WO2018186494A1 - 感光性樹脂組成物 - Google Patents
感光性樹脂組成物 Download PDFInfo
- Publication number
- WO2018186494A1 WO2018186494A1 PCT/JP2018/014771 JP2018014771W WO2018186494A1 WO 2018186494 A1 WO2018186494 A1 WO 2018186494A1 JP 2018014771 W JP2018014771 W JP 2018014771W WO 2018186494 A1 WO2018186494 A1 WO 2018186494A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- photosensitive resin
- group
- alkali
- black
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 90
- 229920005989 resin Polymers 0.000 claims abstract description 102
- 239000011347 resin Substances 0.000 claims abstract description 102
- -1 phenol compound Chemical class 0.000 claims abstract description 61
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 59
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 46
- 239000011230 binding agent Substances 0.000 claims abstract description 40
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical compound [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000003086 colorant Substances 0.000 claims abstract description 28
- 239000000178 monomer Substances 0.000 claims description 42
- 239000002904 solvent Substances 0.000 claims description 31
- 230000005855 radiation Effects 0.000 claims description 24
- 239000003513 alkali Substances 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 22
- 125000003700 epoxy group Chemical group 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 125000004432 carbon atom Chemical group C* 0.000 claims description 18
- 150000002989 phenols Chemical class 0.000 claims description 17
- 229920001577 copolymer Polymers 0.000 claims description 16
- 238000005192 partition Methods 0.000 claims description 16
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 15
- 239000010936 titanium Substances 0.000 claims description 15
- 229910052719 titanium Inorganic materials 0.000 claims description 15
- 238000011161 development Methods 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 14
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 125000000524 functional group Chemical group 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000000975 dye Substances 0.000 description 29
- 239000000049 pigment Substances 0.000 description 29
- 239000010408 film Substances 0.000 description 25
- 238000000034 method Methods 0.000 description 25
- 238000006243 chemical reaction Methods 0.000 description 19
- 239000003822 epoxy resin Substances 0.000 description 19
- 229920000647 polyepoxide Polymers 0.000 description 19
- 239000000463 material Substances 0.000 description 18
- 239000007787 solid Substances 0.000 description 18
- 239000000243 solution Substances 0.000 description 17
- 239000007788 liquid Substances 0.000 description 16
- 238000000576 coating method Methods 0.000 description 15
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 14
- 230000035945 sensitivity Effects 0.000 description 14
- 239000000126 substance Substances 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 12
- 230000018109 developmental process Effects 0.000 description 12
- 239000002270 dispersing agent Substances 0.000 description 12
- 239000006185 dispersion Substances 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 11
- 239000004094 surface-active agent Substances 0.000 description 11
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 10
- 229920003986 novolac Polymers 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- 238000002156 mixing Methods 0.000 description 9
- 229920001187 thermosetting polymer Polymers 0.000 description 9
- UYEMGAFJOZZIFP-UHFFFAOYSA-N 3,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC(O)=C1 UYEMGAFJOZZIFP-UHFFFAOYSA-N 0.000 description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 8
- 239000007864 aqueous solution Substances 0.000 description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000003505 polymerization initiator Substances 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 239000007795 chemical reaction product Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 6
- PJMXUSNWBKGQEZ-UHFFFAOYSA-N (4-hydroxyphenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=C(O)C=C1 PJMXUSNWBKGQEZ-UHFFFAOYSA-N 0.000 description 5
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 5
- 229930003836 cresol Natural products 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- AISZNMCRXZWVAT-UHFFFAOYSA-N 2-ethylsulfanylcarbothioylsulfanyl-2-methylpropanenitrile Chemical compound CCSC(=S)SC(C)(C)C#N AISZNMCRXZWVAT-UHFFFAOYSA-N 0.000 description 4
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 4
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 206010034972 Photosensitivity reaction Diseases 0.000 description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 4
- 239000012987 RAFT agent Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 4
- 230000036211 photosensitivity Effects 0.000 description 4
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 4
- 238000010526 radical polymerization reaction Methods 0.000 description 4
- 239000004408 titanium dioxide Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000007877 V-601 Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000004040 coloring Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 150000003014 phosphoric acid esters Chemical class 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 239000012989 trithiocarbonate Substances 0.000 description 3
- GLDQAMYCGOIJDV-UHFFFAOYSA-N 2,3-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1O GLDQAMYCGOIJDV-UHFFFAOYSA-N 0.000 description 2
- UIAFKZKHHVMJGS-UHFFFAOYSA-N 2,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1O UIAFKZKHHVMJGS-UHFFFAOYSA-N 0.000 description 2
- WXTMDXOMEHJXQO-UHFFFAOYSA-N 2,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC=C1O WXTMDXOMEHJXQO-UHFFFAOYSA-N 0.000 description 2
- AKEUNCKRJATALU-UHFFFAOYSA-N 2,6-dihydroxybenzoic acid Chemical compound OC(=O)C1=C(O)C=CC=C1O AKEUNCKRJATALU-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 2
- MIRQGKQPLPBZQM-UHFFFAOYSA-N 2-hydroperoxy-2,4,4-trimethylpentane Chemical compound CC(C)(C)CC(C)(C)OO MIRQGKQPLPBZQM-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- YQUVCSBJEUQKSH-UHFFFAOYSA-N 3,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(O)=C1 YQUVCSBJEUQKSH-UHFFFAOYSA-N 0.000 description 2
- UJTRCPVECIHPBG-UHFFFAOYSA-N 3-cyclohexylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C2CCCCC2)=C1 UJTRCPVECIHPBG-UHFFFAOYSA-N 0.000 description 2
- YNGIFMKMDRDNBQ-UHFFFAOYSA-N 3-ethenylphenol Chemical compound OC1=CC=CC(C=C)=C1 YNGIFMKMDRDNBQ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Substances CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 230000001476 alcoholic effect Effects 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- CUFNKYGDVFVPHO-UHFFFAOYSA-N azulene Chemical compound C1=CC=CC2=CC=CC2=C1 CUFNKYGDVFVPHO-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid group Chemical group C(C1=CC=CC=C1)(=O)O WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 150000005165 hydroxybenzoic acids Chemical class 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical group [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 2
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 2
- HIZCIEIDIFGZSS-UHFFFAOYSA-L trithiocarbonate Chemical compound [S-]C([S-])=S HIZCIEIDIFGZSS-UHFFFAOYSA-L 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- CDUQMGQIHYISOP-RMKNXTFCSA-N (e)-2-cyano-3-phenylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C\C1=CC=CC=C1 CDUQMGQIHYISOP-RMKNXTFCSA-N 0.000 description 1
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- QYGBYAQGBVHMDD-XQRVVYSFSA-N (z)-2-cyano-3-thiophen-2-ylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C/C1=CC=CS1 QYGBYAQGBVHMDD-XQRVVYSFSA-N 0.000 description 1
- FWUIHQFQLSWYED-ARJAWSKDSA-N (z)-4-oxo-4-propan-2-yloxybut-2-enoic acid Chemical compound CC(C)OC(=O)\C=C/C(O)=O FWUIHQFQLSWYED-ARJAWSKDSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- WHFHDVDXYKOSKI-UHFFFAOYSA-N 1-ethenyl-4-ethylbenzene Chemical compound CCC1=CC=C(C=C)C=C1 WHFHDVDXYKOSKI-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- CAQYAZNFWDDMIT-UHFFFAOYSA-N 1-ethoxy-2-methoxyethane Chemical compound CCOCCOC CAQYAZNFWDDMIT-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- 229940082044 2,3-dihydroxybenzoic acid Drugs 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- YKTNISGZEGZHIS-UHFFFAOYSA-N 2-$l^{1}-oxidanyloxy-2-methylpropane Chemical group CC(C)(C)O[O] YKTNISGZEGZHIS-UHFFFAOYSA-N 0.000 description 1
- PEAVCVNITMWRHQ-UHFFFAOYSA-N 2-(1h-benzimidazol-2-yl)-4,5,6,7-tetrahydro-1h-indazol-3-one Chemical compound C1=CC=C2NC(N3NC=4CCCCC=4C3=O)=NC2=C1 PEAVCVNITMWRHQ-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OTUWCEXPLFPTPA-UHFFFAOYSA-N 2-(4-hydroxyphenyl)prop-2-enamide Chemical compound NC(=O)C(=C)C1=CC=C(O)C=C1 OTUWCEXPLFPTPA-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- PLMIYFSPVVMPMX-UHFFFAOYSA-N 2-[(4-hydroxy-3,5-dimethylphenyl)methyl]prop-2-enamide Chemical compound CC1=CC(CC(=C)C(N)=O)=CC(C)=C1O PLMIYFSPVVMPMX-UHFFFAOYSA-N 0.000 description 1
- KRDXTHSSNCTAGY-UHFFFAOYSA-N 2-cyclohexylpyrrolidine Chemical compound C1CCNC1C1CCCCC1 KRDXTHSSNCTAGY-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- DTQHSUHILQWIOM-UHFFFAOYSA-J 2-hydroxypropanoate titanium(4+) dihydroxide Chemical compound O[Ti++]O.CC(O)C([O-])=O.CC(O)C([O-])=O DTQHSUHILQWIOM-UHFFFAOYSA-J 0.000 description 1
- WUQYBSRMWWRFQH-UHFFFAOYSA-N 2-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=CC=C1O WUQYBSRMWWRFQH-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- IUTPJBLLJJNPAJ-UHFFFAOYSA-N 3-(2,5-dioxopyrrol-1-yl)propanoic acid Chemical compound OC(=O)CCN1C(=O)C=CC1=O IUTPJBLLJJNPAJ-UHFFFAOYSA-N 0.000 description 1
- SXPVZPQNFIDDPP-UHFFFAOYSA-N 3-(4-hydroxyphenyl)pyrrole-2,5-dione Chemical compound C1=CC(O)=CC=C1C1=CC(=O)NC1=O SXPVZPQNFIDDPP-UHFFFAOYSA-N 0.000 description 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
- REWLXMVGEZMKSG-UHFFFAOYSA-N 3-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=CC(O)=C1 REWLXMVGEZMKSG-UHFFFAOYSA-N 0.000 description 1
- NCPQROHLJFARLL-UHFFFAOYSA-N 4-(2,5-dioxopyrrol-1-yl)butanoic acid Chemical compound OC(=O)CCCN1C(=O)C=CC1=O NCPQROHLJFARLL-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- JAGRUUPXPPLSRX-UHFFFAOYSA-N 4-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=C(O)C=C1 JAGRUUPXPPLSRX-UHFFFAOYSA-N 0.000 description 1
- PPDRLQLKHRZIJC-UHFFFAOYSA-N 5-nitrosalicylic acid Chemical compound OC(=O)C1=CC([N+]([O-])=O)=CC=C1O PPDRLQLKHRZIJC-UHFFFAOYSA-N 0.000 description 1
- WOJKKJKETHYEAC-UHFFFAOYSA-N 6-Maleimidocaproic acid Chemical compound OC(=O)CCCCCN1C(=O)C=CC1=O WOJKKJKETHYEAC-UHFFFAOYSA-N 0.000 description 1
- QRYSWXFQLFLJTC-UHFFFAOYSA-N 616-82-0 Chemical compound OC(=O)C1=CC=C(O)C([N+]([O-])=O)=C1 QRYSWXFQLFLJTC-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- 239000012988 Dithioester Substances 0.000 description 1
