WO2020246517A1 - ポジ型感光性樹脂組成物、及び有機el素子隔壁 - Google Patents
ポジ型感光性樹脂組成物、及び有機el素子隔壁 Download PDFInfo
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- WO2020246517A1 WO2020246517A1 PCT/JP2020/021996 JP2020021996W WO2020246517A1 WO 2020246517 A1 WO2020246517 A1 WO 2020246517A1 JP 2020021996 W JP2020021996 W JP 2020021996W WO 2020246517 A1 WO2020246517 A1 WO 2020246517A1
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- resin
- acid
- resin composition
- photosensitive resin
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- 239000011342 resin composition Substances 0.000 title claims abstract description 127
- 238000005192 partition Methods 0.000 title claims description 23
- 229920005989 resin Polymers 0.000 claims abstract description 250
- 239000011347 resin Substances 0.000 claims abstract description 250
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 145
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 144
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 56
- 239000003086 colorant Substances 0.000 claims abstract description 42
- 239000000049 pigment Substances 0.000 claims abstract description 28
- -1 hydroxybenzoic acid compound Chemical class 0.000 claims description 127
- 125000004432 carbon atom Chemical group C* 0.000 claims description 69
- 150000001875 compounds Chemical class 0.000 claims description 43
- 125000000217 alkyl group Chemical group 0.000 claims description 41
- 239000000178 monomer Substances 0.000 claims description 40
- 239000000975 dye Substances 0.000 claims description 35
- 125000000524 functional group Chemical group 0.000 claims description 31
- 229920001577 copolymer Polymers 0.000 claims description 30
- 239000003822 epoxy resin Substances 0.000 claims description 28
- 229920000647 polyepoxide Polymers 0.000 claims description 28
- 239000004593 Epoxy Substances 0.000 claims description 27
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 23
- 239000007864 aqueous solution Substances 0.000 claims description 20
- 125000003545 alkoxy group Chemical group 0.000 claims description 19
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 19
- 125000005843 halogen group Chemical group 0.000 claims description 15
- 229920003986 novolac Polymers 0.000 claims description 15
- 239000000047 product Substances 0.000 claims description 15
- 125000006165 cyclic alkyl group Chemical group 0.000 claims description 11
- 239000007795 chemical reaction product Substances 0.000 claims description 6
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000011161 development Methods 0.000 abstract description 17
- 230000018109 developmental process Effects 0.000 abstract description 17
- 230000007261 regionalization Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 83
- 239000000126 substance Substances 0.000 description 40
- 239000002253 acid Substances 0.000 description 33
- 238000010438 heat treatment Methods 0.000 description 32
- 239000000243 solution Substances 0.000 description 31
- 239000003513 alkali Substances 0.000 description 27
- 238000004519 manufacturing process Methods 0.000 description 27
- 239000002904 solvent Substances 0.000 description 27
- 238000000576 coating method Methods 0.000 description 25
- 239000007787 solid Substances 0.000 description 25
- 239000011248 coating agent Substances 0.000 description 23
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 22
- 239000000203 mixture Substances 0.000 description 19
- 230000035945 sensitivity Effects 0.000 description 19
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 239000002585 base Substances 0.000 description 18
- 238000004090 dissolution Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 15
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 15
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 15
- 230000005855 radiation Effects 0.000 description 15
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 14
- 125000003118 aryl group Chemical group 0.000 description 13
- 229910001873 dinitrogen Inorganic materials 0.000 description 13
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 12
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 11
- 239000004094 surface-active agent Substances 0.000 description 11
- UYEMGAFJOZZIFP-UHFFFAOYSA-N 3,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC(O)=C1 UYEMGAFJOZZIFP-UHFFFAOYSA-N 0.000 description 10
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 description 10
- 229910052731 fluorine Inorganic materials 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 10
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 10
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 10
- 239000012298 atmosphere Substances 0.000 description 9
- 229910052801 chlorine Inorganic materials 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 9
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 8
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 8
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 8
- 229910052740 iodine Inorganic materials 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 125000000623 heterocyclic group Chemical group 0.000 description 7
- 230000001965 increasing effect Effects 0.000 description 7
- 239000003505 polymerization initiator Substances 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical compound [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000003377 acid catalyst Substances 0.000 description 6
- 230000003321 amplification Effects 0.000 description 6
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid group Chemical group C(C1=CC=CC=C1)(=O)O WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 6
- 125000001309 chloro group Chemical group Cl* 0.000 description 6
- 239000008199 coating composition Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 238000001914 filtration Methods 0.000 description 6
- 125000001153 fluoro group Chemical group F* 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 6
- 229910052753 mercury Inorganic materials 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 238000003199 nucleic acid amplification method Methods 0.000 description 6
- 239000012788 optical film Substances 0.000 description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 239000003223 protective agent Substances 0.000 description 5
- 230000004580 weight loss Effects 0.000 description 5
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 4
- UIAFKZKHHVMJGS-UHFFFAOYSA-N 2,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1O UIAFKZKHHVMJGS-UHFFFAOYSA-N 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 4
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 125000004018 acid anhydride group Chemical group 0.000 description 4
- 229930003836 cresol Natural products 0.000 description 4
- 125000004093 cyano group Chemical group *C#N 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical group CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 125000003709 fluoroalkyl group Chemical group 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 125000001624 naphthyl group Chemical group 0.000 description 4
- 150000002923 oximes Chemical class 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- RLUCXJBHKHIDSP-UHFFFAOYSA-N propane-1,2-diol;propanoic acid Chemical compound CCC(O)=O.CC(O)CO RLUCXJBHKHIDSP-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 150000003384 small molecules Chemical class 0.000 description 4
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 4
- 235000017557 sodium bicarbonate Nutrition 0.000 description 4
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 4
- DYHSDKLCOJIUFX-UHFFFAOYSA-N tert-butoxycarbonyl anhydride Chemical compound CC(C)(C)OC(=O)OC(=O)OC(C)(C)C DYHSDKLCOJIUFX-UHFFFAOYSA-N 0.000 description 4
- 125000005931 tert-butyloxycarbonyl group Chemical group [H]C([H])([H])C(OC(*)=O)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 description 4
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- PJMXUSNWBKGQEZ-UHFFFAOYSA-N (4-hydroxyphenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=C(O)C=C1 PJMXUSNWBKGQEZ-UHFFFAOYSA-N 0.000 description 3
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 3
- WXTMDXOMEHJXQO-UHFFFAOYSA-N 2,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC=C1O WXTMDXOMEHJXQO-UHFFFAOYSA-N 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UJTRCPVECIHPBG-UHFFFAOYSA-N 3-cyclohexylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C2CCCCC2)=C1 UJTRCPVECIHPBG-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 239000005711 Benzoic acid Substances 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 125000004423 acyloxy group Chemical group 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 3
- 235000010233 benzoic acid Nutrition 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 235000013985 cinnamic acid Nutrition 0.000 description 3
- 229930016911 cinnamic acid Natural products 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000011630 iodine Substances 0.000 description 3
- 150000003951 lactams Chemical class 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 3
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 230000003472 neutralizing effect Effects 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 3
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 3
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920002577 polybenzoxazole Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 229920005990 polystyrene resin Polymers 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 2
- 229940105324 1,2-naphthoquinone Drugs 0.000 description 2
- OVGRCEFMXPHEBL-UHFFFAOYSA-N 1-ethenoxypropane Chemical group CCCOC=C OVGRCEFMXPHEBL-UHFFFAOYSA-N 0.000 description 2
- JKTCBAGSMQIFNL-UHFFFAOYSA-N 2,3-dihydrofuran Chemical compound C1CC=CO1 JKTCBAGSMQIFNL-UHFFFAOYSA-N 0.000 description 2
- GLDQAMYCGOIJDV-UHFFFAOYSA-N 2,3-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1O GLDQAMYCGOIJDV-UHFFFAOYSA-N 0.000 description 2
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 2
- AKEUNCKRJATALU-UHFFFAOYSA-N 2,6-dihydroxybenzoic acid Chemical compound OC(=O)C1=C(O)C=CC=C1O AKEUNCKRJATALU-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- AISZNMCRXZWVAT-UHFFFAOYSA-N 2-ethylsulfanylcarbothioylsulfanyl-2-methylpropanenitrile Chemical compound CCSC(=S)SC(C)(C)C#N AISZNMCRXZWVAT-UHFFFAOYSA-N 0.000 description 2
- MIRQGKQPLPBZQM-UHFFFAOYSA-N 2-hydroperoxy-2,4,4-trimethylpentane Chemical compound CC(C)(C)CC(C)(C)OO MIRQGKQPLPBZQM-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 2
- YQUVCSBJEUQKSH-UHFFFAOYSA-N 3,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(O)=C1 YQUVCSBJEUQKSH-UHFFFAOYSA-N 0.000 description 2
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 2
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 0 C*(CC1OC1)c1ccccc1 Chemical compound C*(CC1OC1)c1ccccc1 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- JGFZNNIVVJXRND-UHFFFAOYSA-N N,N-Diisopropylethylamine (DIPEA) Chemical compound CCN(C(C)C)C(C)C JGFZNNIVVJXRND-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 239000012987 RAFT agent Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- CUFNKYGDVFVPHO-UHFFFAOYSA-N azulene Chemical compound C1=CC=CC2=CC=CC2=C1 CUFNKYGDVFVPHO-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- 229940114055 beta-resorcylic acid Drugs 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000007809 chemical reaction catalyst Substances 0.000 description 2
- DCFKHNIGBAHNSS-UHFFFAOYSA-N chloro(triethyl)silane Chemical compound CC[Si](Cl)(CC)CC DCFKHNIGBAHNSS-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 125000006343 heptafluoro propyl group Chemical group 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- CKMXAIVXVKGGFM-UHFFFAOYSA-N p-cumic acid Chemical compound CC(C)C1=CC=C(C(O)=O)C=C1 CKMXAIVXVKGGFM-UHFFFAOYSA-N 0.000 description 2
- 125000006340 pentafluoro ethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 229940124530 sulfonamide Drugs 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- HGXJDMCMYLEZMJ-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOOC(=O)C(C)(C)C HGXJDMCMYLEZMJ-UHFFFAOYSA-N 0.000 description 1
- QBYIENPQHBMVBV-HFEGYEGKSA-N (2R)-2-hydroxy-2-phenylacetic acid Chemical compound O[C@@H](C(O)=O)c1ccccc1.O[C@@H](C(O)=O)c1ccccc1 QBYIENPQHBMVBV-HFEGYEGKSA-N 0.000 description 1
- FEIQOMCWGDNMHM-KBXRYBNXSA-N (2e,4e)-5-phenylpenta-2,4-dienoic acid Chemical compound OC(=O)\C=C\C=C\C1=CC=CC=C1 FEIQOMCWGDNMHM-KBXRYBNXSA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- 239000001124 (E)-prop-1-ene-1,2,3-tricarboxylic acid Substances 0.000 description 1
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- QYGBYAQGBVHMDD-XQRVVYSFSA-N (z)-2-cyano-3-thiophen-2-ylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C/C1=CC=CS1 QYGBYAQGBVHMDD-XQRVVYSFSA-N 0.000 description 1
