WO2019014956A1 - 一种不同板料混压的高频板制作方法 - Google Patents

一种不同板料混压的高频板制作方法 Download PDF

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Publication number
WO2019014956A1
WO2019014956A1 PCT/CN2017/094434 CN2017094434W WO2019014956A1 WO 2019014956 A1 WO2019014956 A1 WO 2019014956A1 CN 2017094434 W CN2017094434 W CN 2017094434W WO 2019014956 A1 WO2019014956 A1 WO 2019014956A1
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Prior art keywords
copper layer
frequency
sheet
pressing
board
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PCT/CN2017/094434
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English (en)
French (fr)
Inventor
何艳球
张亚锋
钟招娣
施世坤
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胜宏科技（惠州）股份有限公司
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Priority to KR1020197010096A priority Critical patent/KR102175303B1/ko
Publication of WO2019014956A1 publication Critical patent/WO2019014956A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Definitions

  • the invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing a high frequency board with different sheet materials mixed pressure.
  • the mobile communication network has gradually developed from 4G to 5G.
  • the transceiver is in the outdoor (ODU), modem, and baseband interface in the indoor (IDU) split architecture.
  • ODU outdoor
  • IDU indoor
  • the requirements for the communication distance of microwave communication equipment are from short-distance communication to long-distance communication, and the transmission capacity and interface mode of driving microwave communication equipment can be smoothly upgraded with the development of the network to reduce operators. investment.
  • the PCB which is the mother of electronic products, also needs to be made of special high-frequency, high-speed materials.
  • this special material is currently in the foreign monopoly stage and the price is very expensive.
  • the design scheme of high frequency sheet material + common sheet material mixing is usually adopted.
  • the position of the ordinary sheet material needs to be slotted to achieve a complete signal. transmission. Due to the different characteristics of the high-frequency sheet material and the ordinary sheet material, the plate bending and shrinkage are difficult to control.
  • this type of plate needs to be grooved and then pressed, but the pressure of the sheet is concave after the groove is pressed. When the PP between the high-frequency board and the ordinary sheet is pressed, the flow glue will be difficult to control, resulting in residual glue around the hole, which affects the quality of the product.
  • PCB manufacturers adopt the method of continuously adjusting the pressing program to solve the above problems, and the resin characteristics in the high-frequency sheet material require higher temperature rise during pressing, and the curing temperature is higher, and the heating rate is 3.2- 4.2 ° C / min, curing temperature > 200 ° C or more, so the compression program adjustment space is limited, and the simple adjustment of the compression program has little effect.
  • the present invention provides a method for manufacturing a high frequency board in which different sheets are mixed, which can effectively improve the processing quality of the product, including the following steps:
  • the slot on the epoxy board is aligned with the position of the copper-free block, and the slot on the epoxy board is the same as the shape of the corresponding copper-free block, and runs through the L3 copper layer and the L4 copper layer;
  • the L3 copper layer is browned;
  • L1 copper layer high frequency sheet material, L2 copper layer, non-flowing PP sheet, L3 copper layer, epoxy resin sheet, L4 copper layer, stacking and pressing in order from top to bottom;
  • L2 copper a copper-free area block on the layer and a corresponding slot provided on the non-flowing PP sheet and the epoxy resin board form a depth control groove from the L4 copper layer to the L2 copper layer;
  • the L1 copper layer and the L4 copper layer are ground, drilled, and plated, and then the L1 copper layer and the L4 copper layer are subjected to line fabrication and line inspection, and the antenna is completed when the L1 copper layer is fabricated. Production.
  • step B when drilling the high-frequency sheet material, the phenolic resin sheet is laminated on both sides of the high-frequency sheet material, and an aluminum sheet is stacked on the phenolic resin sheet stacked on the high-frequency sheet material, and then Drilling.
  • step C before the pressing, under the L4 copper layer, three-in-one cushioning material, steel plate and kraft paper are sequentially stacked from top to bottom; above the L1 copper layer, aluminum sheets are laminated in order from bottom to top, Steel plate, kraft paper, and then press-fit.