- XLYMOEINVGRTEX-ARJAWSKDSA-N Ethyl hydrogen fumarate Chemical compound CCOC(=O)\C=C/C(O)=O XLYMOEINVGRTEX-ARJAWSKDSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 235000000177 Indigofera tinctoria Nutrition 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 241000238633 Odonata Species 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000001000 anthraquinone dye Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 150000008378 aryl ethers Chemical class 0.000 description 1
- 239000000987 azo dye Substances 0.000 description 1
- 239000007869 azo polymerization initiator Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- UUZYBYIOAZTMGC-UHFFFAOYSA-M benzyl(trimethyl)azanium;bromide Chemical compound [Br-].C[N+](C)(C)CC1=CC=CC=C1 UUZYBYIOAZTMGC-UHFFFAOYSA-M 0.000 description 1
- LRRJQNMXIDXNIM-UHFFFAOYSA-M benzyl(trimethyl)azanium;iodide Chemical compound [I-].C[N+](C)(C)CC1=CC=CC=C1 LRRJQNMXIDXNIM-UHFFFAOYSA-M 0.000 description 1
- 229940114055 beta-resorcylic acid Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- RPBPCPJJHKASGQ-UHFFFAOYSA-K chromium(3+);octanoate Chemical compound [Cr+3].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O RPBPCPJJHKASGQ-UHFFFAOYSA-K 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical class OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 150000005169 dihydroxybenzoic acids Chemical class 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012990 dithiocarbamate Substances 0.000 description 1
- 150000004659 dithiocarbamates Chemical class 0.000 description 1
- 125000005022 dithioester group Chemical group 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 description 1
- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 description 1
- ZBJDIMHZOFLPJI-UHFFFAOYSA-N ethyl 2-hydroxypropanoate methyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)O.COC(=O)C(C)(C)O ZBJDIMHZOFLPJI-UHFFFAOYSA-N 0.000 description 1
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- 229940097275 indigo Drugs 0.000 description 1
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- DZVCFNFOPIZQKX-LTHRDKTGSA-M merocyanine Chemical compound [Na+].O=C1N(CCCC)C(=O)N(CCCC)C(=O)C1=C\C=C\C=C/1N(CCCS([O-])(=O)=O)C2=CC=CC=C2O\1 DZVCFNFOPIZQKX-LTHRDKTGSA-M 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- FMXYCZVOMYLMKM-UHFFFAOYSA-N methyl 2-hydroxy-2-methylbutanoate Chemical compound CCC(C)(O)C(=O)OC FMXYCZVOMYLMKM-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- GNVRJGIVDSQCOP-UHFFFAOYSA-N n-ethyl-n-methylethanamine Chemical compound CCN(C)CC GNVRJGIVDSQCOP-UHFFFAOYSA-N 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000001007 phthalocyanine dye Substances 0.000 description 1
- 229950010765 pivalate Drugs 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UORVCLMRJXCDCP-UHFFFAOYSA-N propynoic acid Chemical compound OC(=O)C#C UORVCLMRJXCDCP-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- GSECCTDWEGTEBD-UHFFFAOYSA-N tert-butylperoxycyclohexane Chemical compound CC(C)(C)OOC1CCCCC1 GSECCTDWEGTEBD-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- 150000003682 vanadium compounds Chemical class 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000012991 xanthate Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
Definitions
- the present invention relates to a photosensitive resin composition.
- the present invention relates to a high-sensitivity black positive photosensitive resin composition and a partition wall or an insulating film of an organic EL display element using the same.
- a partition material is used at intervals of colored patterns in the display area, edges of the periphery of the display area, and the like in order to improve display characteristics.
- OLED organic EL display
- a partition material is used at intervals of colored patterns in the display area, edges of the periphery of the display area, and the like in order to improve display characteristics.
- a partition is formed, and the pixel of the organic material is formed between the partitions.
- This partition is generally formed by photolithography using a photosensitive resin composition. Specifically, the photosensitive resin composition is applied onto a substrate using a coating apparatus, and after removing volatile components by means of heating or the like, it is exposed through a mask.
- Patent Document 1 proposes a method of coloring a partition material using a radiation-sensitive resin composition containing a pigment.
- Patent Document 2 as a radiation-sensitive resin composition having high resolution and exhibiting light-shielding properties by heat treatment after exposure, a heat-sensitive dye is added to a positive radiation-sensitive resin composition containing an alkali-soluble resin and a quinonediazide compound.
- a composition to which is added has been proposed.
- the thermal dye since the thermal dye is unreacted and not in a colored state before exposure, the resin composition itself does not have light-shielding properties and radiation sensitivity is deteriorated. There is nothing. Therefore, a high-definition pattern can be formed, and the thermal dye reacts with the heat treatment after exposure to exhibit light shielding properties.
- the heat-sensitive dye used has a light-shielding property after heating, it is not black, and in an actual panel, the influence of the hue on the peripheral members is large, and the image quality may be deteriorated.
- the material for forming the pattern has high sensitivity in consideration of productivity and the like.
- a black photosensitive resin composition containing a black colorant when used, it causes exposure failure under normally used exposure conditions. For example, it is necessary to lengthen the exposure time, thereby reducing productivity. It was a factor.
- the present invention has been made on the basis of the above-described circumstances, and the purpose thereof is, for example, a high-sensitivity photosensitive material that can be used even under normal exposure conditions while being a black photosensitive resin composition. It is providing a functional resin composition.
- a quinonediazide adduct of a phenol compound having three or more phenolic hydroxyl groups hereinafter sometimes referred to as “a trivalent or higher phenol compound”
- a binder resin a binder resin
- a black colorant a quinonediazide adduct of a phenol compound having three or more phenolic hydroxyl groups
- a specific quinonediazide adduct is used in a black photosensitive resin composition containing a high-sensitivity, even if the photosensitive resin composition is black, the sensitivity of the pattern is increased by, for example, photolithography using normal exposure conditions. It has been found that the formability can be improved.
- the present invention includes the following aspects.
- (B) The quinonediazide adduct is (B1) a quinonediazide adduct in which one of the phenolic hydroxyl groups of a trihydric or higher phenolic compound is substituted with a structure represented by the formula (I) or (II); A quinonediazide adduct in which two of the phenolic hydroxyl groups of the phenolic compound are substituted with a structure represented by the formula (I) or (II);
- the photosensitive resin composition whose sum total of (b1) and (b2) is 60 mol% or more of the whole (B).
- R a to R d each independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, and * represents a bonding portion with an aromatic ring of a trivalent or higher valent phenol compound. Is shown.
- the binder resin (A) is From the group consisting of (a1) an alkali-soluble copolymer of a polymerizable monomer having an alkali-soluble functional group and another polymerizable monomer, and (a2) an alkali-soluble resin having an epoxy group and a phenolic hydroxyl group. 5.
- the photosensitive resin composition according to any one of items 1 to 4, comprising at least one selected.
- Item 7 An organic EL device partition comprising a cured product of the photosensitive resin composition according to any one of Items 1 to 6.
- the binder resin (A) used in the photosensitive resin composition of the present invention is not particularly limited, but preferably has an alkali-soluble functional group and is alkali-soluble.
- the alkali-soluble functional group of the binder resin is not particularly limited, and examples thereof include a carboxyl group, an alcoholic hydroxyl group, a phenolic hydroxyl group, a sulfo group, a phosphoric acid group, and an acid anhydride group.
- a resin having both groups may be used.
- the binder resin include acrylic resin, styrene resin, epoxy resin, amide resin, phenol resin, and polyamic acid resin. These can be used alone or in combination of two or more kinds of resins.
- alkali-soluble resin examples include alkali-soluble copolymers (a1) of the following polymerizable monomers having an alkali-soluble group and other polymerizable monomers, alkali-soluble resins having an epoxy group and a phenolic hydroxyl group (a2) ) (Also referred to as “component (a2)”) and other alkali-soluble resins (a3) (also referred to as “component (a3)”) can be used.
- alkali-soluble means that it can be dissolved in an alkali solution, for example, a 2.38 mass% tetramethylammonium hydroxide aqueous solution.
- (A1) Alkali-soluble copolymer of polymerizable monomer having alkali-soluble group and other polymerizable monomer
- binder resin (A) of the present invention a polymerizable monomer having an alkali-soluble group and others It is preferable to contain the alkali-soluble copolymer (a1) of the polymerizable monomer.
- the alkali-soluble group of the copolymer (a1) include a carboxyl group, an alcoholic hydroxyl group, a phenolic hydroxyl group, a sulfo group, a phosphoric acid group, and an acid anhydride group.
- a copolymer of a polymerizable monomer having an alkali-soluble group and another polymerizable monomer is, for example, a polymerizable monomer having an alkali-soluble group and another polymerizable monomer, a polymerization initiator and It can be produced by radical polymerization with a RAFT agent (Reversible Addition Fragment Transfer) or the like. Alternatively, an alkali-soluble group may be added after the copolymer is synthesized by radical polymerization.
- the polymerizable functional group possessed by the polymerizable monomer include radically polymerizable functional groups.
- Examples of the polymerizable monomer having an alkali-soluble group include 4-hydroxystyrene, (meth) acrylic acid, ⁇ -bromo (meth) acrylic acid, ⁇ -chloro (meth) acrylic acid, ⁇ -furyl (meth).
- Examples include 4-hydroxyphenyl methacrylate, 3,5-dimethyl-4-hydroxybenzylacrylamide, 4-hydroxyphenylacrylamide, 4-hydroxyphenylmaleimide, 3-maleimidopropionic acid, 4-maleimidobutyric acid, and 6-maleimidohexanoic acid.