- FWUIHQFQLSWYED-ARJAWSKDSA-N (z)-4-oxo-4-propan-2-yloxybut-2-enoic acid Chemical compound CC(C)OC(=O)\C=C/C(O)=O FWUIHQFQLSWYED-ARJAWSKDSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- GEWWCWZGHNIUBW-UHFFFAOYSA-N 1-(4-nitrophenyl)propan-2-one Chemical compound CC(=O)CC1=CC=C([N+]([O-])=O)C=C1 GEWWCWZGHNIUBW-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- WHFHDVDXYKOSKI-UHFFFAOYSA-N 1-ethenyl-4-ethylbenzene Chemical compound CCC1=CC=C(C=C)C=C1 WHFHDVDXYKOSKI-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- CAQYAZNFWDDMIT-UHFFFAOYSA-N 1-ethoxy-2-methoxyethane Chemical compound CCOCCOC CAQYAZNFWDDMIT-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- CDPPYCZVWYZBJH-UHFFFAOYSA-N 2,2,3,3-tetramethylbutanedioic acid Chemical compound OC(=O)C(C)(C)C(C)(C)C(O)=O CDPPYCZVWYZBJH-UHFFFAOYSA-N 0.000 description 1
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- BRRSNXCXLSVPFC-UHFFFAOYSA-N 2,3,4-Trihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(O)=C1O BRRSNXCXLSVPFC-UHFFFAOYSA-N 0.000 description 1
- 229940082044 2,3-dihydroxybenzoic acid Drugs 0.000 description 1
- COXCGWKSEPPDAA-UHFFFAOYSA-N 2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)C#N COXCGWKSEPPDAA-UHFFFAOYSA-N 0.000 description 1
- VRMKFAFIVOVETG-UHFFFAOYSA-N 2,6-bis(methoxymethyl)-4-methylphenol Chemical compound COCC1=CC(C)=CC(COC)=C1O VRMKFAFIVOVETG-UHFFFAOYSA-N 0.000 description 1
- PEAVCVNITMWRHQ-UHFFFAOYSA-N 2-(1h-benzimidazol-2-yl)-4,5,6,7-tetrahydro-1h-indazol-3-one Chemical compound C1=CC=C2NC(N3NC=4CCCCC=4C3=O)=NC2=C1 PEAVCVNITMWRHQ-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OTUWCEXPLFPTPA-UHFFFAOYSA-N 2-(4-hydroxyphenyl)prop-2-enamide Chemical compound NC(=O)C(=C)C1=CC=C(O)C=C1 OTUWCEXPLFPTPA-UHFFFAOYSA-N 0.000 description 1
- QTUVQQKHBMGYEH-UHFFFAOYSA-N 2-(trichloromethyl)-1,3,5-triazine Chemical class ClC(Cl)(Cl)C1=NC=NC=N1 QTUVQQKHBMGYEH-UHFFFAOYSA-N 0.000 description 1
- OXQGTIUCKGYOAA-UHFFFAOYSA-N 2-Ethylbutanoic acid Chemical compound CCC(CC)C(O)=O OXQGTIUCKGYOAA-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- PLMIYFSPVVMPMX-UHFFFAOYSA-N 2-[(4-hydroxy-3,5-dimethylphenyl)methyl]prop-2-enamide Chemical compound CC1=CC(CC(=C)C(N)=O)=CC(C)=C1O PLMIYFSPVVMPMX-UHFFFAOYSA-N 0.000 description 1
- BXVXPASMKWYBFD-UHFFFAOYSA-N 2-[[2-hydroxy-3-(hydroxymethyl)-5-methylphenyl]methyl]-6-(hydroxymethyl)-4-methylphenol Chemical compound CC1=CC(CO)=C(O)C(CC=2C(=C(CO)C=C(C)C=2)O)=C1 BXVXPASMKWYBFD-UHFFFAOYSA-N 0.000 description 1
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 1
- ZGDMDBHLKNQPSD-UHFFFAOYSA-N 2-amino-5-(4-amino-3-hydroxyphenyl)phenol Chemical compound C1=C(O)C(N)=CC=C1C1=CC=C(N)C(O)=C1 ZGDMDBHLKNQPSD-UHFFFAOYSA-N 0.000 description 1
- KNEFRHCUYCDKRK-UHFFFAOYSA-N 2-benzyl-3-phenylprop-2-enoic acid Chemical compound C=1C=CC=CC=1C=C(C(=O)O)CC1=CC=CC=C1 KNEFRHCUYCDKRK-UHFFFAOYSA-N 0.000 description 1
- IJVRPNIWWODHHA-UHFFFAOYSA-N 2-cyanoprop-2-enoic acid Chemical compound OC(=O)C(=C)C#N IJVRPNIWWODHHA-UHFFFAOYSA-N 0.000 description 1
- KRDXTHSSNCTAGY-UHFFFAOYSA-N 2-cyclohexylpyrrolidine Chemical compound C1CCNC1C1CCCCC1 KRDXTHSSNCTAGY-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- BWLBGMIXKSTLSX-UHFFFAOYSA-N 2-hydroxyisobutyric acid Chemical compound CC(C)(O)C(O)=O BWLBGMIXKSTLSX-UHFFFAOYSA-N 0.000 description 1
- WLJVXDMOQOGPHL-PPJXEINESA-N 2-phenylacetic acid Chemical compound O[14C](=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-PPJXEINESA-N 0.000 description 1
- LVFFZQQWIZURIO-UHFFFAOYSA-N 2-phenylbutanedioic acid Chemical compound OC(=O)CC(C(O)=O)C1=CC=CC=C1 LVFFZQQWIZURIO-UHFFFAOYSA-N 0.000 description 1
- ONPJWQSDZCGSQM-UHFFFAOYSA-N 2-phenylprop-2-enoic acid Chemical compound OC(=O)C(=C)C1=CC=CC=C1 ONPJWQSDZCGSQM-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- WCILBWLDYPEMNA-UHFFFAOYSA-N 3-(2,5-dioxopyrrol-3-yl)propanoic acid Chemical compound OC(=O)CCC1=CC(=O)NC1=O WCILBWLDYPEMNA-UHFFFAOYSA-N 0.000 description 1
- VFXXTYGQYWRHJP-UHFFFAOYSA-N 4,4'-azobis(4-cyanopentanoic acid) Chemical compound OC(=O)CCC(C)(C#N)N=NC(C)(CCC(O)=O)C#N VFXXTYGQYWRHJP-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- WXYSZTISEJBRHW-UHFFFAOYSA-N 4-[2-[4-[1,1-bis(4-hydroxyphenyl)ethyl]phenyl]propan-2-yl]phenol Chemical compound C=1C=C(C(C)(C=2C=CC(O)=CC=2)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WXYSZTISEJBRHW-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000004172 4-methoxyphenyl group Chemical group [H]C1=C([H])C(OC([H])([H])[H])=C([H])C([H])=C1* 0.000 description 1
- 125000000590 4-methylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- SHDBJOYDLRRTRA-UHFFFAOYSA-N 4-tert-butyl-2,6-bis(methoxymethyl)phenol Chemical compound COCC1=CC(C(C)(C)C)=CC(COC)=C1O SHDBJOYDLRRTRA-UHFFFAOYSA-N 0.000 description 1
- PPDRLQLKHRZIJC-UHFFFAOYSA-N 5-nitrosalicylic acid Chemical compound OC(=O)C1=CC([N+]([O-])=O)=CC=C1O PPDRLQLKHRZIJC-UHFFFAOYSA-N 0.000 description 1
- QRYSWXFQLFLJTC-UHFFFAOYSA-N 616-82-0 Chemical compound OC(=O)C1=CC=C(O)C([N+]([O-])=O)=C1 QRYSWXFQLFLJTC-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 1
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- XJUZRXYOEPSWMB-UHFFFAOYSA-N Chloromethyl methyl ether Chemical group COCCl XJUZRXYOEPSWMB-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- YXHKONLOYHBTNS-UHFFFAOYSA-N Diazomethane Chemical class C=[N+]=[N-] YXHKONLOYHBTNS-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- BUDQDWGNQVEFAC-UHFFFAOYSA-N Dihydropyran Chemical compound C1COC=CC1 BUDQDWGNQVEFAC-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- 239000012988 Dithioester Substances 0.000 description 1
- XLYMOEINVGRTEX-ARJAWSKDSA-N Ethyl hydrogen fumarate Chemical compound CCOC(=O)\C=C/C(O)=O XLYMOEINVGRTEX-ARJAWSKDSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 235000000177 Indigofera tinctoria Nutrition 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- XYVQFUJDGOBPQI-UHFFFAOYSA-N Methyl-2-hydoxyisobutyric acid Chemical compound COC(=O)C(C)(C)O XYVQFUJDGOBPQI-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- IWYDHOAUDWTVEP-UHFFFAOYSA-N R-2-phenyl-2-hydroxyacetic acid Natural products OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 description 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000007877 V-601 Substances 0.000 description 1
- WYGWHHGCAGTUCH-ISLYRVAYSA-N V-65 Substances CC(C)CC(C)(C#N)\N=N\C(C)(C#N)CC(C)C WYGWHHGCAGTUCH-ISLYRVAYSA-N 0.000 description 1
- PCXUSBICWPJFTN-FBMGVBCBSA-N [(z)-[cyano-(4-methoxyphenyl)methylidene]amino] 4-methylbenzenesulfonate Chemical compound C1=CC(OC)=CC=C1C(\C#N)=N\OS(=O)(=O)C1=CC=C(C)C=C1 PCXUSBICWPJFTN-FBMGVBCBSA-N 0.000 description 1
- JOFSEHHMYPDWFR-UHFFFAOYSA-N [3-(acetyloxymethyl)-2-hydroxy-5-methylphenyl]methyl acetate Chemical compound CC(=O)OCC1=CC(C)=CC(COC(C)=O)=C1O JOFSEHHMYPDWFR-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical group 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 229940091181 aconitic acid Drugs 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- XNCRUNXWPDJHGV-UHFFFAOYSA-N alpha-Methyl-cinnamic acid Chemical compound OC(=O)C(C)=CC1=CC=CC=C1 XNCRUNXWPDJHGV-UHFFFAOYSA-N 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000001000 anthraquinone dye Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000000987 azo dye Substances 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- CHIHQLCVLOXUJW-UHFFFAOYSA-N benzoic anhydride Chemical compound C=1C=CC=CC=1C(=O)OC(=O)C1=CC=CC=C1 CHIHQLCVLOXUJW-UHFFFAOYSA-N 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- UUZYBYIOAZTMGC-UHFFFAOYSA-M benzyl(trimethyl)azanium;bromide Chemical compound [Br-].C[N+](C)(C)CC1=CC=CC=C1 UUZYBYIOAZTMGC-UHFFFAOYSA-M 0.000 description 1
- LRRJQNMXIDXNIM-UHFFFAOYSA-M benzyl(trimethyl)azanium;iodide Chemical compound [I-].C[N+](C)(C)CC1=CC=CC=C1 LRRJQNMXIDXNIM-UHFFFAOYSA-M 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- FJDQFPXHSGXQBY-UHFFFAOYSA-L caesium carbonate Chemical compound [Cs+].[Cs+].[O-]C([O-])=O FJDQFPXHSGXQBY-UHFFFAOYSA-L 0.000 description 1
- 229910000024 caesium carbonate Inorganic materials 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- DKVNPHBNOWQYFE-UHFFFAOYSA-N carbamodithioic acid Chemical compound NC(S)=S DKVNPHBNOWQYFE-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 229940061627 chloromethyl methyl ether Drugs 0.000 description 1
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- RPBPCPJJHKASGQ-UHFFFAOYSA-K chromium(3+);octanoate Chemical compound [Cr+3].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O RPBPCPJJHKASGQ-UHFFFAOYSA-K 0.000 description 1
- FEIQOMCWGDNMHM-UHFFFAOYSA-N cinnamylideneacetic acid Natural products OC(=O)C=CC=CC1=CC=CC=C1 FEIQOMCWGDNMHM-UHFFFAOYSA-N 0.000 description 1
- GTZCVFVGUGFEME-IWQZZHSRSA-N cis-aconitic acid Chemical compound OC(=O)C\C(C(O)=O)=C\C(O)=O GTZCVFVGUGFEME-IWQZZHSRSA-N 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010511 deprotection reaction Methods 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- OREAFAJWWJHCOT-UHFFFAOYSA-N dimethylmalonic acid Chemical compound OC(=O)C(C)(C)C(O)=O OREAFAJWWJHCOT-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000012990 dithiocarbamate Substances 0.000 description 1
- 125000005022 dithioester group Chemical group 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000003754 ethoxycarbonyl group Chemical group C(=O)(OCC)* 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- UKFXDFUAPNAMPJ-UHFFFAOYSA-N ethylmalonic acid Chemical compound CCC(C(O)=O)C(O)=O UKFXDFUAPNAMPJ-UHFFFAOYSA-N 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- XLYMOEINVGRTEX-UHFFFAOYSA-N fumaric acid monoethyl ester Natural products CCOC(=O)C=CC(O)=O XLYMOEINVGRTEX-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- JPZROSNLRWHSQQ-UHFFFAOYSA-N furan-2,5-dione;prop-2-enoic acid Chemical compound OC(=O)C=C.O=C1OC(=O)C=C1 JPZROSNLRWHSQQ-UHFFFAOYSA-N 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 235000004515 gallic acid Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 229940097275 indigo Drugs 0.000 description 1
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910052806 inorganic carbonate Inorganic materials 0.000 description 1
- 229910001853 inorganic hydroxide Inorganic materials 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229960002510 mandelic acid Drugs 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- DZVCFNFOPIZQKX-LTHRDKTGSA-M merocyanine Chemical compound [Na+].O=C1N(CCCC)C(=O)N(CCCC)C(=O)C1=C\C=C\C=C/1N(CCCS([O-])(=O)=O)C2=CC=CC=C2O\1 DZVCFNFOPIZQKX-LTHRDKTGSA-M 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 150000004681 metal hydrides Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- FMXYCZVOMYLMKM-UHFFFAOYSA-N methyl 2-hydroxy-2-methylbutanoate Chemical compound CCC(C)(O)C(=O)OC FMXYCZVOMYLMKM-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- ZIYVHBGGAOATLY-UHFFFAOYSA-N methylmalonic acid Chemical compound OC(=O)C(C)C(O)=O ZIYVHBGGAOATLY-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- GNVRJGIVDSQCOP-UHFFFAOYSA-N n-ethyl-n-methylethanamine Chemical compound CCN(C)CC GNVRJGIVDSQCOP-UHFFFAOYSA-N 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- BPYXFMVJXTUYRV-UHFFFAOYSA-J octanoate;zirconium(4+) Chemical compound [Zr+4].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O BPYXFMVJXTUYRV-UHFFFAOYSA-J 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- LYKRPDCJKSXAHS-UHFFFAOYSA-N phenyl-(2,3,4,5-tetrahydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC(C(=O)C=2C=CC=CC=2)=C1O LYKRPDCJKSXAHS-UHFFFAOYSA-N 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- IBHWREHFNDMRPR-UHFFFAOYSA-N phloroglucinol carboxylic acid Natural products OC(=O)C1=C(O)C=C(O)C=C1O IBHWREHFNDMRPR-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000001007 phthalocyanine dye Substances 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 229960004063 propylene glycol Drugs 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000001226 reprecipitation Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 239000012312 sodium hydride Substances 0.000 description 1
- 229910000104 sodium hydride Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 239000003930 superacid Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- GSECCTDWEGTEBD-UHFFFAOYSA-N tert-butylperoxycyclohexane Chemical compound CC(C)(C)OOC1CCCCC1 GSECCTDWEGTEBD-UHFFFAOYSA-N 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- 125000000025 triisopropylsilyl group Chemical group C(C)(C)[Si](C(C)C)(C(C)C)* 0.000 description 1
- FTVLMFQEYACZNP-UHFFFAOYSA-N trimethylsilyl trifluoromethanesulfonate Chemical compound C[Si](C)(C)OS(=O)(=O)C(F)(F)F FTVLMFQEYACZNP-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 239000012989 trithiocarbonate Substances 0.000 description 1
- HIZCIEIDIFGZSS-UHFFFAOYSA-L trithiocarbonate Chemical compound [S-]C([S-])=S HIZCIEIDIFGZSS-UHFFFAOYSA-L 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L35/04—Homopolymers or copolymers of nitriles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
Definitions
- the present invention relates to a positive photosensitive resin composition, and an organic EL element partition wall, an organic EL element insulating film, and an organic EL element using the same. More specifically, the present invention relates to a positive photosensitive resin composition containing a black colorant, and an organic EL element partition wall, an organic EL element insulating film, and an organic EL element using the same.
- partitioning materials are used at intervals of colored patterns in the display area or at edges of peripheral parts of the display area in order to improve display characteristics.