  • the three-in-one cushioning material is formed by overlapping two buffer sheets in the middle of two release films.
  • step C when pressing, first performing hot pressing and then performing cold pressing; the hot pressing comprises a 9-stage program, and the pressing pressure corresponding to each step is 70 psi, 200 psi, 350 psi, 420 psi, respectively.
  • the corresponding pressing temperature for each program is 120 ° C, 140 ° C, 160 ° C, 180 ° C, 220 ° C, 220 ° C, 180 ° C, 140 ° C, each program
  • the corresponding pressing time is 5 min, 5 min, 5 min, 5 min, 8 min, 50 min, 120 min, 15 min, 10 min.
  • vacuuming is first performed, and the vacuuming time is 3 minutes to reach 50 mBar.
  • the cold pressing is performed at room temperature, and the pressing time is 1.5 hours.
  • the high frequency sheet material is a hydrocarbon based sheet or a ceramic based sheet or a hydrocarbon ceramic mixed sheet.
  • step D prior to electroplating the L1 copper layer and the L4 copper layer, plasma degumming is performed once, and then one or two horizontal chemical degumming is performed to ensure electroplating quality.
  • the method further comprises the step E, after the step D is completed, the anti-welding, writing, surface treatment, molding, testing, FQC, packaging, and the high-frequency board product; super-roughening or sandblasting to treat the copper before the welding prevention Face, to ensure welding resistance.
  • the invention provides a high frequency plate manufacturing method for mixing different sheets of materials, which is prepared by using double-sided copper-clad high-frequency sheet material and epoxy resin sheet, and adopting non-flowing PP sheet as high-frequency sheet material and epoxy.
  • the pressing medium of the resin board is designed with a special manufacturing process, and the size of the slot on the non-flowing PP sheet is improved to solve the problem of slot overflow, reducing the difficulty of manufacturing the product and improving the processing quality of the product;
  • the invention also specially designs a laminating process for drilling high-frequency sheet materials, which can effectively reduce the drilling burrow and improve the drilling precision; not only that, the problem of sheet material depression is caused by the pressing after the slotting in the high-frequency board process.
  • the press-fit stack is specially designed, and a three-in-one cushion pad is used to solve the problem of the groove of the slotted side sheet, and the hot press program is further designed according to the material processing characteristics of the press-fit stack and the high-frequency sheet material.
  • the method of prolonging the cold pressing time is adopted to further avoid the problem that the plate is bent due to different plate shrinkage and contraction coefficients during the cooling process; since the high frequency sheet material has a filling which is difficult to be removed by chemical degumming.
  • the product quality is improved as a whole.
  • FIG. 1 is a schematic view showing a laminated structure of an embodiment of a method for manufacturing a high-frequency board in which different sheets are mixed.
  • the high-frequency board material is covered with L1 copper layer and L2 copper layer on both sides respectively.
  • the epoxy resin board is covered with L3 copper layer and L4 copper layer on both sides respectively;
  • the material may be selected from a hydrocarbon-based sheet or a ceramic-based sheet or a hydrocarbon-based ceramic-based sheet; the epoxy resin sheet is preferably an FR-4 sheet.
  • the L2 copper layer on the high-frequency sheet material and the L3 copper layer on the epoxy resin board are subjected to line fabrication and line inspection; when the L2 copper layer is fabricated, the antenna corresponding to the L1 copper layer is preset.
  • the copper-free area block is etched at the position; after the L2 copper layer is completed, the L2 copper layer is browned; the epoxy resin board is grooved at a position corresponding to the copper-free area block, and the groove on the epoxy resin board
  • the hole has the same shape and size as the corresponding copper-free block, and penetrates the L3 copper layer and the L4 copper layer; then the L3 copper layer is browned;
  • the processing of the high-frequency sheet material, the epoxy resin sheet, and the non-flowing PP sheet can be carried out independently or sequentially, and the browning of the L2 copper layer and the L3 copper layer is preferably performed simultaneously, and the browning can improve the subsequent pressure. Combined strength.