- polymerizable monomers examples include polymerizable styrene derivatives such as styrene, vinyl toluene, ⁇ -methyl styrene, p-methyl styrene, and p-ethyl styrene, acrylamide, acrylonitrile, vinyl n-butyl ether, and the like.
- Vinyl alcohol ethers (meth) acrylic acid alkyl ester, (meth) acrylic acid tetrahydrofurfuryl ester, (meth) acrylic acid dimethylaminoethyl ester, (meth) acrylic acid diethylaminoethyl ester, (meth) acrylic acid glycidyl ester (Meth) acrylic acid esters such as 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, isobornyl (meth) acrylate, maleic anhydride, Fe Rumareimido include N- substituted maleimide and cyclohexyl maleimide.
- the component (a1) has one or more kinds of cyclic structures such as an alicyclic structure, an aromatic structure, a polycyclic structure, an inorganic cyclic structure, and a heterocyclic structure. It is preferable to have.
- the polymerizable monomer having an alkali-soluble group (Wherein R 1 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and r represents an integer of 1 to 5).
- R 1 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and r represents an integer of 1 to 5).
- the polymerizable monomer having an alkali-soluble group capable of forming the monomer unit 4-hydroxyphenyl methacrylate is particularly preferable.
- R 2 and R 3 are each independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a fully or partially fluorinated alkyl group having 1 to 3 carbon atoms, or a halogen atom
- R 4 represents a hydrogen atom, a linear or cyclic alkyl group having 1 to 6 carbon atoms, a phenyl group, or a hydroxy group, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms.
- the polymerization initiator for producing an alkali-soluble copolymer of a polymerizable monomer having an alkali-soluble group and another polymerizable monomer by radical polymerization is not limited to the following, but 2,2 ′ -Azobisisobutyronitrile, 2,2'-azobis (2-methylbutyronitrile), dimethyl 2,2'-azobis (2-methylpropionate), 4,4'-azobis (4-cyanovalerian) Acid), 2,2′-azobis (2,4-dimethylvaleronitrile) (AVN) and other azo polymerization initiators, dicumyl peroxide, 2,5-dimethyl-2,5-di (tert-butylperoxy) ) Hexane, tert-butyl cumyl peroxide, di-tert-butyl peroxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene ha Peroxide polymerization initiators such as dropper oxide having a 10-hour
- the amount of the polymerization initiator used is generally 0.01 parts by mass or more, 0.05 parts by mass or more, 0.5 parts by mass or more, 40 parts by mass or less, and 100 parts by mass with respect to 100 parts by mass of the polymerizable monomer mixture. It is preferable that it is less than or equal to 15 parts by mass.
- the RAFT agent is not limited to the following, but thiocarbonylthio compounds such as dithioesters, dithiocarbamates, trithiocarbonates, xanthates can be used.
- the RAFT agent can be used in the range of 0.005 to 20 parts by mass and preferably in the range of 0.01 to 10 parts by mass with respect to 100 parts by mass of the total amount of polymerizable monomers.
- the weight average molecular weight (Mw) of the alkali-soluble copolymer (a1) of the polymerizable monomer having an alkali-soluble group and another polymerizable monomer is 5,000 to 80,000, It is preferably 70,000, more preferably 7,000 to 60,000.
- the number average molecular weight (Mn) is in the range of 1000 to 30,000, preferably in the range of 3000 to 25,000, and more preferably in the range of 5,000 to 20,000.
- the polydispersity (Mw / Mn) is 1.0 to 3.0, preferably 1.1 to 2.8, and more preferably 1.2 to 2.5. When the weight average molecular weight, number average molecular weight, and polydispersity are in this range, the alkali solubility and developability are excellent.
- the shape maintaining property and developability can be improved and the outgas can be reduced.
- the reaction temperature and reaction time in the production of the alkali-soluble copolymer (a1) of a polymerizable monomer having an alkali-soluble group and another polymerizable monomer is 50 to 150 ° C.
- the temperature is preferably 60 to 130 ° C, more preferably 70 to 120 ° C.
- the polymerization time is preferably 2 to 24 hours, more preferably 3 to 12 hours, and further preferably 4 to 8 hours.
- the binder resin (A) of the present invention includes the following (a2) alkali-soluble resin (also referred to as component (a2)) having an epoxy group and a phenolic hydroxyl group, and other alkali-soluble resins ( a3) (also referred to as component (a3)).
- the binder resin (A) of the present invention also includes an alkali-soluble resin having an epoxy group and a phenolic hydroxyl group.
- the alkali-soluble resin reacts, for example, an epoxy group of a compound having at least two epoxy groups in one molecule (hereinafter sometimes referred to as “epoxy compound”) with a carboxyl group of hydroxybenzoic acids. Can be obtained.
- epoxy compound a compound having at least two epoxy groups in one molecule
- reaction formula 1 An example of a reaction in which one of the epoxy groups of the epoxy compound and a carboxyl group of hydroxybenzoic acid react to form a compound having a phenolic hydroxyl group is shown in the following reaction formula 1.
- Examples of the compound having at least two epoxy groups in one molecule include phenol novolac type epoxy resins, cresol novolac type epoxy resins, bisphenol type epoxy resins, biphenol type epoxy resins, naphthalene skeleton-containing epoxy resins, and heterocyclic epoxy resins. Etc. These epoxy compounds only need to have two or more epoxy groups in one molecule and can be used alone, but may be used in combination of two or more. In addition, since these compounds are a thermosetting type, it cannot be uniquely described from the difference in the presence or absence of an epoxy group, the kind of functional group, a polymerization degree, etc. as common knowledge of those skilled in the art.
- An example of the structure of the novolac type epoxy resin is shown in Formula (1).
- R 5 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms
- q represents an integer of 0 to 50.
- phenol novolac type epoxy resin examples include EPICLON (registered trademark) N-770 (manufactured by DIC Corporation), jER (registered trademark) -152 (manufactured by Mitsubishi Chemical Corporation), and the like.
- cresol novolac type epoxy resin examples include EPICLON (registered trademark) N-695 (manufactured by DIC Corporation), EOCN (registered trademark) -102S (manufactured by Nippon Kayaku Co., Ltd.), and the like.
- bisphenol type epoxy resins examples include bisphenol A type epoxy resins such as jER (registered trademark) 828, jER (registered trademark) 1001 (manufactured by Mitsubishi Chemical Corporation), and YD-128 (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.).
- Bisphenol F type epoxy resin such as JER (registered trademark) 806 (manufactured by Mitsubishi Chemical Corporation), YDF-170 (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), and the like.
- biphenol type epoxy resin examples include jER (registered trademark) YX-4000, jER (registered trademark) YL-6121H (manufactured by Mitsubishi Chemical Corporation), and the like.
- naphthalene skeleton-containing epoxy resin examples include NC-7000 (trade name, manufactured by Nippon Kayaku Co., Ltd.), EXA-4750 (trade name, manufactured by DIC Corporation), and the like.
- Examples of the alicyclic epoxy resin include EHPE (registered trademark) -3150 (manufactured by Daicel Chemical Industries, Ltd.).
- heterocyclic epoxy resin examples include TEPIC (registered trademark), TEPIC-L, TEPIC-H, and TEPIC-S (manufactured by Nissan Chemical Industries, Ltd.).
- “Hydroxybenzoic acid” refers to a compound in which at least one of the 2-6 positions of benzoic acid is substituted with a hydroxyl group.
- a hydroxyl group For example, salicylic acid, 4-hydroxybenzoic acid, 2,3-dihydroxybenzoic acid, 2,4 -Dihydroxybenzoic acid, 2,5-dihydroxybenzoic acid, 2,6-dihydroxybenzoic acid, 3,4-dihydroxybenzoic acid, 3,5-dihydroxybenzoic acid, 2-hydroxy-5-nitrobenzoic acid, 3-hydroxy Examples thereof include -4-nitrobenzoic acid and 4-hydroxy-3-nitrobenzoic acid, and dihydroxybenzoic acids are preferable from the viewpoint of enhancing alkali developability. These hydroxybenzoic acids can be used alone or in combination of two or more.
- the hydroxybenzoic acid is preferably 0.20 to 0.90 equivalent, more preferably 1 equivalent to 1 equivalent of the epoxy group of the epoxy compound. Is used in an amount of 0.25 to 0.85 equivalents, more preferably 0.30 to 0.80 equivalents. If hydroxybenzoic acid is 0.2 equivalent or more, sufficient alkali solubility is expressed, and if it is 0.9 equivalent or less, increase in molecular weight due to side reaction can be suppressed.
- a catalyst may be used to promote the reaction.
- the amount of the catalyst used is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the reaction raw material mixture comprising the epoxy compound and hydroxybenzoic acid.
- the reaction temperature is preferably 60 to 150 ° C., and the reaction time is preferably 3 to 30 hours.
- the catalyst used in this reaction include triethylamine, benzyldimethylamine, triethylammonium chloride, benzyltrimethylammonium bromide, benzyltrimethylammonium iodide, triphenylphosphine, chromium octoate, and zirconium octoate.
- the number average molecular weight of the alkali-soluble resin (a2) having an epoxy group and a phenolic hydroxyl group is preferably in the range of 500 to 8000, more preferably in the range of 1000 to 6000, and in the range of 1500 to 4000. Is more preferable. If the molecular weight is 500 or more, the solubility in an alkaline aqueous solution is appropriate, so that the resin of the photosensitive material is good. If the molecular weight is 8000 or less, the coatability and developability are good.
- alkali-soluble resins include, for example, phenol novolak resins, cresol novolak resins, triphenylmethane type phenol resins, phenol aralkyl resins, biphenyl aralkyl phenol resins, and phenol-dicyclopentadiene.
- Well-known phenol resins, such as copolymer resin, are mentioned.
- a polyalkenylphenol resin obtained by converting these hydroxyl groups into alkenyl ethers and further rearranging the alkenyl ether groups may be used as the binder resin (A).
- alkali-soluble resin examples include a hydroxypolystyrene resin derivative having a structure of the formula (2). By containing such a resin, it is possible to improve the development characteristics of the resulting photosensitive resin composition and to contribute to the reduction of outgas.
- R 6 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms
- m represents an integer of 1 to 4
- n represents an integer of 1 to 4
- m + n is within a range of 2 to 5.
- R 7 represents at least one selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group, and a propyl group.
- a hydroxypolystyrene resin derivative As the binder resin (A) of the photosensitive resin composition of the present invention, it is represented by the monomer unit represented by the formula (2) and the formula (3) from the viewpoint of alkali developability and outgassing.
- a copolymer having a monomer unit is preferred.