- a partition wall is first formed, and the pixels of the organic substance are formed between the partition walls.
- the partition walls are generally formed by photolithography using a photosensitive resin composition and have insulating properties. Specifically, a photosensitive resin composition is applied onto a substrate using a coating device, volatile components are removed by means such as heating, and then exposed through a mask, and then, in the case of a negative type, an unexposed portion is exposed.
- the exposed portion is developed by removing it with a developing solution such as an alkaline aqueous solution, and the obtained pattern is heat-treated to form a partition wall (insulating film).
- a developing solution such as an alkaline aqueous solution
- an organic substance that emits three colors of light, red, green, and blue, is formed between the partition walls by an inkjet method or the like to form pixels of an organic EL display device.
- the partition material In the field, in recent years, due to the miniaturization of display devices and the diversification of displayed contents, higher performance and higher definition of pixels are required. Attempts have been made to make the partition material have a light-shielding property by using a colorant for the purpose of increasing the contrast in the display device and improving the visibility. However, when the partition material is provided with a light-shielding property, the photosensitive resin composition tends to have low sensitivity, and as a result, the exposure time may be long and the productivity may be lowered. Therefore, the photosensitive resin composition used for forming the partition material containing the colorant is required to have higher sensitivity.
- Patent Document 1 Japanese Unexamined Patent Publication No. 2001-281440 describes a positive radiation-sensitive resin composition containing an alkali-soluble resin and a quinonediazide compound as a radiation-sensitive resin composition that exhibits high light-shielding properties by heat treatment after exposure. The composition to which titanium black is added is described.
- Patent Document 2 Japanese Unexamined Patent Publication No. 2002-116536 describes carbon black in a radiation-sensitive resin composition containing [A] alkali-soluble resin, [B] 1,2-quinonediazide compound, and [C] colorant. Describes a method of blackening the partition material using.
- Patent Document 3 Japanese Unexamined Patent Publication No. 2010-237310 describes a positive radiation-sensitive resin composition containing an alkali-soluble resin and a quinonediazide compound as a radiation-sensitive resin composition that exhibits light-shielding properties by heat treatment after exposure. The composition to which the heat-sensitive dye is added is described.
- Japanese Unexamined Patent Publication No. 2001-281440 Japanese Unexamined Patent Publication No. 2002-116536 Japanese Unexamined Patent Publication No. 2010-237310
- the photosensitive resin composition used for forming a colored partition material it is necessary to use a considerable amount of a colorant in order to sufficiently enhance the light-shielding property of the cured film.
- a colorant in order to sufficiently enhance the light-shielding property of the cured film.
- the radiation applied to the coating film of the photosensitive resin composition is absorbed by the coloring agent, so that the effective intensity of the radiation in the coating film is lowered, and the photosensitive resin composition Is not sufficiently exposed, and as a result, the pattern formability is reduced.
- a partition wall in an organic EL element it is important that the material forming the partition wall has high sensitivity from the viewpoint of productivity and the like.
- a black photosensitive resin composition containing a colorant when used, exposure defects occur under the normally used exposure conditions, so that it is necessary to lengthen the exposure time, for example, which reduces productivity. It was a factor to make it. Therefore, it is strongly desired to reduce the exposure amount of the photosensitive resin composition, reduce the energy cost, and increase the throughput.
- An object of the present invention is to provide a highly sensitive photosensitive resin composition containing a black colorant, which can be developed and patterned even at a low exposure amount.
- the present inventors have prepared a positive photosensitive resin composition with a first resin having a plurality of phenolic hydroxyl groups and at least a part of the plurality of phenolic hydroxyl groups protected by an acid-degradable group, and an alkali-soluble functional group. It has been found that by forming a chemical amplification system containing a specific second resin having a group in combination, it is possible to develop and form a pattern even with a low exposure amount even though it contains a black colorant.
- the first resin (A) is a polymerizable monomer having a plurality of phenolic hydroxyl groups, and at least a part of the plurality of phenolic hydroxyl groups is protected by the acid-degradable group.
- the first resin (A) is the formula (3). (In the formula (3), R 1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 5 is the acid-degradable group, r is an integer of 0 to 5, and s is 0 to 0.
- the first resin (A) is the formula (2).
- R 2 and R 3 are independent hydrogen atoms, alkyl groups having 1 to 3 carbon atoms, and fully or partially fluorinated alkyl groups having 1 to 3 carbon atoms, respectively.
- R 4 is a hydrogen atom, a linear or cyclic alkyl group having 4 to 12 carbon atoms, a phenyl group, or a hydroxy group, an alkyl group having 1 to 6 carbon atoms of 1 to 6 carbon atoms And a phenyl group substituted with at least one selected from the group consisting of an alkoxy group having 1 to 6 carbon atoms.
- the positive photosensitive resin composition according to any one of. [11] The positive photosensitive resin composition according to any one of [1] to [10], wherein the optical density (OD value) of the cured film of the positive photosensitive resin composition is 0.5 or more per 1 ⁇ m of the film thickness. .. [12]
- the second resin (B) is a reaction product of a compound having at least two epoxy groups in one molecule and a hydroxybenzoic acid compound, and has the formula (5).
- b is an integer of 1 to 5
- * represents the bond portion of the compound having at least two epoxy groups in one molecule to the residue excluding the epoxy group involved in the reaction.
- alkali-soluble and “alkali aqueous solution-soluble” mean that the positive photosensitive resin composition or its components, or the film or cured film of the positive photosensitive resin composition is an alkaline aqueous solution, for example, 2.38 mass. It means that it can be dissolved in a% aqueous solution of tetramethylammonium hydroxide.
- the "alkali-soluble functional group” means a group that imparts such alkali solubility to the positive photosensitive resin composition or a component thereof, or the film or cured film of the positive photosensitive resin composition. Examples of the alkali-soluble functional group include a phenolic hydroxyl group, a carboxy group, a sulfo group, a phosphoric acid group, an acid anhydride group, a mercapto group and the like.
- the "acid-degradable group” means a group that decomposes (deprotects) to generate an alkali-soluble functional group by heating as necessary in the presence of an acid.
- the "radical polymerizable functional group” refers to one or more ethylenically unsaturated groups.
- (meth) acrylic means acrylic or methacrylic
- (meth) acrylate means acrylate or methacrylate
- (meth) acryloyl means acryloyl or methacrylic.
- the number average molecular weight (Mn) and the weight average molecular weight (Mw) of the resin or polymer mean standard polystyrene-equivalent values measured by gel permeation chromatography (GPC).
- the positive photosensitive resin composition of one embodiment has a first resin (A) having a plurality of phenolic hydroxyl groups and at least a part of the plurality of phenolic hydroxyl groups protected by an acid-degradable group, and an epoxy group. It contains a second resin (B) having a phenolic hydroxyl group, at least one colorant (C) and a photoacid generator (D) selected from the group consisting of black dyes and black pigments.
- the positive photosensitive resin composition contains the first resin (A) in an amount of 10% by mass to 80% by mass, preferably 20% by mass to 65% by mass, more preferably based on a solid content of 100% by mass. Includes 30% by mass to 50% by mass.
- the content of the first resin (A) is 10% by mass or more based on 100% by mass of the solid content, a chemical amplification function can be imparted to the photosensitive resin composition to realize high sensitivity.
- the content of the first resin (A) is 80% by mass or less based on 100% by mass of the solid content, the residual amount of unreacted acid-decomposable groups is reduced, and the solubility of the exposed portion is enhanced to be high. Sensitivity can be achieved.
- the "solid content” refers to the first resin (A), the second resin (B), the colorant (C), the photoacid generator (D), the dissolution accelerator (E), and the optional component (F). Means the total mass of the components including and excluding the solvent (G).
- the positive photosensitive resin composition contains the second resin (B) in an amount of 5% by mass to 50% by mass, preferably 10% by mass to 40% by mass, more preferably based on 100% by mass of the solid content. Contains 15% by mass to 30% by mass.
- the content of the second resin (B) is 5% by mass or more based on 100% by mass of the solid content, dissolution of the exposed portion can be promoted and high sensitivity can be realized, and the coating film after thermosetting can be realized. Stability and durability can be ensured.
- the solubility of the unexposed portion can be kept low and the residual film ratio can be kept high.
- the positive photosensitive resin composition preferably contains the first resin (A) in an amount of 20% by mass to 90% by mass, based on the total mass of the first resin (A) and the second resin (B). Contains 35% by mass to 80% by mass, more preferably 50% by mass to 75% by mass.
- the content of the first resin (A) By setting the content of the first resin (A) to 20% by mass or more, it is possible to impart a chemical amplification function to the photosensitive resin composition and realize high sensitivity.
- the solubility of the exposed portion can be enhanced and high sensitivity can be realized.
- the first resin (A) has a plurality of phenolic hydroxyl groups, and is not particularly limited as long as at least a part of the plurality of phenolic hydroxyl groups is protected by an acid-degradable group.
- the phenolic hydroxyl group is an alkali-soluble functional group, and a part of the phenolic hydroxyl group is protected by an acid-decomposable group, so that the alkali solubility of the first resin (A) before exposure is suppressed.
- the first resin (A) may have an alkali-soluble functional group other than the phenolic hydroxyl group, and these alkali-soluble functional groups may be protected by an acid-degradable group like the phenolic hydroxyl group. ..
- the first resin (A) may have an alkali-soluble functional group other than the phenolic hydroxyl group, for example, a carboxy group, a sulfo group, a phosphoric acid group, an acid anhydride group, a mercapto group and the like.
- the first resin (A) can be used alone or in combination of two or more.
- the first resin (A) may be a combination of two or more kinds of resins having different structural units of the polymer, acid-degradable groups, protection rates of phenolic hydroxyl groups, or combinations thereof.
- the first resin (A) can be obtained by protecting a part of the phenolic hydroxyl groups of the base resin (a) having a plurality of phenolic hydroxyl groups with an acid-degradable group.
- the first resin (A) having a phenolic hydroxyl group protected by an acid-degradable group has a partial structure of Ar—OR, where Ar represents a phenol-derived aromatic ring, and R represents an acid-degradable group. Represent.
- An acid-degradable group is a group that decomposes (deprotects) an alkali-soluble functional group by heating as necessary in the presence of an acid.
- tert-butyl group 1,1-dimethyl-propyl group, 1-methylcyclopentyl group, 1-ethylcyclopentyl group, 1-methylcyclohexyl group, 1-ethylcyclohexyl group, 1-methyladamantyl group.
- a ring structure may be formed therein.).
- the group represented by the formula (7) forms an acetal structure or a ketal structure together with an oxygen atom derived from a phenolic hydroxyl group.
- These acid-degradable groups can be used alone or in combination of two or more.
- the number of ring members of the ring structure is preferably 3 to 10.
- R 6 , R 7 and R 8 may be substituted with a halogen atom selected from the group consisting of fluorine, chlorine, bromine and iodine.
- the acid-decomposable group is preferably a group represented by the formula (7). It is more preferable that R 6 and R 7 are independently hydrogen atoms or linear or branched alkyl groups having 1 to 4 carbon atoms. More preferably, R 8 is a linear, branched or cyclic alkyl group having 1 to 12 carbon atoms. R 8 may be substituted with a halogen atom selected from the group consisting of fluorine, chlorine, bromine and iodine. Examples of such an acid-degradable group include a 1-alkoxyalkyl group.
- Examples of the 1-alkoxyalkyl group include a methoxymethyl group, a 1-methoxyethyl group, a 1-ethoxyethyl group, a 1-n-propoxyethyl group, a 1-n-butoxyethyl group, a 1-isobutoxyethyl group, and 1 Included are-(2-chloroethoxy) ethyl group, 1- (2-ethylhexyloxy) ethyl group, 1-cyclohexyloxyethyl group, and 1- (2-cyclohexylethoxy) ethyl group, 1-ethoxyethyl group and 1
- the -n-propoxyethyl group is preferred.
- a group represented by the formula (7) in which one of R 6 or R 7 and R 8 are bonded to form a ring structure can also be preferably used.
- R 6 or R 7, which is not involved in the formation of the ring structure is preferably a hydrogen atom.
- the number of ring members of the ring structure is preferably 3 to 10. Examples of such an acid-degradable group include a 2-tetrahydrofuranyl group and a 2-tetrahydropyranyl group, and a 2-tetrahydrofuranyl group is preferable.
- the phenolic hydroxyl group protection reaction can be carried out under known conditions using a general protective agent.
- a general protective agent for example, by reacting the base resin (a) of the first resin (A) with a protective agent in a solvent-free solvent or a solvent such as toluene or hexane at a reaction temperature of ⁇ 20 to 50 ° C. in the presence of an acid or a base. , The first resin (A) can be obtained.
- the protective agent a known protective agent capable of protecting the phenolic hydroxyl group can be used.
- the protective agent for example, isobutene can be used when the acid-degradable group is tert-butyl group, and di-tert-butyl dicarbonate can be used when the acid-degradable group is tert-butoxycarbonyl group.
- the acid-degradable group is a silyl group such as a trimethylsilyl group or a triethylsilyl group
- a silicon-containing chloride such as trimethylsilyl chloride or triethylsilyl chloride
- a silicon-containing triflate compound such as trimethylsilyltriflate or triethyltriflate
- the acid-degradable group is a methoxymethyl group, it is a chloromethylmethyl ether, when it is a 1-ethoxyethyl group, it is an ethyl vinyl ether, when it is a 1-n-propoxyethyl group, it is an n-propyl vinyl ether, and when it is a 2-tetrahydrofuranyl group.
- 2-tetrahydrofuranyl group 2,3-dihydrofuran, 2-tetrahydropyranyl group, 3,4-dihydro-2H-pyran and the like can be used.
- Examples of the acid include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid and perchloric acid, and organic acids such as methanesulfonic acid, trifluoromethanesulfonic acid, p-toluenesulfonic acid and benzenesulfonic acid. Salts of organic acids, such as pyridinium salts of p-toluenesulfonic acid, can also be used as acid sources.