  • L1 copper layer 1 high frequency sheet a, L2 copper layer 2, non-adhesive PP sheet b, L3 copper layer 3, epoxy resin sheet c, L4 copper layer 4, stacked in order from top to bottom And pressing;; the copper-free area block 21 on the L2 copper layer and the corresponding slot provided on the non-flowing PP sheet b and the epoxy resin sheet c form a depth control from the L4 copper layer 4 to the L2 copper layer 2
  • the slot d and the depth control slot d are located below the preset position of the antenna on the L1 copper layer 1 in order to improve the antenna performance and achieve complete signal transmission.
  • three-in-one cushioning material 6, steel is laminated in order from top to bottom.
  • the plate 71 and the kraft paper 81 are laminated on the L1 copper layer in this order from the bottom to the top, and the aluminum sheet 5, the steel plate 72, and the kraft paper 82 are laminated in this order, and the press-bonding is completed and then pressed, and the laminated structure is as shown in FIG.
  • the three-in-one cushioning material is made by overlapping two buffer sheets in the middle of two release films.
  • the kraft paper plays the role of buffering pressure and uniform heat transfer, and the steel plate can ensure flat pressing and uniform thickness.
  • the use of aluminum sheets on the side of the high-frequency sheet material can accelerate the heat conduction on the side, which causes a difference in heat between the high-frequency sheet material and the epoxy resin sheet, thereby improving the high-temperature sheet material and the epoxy resin sheet during hot pressing.
  • the problem of plate surface bending caused by different expansion and contraction factors; the use of three-in-one cushioning material reduces the heat transfer efficiency of one side of the epoxy resin plate on the one hand, and the separation of the production plate at a high temperature on the other hand.
  • the cushioning material has an effective filling effect. When pressing, the three-in-one cushioning material must be placed on the side of the groove.
  • the cushioning material When pressing, the cushioning material can be filled into the slot to form a support, thereby avoiding the problem of depression, and the release film on the surface of the three-in-one cushioning material is smooth and smooth. Easy to install when laminated and stacked, it is easy to remove after pressing.
  • the hot pressing when press-bonding, hot pressing is first performed; the hot pressing includes a 9-stage program, and the heating rate required according to the resin characteristics in the high-frequency sheet material is 3.2-4.2 ° C / min, curing Temperature >200 ° C or more, combined with the design of the press-fit stack, the corresponding press pressure for each block is 70 psi, 200 psi, 350 psi, 420 psi, 420 psi, 420 psi, 420 psi, 420 psi, 240 psi, 140 psi, and the corresponding press for each block.
  • the temperature is 120 ° C, 140 ° C, 160 ° C, 180 ° C, 220 ° C, 220 ° C, 220 ° C, 180 ° C, 140 ° C, and the pressing time corresponding to each step is 5 min, 5 min, 5 min, 5 min, 8 min, 50min, 120min, 15min, 10min; vacuum is required before hot pressing, vacuuming time is 3min, reaching 50mBar.
  • cold pressing is carried out at room temperature for 1.5 hours, compared to the ordinary wiring board made of epoxy resin board, much longer for cold pressing time, and improve the high frequency sheet The problem of plate surface bending caused by different expansion and contraction coefficients of epoxy resin sheets after cooling.
  • the L1 copper layer and the L4 copper layer are ground, drilled, and plated, and then the L1 copper layer and the L4 copper layer are subjected to line fabrication and line inspection, and the antenna is completed when the L1 copper layer is fabricated.
  • Production Before the electroplating of the L1 copper layer and the L4 copper layer, a plasma degumming is performed first, and the filler which is not easily removed by the chemical degumming method in the high-frequency sheet material is sufficiently cleaned, and then one or two horizontal chemical degumming is performed to ensure Plating quality.