- R 8 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and p represents an integer of 1 to 5)
- Examples of the monomer unit represented by the general formula (3) include phenols such as p-hydroxystyrene, m-hydroxystyrene, o-hydroxystyrene, p-isopropenylphenol, m-isopropenylphenol, and o-isopropenylphenol.
- aromatic vinyl compounds having a functional hydroxyl group a polymer or a copolymer obtained by polymerizing one or two or more kinds by a known method is allowed to react with formaldehyde by a known method, or an alcohol. It is obtained by reacting with
- aromatic vinyl compound having a phenolic hydroxyl group p-hydroxystyrene and m-hydroxystyrene are preferably used.
- the preferred number average molecular weight is in the range of 1000 to 20000, more preferably in the range of 3000 to 10,000. preferable.
- the molecular weight is 1000 or more, the alkali solubility is appropriate, so that it is suitable as a resin for the photosensitive material.
- the molecular weight is 20000 or less, the coating property and the developability are good.
- a component (a1) corresponds also to alkali-soluble resin (a2) which has an epoxy group and a phenolic hydroxyl group
- the component (a2) falls under other alkali-soluble resin (a3), it is handled as the component (a2). That is, the alkali-soluble resin (a2) having an epoxy group and a phenolic hydroxyl group and the other alkali-soluble resin (a3) exclude those corresponding to the component (a1).
- the binder resin (A) one type of resin may be used alone, or two or more types of resins may be used in combination.
- the binder resin (A) contains at least one selected from the group represented by the component (a2) and the component (a3) in addition to the component (a1), the binder resin (A) is 100 parts by mass.
- the total amount of at least one component selected from the group represented by component (a2) and component (a3) is preferably 1 to 100 parts by mass, more preferably 10 to 100 parts by mass, and still more preferably 30 to 100 parts by mass.
- component (a2) and component (a3) are contained within this range, the heat resistance of the photosensitive resin composition is good.
- the photosensitive resin composition of the present invention is a quinonediazide adduct of trivalent or higher phenolic compound as a radiation sensitive compound. Containing.
- the quinonediazide adduct is, for example, a trivalent phenol compound represented by the formula (III): At least one of the three phenolic hydroxyl groups of the phenolic compound is substituted with a group having a quinonediazide structure, for example, a naphthoquinonediazidesulfonate group (the hydroxyl group of the phenolic compound is esterified (sulfonated) with a quinonediazidesulfonic acid halide) I) The following compounds are meant.
- the quinonediazide adduct (B) (naphthoquinonediazide sulfonate ester) of the present invention is known to generate a carboxyl group through the reaction shown in the following reaction formula (2) when exposed to ultraviolet light or the like. .
- the exposed portion (film) can be dissolved in alkaline water, and alkali developability is exhibited.
- the quinonediazide adduct (B) of a trivalent or higher valent phenol compound used in the present invention has a structure in which one of the phenolic hydroxyl groups of the trivalent or higher valent phenol compound is represented by the formula (I) or (II).
- (B1) a quinonediazide addition product in which two of the phenolic hydroxyl groups of a trivalent or higher valent phenol compound are substituted with the structure represented by formula (I) or (II)
- the sum of (b1) and (b2) may be 60 mol% or more, preferably 65 mol% or more, more preferably 70 mol% or more of the whole (B).
- R a to R d each independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, and * represents a bonding portion with an aromatic ring of a trivalent or higher valent phenol compound. Is shown.
- the present inventors have adopted a quinonediazide adduct (B) in which the quinonediazide adducts (b1) and (b2) are contained in the above-mentioned specific ratio as the radiation-sensitive compound, so that the black color is highly sensitive while being black. It has been found that a photosensitive resin composition, in particular, a black positive photosensitive resin composition can be obtained.
- high sensitivity means a case where a resist pattern formed using the photosensitive resin composition is exposed at 150 mJ / cm 2 and no defect occurs in the resist pattern.
- a quinonediazide adduct in which the proportion of the photosensitive naphthoquinonediazide group is increased as much as possible.
- a radiation-sensitive material having a high proportion of quinonediazide adducts in which all of the three hydroxyl groups of the phenol compound are naphthoquinonediazidesulfonic acid esters.
- the sensitivity was not improved even when such a radiation sensitive material was used.
- the quinonediazide adduct (B) used in the present invention is a quinonediazide adduct in which one or two phenolic hydroxyl groups of a trivalent or higher phenol compound are photosensitive naphthoquinonediazidesulfonic acid esters, that is, as described above.
- the black photosensitive resin layer containing the quinonediazide adduct (B) of the present invention since the radiation-sensitive material having relatively low photosensitivity is uniformly distributed in the layer, the light to be exposed is It is considered that the entire black photosensitive resin layer can be efficiently exposed by reaching the inside of the layer without being completely absorbed near the surface layer of the photosensitive resin layer.
- the trivalent or higher valent phenol compound preferably has a molecular weight of 250 or more, or more preferably 300 or more, and the upper limit of the molecular weight is not particularly limited, but is 1000 or less, 800 or less, or 600 or less. be able to. Although it does not specifically limit as such a phenolic compound, The thing in which a phenolic compound has three or more aromatic rings is preferable. Specific examples include compounds represented by the following formulas (III) to (VI). (Hereafter, it may be expressed as “TS”), (Hereafter, it may be expressed as “CNB”), (Hereafter, it may be expressed as “TEKP”), (Hereafter, it may be described as “HP”.) Etc.
- the quinonediazide adduct (b1) or (b2) of a trivalent or higher valent phenol compound is obtained, for example, by subjecting a hydroxyl group of a trivalent or higher valent phenol compound to a compound represented by the formula (Ia) or (IIa).
- R a to R d each independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, and X represents a halogen atom or OH.
- R a to R d are each independently preferably a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, or an alkoxy group, more preferably a hydrogen atom, a methyl group, or a methoxy group, and even more preferably a hydrogen atom.
- X is preferably a chlorine atom.
- Specific examples include 1,2-naphthoquinonediazide-5-sulfonic acid chloride, 1,2-naphthoquinonediazide-4-sulfonic acid chloride, and the like. Of these, 1,2-naphthoquinonediazide-5-sulfonic acid chloride is preferable.
- the content of (A) binder resin is 100 to 1000 parts by mass, preferably 150 to 1000 parts by mass, more preferably 100 parts by mass of (B) quinonediazide adduct. Is 170 to 500 parts by mass, or more preferably 200 to 400 parts by mass, and (C) the content of the black colorant is 15 to 750 parts by mass, preferably 30 to 350 parts by mass, or more preferably 60 to 260 parts by mass. It may be included in a range.
- the ratio (A / B) of (A) binder resin and (B) quinonediazide adduct is preferably 1.7 to 5.0 or more preferably 2.0 to 4.0.
- (C) Black coloring The ratio of the agent to (B) quinonediazide adduct (C / B) is preferably 0.3 to 3.5 or more preferably 0.6 to 2.6. Within such a range, alkali developability and sensitivity can be further improved.
- (C) Black colorant As the black colorant of the present invention, for example, a black dye (c1) defined by the color index (CI) of Solvent Black 27 to 47 can be used.
- the black dye is preferably C.I. of Solvent Black 27, 29 or 34. I. It is stipulated in. Solvent Black 27-47 C.I. I.
- the optical density (OD value) per 1 ⁇ m thickness of the film of the photosensitive resin composition after baking is set to 0.1 to 3.0. Can maintain a color closer to black.
- the optical density (OD value) per 1 ⁇ m of film thickness can be measured using a transmission densitometer and a film thickness measuring device. From this advantage, when the photosensitive resin composition of the present invention is used as a partition material for a display device such as an organic EL display, the visibility of the display device can be improved.
- Content of the black dye (c1) in the photosensitive resin composition in this invention is (A) binder resin, (B) quinonediazide compound, (C) black dye, and other solid content (except for black dye).
- the total amount is 100% by mass, preferably 0.1 to 50% by mass, more preferably 5 to 40% by mass.
- the content is 0.1% by mass or more, the OD value per 1 ⁇ m thickness of the cured film after firing can be in the range of 0.1 to 3.0, and black color can be maintained even when heated. .
- it is 50% by mass or less the remaining film ratio, heat resistance, sensitivity, and the like are good.
- the black pigment (c2) can also be used as the black colorant of the present invention.
- the black pigment include black pigments such as carbon black, carbon nanotube, acetylene black, graphite, iron black, aniline black, and titanium black. These may be used alone or in combination of two or more.
- the black pigment can be used in the form of a dispersion.
- the black pigment is preferably titanium black or carbon black, and more preferably titanium black.
- the titanium black used in the present invention is not particularly limited, but a method of heating and reducing a mixture of titanium dioxide and metal titanium in a reducing atmosphere (JP-A 49-5432), high-temperature hydrolysis of titanium tetrachloride.
- JP-A 49-5432 a method of heating and reducing a mixture of titanium dioxide and metal titanium in a reducing atmosphere
- JP-A 49-5432 high-temperature hydrolysis of titanium tetrachloride.
- a method of reducing ultrafine titanium dioxide obtained in the above in a reducing atmosphere containing hydrogen Japanese Patent Laid-Open No. 57-205322
- a method of reducing titanium dioxide or titanium hydroxide at high temperature in the presence of ammonia Japanese Patent Laid-Open No.
- JP-A-61-201610 a method of attaching a vanadium compound to titanium dioxide or titanium hydroxide and reducing it at high temperature in the presence of ammonia
- Examples of commercially available titanium black include Titanium Black 10S, 12S, 13R, 13M, 13M-C, 13-MT, 16M, UF-8 manufactured by Mitsubishi Materials Corporation, and Tilac D manufactured by Ako Kasei Co., Ltd. Can be mentioned. These titanium blacks may be used alone or in combination of two or more.
- the titanium black is preferably 3 to 30 parts by mass, more preferably 5 to 20 parts by mass, and still more preferably 8 to 15 parts by mass based on 100 parts by mass of the binder resin (A). If the content of titanium black is 3 to 30 parts by mass based on 100 parts by mass of the binder resin (A), the desired OD value (optical density) can be obtained.
- the average particle diameter D50 (volume basis) of titanium black in the dispersion is preferably 5 to 100 nm. When the average particle diameter D50 is 5 to 100 nm, high light shielding properties can be obtained.
- the average particle diameter D50 can be measured using a laser diffraction / scattering particle diameter distribution measuring apparatus Microtrac wave (Nikkiso Co., Ltd.).
- a black colorant when a black dye defined by the color index (CI) of Solvent Black 27 to 47, titanium black is adopted, it is particularly excellent in heat resistance, so even after a high temperature treatment at 200 ° C. or higher, The photosensitive resin composition containing the black colorant can maintain black and maintain high light shielding properties.