- Examples of the base include inorganic hydroxides such as sodium hydroxide and potassium hydroxide, inorganic carbonates such as sodium carbonate, sodium hydrogen carbonate, potassium carbonate and cesium carbonate, metal hydrides such as sodium hydride, and pyridine. Examples thereof include amine compounds such as N, N-dimethyl-4-aminopyridine, imidazole, triethylamine and diisopropylethylamine.
- the first resin (A) can also be obtained by polymerizing or copolymerizing other polymerizable monomers according to the above.
- the phenolic hydroxyl group of the polymerizable monomer having a phenolic hydroxyl group can be protected in the same manner as the protection of the phenolic hydroxyl group of the base resin (a).
- Base resin (a) examples include polystyrene resin, epoxy resin, polyamide resin, phenol resin, polyimide resin, polyamic acid resin, polybenzoxazole resin, and poly having a plurality of phenolic hydroxyl groups.
- examples thereof include benzoxazole resin precursors, silicone resins, cyclic olefin polymers, cardo resins, and derivatives of these resins.
- a derivative of a phenol resin a polyalkenylphenol resin in which an alkenyl group is bonded to a benzene ring
- a polystyrene resin a hydroxypolystyrene resin derivative in which a phenolic hydroxyl group and a hydroxyalkyl group or an alkoxy group are bonded to a benzene ring, etc.
- the base resin (a) a homopolymer or a copolymer of a polymerizable monomer having a phenolic hydroxyl group can also be used.
- These base resins (a) can be used alone or in combination of two or more.
- the base resin (a) may have a radically polymerizable functional group.
- the base resin (a) has a (meth) acryloyloxy group, an allyl group or a metalyl group as a radically polymerizable functional group.
- the base resin (a) of the first resin (A) is an alkaline aqueous solution-soluble copolymer (a1) of a polymerizable monomer having a phenolic hydroxyl group and another polymerizable monomer.
- the alkaline aqueous solution soluble copolymer (a1) has a plurality of phenolic hydroxyl groups.
- the first resin (A) is obtained by protecting at least a part of a plurality of phenolic hydroxyl groups of the aqueous alkaline aqueous solution-soluble copolymer (a1) with an acid-degradable group.
- the alkaline aqueous solution-soluble copolymer (a1) may further have an alkali-soluble functional group other than the phenolic hydroxyl group, for example, a carboxy group, a sulfo group, a phosphoric acid group, an acid anhydride group, or a mercapto group.
- the polymerizable functional group contained in the polymerizable monomer include radically polymerizable functional groups.
- the alkaline aqueous solution-soluble copolymer (a1) can be produced, for example, by radically polymerizing a polymerizable monomer having a phenolic hydroxyl group and another polymerizable monomer. After synthesizing the copolymer by radical polymerization, a phenolic hydroxyl group may be added to the copolymer.
- the polymerizable monomer having a phenolic hydroxyl group include 4-hydroxystyrene, 4-hydroxyphenyl (meth) acrylate, 3,5-dimethyl-4-hydroxybenzylacrylamide, 4-hydroxyphenylacrylamide, and 4-hydroxy. Examples include phenylmaleimide and the like.
- polymerizable monomers examples include polymerizable styrene derivatives such as styrene, vinyltoluene, ⁇ -methylstyrene, p-methylstyrene, and p-ethylstyrene, acrylamide, acryliconitrile, vinyl-n-butyl ether, and the like.
- Vinyl alcohol ether compound alkyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, glycidyl (meth) acrylate, 2,2,2-trifluoroethyl (Meta) acrylate, (meth) acrylic acid ester such as 2,2,3,3-tetrafluoropropyl (meth) acrylate, isobornyl (meth) acrylate, N-substituted maleimide such as phenylmaleimide and cyclohexylmaleimide, maleic acid anhydride Acrylate, maleic acid monoester, (meth) acrylic acid, ⁇ -bromo (meth) acrylic acid, ⁇ -chloro (meth) acrylic acid, ⁇ -frill (meth) acrylic acid, ⁇ -styryl (meth) acrylic acid
- the alkaline aqueous solution-soluble copolymer (a1) has one or more rings such as an alicyclic structure, an aromatic structure, a polycyclic structure, an inorganic ring structure and a heterocyclic structure. It preferably has a formula structure.
- R 1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and a is an integer of 1 to 5.
- R 1 is preferably a hydrogen atom or a methyl group.
- a is preferably an integer of 1 to 3, and more preferably 1.
- 4-hydroxyphenyl methacrylate is particularly preferable.
- R 2 and R 3 are independently hydrogen atoms, alkyl groups having 1 to 3 carbon atoms, fully or partially fluorinated alkyl groups having 1 to 3 carbon atoms, or A halogen atom
- R 4 is a hydrogen atom, a linear alkyl group having 1 to 6 carbon atoms or a cyclic alkyl group having 4 to 12 carbon atoms, a phenyl group, or a hydroxy group, an alkyl group having 1 to 6 carbon atoms, and an alkyl group.
- R 2 and R 3 are independently hydrogen atoms or alkyl groups having 1 to 3 carbon atoms.
- R 4 is at least one selected from the group consisting of cyclic alkyl groups having 4 to 12 carbon atoms, phenyl groups, or hydroxy groups, alkyl groups having 1 to 6 carbon atoms and alkoxy groups having 1 to 6 carbon atoms. It is preferably a phenyl group substituted with a species, and more preferably a cyclic alkyl group having 4 to 12 carbon atoms or a phenyl group. Phenylmaleimide and cyclohexylmaleimide are particularly preferred as such other polymerizable monomers.
- the alkaline aqueous solution soluble copolymer (a1) is represented by the formula (1).
- R 1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and a is an integer of 1 to 5).
- Structural unit represented by and formula (2) (In the formula (2), R 2 and R 3 are independent hydrogen atoms, alkyl groups having 1 to 3 carbon atoms, and fully or partially fluorinated alkyl groups having 1 to 3 carbon atoms, respectively.
- R 4 is a hydrogen atom, a linear or cyclic alkyl group having 4 to 12 carbon atoms, a phenyl group, or a hydroxy group, an alkyl group having 1 to 6 carbon atoms of 1 to 6 carbon atoms And a phenyl group substituted with at least one selected from the group consisting of an alkoxy group having 1 to 6 carbon atoms.) It has a structural unit represented by.
- the polymerization initiator for producing the base resin (a) or the aqueous alkaline aqueous solution-soluble copolymer (a1) by radical polymerization is not limited to the following, but is limited to 2,2'-azobisisobutyronitrile, 2 , 2'-azobis (2-methylbutyronitrile), dimethyl 2,2'-azobis (2-methylpropionate), 4,4'-azobis (4-cyanovaleric acid), 2,2'-azobis Azobisisobutyment initiators such as (2,4-dimethylvaleronitrile) (AVN), dicumyl peroxide, 2,5-dimethyl-2,5-di (tert-butylperoxy) hexane, tert-butylcumyl peroxide , Di-tert-butyl peroxide, 1,1,3,3-tetramethylbutylhydroperoxide, cumenehydroperoxide and the like, or a peroxide polymerization initiator having
- Peroxide polymerization initiators such as benzoyl oxide, lauroyl peroxide, 1,1'-di (tert-butylperoxy) cyclohexane, and tert-butylperoxypivalate can be used.
- the amount of the polymerization initiator used is generally 0.01 parts by mass or more, 0.05 parts by mass or more or 0.5 parts by mass or more, 40 parts by mass or less, 20 parts by mass with respect to 100 parts by mass of the total amount of the polymerizable monomer. It is preferably parts by mass or less or 15 parts by mass or less.
- a RAFT (Reversible Addition Fragmentation Transfer) agent may be used in combination with a polymerization initiator.
- the RAFT agent is not limited to the following, and thiocarbonylthio compounds such as dithioester, dithiocarbamate, trithiocarbonate, and xantate can be used.
- the RAFT agent can be used in the range of 0.005 to 20 parts by mass with respect to 100 parts by mass of the total amount of the polymerizable monomer, and is preferably used in the range of 0.01 to 10 parts by mass.
- the weight average molecular weight (Mw) of the base resin (a) or the aqueous alkaline aqueous solution-soluble copolymer (a1) can be 3000 to 80,000, preferably 4000 to 70000, and more preferably 5000 to 60,000. preferable.
- the number average molecular weight (Mn) can be 1000 to 30000, preferably 1500 to 25000, and more preferably 2000 to 20000.
- the polydispersity (Mw / Mn) can be 1.0 to 3.5, preferably 1.1 to 3.0, and more preferably 1.2 to 2.8.
- 10 mol% to 95 mol%, preferably 20 mol% to 80 mol%, more preferably 25 mol% to 70 mol% of the phenolic hydroxyl group of the first resin (A) is an acid-degradable group. It is protected.
- a chemical amplification function is imparted to the photosensitive resin composition to realize high sensitivity. be able to.
- the proportion of phenolic hydroxyl groups protected by acid-decomposable groups is calculated from the weight loss rate (%) of the first resin (A) by a thermogravimetric differential thermal analyzer (TG / DTA).
- TG / DTA thermogravimetric differential thermal analyzer
- the positive photosensitive resin composition has 5 of the phenolic hydroxyl groups of the first resin (A) based on the total of the alkali-soluble functional groups of the first resin (A) and the second resin (B).
- Mol% to 65 mol%, preferably 10 mol% to 55 mol%, more preferably 15 mol% to 50 mol% are protected by acid-degradable groups.
- the chemical amplification function is achieved by setting the protection rate of the phenolic hydroxyl group of the first resin (A) to 5 mol% or more based on the total of the alkali-soluble functional groups of the first resin (A) and the second resin (B). Can be added to the photosensitive resin composition to achieve high sensitivity.
- the reference alkali-soluble functional group includes any carboxy group, sulfo group, phosphoric acid group, acid anhydride group, mercapto group and the like in addition to the phenolic hydroxyl group.
- the first resin (A) has a plurality of phenolic hydroxyl groups, and at least a part of the plurality of phenolic hydroxyl groups is protected by an acid-degradable group, and the polymerizable single amount having a phenolic hydroxyl group. It is an alkaline aqueous solution-soluble copolymer of the body and other polymerizable monomers. That is, the first resin (A) uses an alkaline aqueous solution-soluble copolymer (a1) of a polymerizable monomer having a phenolic hydroxyl group and another polymerizable monomer as the base resin (a). The alkaline aqueous solution-soluble copolymer (a1) has a plurality of phenolic hydroxyl groups, and at least a part of these phenolic hydroxyl groups is protected by an acid-degradable group.
- the first resin (A) is represented by the formula (3).
- R 1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms
- R 5 is an acid degradable group
- r is an integer of 0 to 5
- s is 0 to 5.
- the first resin (A) has at least one structural unit in which s is an integer of 1 or more. It is preferable to have.
- Acid-decomposable group of R 5 has the formula (7) -CR 6 R 7 -OR 8 (7) It is preferably a group represented by.
- R 6 and R 7 are independently hydrogen atoms or linear or branched alkyl groups having 1 to 4 carbon atoms.
- R 8 is a linear, branched or cyclic alkyl group having 1 to 12 carbon atoms, an aralkyl group having 7 to 12 carbon atoms, or an alkenyl group having 2 to 12 carbon atoms, or R 6 or R. It is more preferable that one of 7 and R 8 are combined to form a ring structure having 3 to 10 ring members.
- R 6 , R 7 and R 8 may be substituted with a halogen atom selected from the group consisting of fluorine, chlorine, bromine and iodine.
- Examples of such an acid-degradable group include a 1-alkoxyalkyl group.
- Examples of the 1-alkoxyalkyl group include a methoxymethyl group, a 1-methoxyethyl group, a 1-ethoxyethyl group, a 1-n-propoxyethyl group, a 1-n-butoxyethyl group, a 1-isobutoxyethyl group, and 1 Included are-(2-chloroethoxy) ethyl group, 1- (2-ethylhexyloxy) ethyl group, 1-cyclohexyloxyethyl group, and 1- (2-cyclohexylethoxy) ethyl group, 1-ethoxyethyl group and 1
- the -n-propoxyethyl group is preferred.
- Examples of the acid-degradable group in which one of R 6 or R 7 and R 8 are bonded to form a ring structure having 3 to 10 ring members include a 2-tetrahydrofuranyl group and a 2-tetrahydropyranyl group.
- a 2-tetrahydrofuranyl group is preferred.
- the first resin (A) is represented by the formula (2).
- R 2 and R 3 are independent hydrogen atoms, alkyl groups having 1 to 3 carbon atoms, and fully or partially fluorinated alkyl groups having 1 to 3 carbon atoms, respectively.
- R 4 is a hydrogen atom, a linear or cyclic alkyl group having 4 to 12 carbon atoms, a phenyl group, or a hydroxy group, an alkyl group having 1 to 6 carbon atoms of 1 to 6 carbon atoms It is preferable to have a structural unit represented by (a phenyl group substituted with at least one selected from the group consisting of an alkoxy group having 1 to 6 carbon atoms). It is preferable that R 2 and R 3 are independently hydrogen atoms or alkyl groups having 1 to 3 carbon atoms.
- R 4 is at least one selected from the group consisting of a cyclic alkyl group having 4 to 12 carbon atoms, a phenyl group, or a hydroxy group, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms. It is preferably a species-substituted phenyl group.
- the number of structural units is 5% to 95%, preferably 15% to 70%, and more preferably 25% to 60% of the total number of structural units of the first resin (A).
- the second resin (B) having an epoxy group and a phenolic hydroxyl group is an alkaline aqueous solution-soluble resin.
- the second resin (B) may have an alkali-soluble functional group other than the phenolic hydroxyl group. Phenolic hydroxyl groups and other alkali-soluble functional groups may be protected by acid-degradable groups.
- the second resin (B) is, for example, a part of the epoxy group of a compound having at least two epoxy groups in one molecule (hereinafter, may be referred to as “epoxy compound”) and a hydroxybenzoic acid compound. It can be obtained by reacting the carboxy group of.