  • step D anti-welding, text, surface treatment, molding, testing, FQC, packaging, and high-frequency board products; super-roughening or sandblasting to prevent copper surface before welding, to ensure solder joint force.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

一种不同板料混压的高频板制作方法，选用双面覆铜的高频板料（a）和环氧树脂板（c）进行制作，采用不流胶PP片（b）作为高频板料和环氧树脂板的压合介质，并对不流胶PP片上的槽孔尺寸进行专门设计，以解决槽孔溢胶的问题，从而提高产品的加工品质；此外，还专门设计了对高频板料进行钻孔的层叠工艺；针对高频板工艺中开槽后压合会有板料凹陷的问题，特别设计了压合叠构，采用三合一缓冲垫等以解决开槽侧板料凹陷的问题，并根据其压合叠构一步设计了热压程式，同时采用延长冷压时间以进一步降低因不同板料涨缩系数不同而导致板弯曲的问题；由于高频板料中存在不易通过化学除胶方式去除的填料，在进行电镀前，先进行等离子除胶，再采用化学除胶，充分清洁，以有效提高电镀质量。

Description

一种不同板料混压的高频板制作方法 技术领域
本发明涉及线路板制作领域，尤其涉及一种不同板料混压的高频板制作方法。
背景技术
随着移动和数据通信的发展，移动通信网络逐步由4G向5G发展,就设备的结构而言，逐步摒弃了传统的室内一体机的设计结构，发展成为现有的体积更小且拆移简易的收发信机在室外(ODU)、调制解调和基带接口在室内(IDU)的分体式结构。特别是海洋船只通信的需要，对于微波通信设备通信距离的要求从短距离通信向长距离通信发展，驱动微波通信设备的传输容量及接口方式也能随网络的发展而平滑升级，以减少运营商的投资。
为达到高速远程距离传输信号的需要，做为电子产品之母的PCB也需要采用特种高频，高速材料制作。但这种特殊材料目前还属于国外垄断阶段，价格非常昂贵。为达到信号传输完整，又节约成本的目的，通常会采用高频板料+普通板料混压的设计方案，对于天线下方的位置，还需要将普通板料位置开槽，以达到完整的信号传输。由于高频板料与普通板料，涨缩特性不同，板曲、涨缩较难管控，另外此类型的板需要先开槽再压合，但开槽后压合会有板料凹陷的风险，且高频板与普通板料之间PP在压合时，流胶会较难管控，导致槽孔周围有残胶，影响产品的质量。
目前PCB厂家采用的是通过不断调整压合程式的方式以期望解决上述问题，而高频板料中的树脂特性要求压合时的温升较高，且固化温度较高，升温速率在3.2-4.2℃/min，固化温度＞200℃以上,因此压合程式调整的空间有限,且单纯的调整压合程式收效甚微。
发明内容
针对上述问题，本发明提供一种不同板料混压的高频板制作方法,可有效提高该产品的加工品质，包括以下步骤:
A.提供一两面分别覆有L1铜层、L2铜层的高频板料，一两面分别覆有L3铜层、L4铜层的环氧树脂板,一不流胶PP片；
B.对所述高频板料、环氧树脂板进行开料、钻孔，然后对高频板料上的L2铜层 及环氧树脂板上的L3铜层进行线路制作、线路检查；在进行L2铜层的线路制作时,对应设计于L1铜层上的天线的预设位置蚀刻出无铜区域块；L2铜层的线路制作完成后，对L2铜层进行棕化；
在环氧树脂板上与无铜区域块对应的位置铣槽孔，环氧树脂板上的槽孔与对应的无铜区域块的形状尺寸一致，并贯穿L3铜层、L4铜层；然后对L3铜层进行棕化；
对所述不流胶PP片进行开料、钻孔；在不流胶PP片上与无铜区域块对应的位置铣槽孔，不流胶PP片上的槽孔比对应的无铜区域块单边大0.1-0.3mm；