- CI color index
- the photosensitive resin composition of this invention can add a dispersing agent, another coloring agent, a thermosetting agent, surfactant, a solvent etc. as an arbitrary component.
- the optional component is defined as not applicable to any of (A) to (C).
- Dispersant may be used to disperse a pigment such as titanium black.
- known ones can be used.
- trade names DISPERBYK-110, DISPERBYK-111 manufactured by Big Chemie Japan Co., Ltd.
- trade names such as Disparon (registered trademark) PW-36, Disparon (registered trademark) DA -375 (manufactured by Enomoto Kasei Co., Ltd.)
- phosphoric acid esters such as phosphoric acid esters, polyphosphoric acid esters, phosphoric acid polyesters, polyether phosphoric acid esters
- Floren G-700, Floren G-900 Carboxyl group-containing polymer dispersants such as Floren GW-1500 (manufactured by Kyoeisha Chemical Co., Ltd.), higher fatty acid ester dispersions such as trade names Ajisper (registered trademark) PN411, Azisper (registered trademark) PA111
- a dispersant having no graft chain in the skeleton for example, trade names DISPERBYK-110, DISPERBYK-111 (manufactured by Big Chemie Japan Co., Ltd.) and the like are preferably used.
- the dispersant is preferably contained in an amount of 1 to 40 parts by weight, more preferably 2 to 30 parts by weight, and further preferably 3 to 20 parts by weight with respect to 100 parts by weight of the black pigment (c2). If the dispersant is 1 to 40 parts by mass with respect to 100 parts by mass of the black pigment (c2), the particles can be dispersed well.
- the photosensitive resin composition of the present invention may further contain other colorants as optional components.
- examples of such a colorant include dyes, organic pigments, and inorganic pigments, which can be used according to the purpose.
- the dye examples include azo dye, benzoquinone dye, naphthoquinone dye, anthraquinone dye, cyanine dye, squarylium dye, croconium dye, merocyanine dye, stilbene dye, diphenylmethane dye, triphenylmethane dye, fluorane dye, spiropyran dye, phthalocyanine dye, Examples include indigo dyes, fulgide dyes, nickel complex dyes, and azulene dyes.
- C.I. I. Pigment Yellow 20 24, 86, 93, 109, 110, 117, 125, 137, 138, 147, 148, 153, 154, 166, C.I. I. Pigment orange 36, 43, 51, 55, 59, 61, C.I. I. Pigment Red 9, 97, 122, 123, 149, 168, 177, 180, 192, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, C.I. I. Pigment violet 19, 23, 29, 30, 37, 40, 50, C.I. I. Pigment Blue 15, 15: 1, 15: 4, 22, 60, 64, C.I. I. Pigment green 7, C.I. I. And CI pigment brown 23, 25, 26.
- thermosetting agent it is preferable to contain a thermosetting agent in the photosensitive resin composition of the present invention because the composition can be cured by heating.
- a thermal radical generator can be used.
- the thermal radical generator include organic peroxides, and specifically include dicumyl peroxide, 2,5-dimethyl-2,5-di (tert-butylperoxy) hexane, and tert-butyl.
- Organic peroxides such as cumyl peroxide, di-tert-butyl peroxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, etc. having a 10-hour half-life temperature of 100 to 170 ° C. Can be mentioned.
- thermosetting agent is based on 100 parts by mass of the total amount of the binder resin (A), the quinonediazide compound (B), the black colorant (C), and other solids (excluding the thermosetting agent). 0.1 to 5 parts by mass, more preferably 0.5 to 3 parts by mass.
- the photosensitive resin composition of the present invention can further contain, as an optional component, for example, a surfactant in order to improve applicability or developability of the coating film.
- a surfactant in order to improve applicability or developability of the coating film.
- surfactants include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleyl ether; polyoxyethylene octyl phenyl ether, polyoxyethylene nonyl phenyl ether Polyoxyethylene aryl ethers such as polyoxyethylene dilaurate, nonoxy surfactants such as polyoxyethylene dialkyl esters such as polyoxyethylene distearate; Megafac® F-251, F-281, F-430, F-444, R-40, F-553, F-554, F-555, F-556, F-557, F-558, F-559 ( Above, product name, manufactured by DIC Corporation), -Fluorosurfact
- Such a surfactant is based on a total amount of 100 parts by mass of the binder resin (A), the quinonediazide compound (B), the black colorant (C), and other solids (excluding the surfactant).
- the amount is preferably 2 parts by mass or less, more preferably 1 part by mass or less.
- the photosensitive resin composition of the present invention is preferably dissolved in a solvent and used in the form of a solution from the viewpoint of applicability to a substrate.
- a binder resin is dissolved in a solvent, and a quinonediazide compound, a black colorant and, if necessary, additives such as a thermosetting agent and a surfactant are mixed in a certain ratio, so that a photosensitivity in a solution state is obtained.
- Resin composition can be prepared.
- an appropriate solid content concentration can be adopted.
- the solid content concentration can be 1 to 60% by mass, preferably 3 to 50% by mass, and more preferably 5 to 40% by mass.
- the solvent examples include glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol dimethyl ether, ethylene glycol methyl ethyl ether, and ethylene glycol monoethyl ether, ethylene glycol alkyl ether acetates such as methyl cellosolve acetate and ethyl cellosolve acetate, diethylene glycol monomethyl ether, Diethylene glycols such as diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol monoethyl ether and diethylene glycol monobutyl ether, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate and other propylene glycol Glycol ethers, aromatic hydrocarbons such as toluene and xylene, ketones such as methyl ethyl ketone, methyl amyl ketone, cyclohe
- the binder resin (A), the quinonediazide compound (B), the black colorant (C), and other components as necessary are dissolved or dispersed in the solvent and mixed.
- an appropriate solid content concentration can be adopted, and for example, the solid content concentration can be 10 to 60% by mass.
- the prepared solution of the composition is usually filtered before use. Examples of the filtration means include a membrane filter having a pore diameter of 0.05 to 1.0 ⁇ m.
- the photosensitive resin composition of the present invention thus prepared is also excellent in long-term storage stability.
- the pigment dispersion can be produced by mixing a pigment, a solvent, and, if necessary, a dispersant.
- a disperser used to disintegrate or disperse the pigments.
- Ball types such as ball mills, sand mills, bead mills, paint shakers, rocking mills, blades such as kneaders, paddle mixers, planetary mixers, Henschel mixers, etc.
- Examples thereof include a roll type such as a mold and a three-roll mixer, and other examples include a crushing machine, a colloid mill, an ultrasonic wave, a homogenizer, and a rotation / revolution mixer.
- a ball type that can stably and finely disperse in a short time is preferable.
- the material of the ball used in the ball mold include glass, silicon nitride, alumina, zircon, zirconia, and steel.
- As the bead diameter a general shape having a diameter of 0.03 to 25 mm can be used, but a small diameter of 5 mm or less is preferable from the viewpoint of miniaturization.
- the order of addition when preparing the dispersion is not particularly limited, but the following order is desirable in order to obtain a good dispersion.
- the solvent and the dispersant are uniformly dispersed.
- uniformly dispersing the solvent and the dispersant in advance it is possible to suppress problems such as partial aggregation of particles caused by areas with a high concentration of the dispersant.
- the required amount of pigment is then placed in the previously prepared solution and finally the beads.
- preliminary dispersion may be performed.
- a binder resin or other resin component may be used for the purpose of compatibility with the resin and suppression of reaggregation of the pigment.
- a photosensitive resin composition in a solution state can be prepared by mixing additives such as a thermosetting agent and a surfactant in a predetermined ratio.
- the stirrer for mixing the pigment dispersion, binder resin, quinonediazide compound, and optional components is not particularly limited.
- Ball types such as ball mill, sand mill, bead mill, paint shaker, rocking mill, kneader, paddle mixer And blade types such as planetary mixers and Henschel mixers, and roll types such as three roll mixers.
- Other examples include crushing machines, colloid mills, ultrasonic waves, homogenizers, rotation / revolution mixers, and mechanical stirrers. When used at a laboratory level, a mechanical stirrer is preferable because it can be stably mixed in a short time.
- the stirring blade used at the time of stirring can be appropriately selected from a fan, a propeller, a cross, a turbine, a dragonfly type, and the like.
- a resin composition can be obtained by mixing a pigment dispersion or a binder resin solution and stirring at room temperature for 1 to 10 minutes at a rotation speed of 10 to 1000 rpm. It is preferable to filter the prepared composition liquid before use. Examples of the filtration means include a membrane filter having a pore diameter of 0.05 to 1.0 ⁇ m.
- the photosensitive resin composition of the present invention thus prepared is also excellent in long-term storage stability.
- the photosensitive resin composition of the present invention When the photosensitive resin composition of the present invention is used for, for example, positive type radiation lithography, first, the photosensitive resin composition of the present invention dissolved in a solvent is applied to the substrate surface, and the solvent is heated by means such as heating. Can be removed to form a coating film.
- the method for applying the photosensitive resin composition to the substrate surface is not particularly limited, and various methods such as a spray method, a roll coating method, a slit method, and a spin coating method can be employed.
- the solvent is usually dried by heating (pre-baking) to form a coating film.
- the heating conditions vary depending on the type of each component, the blending ratio, etc., but it is usually applied by heating at 70 to 130 ° C. for a predetermined time, for example, 1 to 20 minutes on a hot plate or 3 to 60 minutes in an oven.
- a membrane can be obtained.
- the pre-baked coating film is irradiated with radiation (eg, visible light, ultraviolet light, far ultraviolet light, etc.) through a mask having a predetermined pattern (exposure process), and then developed with a developer to remove unnecessary portions.
- radiation eg, visible light, ultraviolet light, far ultraviolet light, etc.
- Exposure process e.g., a predetermined pattern
- developer process e.g., a developer to remove unnecessary portions.
- preferable radiation is ultraviolet to visible light having a wavelength of 250 to 450 nm.
- Examples of the developer include inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, and aqueous ammonia; primary amines such as ethylamine and n-propylamine; Secondary amines such as n-propylamine; tertiary amines such as triethylamine and methyldiethylamine; alcohol amines such as dimethylethanolamine and triethanolamine; tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline Quaternary ammonium salts such as pyrrole, piperidine, cyclic amines such as 1,8-diazabicyclo [5.4.0] -7-undecene, 1,5-diazabicyclo [4.3.0] -5-nonane Use aqueous solutions of alkalis such as It can be.