- the epoxy group of the second resin (B) forms a crosslink by reacting with a phenolic hydroxyl group during heat treatment (post-baking) after development, whereby the chemical resistance and heat resistance of the coating film can be improved. .. Since the phenolic hydroxyl group contributes to the solubility in the alkaline aqueous solution during development, the second resin (B) sufficiently decomposes (deprotects) the acid-decomposable group in the exposed portion when exposed at a low exposure amount. It also functions as a dissolution accelerator for the unexposed first resin (A), while the phenolic hydroxyl group has a relatively lower alkali solubility than the carboxy group, so that the second resin (B) is exposed.
- the photosensitive resin composition can be made highly sensitive and a high resolution pattern can be formed. Further, in the second resin (B), since a phenolic hydroxyl group having a relatively low acidity as an alkali-soluble functional group coexists with an epoxy group having reactivity with an acid, a functional group having a high acidity such as a carboxy group And, as compared with the resin having an epoxy group, the ring-opening polymerization of the epoxy group of the second resin (B) is less likely to proceed. Thereby, the performance of the photosensitive resin composition, such as alkali solubility and cross-linking reactivity, can be stably maintained for a long period of time.
- the resin having an epoxy group among the components is alkaline. Since it has no solubility, the alkali solubility of the exposed portion may decrease.
- the second resin (B) is a compound in which all of its components have an alkali-soluble functional group. Therefore, by using the second resin (B), it is possible to easily adjust the alkali solubility of the photosensitive resin composition, and it is possible to impart excellent pattern forming properties to the photosensitive resin composition.
- reaction formula 1 shows an example of a reaction in which one of the epoxy groups of the epoxy compound reacts with the carboxy group of the hydroxybenzoic acid compound to form a compound having a phenolic hydroxyl group.
- Examples of the compound having at least two epoxy groups in one molecule include phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol type epoxy resin, biphenol type epoxy resin, naphthalene skeleton-containing epoxy resin, and alicyclic epoxy resin. , Heterocyclic epoxy resin and the like. These epoxy compounds may have two or more epoxy groups in one molecule, and may be used alone or in combination of two or more. Since these compounds are thermosetting, the structure cannot be uniquely described due to differences in the presence or absence of epoxy groups, the types of functional groups, the degree of polymerization, etc., as is common knowledge of those skilled in the art. An example of the structure of the novolak type epoxy resin is shown in the equation (4).
- R 9 is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group or a hydroxyl group having 1 to 2 carbon atoms, and m is an integer of 1 to 50.
- Examples of the phenol novolac type epoxy resin include EPRICLON (registered trademark) N-770 (manufactured by DIC Corporation) and jER (registered trademark) -152 (manufactured by Mitsubishi Chemical Corporation).
- Examples of the cresol novolac type epoxy resin include EPICLON (registered trademark) N-695 (manufactured by DIC Corporation) and EOCN (registered trademark) -102S (manufactured by Nippon Kayaku Co., Ltd.).
- Examples of the bisphenol type epoxy resin include bisphenol A type such as jER (registered trademark) 828, jER (registered trademark) 1001 (manufactured by Mitsubishi Chemical Co., Ltd.), and YD-128 (trade name, manufactured by Nippon Steel Chemical & Materials Co., Ltd.).
- Examples thereof include epoxy resins, bisphenol F type epoxy resins such as jER (registered trademark) 806 (manufactured by Mitsubishi Chemical Co., Ltd.) and YDF-170 (trade name, manufactured by Nippon Steel Chemical & Materials Co., Ltd.).
- Examples of the biphenol type epoxy resin include jER (registered trademark) YX-4000 and jER (registered trademark) YL-6121H (manufactured by Mitsubishi Chemical Corporation).
- Examples of the naphthalene skeleton-containing epoxy resin include NC-7000 (trade name, manufactured by Nippon Kayaku Co., Ltd.) and EXA-4750 (trade name, manufactured by DIC Corporation).
- Examples of the alicyclic epoxy resin include EHPE (registered trademark) -3150 (manufactured by Daicel Chemical Industries, Ltd.).
- Examples of the heterocyclic epoxy resin include TEPIC (registered trademark), TEPIC-L, TEPIC-H, and TEPIC-S (manufactured by Nissan Chemical Industries, Ltd.).
- the compound having at least two epoxy groups in one molecule is preferably a novolac type epoxy resin, and more preferably at least one selected from the group consisting of a phenol novolac type epoxy resin and a cresol novolac type epoxy resin. preferable.
- the positive photosensitive resin composition containing the second resin (B) derived from the novolak type epoxy resin has excellent pattern forming property, easy adjustment of alkali solubility, and less outgassing.
- a hydroxybenzoic acid compound is a compound in which at least one of the 2 to 6 positions of benzoic acid is substituted with a hydroxyl group, for example, salicylic acid, 4-hydroxybenzoic acid, 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid. , 2,5-Dihydroxybenzoic acid, 2,6-dihydroxybenzoic acid, 3,4-dihydroxybenzoic acid, 3,5-dihydroxybenzoic acid, 2-hydroxy-5-nitrobenzoic acid, 3-hydroxy-4-nitro Examples thereof include benzoic acid and 4-hydroxy-3-nitrobenzoic acid, and a dihydroxybenzoic acid compound is preferable from the viewpoint of enhancing alkali developability.
- the hydroxybenzoic acid compound can be used alone or in combination of two or more.
- the second resin (B) is a reaction product of a compound having at least two epoxy groups in one molecule and a hydroxybenzoic acid compound, and formula (5).
- b is an integer of 1 to 5
- * represents the bond portion of the compound having at least two epoxy groups in one molecule to the residue excluding the epoxy group involved in the reaction.
- 0.2 to 0.95 equivalent of the hydroxybenzoic acid compound can be used with respect to 1 equivalent of the epoxy group of the epoxy compound, which is preferable. Uses 0.3 to 0.9 equivalents, more preferably 0.4 to 0.8 equivalents.
- the hydroxybenzoic acid compound is 0.2 equivalent or more, sufficient alkali solubility can be obtained, and when it is 1.0 equivalent or less, the increase in molecular weight due to a side reaction can be suppressed.
- a catalyst may be used to accelerate the reaction between the epoxy compound and the hydroxybenzoic acid compound.
- the amount of the catalyst used can be 0.1 to 10 parts by mass based on 100 parts by mass of the reaction raw material mixture composed of the epoxy compound and the hydroxybenzoic acid compound.
- the reaction temperature can be 60 to 150 ° C. and the reaction time can be 3 to 30 hours.
- Examples of the catalyst used in this reaction include triethylamine, benzyldimethylamine, triethylammonium chloride, benzyltrimethylammonium bromide, benzyltrimethylammonium iodide, triphenylphosphine, chromium octanate, zirconium octanate and the like.
- the number average molecular weight (Mn) of the second resin (B) is preferably 500 to 8000, more preferably 800 to 6000, and even more preferably 1000 to 5000.
- the alkali solubility is appropriate, so that it is good as a resin for a photosensitive material, and when it is 8000 or less, the coatability and developability are good.
- the epoxy equivalent of the second resin (B) is 300 to 7000, preferably 400 to 6000, and even more preferably 500 to 5000.
- the epoxy equivalent of the second resin (B) is 300 or more, sufficient alkali solubility can be exhibited in the second resin (B).
- the epoxy equivalent of the second resin (B) is 7,000 or less, the strength and heat resistance of the coating film after curing can be increased.
- Epoxy equivalents are determined by JIS K 7236: 2009.
- the hydroxyl group equivalent of the second resin (B) is 160 to 500, preferably 170 to 400, and more preferably 180 to 300.
- the hydroxyl group equivalent of the second resin (B) is 160 or more, the strength and heat resistance of the coating film after curing can be increased.
- the hydroxyl group equivalent of the second resin (B) is 500 or less, sufficient alkali solubility can be exhibited in the second resin (B).
- the hydroxyl group equivalent is determined by JIS K 0070: 1992.
- the molar ratio of the epoxy group / phenolic hydroxyl group of the second resin (B) is 1/18 to 9/2, preferably 2/16 to 8/4, and even more preferably 3 /. It is 14 to 7/6.
- the molar ratio of the epoxy group / phenolic hydroxyl group of the second resin (B) is 1/18 or more, the strength and heat resistance of the coating film after curing can be increased.
- the molar ratio of the epoxy group / phenolic hydroxyl group of the second resin (B) is 9/2 or less, sufficient alkali solubility can be exhibited in the second resin (B).
- the molar ratio of epoxy group / phenolic hydroxyl group is calculated from the charge ratio of the raw material at the time of manufacturing the second resin (B), for example, the charge ratio of the compound having at least two epoxy groups in one molecule and the hydroxybenzoic acid compound. It is determined based on the theoretical equivalent.
- the colorant (C) is at least one selected from the group consisting of black dyes and black pigments.
- a black dye and a black pigment may be used in combination.
- a black partition wall on an organic EL element using a positive photosensitive resin composition containing a colorant (C)
- the visibility of a display device such as an organic EL display can be improved.
- the colorant (C) contains a black dye.
- a dye specified by the color index (CI) of Solvent Black 27 to 47 can be used.
- the black dye is preferably Solvent Black 27, 29 or 34 C.I. I. It is specified in. Solvent Black 27-47 C.I. I.
- the positive photosensitive resin composition containing a black dye has less residue of the colorant (C) during development as compared with the positive photosensitive resin composition containing a black pigment, and forms a high-definition pattern on the film. be able to.
- a black pigment may be used as the colorant (C).
- black pigments include carbon black, carbon nanotubes, acetylene black, graphite, iron black, aniline black, titanium black, perylene pigments, and lactam pigments. Those having a surface treatment applied to these black pigments can also be used.
- perylene-based pigments include K0084 and K0083 manufactured by BASF, Pigment Black 21, 30, 31, 32, 33, and 34.
- Examples of commercially available lactam pigments include Irgaphor (registered trademark) Black S0100CF manufactured by BASF. Since it has a high light-shielding property, the black pigment is preferably at least one selected from the group consisting of carbon black, titanium black, perylene pigment, and lactam pigment.
- the positive photosensitive resin composition contains 10 parts by mass to 150 parts by mass of the colorant (C) based on a total of 100 parts by mass of the first resin (A) and the second resin (B). It preferably contains 30 parts by mass to 100 parts by mass, and more preferably 40 parts by mass to 60 parts by mass.
- the content of the colorant (C) is 10 parts by mass or more based on the total of 100 parts by mass, the light-shielding property of the coating film after firing can be maintained.
- the content of the colorant (C) is 150 parts by mass or less based on the total of 100 parts by mass, the coating film can be colored without impairing the alkali developability.
- the positive photosensitive resin composition contains a photoacid generator (D).
- the photoacid generator (D) is a compound that produces an acid when irradiated with radiation such as visible light, ultraviolet light, ⁇ -rays, and electron beams.
- the photoacid generator (D) promotes the decomposition of the acid-decomposable group of the first resin (A) to regenerate the phenolic hydroxyl group and increase the alkali solubility of the first resin (A).
- the presence of the acid generated from the photoacid generator (D) in the irradiated portion makes it easier for the resin in that portion to dissolve in the alkaline aqueous solution together with the acid. As a result, it is possible to form a pattern with high sensitivity and high resolution even with a low exposure amount.
- the photoacid generator (D) can be used alone or in combination of two or more.
- the photoacid generator (D) preferably generates an acid having a pKa of 4 or less by irradiation, and more preferably an acid having a pKa of 3 or less. Such a photoacid generator (D) can produce an acid having an ability to decompose an acid-degradable group.
- the photoacid generator (D) preferably generates an acid having a pKa of -15 or more by irradiation, and more preferably an acid having a pKa of -5 or more. Such a photoacid generator (D) does not excessively proceed with ring-opening polymerization of the epoxy group of the second resin (B) during the exposure and the heat treatment (PEB) after the exposure, and the second resin (D) is developed. The alkali solubility of B) can be maintained.
- Examples of the photoacid generator (D) include onium salts such as trichloromethyl-s-triazine compounds, sulfonium salts, phosphonium salts, diazonium salts, and iodonium salts, quaternary ammonium salts, diazomethane compounds, imide sulfonate compounds, and oximes. Sulfonate compounds can be mentioned. Among these, it is preferable to use an oxime sulfonate compound because of its high sensitivity and high insulating property.
- Examples of the oxime sulfonate compound include a compound represented by the formula (6).
- R 10 is a substituted or unsubstituted alkyl group, alkoxy group, aryl group, or halogen atom
- R 11 and R 12 are independently substituted or unsubstituted aryl group or substituted, respectively.
- it is an unsubstituted heterocyclic group, a cyano group, an acyloxy group, a carboxy group, an alkoxycarbonyl group, or a fluoroalkyl group.
- R 11 and R 12 may be combined to form a ring structure.
- the number of ring members of the ring structure is preferably 3 to 10.
- Examples of the substituted or unsubstituted alkyl group of R 10 include a linear or branched alkyl group having 1 to 10 carbon atoms, and a methyl group, an ethyl group, or an n-propyl group is preferable. ..
- Examples of the substituted or unsubstituted alkoxy group of R 10 include a linear or branched alkoxy group having 1 to 5 carbon atoms, and a methoxy group or an ethoxy group is preferable.
- Examples of the substituent of the alkyl group and the alkoxy group of R 10 include a halogen atom (fluorine atom, chlorine atom, bromine atom, and iodine atom), a cyano group, a nitro group, an aryl group having 6 to 20 carbon atoms, and carbon. Examples thereof include an alkoxy group having 1 to 10 atoms and a cycloalkyl group having 3 to 10 carbon atoms.
- Substituted alkyl group of R 10 is preferably a fluoroalkyl group, a trifluoromethyl group, pentafluoroethyl group, or more preferably heptafluoropropyl group, more preferably a trifluoromethyl group .
- Examples of the substituted or unsubstituted aryl group of R 10 include an aryl group having 6 to 20 carbon atoms, and a phenyl group, a 4-methylphenyl group, or a naphthyl group is preferable.