C.依照L1铜层、高频板料、L2铜层、不流胶PP片、L3铜层、环氧树脂板、L4铜层的顺序，从上至下依次层叠并进行压合；L2铜层上的无铜区域块与设于不流胶PP片和环氧树脂板上的对应槽孔形成从L4铜层至L2铜层的控深槽；
D.压合完成后，对L1铜层、L4铜层进行研磨、钻孔、电镀，再对L1铜层、L4铜层进行线路制作、线路检查，在对L1铜层进行线路制作时完成天线的制作。
优选的,在步骤B中，对高频板料进行钻孔时，在高频板料两面层叠酚醛树脂板，并在层叠于高频板料上方的酚醛树脂板上再叠一铝片，然后进行钻孔加工。
优选的,在进行步骤C时，在压合之前，在L4铜层下方，由上至下依次层叠三合一缓冲材、钢板、牛皮纸；在L1铜层上方，由下至上依次层叠铝片、钢板、牛皮纸，再进行压合。
进一步的,所述三合一缓冲材由两张离型膜中间夹一张缓冲材重叠制作而成。
进一步的,在步骤C中,进行压合时，先进行热压，再进行冷压；所述热压包括9段程式，每段程式对应的压合压力依次为70psi、200psi、350psi、420psi、420psi、420psi、420psi、240psi、140psi，每段程式对应的压合温度依次为120℃、140℃、160℃、180℃、220℃、220℃、220℃、180℃、140℃，每段程式对应的压合时间依次为5min、5min、5min、5min、8min、50min、120min、15min、10min。
进一步的,进行热压时需先进行抽真空，抽真空时间3min,达到50mBar。
进一步的,所述冷压是在常温下进行压合，压合时间1.5小时。
优选的,所述高频板料为碳氢系板料或陶瓷系板料或碳氢陶瓷混合系板料。
优选的,在步骤D中，对L1铜层、L4铜层进行电镀前，先进行一次等离子除胶，再进行一次或二次水平化学除胶，以保证电镀品质。
优选的,还包括步骤E，在步骤D完成后进行防焊、文字、表面处理、成型、测试、FQC、包装，制成高频板产品；防焊前进行超粗化或喷砂来处理铜面，保证防焊结合力。
本发明提供了一种不同板料混压的高频板制作方法，选用双面覆铜的高频板料和环氧树脂板进行制作，采用不流胶PP片作为高频板料和环氧树脂板的压合介质，设计专门的制作流程，并对不流胶PP片上的槽孔尺寸进行改进，以解决槽孔溢胶的问题，降低产品的制作难度，提高产品的加工品质；此外，本发明还专门设计了对高频板料进行钻孔的层叠工艺，可有效减少钻孔披锋，提高钻孔精度；不仅如此，针对高频板工艺中开槽后压合会有板料凹陷的问题，特别设计了压合叠构，采用三合一缓冲垫等以解决开槽侧板料凹陷的问题，并根据其压合叠构及高频板料的材料加工特性进一步设计了热压程式，同时采用延长冷压时间的方法,进一步避免在降温过程中因不同板料涨缩系数不同而导致板弯曲的问题；由于高频板料中存在不易通过化学除胶方式去除的填料，在进行电镀前，先进行等离子除胶，再采用化学除胶，充分清洁，以有效提高电镀质量。通过上述制作方法的改进，从整体上提高产品质量。
附图说明
图1是本发明提供的不同板料混压的高频板制作方法实施例压合叠构示意图。
具体实施方式
为方便本领域的技术人员了解本发明的技术内容，下面结合附图及实施例对本发明做进一步的详细说明。
在制作用于通讯的不同板料混压的高频板时,具体采用以下步骤:
A.选用一高频板料和一环氧树脂板,高频板料两面分别覆有L1铜层、L2铜层，环氧树脂板两面分别覆有L3铜层、L4铜层；高频板料可选择碳氢系板料或陶瓷系板料或碳氢陶瓷混合系板料；环氧树脂板优选FR-4板。
B.对高频板料、环氧树脂板进行开料、钻孔；对高频板料进行钻孔加工时，需在高频板料两面层叠酚醛树脂板，并在钻孔方向的酚醛树脂板上再叠一层铝片， 再进行钻孔加工,以改善钻孔披锋,提高钻孔孔位精度。钻孔时需根据钻孔直径采用专门参数，如下表所示。
Figure PCTCN2017094434-appb-000001