- inorganic alkalis such as sodium hydroxide, potassium hydro
- the concentration is not particularly limited but is preferably 0.5 to 5.0% by mass.
- An aqueous solution obtained by adding an appropriate amount of a water-soluble organic solvent such as methanol or ethanol, a surfactant or the like to the alkaline aqueous solution can also be used as a developer.
- the developing time is usually 30 to 180 seconds, and the developing method may be any of a liquid filling method, a shower method, a dipping method and the like. After development, washing with running water is performed for 30 to 90 seconds, unnecessary portions are removed, and the pattern is formed by air drying with compressed air or compressed nitrogen. Thereafter, this pattern can be heat-treated at a predetermined temperature, for example, 120 to 350 ° C. for 20 to 200 minutes with a heating device such as a hot plate or an oven, but a coating film can be obtained. (Heat treatment process).
- the present invention includes (1) a coating process in which the photosensitive resin composition is dissolved in a solvent and applied to a substrate; (2) a drying process in which the solvent in the coated photosensitive resin composition is removed; 3) An exposure process of irradiating radiation through a photomask; (4) a development process of forming a pattern by alkali development; and (5) a heat treatment process of heating at a temperature of 100 to 350 ° C. Can be adopted. This method can be used, for example, for forming partition walls and insulating films of organic EL elements.
- a partition wall of an organic EL element made of a cured product of the photosensitive resin composition can be obtained.
- an insulating film of an organic EL element made of a cured product of the photosensitive resin composition can be obtained.
- an organic EL device containing a cured product of the photosensitive resin composition can be obtained.
- reaction liquid a1-1 This was dissolved in ⁇ -butyrolactone to obtain a resin liquid having a solid content of 20% by mass (resin liquid a1-1).
- the number average molecular weight of the obtained reaction product was 12400, and the weight average molecular weight was 21100.
- the obtained solution was dropped into 240 g of 1-methoxy-2-propyl acetate (manufactured by Daicel Corporation) in a 500 mL three-necked flask heated to 85 ° C. in a nitrogen gas atmosphere over 2 hours. The reaction was carried out at 0 ° C. for 3 hours. The reaction solution cooled to room temperature was dropped into 1800 g of toluene to precipitate a polymer. The precipitated polymer was recovered by filtration and vacuum dried at 80 ° C. for 15 hours to recover 129.7 g of a light yellow powder. This was dissolved in ⁇ -butyrolactone to obtain a resin liquid having a solid content of 20% by mass (resin liquid a1-2). The number average molecular weight of the obtained reaction product was 7500, and the weight average molecular weight was 11300.
- the obtained solution was dropped into 72.0 g of 1-methoxy-2-propyl acetate (manufactured by Daicel Corporation) heated to 85 ° C. under a nitrogen gas atmosphere in a 500 mL three-neck flask over 2 hours. Thereafter, the reaction was carried out at 85 ° C. for 5 hours.
- the reaction solution cooled to room temperature was dropped into 960 g of toluene to precipitate a polymer.
- the precipitated polymer was collected by filtration and vacuum dried at 90 ° C. for 9 hours to collect 37.8 g of white powder. This was dissolved in ⁇ -butyrolactone to obtain a resin liquid having a solid content of 20% by mass (resin liquid a1-3).
- the number average molecular weight of the obtained reaction product was 7400, and the weight average molecular weight was 14100.
- the weight average molecular weight and the number average molecular weight were calculated using a calibration curve prepared using a polystyrene standard substance under the following measurement conditions.
- Device name Shodex (registered trademark) GPC-101
- Binder resin As the binder resin, resin liquids a1-1 to a1-3, a2-1 to a2-3 synthesized according to Production Examples 1 to 6, and novolak phenol resin BRG-558 ( Resin liquid x1 prepared by adjusting the solid content to 20 mass% with ⁇ -butyrolactone was used.
- Table 1 shows materials other than the binder resin.
- Table 2 shows the ratio of the naphthoquinone diazide sulfonesulfonate group (DNQ) substituted with the phenolic hydroxyl group of the trivalent or higher valent phenol compound in the (B) quinone diazide adduct used.
- DNQ naphthoquinone diazide sulfonesulfonate group
- Examples 2 to 8, Comparative Examples 1 to 4 A positive photosensitive resin composition was prepared in the same manner as in Example 1 except that the composition shown in Table 3 was used.
- the unit of the numerical value of each component of the Example described in Table 3 is “g”
- the amount in parentheses is the amount of solid content (g).
- the positive photosensitive resin compositions prepared in each Example and each Comparative Example were evaluated for alkali developability, pattern formability, and OD value (optical density). The results are shown in Table 3.
- the evaluation method is as follows.
- the exposed coating film was subjected to alkali development with a 2.38 mass% tetramethylammonium hydroxide aqueous solution for 60 seconds using a spin developing device (AD-1200, manufactured by Takizawa Sangyo Co., Ltd.), and evaluated for alkali developability.
- a spin developing device AD-1200, manufactured by Takizawa Sangyo Co., Ltd.
- Alkali developability By observation using an optical microscope (VH-Z250, manufactured by Keyence Corporation), the case where there was no residue after alkali development was judged as “good”, and the case where there was a residue was judged as “impossible”.