- Examples of the substituent of the aryl group of R 10 include an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, and a halogen atom (fluorine atom, chlorine atom, bromine atom, and iodine atom). Can be mentioned.
- Examples of the halogen atom of R 10 include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
- Examples of the substituted or unsubstituted aryl group of R 11 and R 12 include an aryl group having 6 to 20 carbon atoms, and a phenyl group or a naphthyl group is preferable.
- Examples of the substituted or unsubstituted heterocyclic group of R 11 and R 12 include 2-benzofuranyl group, 3-benzofuranyl group, 2-benzoimidazolyl group, 2-benzoxazolyl group, 2-benzothiazolyl group and 2-indrill. Included are groups, 3-cummarinyl groups, 4-cummarinyl groups, 3-isocummarinyl groups, and 4-isocummarinyl groups.
- Examples of the substituents of the aryl group and the heterocyclic group of R 11 and R 12 include an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, and an acyloxy group having 2 to 4 carbon atoms. And halogen atoms (fluorine atom, chlorine atom, bromine atom, and iodine atom).
- Examples of the acyloxy group of R 11 and R 12 include an acetoxy group and a benzoyl group.
- Examples of the alkoxycarbonyl group of R 11 and R 12 include an ethoxycarbonyl group.
- fluoroalkyl groups of R 11 and R 12 include a trifluoromethyl group, a pentafluoroethyl group, and a heptafluoropropyl group.
- R 11 is preferably a cyano group, a carboxy group, an alkoxycarbonyl group, or a fluoroalkyl group, and more preferably a cyano group or a trifluoromethyl group.
- R 12 is preferably a substituted or unsubstituted aryl group or a substituted or unsubstituted heterocyclic group, preferably a 4-methoxyphenyl group, or a substituted or unsubstituted 2-benzofuranyl group, 3-benzofuranyl group, 3-. It is preferably a cummarinyl group, a 4-cummarinyl group, a 3-isocummarinyl group, or a 4-isocummarinyl group.
- Examples of the oxime sulfonate compound having a ring structure formed by bonding R 11 and R 12 include an oxime sulfonate compound represented by the formula (6a).
- R 10 is as described in formula (6)
- R 13 is an alkyl group, an alkoxy group, or a halogen atom, respectively
- m represents an integer of 0 to 5.
- Examples of the alkyl group of R 13 include a linear or branched alkyl group having 1 to 10 carbon atoms, and a methyl group, an ethyl group, or an n-propyl group is preferable.
- Examples of the alkoxy group of R 13 include a linear or branched alkoxy group having 1 to 5 carbon atoms, and a methoxy group or an ethoxy group is preferable.
- Examples of the halogen atom of R 13 include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, and a chlorine atom or a fluorine atom is preferable.
- m is preferably 0 or 1.
- Examples of the oxime sulfonate compound include (Z, E) -2- (4-methoxyphenyl) ([((4-methylphenyl) sulfonyl) oxy] imino) acetonitrile and 2- [2- (propylsulfonyloxyimino) thiophene. -3 (2H) -iriden] -2- (2-methylphenyl) acetonitrile, 2- [2- (4-methylphenylsulfonyloxyimine) thiophene-3 (2H) -iriden] -2- (2-methylphenyl) ) Examples include acetonitrile.
- the positive photosensitive resin composition contains 0.5 parts by mass or more of the photoacid generator (D) based on a total of 100 parts by mass of the first resin (A) and the second resin (B). It contains 75 parts by mass, preferably 5 parts by mass to 40 parts by mass, and more preferably 10 parts by mass to 30 parts by mass.
- the content of the photoacid generator (D) is 0.5 parts by mass or more based on the total of 100 parts by mass, high sensitivity can be realized.
- the content of the photoacid generator (D) is 75 parts by mass or less based on the total of 100 parts by mass, the alkali developability is good.
- the positive photosensitive resin composition may further contain a dissolution accelerator (E) for improving the solubility of the alkali-soluble portion in the developing solution during development.
- a dissolution accelerator (E) for improving the solubility of the alkali-soluble portion in the developing solution during development.
- the dissolution accelerator (E) include organic low molecular weight compounds selected from the group consisting of a compound having a carboxy group and a compound having a phenolic hydroxyl group.
- the dissolution accelerator (E) can be used alone or in combination of two or more.
- the "low molecular weight compound” means a compound having a molecular weight of 1000 or less.
- the organic low molecular weight compound has a carboxy group or a plurality of phenolic hydroxyl groups and is alkali-soluble.
- Such organic low molecular weight compounds include, for example, aliphatic monocarboxylic acids such as cinnamic acid, acetic acid, propionic acid, butyric acid, valeric acid, pivalic acid, caproic acid, diethylacetic acid, enanthic acid, capric acid; oxalic acid, malon. Acids, succinic acid, glutaric acid, adipic acid, pimeric acid, suberic acid, azelaic acid, sebacic acid, brassic acid, methylmalonic acid, ethylmalonic acid, dimethylmalonic acid, methylsuccinic acid, tetramethylsuccinic acid, citraconic acid, etc.
- aliphatic monocarboxylic acids such as cinnamic acid, acetic acid, propionic acid, butyric acid, valeric acid, pivalic acid, caproic acid, diethylacetic acid, enanthic acid, capric acid; o
- Aliphatic dicarboxylic acids such as aliphatic tricarboxylic acids such as tricarbaryl acid, aconitic acid, and cinnamic acid; aromatic monocarboxylic acids such as benzoic acid, toluic acid, cumic acid, hemmellitic acid, and mesitylic acid; phthalic acid, isophthalic acid, Aromatic polycarboxylic acids such as terephthalic acid, trimellitic acid, trimesic acid, merophanic acid, pyromellitic acid; aromatic hydroxycarboxylic acids such as dihydroxybenzoic acid, trihydroxybenzoic acid and gallic acid; phenylacetic acid, hydroatropic acid, hydrocay Other carboxylic acids such as dermal acid, mandelic acid, phenylsuccinic acid, atropic acid, cinnamic acid, methyl cinnamic acid, benzyl cinnamic acid, cinnamylidene acetic acid,
- the content of the dissolution accelerator (E) in the positive photosensitive resin composition is 0.1 parts by mass to 50 parts by mass based on a total of 100 parts by mass of the first resin (A) and the second resin (B). It can be a part, preferably 1 part by mass to 35 parts by mass, and more preferably 2 parts by mass to 20 parts by mass. If the content of the dissolution accelerator (E) is 0.1 parts by mass or more based on the total of 100 parts by mass, the dissolution of the resin component can be effectively promoted, and if it is 50 parts by mass or less. It is possible to suppress excessive dissolution of the resin component and improve the pattern forming property of the film, the surface quality and the like.
- the positive photosensitive resin composition contains, as an optional component (F), a resin other than the first resin (A) and the second resin (B), a thermosetting agent, a surfactant, a colorant other than (C), and quinonediazide. It can contain compounds and the like.
- the optional component (F) is defined as not applicable to any of (A) to (E).
- resins other than the first resin (A) and the second resin (B) include acrylic resin, polystyrene resin, epoxy resin, polyamide resin, phenol resin, polyimide resin, polyamic acid resin, polybenzoxazole resin, and polybenzoxazole.
- resin precursors include resin precursors, silicone resins, cyclic olefin polymers, cardo resins, and derivatives of these resins. These resins may or may not have alkali-soluble functional groups.
- thermosetting agent A thermal radical generator can be used as the thermosetting agent.
- Preferred thermal radical generators include organic peroxides, specifically dicumyl peroxide, 2,5-dimethyl-2,5-di (tert-butylperoxy) hexane, tert-butyl.
- Organic peroxides with a 10-hour half-life temperature of 100 to 170 ° C. such as cumyl peroxide, di-tert-butyl peroxide, 1,1,3,3-tetramethylbutylhydroperoxide, cumenehydroperoxide, etc. Can be mentioned.
- the content of the thermosetting agent is preferably 5 parts by mass or less, more preferably 4 parts by mass or less, and further preferably 3 parts by mass or less, based on 100 parts by mass of the total solid content excluding the thermosetting agent. ..
- the positive photosensitive resin composition can contain a surfactant, for example, in order to improve the coatability, the smoothness of the coating film, or the developability of the coating film.
- a surfactant include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleyl ether; and poly such as polyoxyethylene octylphenyl ether and polyoxyethylene nonylphenyl ether.
- Oxyethylene aryl ethers Nonionic surfactants such as polyoxyethylene dialkyl esters such as polyoxyethylene dilaurate and polyoxyethylene distearate; Megafuck (registered trademarks) F-251, F-281, F 430, F-444, R-40, F-553, F-554, F-555, F-556, F-557, F-558, F-559 (above, Product name, manufactured by DIC Co., Ltd., Surfron (registered trademark) S-242, S-243, S-386, S-420, S-611 (above, product name, manufactured by ACG Seimi Chemical Co., Ltd.) Fluorosurfactants such as Organosiloxane Polymers KP323, KP326, KP341 (above, trade name, manufactured by Shin-Etsu Chemical Industry Co., Ltd.) and the like.
- the surfactant can be used alone or in combination of two or more.
- the content of the surfactant is preferably 2 parts by mass or less, more preferably 1 part by mass or less, still more preferably 0.5 parts by mass or less, based on 100 parts by mass of the total solid content excluding the surfactant. Is.
- the positive photosensitive resin composition can contain a second colorant other than the colorant (C).
- the second colorant include dyes, organic pigments, inorganic pigments and the like, which can be used according to the purpose.
- the second colorant can be used in a content that does not impair the effects of the disclosure of the present invention.
- dyes examples include azo dyes, benzoquinone dyes, naphthoquinone dyes, anthraquinone dyes, cyanine dyes, squarylium dyes, croconium dyes, merocyanine dyes, stillben dyes, diphenylmethane dyes, and triphenylmethane dyes.
- dyes include dyes, fluorane dyes, spiropyran dyes, phthalocyanine dyes, indigo dyes, flugide dyes, nickel complex dyes, and azulene dyes.
- pigments examples include C.I. I. Pigment Yellow 20, 24, 86, 93, 109, 110, 117, 125, 137, 138, 147, 148, 153, 154, 166, C.I. I. Pigment Orange 36, 43, 51, 55, 59, 61, C.I. I. Pigment Red 9, 97, 122, 123, 149, 168, 177, 180, 192, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, C.I. I. Pigment Violet 19, 23, 29, 30, 37, 40, 50, C.I. I. Pigment Blue 15, 15: 1, 15: 4, 22, 60, 64, C.I. I. Pigment Green 7, C.I. I. Pigment Brown 23, 25, 26 and the like.
- the above photoacid generator (D) and a quinonediazide compound may be used in combination.
- the quinone diazide compound includes a polyhydroxy compound in which quinone diazide sulfonic acid is ester-bonded, a polyamino compound in which quinone diazide sulfonic acid is conjugated with a sulfonamide, and a polyhydroxypolyamino compound in which quinone diazide sulfonic acid is ester-bonded or a sulfonamide bond. Examples include those that have been used. From the viewpoint of the contrast between the exposed portion and the unexposed portion, it is preferable that 20 mol% or more of the total functional groups of the polyhydroxy compound or the polyamino compound are substituted with quinonediazide.
- polyhydroxy compound examples include Bis-Z, BisP-EZ, TekP-4HBPA, TrisP-HAP, TrisP-PA, TrisP-SA, TrisOCR-PA, BisOCHP-Z, BisP-MZ, BisP-PZ, and BisP-IPZ.
- BisOCP-IPZ BisP-CP, BisRS-2P, BisRS-3P, BisP-OCHP, Methyltris-FR-CR, BisRS-26X, DML-MBPC, DML-MBOC, DML-OCHP, DML-PCHP, DML- PC, DML-PTBP, DML-34X, DML-EP, DML-POP, Dimethylol-BisOC-P, DML-PFP, DML-PSBP, DML-MTrisPC, TriML-P, TriML-35XL, TML-BP, TML- HQ, TML-pp-BPF, TML-BPA, TMOM-BP, HML-TPPHBA, HML-TPHAP (trade name, manufactured by Honshu Chemical Industry Co., Ltd.), BIR-OC, BIP-PC, BIR-PC, BIR -PTBP, BIRO-PCHP, BIP-BIOC-F, 4PC, BIR-BIPC-F, TEP-BIP
- polyamino compound examples include 1,4-phenylenediamine, 1,3-phenylenediamine, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone, and 4,4'-.
- examples thereof include, but are not limited to, diaminodiphenyl sulfide.
- polyhydroxypolyamino compound examples include, but are not limited to, 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane, 3,3'-dihydroxybenzidine and the like.
- the quinone diazide compound is preferably a 1,2-naphthoquinone diazido-4-sulfonic acid ester or a 1,2-naphthoquinone diazido-5-sulfonic acid ester of a polyhydroxy compound.
- the quinone diazide compound When the quinone diazide compound is irradiated with ultraviolet light or the like, it produces a carboxy group through the reaction shown in the following reaction formula 2. By generating a carboxy group, the exposed portion (coating) becomes soluble in an alkaline aqueous solution, and the portion becomes alkaline developable.
- the positive photosensitive resin composition contains 0.5 parts by mass to 75 parts by mass of the quinone diazide compound, preferably 0.5 parts by mass, based on a total of 100 parts by mass of the first resin (A) and the second resin (B). Contains 2 parts by mass to 40 parts by mass, more preferably 5 parts by mass to 30 parts by mass.
- the content of the quinone diazide compound is 0.5 parts by mass or more based on the total of 100 parts by mass, high sensitivity can be realized.
- the content of the quinone diazide compound is 75 parts by mass or less based on the total of 100 parts by mass, the alkali developability is good.
- the positive photosensitive resin composition can be used in a solution state (however, when a black pigment is contained, the pigment is in a dispersed state) after being dissolved in a solvent (G).
- a colorant (C) and a photoacid generator (D) are added to a solution obtained by dissolving the first resin (A) and the second resin (B) in a solvent (G), and if necessary.