然后对高频板料上的L2铜层及环氧树脂板上的L3铜层进行线路制作、线路检查；在进行L2铜层的线路制作时,对应设计于L1铜层上的天线的预设位置蚀刻出无铜区域块；L2铜层的线路制作完成后，对L2铜层进行棕化；在环氧树脂板上与无铜区域块对应的位置铣槽孔，环氧树脂板上的槽孔与对应的无铜区域块的形状尺寸一致，并贯穿L3铜层、L4铜层；然后对L3铜层进行棕化；
对不流胶PP片进行开料、钻孔；在不流胶PP片上与无铜区域块对应的位置铣槽孔，不流胶PP片上的槽孔比对应的无铜区域块单边大0.15mm，以防止压合时溢胶；
对高频板料、环氧树脂板、不流胶PP片的加工处理可分别独立进行，也可依次进行，对L2铜层、L3铜层的棕化优选同时进行，棕化可以提高后续压合的结合力。
C.依照L1铜层1、高频板料a、L2铜层2、不流胶PP片b、L3铜层3、环氧树脂板c、L4铜层4的顺序，从上至下依次层叠并进行压合；；L2铜层上的无铜区域块21与设于不流胶PP片b和环氧树脂板c上的对应槽孔形成从L4铜层4至L2铜层2的控深槽d,控深槽d对应的位于L1铜层1上天线预设位置的下方，以便于提高天线性能，达到完整的信号传输。
在压合之前，在L4铜层4下方，由上至下依次层叠三合一缓冲材6、钢 板71、牛皮纸81；在L1铜层上方，由下至上依次层叠铝片5、钢板72、牛皮纸82，完成此压合叠构后再进行压合，压合叠构如图1所示。三合一缓冲材由两张离型膜中间夹一张缓冲材重叠制作而成。
其中牛皮纸起到缓冲压力、均匀传热的作用，采用钢板可保证压合平整，板厚均匀。在高频板料一侧使用铝片可使得该侧的导热加快，使得高频板料和环氧树脂板的受热产生差异，从而改善高频板料和环氧树脂板在进行热压时因涨缩系数不同而导致的板面弯曲问题；采用三合一缓冲材，一方面降低环氧树脂板一侧的传热效率，另一方面离型膜起到在高温下隔离生产板的作用，而缓冲材起到有效的填充效果。压合时三合一缓冲材必须放在开槽的一面，压合时缓冲材可填充入槽孔内形成支撑，从而避免凹陷问题，且三合一缓冲材表面的离型膜平整光滑，预叠压合叠构时易安装，在压合完成后也很容易揭除。
针对该压合叠构，在进行压合时，先进行热压；所述热压包括9段程式，根据高频板料中的树脂特性所要求的升温速率在3.2-4.2℃/min，固化温度＞200℃以上，并结合压合叠构的设计，每段程式对应的压合压力依次为70psi、200psi、350psi、420psi、420psi、420psi、420psi、240psi、140psi，每段程式对应的压合温度依次为120℃、140℃、160℃、180℃、220℃、220℃、220℃、180℃、140℃，每段程式对应的压合时间依次为5min、5min、5min、5min、8min、50min、120min、15min、10min；热压前还需抽真空，抽真空时间3min,达到50mBar。
热压完成后进行冷压，冷压是在常温下进行压合，压合时间1.5小时，相比普通环氧树脂板制成的线路板，冷压时间大幅延长，改善高频板料和环氧树脂板在降温后因涨缩系数不同而导致的板面弯曲问题。
D.压合完成后，对L1铜层、L4铜层进行研磨、钻孔、电镀，再对L1铜层、L4铜层进行线路制作、线路检查，在对L1铜层进行线路制作时完成天线的制作。对L1铜层、L4铜层进行电镀前，先进行一次等离子除胶，将高频板料中不易通过化学除胶方式去除的填料充分清洁，再进行一次或二次水平化学除胶，以保证电镀品质。
E.在步骤D完成后进行防焊、文字、表面处理、成型、测试、FQC、包装，制成高频板产品；防焊前进行超粗化或喷砂来处理铜面，保证防焊结合力。
以上为本发明的具体实现方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员 来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些显而易见的替换形式均属于本发明的保护范围。