- Evaluation of pattern formability was performed by measuring the line width of the pattern after alkali development. Using an optical microscope (VH-Z250, manufactured by Keyence Co., Ltd.), it was carried out by confirming the locations where the line width of the photomask line & space pattern was 10 ⁇ m. If the line width of the pattern line and the space pattern after alkali development is 1: 1, the line width of the line part is within ⁇ 10%, and other than “good” is “OK”, The pattern forming property was evaluated as “impossible”. In addition, in the item of pattern formability, those that were “impossible” in the evaluation of alkali developability were determined as “impossible to judge”.
- Each of the positive photosensitive resin compositions of Examples 1 to 8 and Comparative Examples 1 to 4 was applied to a glass substrate (size 100 mm ⁇ 100 mm ⁇ 0.7 mm) so as to have a thickness of about 1.3 ⁇ m.
- the solvent was dried by heating at 120 ° C. for 80 seconds.
- the coating film was obtained by making it harden
- the cured coating film was measured with a transmission densitometer (BMT-1, manufactured by Sakata Inx Engineering Co., Ltd.) and converted to an OD value per 1 ⁇ m.
- the thickness of the coating film was measured using an optical film thickness measuring device (F-20NIR, manufactured by Filmetrics Co., Ltd.).
- the black photosensitive resin composition of the present invention has high sensitivity, it can be suitably used for, for example, positive type radiation lithography.
- the organic EL element provided with the partition and insulating film formed from the black photosensitive resin composition of this invention is used suitably as an electronic component of the display apparatus which shows favorable contrast.
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Abstract
Description
[項目1](A)バインダー樹脂、(B)フェノール性水酸基を3つ以上有するフェノール化合物(以下「3価以上のフェノール化合物」ということがある。)のキノンジアジド付加体、及び(C)黒色着色剤を含み、
(B)キノンジアジド付加体は、
(b1)3価以上のフェノール化合物が有するフェノール性水酸基のうちの1つの水酸基が式(I)又は(II)で示される構造で置換されているキノンジアジド付加体、及び
(b2)3価以上のフェノール化合物が有するフェノール性水酸基のうちの2つの水酸基が式(I)又は(II)で示される構造で置換されているキノンジアジド付加体を含み、
(b1)及び(b2)の合計が(B)全体の60モル%以上である、感光性樹脂組成物。
(a1)アルカリ可溶性官能基を有する重合性単量体とその他の重合性単量体のアルカリ可溶性共重合体、及び(a2)エポキシ基とフェノール性水酸基とを有するアルカリ可溶性樹脂、からなる群から選ばれた少なくとも1種を含有する、項目1~4のいずれか一項に記載の感光性樹脂組成物。
項目1~6のいずれか一項に記載の感光性樹脂組成物の硬化物からなる有機EL素子の隔壁。
項目1~6のいずれか一項に記載の感光性樹脂組成物の硬化物を含む有機EL素子。
(1)項目1~6のいずれか一項に記載の感光性樹脂組成物を溶媒に溶かし、これを基材に塗布する塗布工程、
(2)塗布された感光性樹脂組成物中の溶媒を除去する乾燥工程、
(3)放射線をフォトマスク越しに照射する露光工程、
(4)アルカリ現像によりパターン形成する現像工程、及び
(5)100~350℃の温度で加熱する加熱処理工程
を含む放射線リソグラフィー構造物の製造方法。
本発明の感光性樹脂組成物において使用する、バインダー樹脂(A)としては、特に限定されないが、アルカリ可溶性官能基を有し、アルカリ可溶性であることが好ましい。バインダー樹脂が有するアルカリ可溶性官能基としては、特に限定されないが、カルボキシル基、アルコール性水酸基、フェノール性水酸基、スルホ基、リン酸基、酸無水物基等が挙げられ、2種以上のアルカリ可溶性官能基を併せ持つ樹脂を使用してもよい。バインダー樹脂としては、例えば、アクリル樹脂、スチレン樹脂、エポキシ樹脂、アミド樹脂、フェノール樹脂、ポリアミック酸樹脂等が挙げられる。これらは単独で、又は2種類以上の樹脂を組み合わせて用いることができる。
本発明のバインダー樹脂(A)としては、アルカリ可溶性基を有する重合性単量体とその他の重合性単量体のアルカリ可溶性共重合体(a1)を含むことが好ましい。該共重合体(a1)のアルカリ可溶性基としては、カルボキシル基、アルコール性水酸基、フェノール性水酸基、スルホ基、リン酸基、酸無水物基等を挙げることができる。アルカリ可溶性基を有する重合性単量体とその他の重合性単量体の共重合体は、例えば、アルカリ可溶性基を有する重合性単量体とその他の重合性単量体を、重合開始剤及びRAFT剤(Reversible Addition Fragmentation Transfer;可逆的付加開裂型連鎖移動剤)等でラジカル重合させることにより製造することができる。あるいはラジカル重合にて共重合体を合成した後に、アルカリ可溶性基を付加したものであってもよい。重合性単量体が有する重合性官能基としては、ラジカル重合性官能基を挙げることができる。具体的には、CH2=CH-、CH2=C(CH3)-、CH2=CHCO-、CH2=C(CH3)CO-、-OC-CH=CH-CO-などを例示できる。アルカリ可溶性基を有する重合性単量体としては、例えば、4-ヒドロキシスチレン、(メタ)アクリル酸、α-ブロモ(メタ)アクリル酸、α-クロル(メタ)アクリル酸、β-フリル(メタ)アクリル酸、β-スチリル(メタ)アクリル酸、マレイン酸、マレイン酸モノメチル、マレイン酸モノエチル、マレイン酸モノイソプロピル、フマル酸、ケイ皮酸、α-シアノケイ皮酸、イタコン酸、クロトン酸、プロピオール酸、4-ヒドロキシフェニルメタクリレート、3,5-ジメチル-4-ヒドロキシベンジルアクリルアミド、4-ヒドロキシフェニルアクリルアミド、4-ヒドロキシフェニルマレイミド、3-マレイミドプロピオン酸、4-マレイミド酪酸、6-マレイミドヘキサン酸等が挙げられる。
本発明のバインダー樹脂(A)として、エポキシ基とフェノール性水酸基とを有するアルカリ可溶性樹脂も挙げられる。該アルカリ可溶性樹脂は、例えば、1分子中に少なくとも2個のエポキシ基を有する化合物(以下、「エポキシ化合物」と表記することがある。)のエポキシ基と、ヒドロキシ安息香酸類のカルボキシル基を反応させることで得ることができる。本発明の感光性樹脂組成物において、前記アルカリ可溶性樹脂(a2)がエポキシ基を有することで、加熱時にフェノール性水酸基と反応して架橋し耐薬品性、耐熱性などが向上するという利点があり、フェノール性水酸基を有することでアルカリ水溶液に可溶になるという利点がある。
その他のアルカリ可溶性樹脂(a3)としては、例えば、フェノールノボラック樹脂、クレゾールノボラック樹脂、トリフェニルメタン型フェノール樹脂、フェノールアラルキル樹脂、ビフェニルアラルキルフェノール樹脂、フェノール-ジシクロペンタジエン共重合体樹脂等の公知のフェノール樹脂が挙げられる。これらの水酸基をアルケニルエーテル化し、さらにアルケニルエーテル基をクライゼン転位することにより得られるポリアルケニルフェノール樹脂をバインダー樹脂(A)として用いてもよい。
本発明の感光性樹脂組成物は、感放射線化合物として、3価以上のフェノール化合物のキノンジアジド付加体を含有する。このキノンジアジド付加体とは、例えば、式(III)で示される3価のフェノール化合物の場合、
等が挙げられる。
本発明の黒色着色剤としては、例えば、ソルベントブラック27~47のカラーインデックス(C.I.)で規定される黒色染料(c1)を使用することができる。黒色染料は、好ましくは、ソルベントブラック27、29又は34のC.I.で規定されるものである。ソルベントブラック27~47のC.I.で規定される染料のうち少なくとも1種類を黒色染料として用いた場合、焼成後の感光性樹脂組成物の膜の厚さ1μm当たりの光学濃度(OD値)を0.1~3.0にすることができ、より黒色に近い色を保つことができる。膜の厚さ1μm当たりの光学濃度(OD値)は、透過濃度計及び膜厚測定装置を用いて測定可能である。この利点から本発明の感光性樹脂組成物を有機ELディスプレイ等の表示装置の隔壁材として使用した場合、表示装置の視認性を向上させることができる。
本発明の感光性樹脂組成物は、任意成分として、分散剤、その他の着色剤、熱硬化剤、界面活性剤、溶媒等を添加することができる。なお、任意成分は(A)~(C)のいずれにも当てはまらないものと定義する。
チタンブラック等の顔料を分散させるために、分散剤を使用することも可能である。分散剤としては、公知のものが使用でき、例えば、商品名DISPERBYK-110、DISPERBYK-111(ビックケミー・ジャパン株式会社製)等、商品名ディスパロン(登録商標)PW-36、ディスパロン(登録商標)DA-375(楠本化成株式会社製)等のリン酸エステル類、ポリリン酸エステル類、リン酸ポリエステル類、ポリエーテルリン酸エステル類等のリン酸分散剤、商品名フローレンG-700、フローレンG-900、フローレンGW-1500(共栄社化学株式会社製)等のカルボキシル基含有ポリマー分散剤、商品名アジスパー(登録商標)PN411、アジスパー(登録商標)PA111(味の素ファインテクノ株式会社製)等の高級脂肪酸エステル分散剤が挙げられる。中でも骨格にグラフト鎖を有しない分散剤、例えば商品名DISPERBYK-110、DISPERBYK-111(ビックケミー・ジャパン株式会社製)等が好ましく用いられる。
本発明の感光性樹脂組成物は、さらに任意成分として、その他の着色剤を含有することができる。このような着色剤は、染料、有機顔料、無機顔料が挙げられるが、目的に合わせて用いることができる。
本発明の感光性樹脂組成物に熱硬化剤を含有することが、加熱により組成物を硬化させることができるため好ましい。熱硬化剤としては、熱ラジカル発生剤を使用することができる。好ましい熱ラジカル発生剤としては、有機過酸化物を挙げることができ、具体的にはジクミルパーオキサイド、2,5-ジメチル-2,5-ジ(tert-ブチルパーオキシ)ヘキサン、tert-ブチルクミルパーオキサイド、ジ-tert-ブチルパーオキシド、1,1,3,3-テトラメチルブチルハイドロパーオキサイド、クメンハイドロパーオキサイド等の10時間半減期温度が100~170℃の有機過酸化物等を挙げることができる。
本発明の感光性樹脂組成物は、さらに任意成分として、例えば塗布性を向上させるため、あるいは塗膜の現像性を向上させるために、界面活性剤を含有することができる。このような界面活性剤としては、例えば、ポリオキシエチレンラウリルエーテル、ポリオキシエチレンステアリルエーテル、ポリオキシエチレンオレイルエーテル等のポリオキシエチレンアルキルエーテル類;ポリオキシエチレンオクチルフェニルエーテル、ポリオキシエチレンノニルフェニルエーテル等のポリオキシエチレンアリールエーテル類;ポリオキシエチレンジラウレート、ポリオキシエチレンジステアレート等のポリオキシエチレンジアルキルエステル類等のノニオン界面活性剤;メガファック(登録商標)F-251、同F-281、同F-430、同F-444、同R-40、同F-553、同F-554、同F-555、同F-556、同F-557、同F-558、同F-559(以上、商品名、DIC株式会社製)、サーフロン(登録商標)S-242、同S-243、同S-420、同S-611(以上、商品名、ACGセイミケミカル株式会社製)等のフッ素系界面活性剤;オルガノシロキサンポリマーKP323、KP326、KP341(以上、商品名、信越化学工業株式会社製)等が挙げられる。これらは単独で用いてもよいし、2種以上用いることもできる。
本発明の感光性樹脂組成物は、溶媒に溶解されて溶液状態で用いられることが、基材への塗布性の面で好ましい。例えば、バインダー樹脂を溶媒に溶解し、この溶液に、キノンジアジド化合物、黒色着色剤、必要に応じて熱硬化剤、界面活性剤等の添加剤を一定の割合で混合することにより、溶液状態の感光性樹脂組成物を調製することができる。使用目的により、適宜の固形分濃度を採用することができるが、例えば、固形分濃度1~60質量%、好ましくは3~50質量%、さらに好ましくは5~40質量%とすることができる。