- a solution-type positive photosensitive resin composition can be prepared by mixing an optional component (F) such as a dissolution accelerator (E), a thermosetting agent, and a surfactant in a predetermined ratio.
- the positive photosensitive resin composition can be adjusted to a viscosity suitable for the coating method used by changing the amount of the solvent (G).
- Examples of the solvent (G) include glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol dimethyl ether, ethylene glycol methyl ethyl ether and ethylene glycol monoethyl ether, ethylene glycol alkyl ether acetate such as methyl cellosolve acetate and ethyl cellosolve acetate, and diethylene glycol.
- glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol dimethyl ether, ethylene glycol methyl ethyl ether and ethylene glycol monoethyl ether
- ethylene glycol alkyl ether acetate such as methyl cellosolve acetate and ethyl cellosolve acetate
- diethylene glycol diethylene glycol
- Diethylene glycol compounds such as monomethyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol alkyl ether acetate compounds such as propylene glycol methyl ether acetate and propylene glycol ethyl ether acetate, toluene, Aromatic hydrocarbons such as xylene, methyl ethyl ketone, methyl amyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, ketones such as cyclohexanone, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate , 2-Hydroxy-2-methylpropionate, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-2-methylbutanoate,
- the positive photosensitive resin composition includes a first resin (A), a second resin (B), a colorant (C), a photoacid generator (D), and a dissolution accelerator (E), if necessary.
- the optional component (F) can be prepared by dissolving or dispersing in the solvent (G) and mixing.
- the solid content concentration of the positive photosensitive resin composition can be appropriately determined depending on the purpose of use.
- the solid content concentration of the positive photosensitive resin composition may be 1 to 60% by mass, 3 to 50% by mass, or 5 to 40% by mass.
- a known method can be used as the dispersion mixing method when a pigment is used.
- ball type such as ball mill, sand mill, bead mill, paint shaker, locking mill, blade type such as kneader, paddle mixer, planetary mixer, henschel mixer, roll type such as three roll mixer, and other types such as raikai machine, colloid mill, etc.
- An ultrasonic wave, a homogenizer, a rotation / revolution mixer, or the like may be used. It is preferable to use a bead mill because of dispersion efficiency and fine dispersion.
- the prepared positive photosensitive resin composition is usually filtered before use.
- the filtration means include a millipore filter having a pore size of 0.05 to 1.0 ⁇ m.
- the positive photosensitive resin composition prepared in this way is also excellent in long-term storage stability.
- the positive photosensitive resin composition When the positive photosensitive resin composition is used for radiation lithography, first, the positive photosensitive resin composition is dissolved or dispersed in a solvent to prepare a coating composition. Next, the coating composition can be applied to the surface of the substrate and the solvent can be removed by means such as heating to form a film.
- the method for applying the coating composition to the substrate surface is not particularly limited, and for example, a spray method, a roll coating method, a slit method, a spin coating method, or the like can be used.
- the solvent is usually removed by heating to form a film (pre-baking).
- the heating conditions vary depending on the type of each component, the mixing ratio, etc., but a film is usually obtained by heat-treating at 70 to 130 ° C., for example, for 30 seconds to 20 minutes on a hot plate and 1 to 60 minutes in an oven. be able to.
- the prebaked film is irradiated with radiation (for example, visible light, ultraviolet rays, far ultraviolet rays, X-rays, electron beams, gamma rays, synchrotron radiation, etc.) through a photomask having a predetermined pattern (exposure step).
- radiation for example, visible light, ultraviolet rays, far ultraviolet rays, X-rays, electron beams, gamma rays, synchrotron radiation, etc.
- the preferred radiation is ultraviolet to visible light with a wavelength of 250-450 nm.
- the radiation is i-ray.
- the radiation is ghi rays.
- a heat treatment (PEB) for accelerating the decomposition of the acid-degradable group by the acid generated from the photoacid generator (D) can be performed.
- the alkali solubility of the first resin (A) in the exposed portion can be increased by PEB.
- the heating conditions vary depending on the type of each component, the mixing ratio, etc., but PEB is usually performed at 70 to 140 ° C., for example, by heat treatment on a hot plate for 30 seconds to 20 minutes and in an oven for 1 to 60 minutes. be able to.
- the film is developed by bringing it into contact with a developing solution, unnecessary parts are removed, and a pattern is formed on the film (development process).
- a developing solution examples include inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, and aqueous ammonia; primary amines such as ethylamine and n-propylamine; diethylamine and di.
- Secondary amines such as -n-propylamine; Tertiary amines such as triethylamine and methyldiethylamine; Alcoholic amines such as dimethylethanolamine and triethanolamine; Tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline Tertiary ammonium salts such as pyrrole, piperidine, 1,8-diazabicyclo [5.4.0] -7-undecene, 1,5-diazabicyclo [4.3.0] -5-nonane, etc.
- An aqueous solution of the alkali compound of the above can be used.
- An aqueous solution obtained by adding an appropriate amount of a water-soluble organic solvent such as methanol or ethanol, a surfactant or the like to an alkaline aqueous solution can also be used as a developing solution.
- the development time is usually 30 to 180 seconds.
- the developing method may be any of a liquid filling method, a shower method, a dipping method and the like. After the development, a pattern can be formed on the coating film by washing with running water for 30 to 90 seconds, removing unnecessary portions, and air-drying with compressed air or compressed nitrogen.
- a cured film can be obtained by heat-treating the patterned film with a heating device such as a hot plate or an oven at 100 to 350 ° C. for 20 to 200 minutes (post-baking, heat treatment). Process).
- a heating device such as a hot plate or an oven at 100 to 350 ° C. for 20 to 200 minutes
- the temperature may be kept constant, the temperature may be raised continuously, or the temperature may be raised stepwise.
- the heat treatment is preferably carried out in a nitrogen atmosphere.
- the optical density (OD value) of the cured film of the positive photosensitive resin composition is preferably 0.5 or more, more preferably 0.7 or more, and 1.0 or more per 1 ⁇ m of the film thickness. Is even more preferable. When the OD value of the cured film is 0.5 or more per 1 ⁇ m of the film thickness, sufficient light-shielding property can be obtained.
- the method for producing an organic EL device partition wall or an insulating film is to prepare a coating composition by dissolving or dispersing a positive photosensitive resin composition in a solvent, or to apply the coating composition to a substrate to form a coating.
- a coating composition by dissolving or dispersing a positive photosensitive resin composition in a solvent, or to apply the coating composition to a substrate to form a coating.
- remove the solvent contained in the film to dry the film irradiate the dried film with radiation through a photomask to expose the film, and heat the exposed film to heat the first resin.
- Decomposing at least a part of the acid-decomposable group of (A) developing the film by contacting the film heated after exposure with a developing solution to form a pattern on the film, and the film on which the pattern is formed. Is heat-treated at a temperature of 100 ° C. to 350 ° C. to form an organic EL element partition wall or an insulating film.
- the epoxy equivalent of the second resin (B) having an epoxy group and a phenolic hydroxyl group is 300 to 1800, and the photoacid generator (D) is trifluoromethanesulfonic acid. Generate.
- the epoxy equivalent of the second resin (B) is 300 or more and 1800 or less, heat dripping of the coating film during the heat treatment can be suppressed.
- the epoxy equivalent of the second resin (B) having an epoxy group and a phenolic hydroxyl group is preferably 400 or more, more preferably 500 or more, and further preferably 600 or more.
- the epoxy equivalent of the second resin (B) having an epoxy group and a phenolic hydroxyl group is preferably 1500 or less, more preferably 1000 or less, and even more preferably 900 or less.
- the positive photosensitive resin composition of this embodiment is particularly suitable for forming a thick film because of its high sensitivity, and even if the film is exposed to a high temperature during post-baking, the pattern shape of the film can be accurately formed. The film can be cured while being held. Therefore, the positive photosensitive resin composition of this embodiment can be suitably used for the halftone exposure process.
- the number average molecular weight (Mn) of the second resin (B) having an epoxy group and a phenolic hydroxyl group is preferably 500 to 8000, more preferably 800 to 6000, and more preferably 1000 to 5000. Is more preferable.
- the number average molecular weight is 500 or more, the alkali solubility is appropriate, so that it is good as a resin for a photosensitive material, and when it is 8000 or less, the coatability and developability are good.
- the photoacid generator (D) is preferably PAG-169 (manufactured by BASF).
- the first resin (A) is preferably a copolymer containing a structural unit represented by the formula (3) and a structural unit represented by the formula (2).
- the structural unit represented by the formula (3) and the structural unit represented by the formula (2) are as described above.
- the acid-degradable group of the first resin (A) is preferably a group represented by the formula (7), and is a 1-alkoxyalkyl group or a group represented by the formula (7). It is more preferable that one of R 6 or R 7 and R 8 are bonded to form a ring structure, that is, a 1-ethoxyethyl group, a 1-n-propoxyethyl group, or a 2-tetrahydrofuranyl group. , Or a 2-tetrahydropyranyl group is more preferred.
- the groups R 6 , R 7 and R 8 represented by the formula (7) are as described above.
- the content of the colorant (C) is preferably 10 parts by mass based on a total of 100 parts by mass of the first resin (A) and the second resin (B). It is ⁇ 150 parts by mass, more preferably 30 parts by mass to 100 parts by mass, and further preferably 40 parts by mass to 90 parts by mass. If the content of the colorant (C) is 40 parts by mass or more based on a total of 100 parts by mass of the first resin (A) and the second resin (B), the light-shielding property of the thick film and the coating pattern If the formability is good and the amount is 150 parts by mass or less, the coating film can be colored without impairing the alkali developability.
- One embodiment is an organic EL device partition wall containing a cured product of a positive photosensitive resin composition.
- One embodiment is an organic EL device insulating film containing a cured product of a positive photosensitive resin composition.
- One embodiment is an organic EL device containing a cured product of a positive photosensitive resin composition.
- the weight average molecular weight and number average molecular weight of the first resin (A), the second resin (B) and other resins are calculated using a calibration curve prepared using a polystyrene standard substance under the following measurement conditions. did.
- V-601 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) was completely dissolved in 14.6 g of 1-methoxy-2-propyl acetate (manufactured by Daicel Co., Ltd.). The two solutions obtained were placed in 61.2 g of 1-methoxy-2-propyl acetate (manufactured by Daicel Corporation) heated to 85 ° C. in a nitrogen gas atmosphere in a 300 mL three-necked flask over 2 hours at the same time. The mixture was added dropwise, and then the reaction was carried out at 85 ° C. for 3 hours.
- the reaction solution cooled to room temperature was added dropwise to 815 g of toluene to precipitate the copolymer.
- the precipitated copolymer was recovered by filtration and vacuum dried at 90 ° C. for 4 hours to recover 32.4 g of white powder.
- the obtained PCX-02e had a number average molecular weight of 3100 and a weight average molecular weight of 6600.
- GMA-MAA glycidyl methacrylate and methacrylic acid
- the PGMEA solution of GMA-MAA had low stability, and the increase in molecular weight progressed with time, and the viscosity of the solution increased.
- First resin (A) [Production Example 1] Production of First Resin (A) (PCX-02e-EOE) in which Phenolic Hydroxyl Groups Are Protected by 1-ethoxyethyl Group Polymerizable with Phenolic Hydroxyl Groups in 100 mL of Three-Mouth Flask 10.0 g of an alkaline aqueous solution-soluble copolymer (PCX-02e) of a monomer and other polymerizable monomer, and 0.60 g of a pyridinium salt of p-toluenesulfonic acid (manufactured by Tokyo Kasei Kogyo Co., Ltd.) as an acid catalyst.
- PCX-02e-EOE Phenolic Hydroxyl Groups Are Protected by 1-ethoxyethyl Group Polymerizable with Phenolic Hydroxyl Groups in 100 mL of Three-Mouth Flask 10.0 g of an alkaline aqueous solution-soluble
- the obtained solid was dissolved in 50.0 g of ethyl acetate and added dropwise to 200 g of toluene to precipitate the product.
- the precipitate was collected by filtration and vacuum dried at 80 ° C. for 4 hours to recover 11.0 g of white powder.
- the obtained powder was dissolved in propylene glycol monomethyl acetate to obtain a solution having a solid content of 20% by mass of the first resin (A) (PCX-02e-EOE) in which the phenolic hydroxyl group was protected by a 1-ethoxyethyl group. ..
- the obtained PCX-02e-EOE has a number average molecular weight of 4300, a weight average molecular weight of 7900, a proportion of phenolic hydroxyl groups protected by acid-degradable groups of 65 mol%, and at least one phenolic hydroxyl group is acid-degradable.
- the number of structural units represented by the formula (3) protected by the group was 55% of the total number of structural units of the first resin (A).
- the ratio of phenolic hydroxyl groups protected by acid-decomposable groups is determined by using a thermogravimetric differential thermal analyzer (TG / DTA6200, manufactured by Hitachi High-Tech Science Co., Ltd.) in a nitrogen gas stream at a heating rate of 10 ° C./min.
- the obtained powder was dissolved in propylene glycol monomethyl acetate to obtain a 20% by mass solution of the first resin (A) (PCX-02e-Boc) in which the phenolic hydroxyl group was protected by a tert-butoxycarbonyl group. ..
- the obtained PCX-02e-Boc has a number average molecular weight of 4400, a weight average molecular weight of 7800, a proportion of phenolic hydroxyl groups protected by acid-degradable groups of 30 mol%, and at least one phenolic hydroxyl group is acid-degradable.
- the number of structural units represented by the formula (3) protected by the group was 26% of the total number of structural units of the first resin (A).
- the ratio of phenolic hydroxyl groups protected by acid-decomposable groups is determined by using a thermogravimetric differential thermal analyzer (TG / DTA6200, manufactured by Hitachi High-Tech Science Co., Ltd.) in a nitrogen gas stream at a heating rate of 10 ° C./min. It was calculated from the weight loss rate (%) of the first resin (A) at 220 ° C. when the temperature was raised from room temperature to 400 ° C. under the conditions.