Claims (10)

  1. 一种不同板料混压的高频板制作方法,包括以下步骤:
    A.提供一两面分别覆有L1铜层、L2铜层的高频板料，一两面分别覆有L3铜层、L4铜层的环氧树脂板,一不流胶PP片；
    B.对所述高频板料、环氧树脂板进行开料、钻孔，然后对高频板料上的L2铜层及环氧树脂板上的L3铜层进行线路制作、线路检查；在进行L2铜层的线路制作时,对应设计于L1铜层上的天线的预设位置蚀刻出无铜区域块；L2铜层的线路制作完成后，对L2铜层进行棕化；
    在环氧树脂板上与无铜区域块对应的位置铣槽孔，环氧树脂板上的槽孔与对应的无铜区域块的形状尺寸一致，并贯穿L3铜层、L4铜层；然后对L3铜层进行棕化；
    对所述不流胶PP片进行开料、钻孔；在不流胶PP片上与无铜区域块对应的位置铣槽孔，不流胶PP片上的槽孔比对应的无铜区域块单边大0.1-0.3mm；
    C.依照L1铜层、高频板料、L2铜层、不流胶PP片、L3铜层、环氧树脂板、L4铜层的顺序，从上至下依次层叠并进行压合；L2铜层上的无铜区域块与设于不流胶PP片和环氧树脂板上的对应槽孔形成从L4铜层至L2铜层的控深槽；
    D.压合完成后，对L1铜层、L4铜层进行研磨、钻孔、电镀，再对L1铜层、L4铜层进行线路制作、线路检查，在对L1铜层进行线路制作时完成天线的制作。
  2. 依据权利要求1所述不同板料混压的高频板制作方法，其特征在于：在步骤B中，对高频板料进行钻孔时，在高频板料两面层叠酚醛树脂板，并在层叠于高频板料上方的酚醛树脂板上再叠一铝片，然后进行钻孔加工。
  3. 依据权利要求1所述不同板料混压的高频板制作方法，其特征在于：在进行步骤C时，在压合之前，在L4铜层下方，由上至下依次层叠三合一缓冲材、钢板、牛皮纸；在L1铜层上方，由下至上依次层叠铝片、钢板、牛皮纸，再进行压合。
  4. 依据权利要求3所述不同板料混压的高频板制作方法，其特征在于：所述三合一缓冲材由两张离型膜中间夹一张缓冲材重叠制作而成。
  5. 依据权利要求3所述不同板料混压的高频板制作方法，其特征在于：在步骤C中，进行压合时，先进行热压，再进行冷压；所述热压包括9段程式，每段程式对应的压合压力依次为70psi、200psi、350psi、420psi、420psi、420psi、420psi、 240psi、140psi，每段程式对应的压合温度依次为120℃、140℃、160℃、180℃、220℃、220℃、220℃、180℃、140℃，每段程式对应的压合时间依次为5min、5min、5min、5min、8min、50min、120min、15min、10min。
  6. 依据权利要求5所述不同板料混压的高频板制作方法，其特征在于：进行热压时需先进行抽真空，抽真空时间3min,达到50mBar。
  7. 依据权利要求5所述不同板料混压的高频板制作方法，其特征在于：所述冷压是在常温下进行压合，压合时间1.5小时。
  8. 依据权利要求1所述不同板料混压的高频板制作方法，其特征在于：所述高频板料为碳氢系板料或陶瓷系板料或碳氢陶瓷混合系板料。
  9. 依据权利要求1所述不同板料混压的高频板制作方法，其特征在于：在步骤D中，对L1铜层、L4铜层进行电镀前，先进行一次等离子除胶，再进行一次或二次水平化学除胶，以保证电镀品质。
  10. 依据权利要求1所述不同板料混压的高频板制作方法，其特征在于：还包括步骤E，在步骤D完成后进行防焊、文字、表面处理、成型、测试、FQC、包装，制成高频板产品；防焊前进行超粗化或喷砂来处理铜面，保证防焊结合力。
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