本発明の感光性樹脂組成物は、前記のバインダー樹脂(A)、キノンジアジド化合物(B)、黒色着色剤(C)、及び必要に応じてその他の成分を前記の溶媒に溶解又は分散して混合することにより調製することができる。使用目的により、適宜の固形分濃度を採用することができるが、例えば、固形分濃度10~60質量%とすることができる。調製された組成物の溶液は、通常、使用前にろ過される。ろ過の手段としては、例えば孔径0.05~1.0μmのメンブレンフィルター等が挙げられる。このように調製された本発明の感光性樹脂組成物は、長期間の貯蔵安定性にも優れている。
顔料を混合する際は、前記のバインダー樹脂(A)及びキノンジアジド化合物(B)と混合する前に顔料を溶媒に分散させておくことが好ましい。顔料分散液は、顔料、溶媒、及び必要に応じて分散剤を混合することで製造できる。顔料を解砕・分散する際の分散機としては特に限定されるものではなく、ボールミル、サンドミル、ビーズミル、ペイントシェーカー、ロッキングミルなどのボール型、ニーダー、パドルミキサー、プラネタリミキサー、ヘンシェルミキサーなどのブレード型、3本ロールミキサーなどのロール型、その他として擂潰(ライカイ)機、コロイドミル、超音波、ホモジナイザー、自転・公転ミキサーなどが挙げられる。この中でも、安定して短時間で微分散が可能なボール型が好ましい。このボール型に使用するボールの材質としては、ガラス、窒化珪素、アルミナ、ジルコン、ジルコニア、スチールなどが挙げられる。ビーズ径としては、直径0.03~25mmの一般的な形状のものが使用できるが、微細化の観点からは直径5mm以下の小径が好ましい。
本発明の感光性樹脂組成物を、例えば、ポジ型の放射線リソグラフィー用に使用する場合、まず、溶媒に溶かした本発明の感光性樹脂組成物を基板表面に塗布し、加熱等の手段により溶媒を除去して、塗膜を形成することができる。基板表面への感光性樹脂組成物の塗布方法は特に限定されず、例えばスプレー法、ロールコート法、スリット法、回転塗布法等の各種の方法を採用することができる。
[製造例1]アルカリ可溶性官能基を有する重合性単量体とその他の重合性単量体のアルカリ可溶性共重合体(成分a1-1)の製造
4-ヒドロキシフェニルメタクリレート(昭和電工株式会社製「PQMA」)76.8g、N-シクロヘキシルマレイミド(株式会社日本触媒製)28.8g、重合開始剤としてV-601(和光純薬工業株式会社製)1.80g、RAFT剤としてS-ドデシル-S’-(α,α’-ジメチル-α”-酢酸)トリチオカルボナート(シグマアルドリッチ製「723010」)1.92gを、1-メトキシ-2-プロピルアセテート(株式会社ダイセル製)180gに完全に溶解させた。得られた溶液を、500mLの3つ口型フラスコ中、窒素ガス雰囲気下で85℃に加熱した1-メトキシ-2-プロピルアセテート(株式会社ダイセル製)180gに2時間かけて滴下し、その後85℃で3時間反応させた。室温まで冷却した反応溶液を1200gのトルエン中に滴下し、重合体を沈殿させた。沈殿した重合体をろ過により回収し、80℃で15時間真空乾燥し薄黄色の粉体を104.4g回収した。これをγ-ブチロラクトンに溶解し、固形分20質量%の樹脂液を得た(樹脂液a1-1)。得られた反応物の数平均分子量は12400、重量平均分子量は21100であった。
4-ヒドロキシフェニルメタクリレート(昭和電工株式会社製「PQMA」)102.4g、N-シクロヘキシルマレイミド(株式会社日本触媒製)38.4g、重合開始剤としてV-601(和光純薬工業株式会社製)3.54g、RAFT剤としてS-ドデシル-S’-(α,α’-ジメチル-α”-酢酸)トリチオカルボナート(シグマアルドリッチ製「723010」)7.58gを、1-メトキシ-2-プロピルアセテート(株式会社ダイセル製)240gに完全に溶解させた。得られた溶液を、500mLの3つ口型フラスコ中、窒素ガス雰囲気下で85℃に加熱した1-メトキシ-2-プロピルアセテート(株式会社ダイセル製)240gに2時間かけて滴下し、その後85℃で3時間反応させた。室温まで冷却した反応溶液を1800gのトルエン中に滴下し、重合体を沈殿させた。沈殿した重合体をろ過により回収し、80℃で15時間真空乾燥し薄黄色の粉体を129.7g回収した。これをγ-ブチロラクトンに溶解し、固形分20質量%の樹脂液を得た(樹脂液a1-2)。得られた反応物の数平均分子量は7500、重量平均分子量は11300であった。
4-ヒドロキシフェニルメタクリレート(昭和電工株式会社製「PQMA」)33.0g、N-シクロヘキシルマレイミド(株式会社日本触媒製)9.29g、重合開始剤としてV-601(和光純薬工業株式会社製)4.31gを、1-メトキシ-2-プロピルアセテート(株式会社ダイセル製)108gに完全に溶解させた。得られた溶液を、500mLの3つ口型フラスコ中、窒素ガス雰囲気下で85℃に加熱した1-メトキシ-2-プロピルアセテート(株式会社ダイセル製)72.0gに2時間かけて滴下し、その後85℃で5時間反応させた。室温まで冷却した反応溶液を960gのトルエン中に滴下し、重合体を沈殿させた。沈殿した重合体をろ過により回収し、90℃で9時間真空乾燥し白色の粉体を37.8g回収した。これをγ-ブチロラクトンに溶解し、固形分20質量%の樹脂液を得た(樹脂液a1-3)。得られた反応物の数平均分子量は7400、重量平均分子量は14100であった。
300mLの3つ口型フラスコに溶剤としてγ-ブチロラクトン(三菱化学株式会社製)60g、1分子中に少なくとも2個のエポキシ基を有する化合物としてEPICLON(登録商標)N-695(DIC株式会社製クレゾールノボラック型エポキシ樹脂、エポキシ当量210)を42g仕込み、窒素ガス雰囲気下、60℃で溶解させた。そこへヒドロキシ安息香酸類として3,5-ジヒドロキシ安息香酸(和光純薬工業株式会社製)を15.5g(0.10mol、エポキシ1当量に対して0.5当量)、反応触媒としてトリフェニルホスフィン(北興化学工業株式会社製)を0.2g(0.76mmol)追加し、110℃で12時間反応させた。反応溶液を室温に戻し、γ-ブチロラクトンで固形分20質量%に希釈し、溶液をろ過して260g回収した(樹脂液a2-1)。得られた反応物の数平均分子量は2400、重量平均分子量は5600であった。
3,5-ジヒドロキシ安息香酸(和光純薬工業株式会社製)を21.7g(0.14mol、エポキシ1当量に対して0.7当量)使用し、110℃で24時間反応させた以外は製造例4と同様の方法で樹脂液a2-2を得た。得られた反応物の数平均分子量は3200、重量平均分子量は9000であった。
1分子中に少なくとも2個のエポキシ基を有する化合物としてEPICLON(登録商標)N-770(DIC株式会社製クレゾールノボラック型エポキシ樹脂、エポキシ当量188)を37.6g、3,5-ジヒドロキシ安息香酸(ハイケム株式会社製)を20.1g(0.13mol、エポキシ1当量に対して0.65当量)使用し、110℃で24時間反応させた以外は製造例4と同様の方法で樹脂液a2-3を得た。得られた反応物の数平均分子量は2400、重量平均分子量は8300であった。
装置名:Shodex(登録商標)GPC-101
カラム:Shodex(登録商標)LF-804
移動相:テトラヒドロフラン
流速:1.0mL/min
検出器:Shodex(登録商標)RI-71
温度:40℃
(A)バインダー樹脂
(A)バインダー樹脂として、製造例1~6により合成した樹脂液a1-1~a1-3、a2-1~a2-3、及びノボラックフェノール樹脂BRG-558(アイカSDKフェノール株式会社製)をγ-ブチロラクトンで固形分20質量%に調整した樹脂液x1を使用した。
[実施例1]
樹脂液a2-2を20g(固形分4g)、樹脂液a1-1を5.0g(固形分1.0g)、樹脂液a1-2を9.0g(固形分1.8g)及び樹脂液x1を1.0g(固形分0.2g)混合、溶解し、キノンジアジド化合物としてTS-100Gを15g、黒色着色剤としてVALIFAST(登録商標) BLACK 3804を4.3g、及び界面活性剤としてサーフロン(登録商標)S-386を0.022g加え、さらに混合を行った。溶解を目視で確認した後、孔径0.22μmのメンブレンフィルターで濾過し、固形分濃度12質量%のポジ型感光性樹脂組成物を調製した。
表3に記載の組成にした以外は、実施例1と同様の方法によりポジ型感光性樹脂組成物を調製した。なお、表3中に記載の実施例の各成分の数字の単位は「g」であり、()内は固形分の量(g)である。
ガラス基板(大きさ100mm×100mm×0.7mm)に、実施例1~8及び比較例1~4のポジ型感光性樹脂組成物を乾燥膜厚が1.8~2μmになるように各々バーコートし、120℃で80秒溶剤を乾燥した。さらに超高圧水銀ランプを組み込んだ露光装置(商品名マルチライトML-251A/B、ウシオ電機株式会社製)で石英製のフォトマスクを介して100mJ/cm2露光した。露光量は紫外線積算光量計(商品名UIT-150 受光部 UVD-S365、ウシオ電機株式会社製)を用いて測定した。露光した塗膜は、スピン現像装置(AD-1200、滝沢産業株式会社製)を用い2.38質量%テトラメチルアンモニウムハイドロオキサイド水溶液で60秒間アルカリ現像を行ない、アルカリ現像性の評価を行った。光学顕微鏡(VH-Z250、株式会社キーエンス製)を用いた観察で、アルカリ現像後の残渣がない場合を「良好」、残渣があった場合を「不可」として判定した。
ガラス基板(大きさ100mm×100mm×0.7mm)に、実施例1~8及び比較例1~4のポジ型感光性樹脂組成物を約1.3μmになるように各々塗布し、ホットプレート上120℃で80秒加熱し溶媒を乾燥した。その後、窒素ガス雰囲気下250℃で60分硬化させることにより塗膜を得た。硬化後の塗膜を透過濃度計(BMT-1、サカタインクスエンジニアリング株式会社製)で測定し、1μm当たりのOD値に換算した。なお、塗膜の厚みは光学式膜厚測定装置(F-20NIR、フィルメトリクス株式会社製)を用いて測定した。
Claims (10)
- (A)バインダー樹脂、(B)フェノール性水酸基を3つ以上有するフェノール化合物(以下「3価以上のフェノール化合物」ということがある。)のキノンジアジド付加体、及び(C)黒色着色剤を含み、
(B)キノンジアジド付加体は、
(b1)3価以上のフェノール化合物が有するフェノール性水酸基のうちの1つの水酸基が式(I)又は(II)で示される構造で置換されているキノンジアジド付加体、及び
(b2)3価以上のフェノール化合物が有するフェノール性水酸基のうちの2つの水酸基が式(I)又は(II)で示される構造で置換されているキノンジアジド付加体を含み、
(b1)及び(b2)の合計が(B)全体の60モル%以上である、感光性樹脂組成物。
- 3価以上のフェノール化合物が芳香環を3つ以上有する、請求項1に記載の感光性樹脂組成物。
- (B)キノンジアジド付加体の総量100質量部に対して、(A)バインダー樹脂の含有量が100~1000質量部、及び(C)黒色着色剤の含有量が15~750質量部である、請求項1~3のいずれか一項に記載の感光性樹脂組成物。
- バインダー樹脂(A)が、
(a1)アルカリ可溶性官能基を有する重合性単量体とその他の重合性単量体のアルカリ可溶性共重合体、及び(a2)エポキシ基とフェノール性水酸基を有するアルカリ可溶性樹脂、からなる群から選ばれた少なくとも1種を含有する、請求項1~4のいずれか一項に記載の感光性樹脂組成物。 - (C)黒色着色剤が
(c1)ソルベントブラック27~47のカラーインデックスで規定される黒色染料、及び
(c2)チタンブラック
からなる群から選ばれた少なくとも1種を含む、請求項1~5のいずれか一項に記載の感光性樹脂組成物。 - 請求項1~6のいずれか一項に記載の感光性樹脂組成物の硬化物からなる有機EL素子の絶縁膜。
- 請求項1~6のいずれか一項に記載の感光性樹脂組成物の硬化物からなる有機EL素子の隔壁。
- 請求項1~6のいずれか一項に記載の感光性樹脂組成物の硬化物を含む有機EL素子。
- (1)請求項1~6のいずれか一項に記載の感光性樹脂組成物を溶媒に溶かし、これを基材に塗布する塗布工程、
(2)塗布された感光性樹脂組成物中の溶媒を除去する乾燥工程、
(3)放射線をフォトマスク越しに照射する露光工程、
(4)アルカリ現像によりパターン形成する現像工程、及び
(5)100~350℃の温度で加熱する加熱処理工程
を含む放射線リソグラフィー構造物の製造方法。
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JP7171845B2 (ja) | 2022-11-15 |
TW201901297A (zh) | 2019-01-01 |
JP7051818B2 (ja) | 2022-04-11 |
KR20190087606A (ko) | 2019-07-24 |
JPWO2018186494A1 (ja) | 2019-11-07 |
CN110352384B (zh) | 2023-04-25 |
KR102424545B1 (ko) | 2022-07-25 |
US20200033726A1 (en) | 2020-01-30 |
CN110352384A (zh) | 2019-10-18 |
TWI683182B (zh) | 2020-01-21 |
KR102361258B1 (ko) | 2022-02-10 |
JP2021170132A (ja) | 2021-10-28 |
KR20220025100A (ko) | 2022-03-03 |
US11561469B2 (en) | 2023-01-24 |
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