the methods discussed herein are not limited to any particular order or arrangement.
• steps of the methods disclosed herein can be omitted, rearranged, combined, and/or adapted in various ways without deviating from the scope of the present disclosure.
• the method 400 may include, at (402), providing a multilayer capacitor body including electrodes that form a pair of capacitors in a split feedthrough type construction, for example as described above with reference to FIGS. 1 A through 3C.
• the method may include, at (404) forming a first active termination and a second active termination external to the multilayer capacitor body such that the pair of capacitors are connected in series between the first active termination and the second active termination, for example as described above with reference to FIGS. 1 A through 3C.
• the method may include, at (406) stacking a discrete varistor with the multilayer capacitor body such that a first varistor termination of the discrete varistor is connected with the first active termination and a second varistor termination is connected with the second active termination.
• an integrated component has first and second capacitors that each exhibit about 475 nF.
• the integrated component includes a discrete varistor having a clamping voltage of about 22 volts.
• an integrated component has first and second capacitors that each exhibit about 685 nF.
• the integrated component includes a discrete varistor having a clamping voltage of about 22 volts.
• an integrated component has first and second capacitors that each exhibit about 1 pF.
• the integrated component includes a discrete varistor having a clamping voltage of about 22 volts.
• the clamping voltage of the varistor may be measured using a Keithley 2400 series Source Measure Unit (SMU), for example, a Keithley 2410-C SMU.
• SMU Source Measure Unit
• the varistor may be subjected to an 8/20 ps current wave, for example according to ANSI Standard C62.1.
• the current wave may have a peak current value of 1 mA.
• the peak current value may be selected such that the peak current causes the varistor to“clamp” the voltage.
• the current may increase to the peak current value and then decay.
• A“rise” time period may be from the initiation of the current pulse to when the current reaches 90% of the peak current value.
• The“rise” time may be 8 ps.
• The“decay time” may be from the initiation of the current pulse to 50% of the peak current value.
• The“decay time” may be 20 ps.
• the clamping voltage measured as the maximum voltage across the varistor during the current wave.
• the capacitance(s) of the multilayer capacitor may be measured using a Keithley 2400 series Source Measure Unit (SMU), for example, a Keithley 2410-C SMU.
• SMU Source Measure Unit
• the first capacitance of the first capacitor may be measured between ground and the first external terminal of the multilayer capacitor.
• the second capacitance of the second capacitor may be measured between ground and the second external terminal of the multilayer capacitor.

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• 2020
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  • 2020-04-17 KR KR1020257042009A patent/KR20260003406A/ko active Pending
  • 2020-04-17 DE DE112020002054.1T patent/DE112020002054T5/de active Pending
  • 2020-04-17 CN CN202411361784.0A patent/CN119361324A/zh active Pending
  • 2020-04-17 WO PCT/US2020/028740 patent/WO2020219357A1/en not_active Ceased
  • 2020-04-17 KR KR1020217038439A patent/KR102902461B1/ko active Active
  • 2020-04-17 CN CN202080031059.0A patent/CN113728407A/zh active Pending
  • 2020-04-24 TW TW109113740A patent/TW202109578A/zh unknown
• 2024
  • 2024-07-10 JP JP2024111012A patent/JP2024138420A/ja active Pending

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