- TG / DTA6200 thermogravimetric differential thermal analyzer
- the obtained solid was dissolved in 50.0 g of ethyl acetate and added dropwise to 200 g of toluene to precipitate the product.
- the precipitate was collected by filtration and vacuum dried at 80 ° C. for 4 hours to recover 11.0 g of white powder.
- the obtained powder was dissolved in propylene glycol monomethyl acetate to obtain a solution having a solid content of 20% by mass of the first resin (A) (PCX-02e-THF) in which the phenolic hydroxyl group was protected by a 2-tetrahydrofuranyl group. ..
- the obtained PCX-02e-THF has a number average molecular weight of 3716, a weight average molecular weight of 6806, a proportion of phenolic hydroxyl groups protected by acid-degradable groups of 65 mol%, and at least one phenolic hydroxyl group is acid-degradable.
- the number of structural units represented by the formula (3) protected by the group was 55% of the total number of structural units of the first resin (A).
- the ratio of phenolic hydroxyl groups protected by acid-decomposable groups is determined by using a thermogravimetric differential thermal analyzer (TG / DTA6200, manufactured by Hitachi High-Tech Science Co., Ltd.) in a nitrogen gas stream at a heating rate of 10 ° C./min.
- the obtained powder was dissolved in propylene glycol monomethyl acetate to prepare a 20% by mass solid content solution of the first resin (A) (PCX-02e-POE) in which the phenolic hydroxyl group was protected by a 1-n-propoxyethyl group. Obtained.
- the obtained PCX-02e-POE has a number average molecular weight of 4550, a weight average molecular weight of 8054, a proportion of phenolic hydroxyl groups protected by acid-degradable groups of 65 mol%, and at least one phenolic hydroxyl group is acid-degradable.
- the number of structural units represented by the formula (3) protected by the group was 55% of the total number of structural units of the first resin (A).
- the ratio of phenolic hydroxyl groups protected by acid-decomposable groups is determined by using a thermogravimetric differential thermal analyzer (TG / DTA6200, manufactured by Hitachi High-Tech Science Co., Ltd.) in a nitrogen gas stream at a heating rate of 10 ° C./min. Weight loss rate of the first resin (A) at 260 ° C. when the temperature is raised from room temperature to 250 ° C. under the conditions, held for 10 minutes, and further raised to 400 ° C. under the condition of a temperature rising rate of 10 ° C./min. Calculated from (%).
- TG / DTA6200 manufactured by Hitachi High-Tech Science Co., Ltd.
- Second resin (B) [Production Example 5] Production of a second resin (N770OH70) having an epoxy group and a phenolic hydroxyl group 75.2 g of ⁇ -butyrolactone (manufactured by Mitsubishi Chemical Corporation) as a solvent in a 300 mL three-necked flask, at least in one molecule As a compound having two epoxy groups, 37.6 g of EPICLON (registered trademark) N-770 (phenol novolac type epoxy resin manufactured by DIC Co., Ltd., epoxy equivalent 188) was charged and dissolved at 60 ° C. in a nitrogen gas atmosphere.
- EPICLON registered trademark
- N-770 phenol novolac type epoxy resin manufactured by DIC Co., Ltd., epoxy equivalent 188
- reaction solution was returned to room temperature, diluted with ⁇ -butyrolactone to a solid content of 20% by mass, and the solution was filtered to obtain a solution of 286.5 g of a second resin (N770OH70) having an epoxy group and a phenolic hydroxyl group.
- a second resin N770OH70 having an epoxy group and a phenolic hydroxyl group.
- the number average molecular weight of the obtained reaction product was 2400, the weight average molecular weight was 8300, and the epoxy equivalent was 2000.
- the reaction solution was returned to room temperature, diluted with ⁇ -butyrolactone to a solid content of 20% by mass, and the solution was filtered to obtain a solution of a second resin (N695OH70) having 274.2 g of an epoxy group and a phenolic hydroxyl group.
- the number average molecular weight of the obtained reaction product was 3000, the weight average molecular weight was 7500, and the epoxy equivalent was 2200.
- Colorant (C) As the colorant (C), VALIFAST (registered trademark) BLACK 3804 (black dye specified by CI of Solvent Black 34, manufactured by Orient Chemical Industry Co., Ltd.), NUBIAN (registered trademark) BLACK PA- 2802 (mixture of black dye and oil-soluble dye specified by CI of Solvent Black 27, manufactured by Orient Chemical Industry Co., Ltd.) or VALIFAST (registered trademark) BLACK 3820 (defined by CI of Solvent Black 27). Black dye, manufactured by Orient Chemical Industry Co., Ltd.) was used.
- PAG-103 (2- [2- (propylsulfonyloxyimino) thiophene-3 (2H) -iriden] -2- (2-methylphenyl) acetonitrile, which is an oxime photoacid generator , BASF, CAS No. 852246-55-0) was used.
- the structure of PAG-103 is shown below.
- PAG-169 manufactured by BASF, which is an oxime-based photoacid generator, was used.
- TS-150A (4,4'-[1- [4- [1- (4-hydroxyphenyl) -1-methylethyl] phenyl] ethylidene] bisphenol (TrisP-PA) and 6-diazo-5 as quinonediazide compounds
- TrisP-PA 6-dihydro-5-oxonaphthalene-1-sulfonic acid (1,2-naphthoquinonediazide-5-sulfonic acid), manufactured by Toyo Synthetic Industry Co., Ltd. was used.
- the structure of TS-150A is shown below.
- Phloroglucinol or 2,4-dihydroxybenzoic acid was used as the dissolution accelerator (E).
- F-559 fluorine-based surfactant, manufactured by DIC Corporation was used as the surfactant (leveling agent).
- PCX-02e of Reference Production Example 1 GMA-MAA of Reference Production Example 2
- EPICLON registered trademark
- N-770 phenol novolac type epoxy resin manufactured by DIC Corporation, epoxy equivalent 188
- Shonor DIC Corporation
- BRG-556 phenol novolac resin manufactured by Aika Kogyo Co., Ltd.
- the positive photosensitive resin composition was dried on a glass substrate (size 100 mm ⁇ 100 mm ⁇ 1 mm) and had a dry film thickness of about 1.5 ⁇ m (Examples 1 to 13, Comparative Examples 1 to 4) or about 3.8 ⁇ m (Example 14).
- the solvent was dried by spin-coating to 19) and heating on a hot plate at 120 ° C. for 80 seconds. Then, a film was obtained by curing at 250 ° C. for 60 minutes in a nitrogen gas atmosphere.
- the OD value of the cured film was measured with a transmission densitometer (BMT-1, manufactured by Sakata Inx Engineering Co., Ltd.), corrected by the OD value of glass only, and converted to the OD value per 1 ⁇ m of the film thickness.
- the thickness of the coating film was measured using an optical film thickness measuring device (F20-NIR, manufactured by Filmometrics Co., Ltd.).
- the positive photosensitive resin composition was bar-coated on a glass substrate (size 100 mm ⁇ 100 mm ⁇ 1 mm) so that the dry film thickness was 2.0 ⁇ m, and heated on a hot plate at 120 ° C. for 80 seconds to dry the solvent. After measuring the dry film thickness using an optical film thickness measuring device (F20-NIR, manufactured by Filmometrics Co., Ltd.), 2.38 mass% tetramethyl using a spin developing device (AD-1200, manufactured by Takizawa Sangyo Co., Ltd.). Alkaline development was carried out with an aqueous solution of ammonium hydroxide for 60 seconds.
- the film thickness after alkaline development was measured again using an optical film thickness measuring device (F20-NIR, manufactured by Filmometrics Co., Ltd.), and the film thickness ( ⁇ m) dissolved before and after development was calculated as the unexposed portion solubility. ..
- a positive photosensitive resin composition was bar-coated on a glass substrate (size 100 mm ⁇ 100 mm ⁇ 1 mm) so that the dry film thickness was 2.0 ⁇ m, and prebaked by heating on a hot plate at 100 ° C. for 1 minute. ..
- an exposure device incorporating an ultra-high pressure mercury lamp (trade name: Multilight ML-251A / B, Ushio, Inc.) Band pass filter for mercury exposure (trade name HB0365, manufactured by Asahi Spectrometry Co., Ltd.) and quartz photomask (5 ⁇ m, 10 ⁇ m, 20 ⁇ m, 50 ⁇ m, 100 ⁇ m, 200 ⁇ m, 500 ⁇ m line & space (L / S)) It was exposed at 100 mJ / cm 2 through the one having a pattern).
- the exposure amount was measured using an ultraviolet integrated light meter (trade name UIT-150 light receiving unit UVD-S365, manufactured by Ushio, Inc.). After the exposure, PEB was performed by heating on a hot plate at 100 ° C. or 120 ° C. for 3 minutes or 5 minutes. Then, using a spin developer (AD-1200, manufactured by Takizawa Sangyo Co., Ltd.), alkali development was carried out for 60 seconds with a 2.38 mass% tetramethylammonium hydroxide aqueous solution. The film thickness after the alkaline development was measured again using an optical film thickness measuring device (F20-NIR, manufactured by Filmometrics Co., Ltd.), and the film thickness ( ⁇ m) dissolved before and after the development was calculated as the exposure portion solubility.
- an ultraviolet integrated light meter trade name UIT-150 light receiving unit UVD-S365, manufactured by Ushio, Inc.
- PEB was performed by heating on a hot plate at 100 ° C. or 120 ° C. for
- a positive photosensitive resin composition was bar-coated on a glass substrate (size 100 mm ⁇ 100 mm ⁇ 1 mm) so that the dry film thickness was 3.8 ⁇ m, vacuum dried for 90 seconds, and then placed on a hot plate with a lid at 110 ° C. Prebaking was performed by heating for 2 minutes.
- An exposure device (trade name: Multilight ML-251A / B, manufactured by Ushio, Inc.) incorporating an ultra-high pressure mercury lamp, a bandpass filter for mercury exposure (trade name: HB0365, manufactured by Asahi Spectral Co., Ltd.) and a quartz photomask.
- Exposure was performed at 100 mJ / cm 2 or less via (having a ⁇ 10 ⁇ m pattern).
- the exposure amount was measured using an ultraviolet integrated light meter (trade name UIT-150 light receiving unit UVD-S365, manufactured by Ushio, Inc.).
- PEB was performed by heating on a hot plate with a lid at 115 to 130 ° C. for 3 minutes or 4 minutes.
- a spin developer AD-1200, manufactured by Takizawa Sangyo Co., Ltd.
- alkali development was carried out for 60 seconds with a 2.38 mass% tetramethylammonium hydroxide aqueous solution. Further, the coating film was cured by heating at 250 ° C.
- the film thickness of the coating film is measured using an optical film thickness measuring device (F20-NIR, manufactured by Filmometry Co., Ltd.), and the formed holes are measured with a microscope (VHX-6000, manufactured by KEYENCE CORPORATION). Observed. A film thickness of 3.0 ⁇ m or more and a hole diameter of 10 ⁇ m or more was judged to be good, and a film thickness of 2.9 ⁇ m or less or a hole diameter of 9 ⁇ m or less was judged to be defective.
- a positive photosensitive resin composition was bar-coated on a glass substrate (size 100 mm ⁇ 100 mm ⁇ 1 mm) so that the dry film thickness was 3.8 ⁇ m, vacuum dried for 90 seconds, and then placed on a hot plate with a lid at 110 ° C. Prebaking was performed by heating for 2 minutes.
- An exposure device (trade name: Multilight ML-251A / B, manufactured by Ushio, Inc.) incorporating an ultra-high pressure mercury lamp, a bandpass filter for mercury exposure (trade name: HB0365, manufactured by Asahi Spectral Co., Ltd.) and a quartz halftone.
- a photomask a hole having a transmittance of 100% and a diameter of 10.5 ⁇ m in the center and a circular pattern having an outer diameter of 30.5 ⁇ m and a width of 10 ⁇ m having a transmittance of 25% on the outside. It was exposed below. The exposure amount was measured using an ultraviolet integrated light meter (trade name UIT-150 light receiving unit UVD-S365, manufactured by Ushio, Inc.). After the exposure, PEB was performed by heating on a hot plate with a lid at 110 to 130 ° C. for 3 minutes or 4 minutes.
- Tables 1 and 2 are solid content conversion values. Tables 1 and 2 also show the protection rate of the phenolic hydroxyl group of the first resin (A) based on the total of the alkali-soluble functional groups of the first resin (A) and the second resin (B). .. Table 1 shows the evaluation results of the positive photosensitive resin compositions of Examples 1 to 9 and Comparative Examples 1 and 2. Table 2 shows the evaluation results of the positive photosensitive resin compositions of Examples 10 to 13 and Comparative Examples 3 to 4.
- Example 14 to 19 The first resin (A) and the second resin (B) are mixed and dissolved with the compositions shown in Table 3, and the colorant (C) and the photoacid generator (D) shown in Table 3 are added to the obtained solution. ), The dissolution accelerator (E), and the GBL / PGMEA mixed solvent (G) were added and further mixed. After visually confirming that the components were dissolved, the mixture was filtered through a millipore filter having a pore size of 0.22 ⁇ m to prepare a positive photosensitive resin composition having a solid content concentration of about 12% by mass. The mass part of the composition in Table 3 is a solid content conversion value.
- Table 3 shows the protection rate of the phenolic hydroxyl group of the first resin (A) based on the total of the alkali-soluble functional groups of the first resin (A) and the second resin (B), and the second resin (B). Epoxy equivalents are also listed. Table 3 shows the evaluation results of the positive photosensitive resin compositions of Examples 14 to 19.
- the positive photosensitive resin composition according to the present disclosure can be suitably used for radiation lithography for forming a partition wall or an insulating film of an organic EL element.
- the organic EL element provided with a partition wall or an insulating film formed from the positive photosensitive resin composition according to the present disclosure is suitably used as an electronic component of a display device showing good contrast.
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Abstract
Description
[1]
複数のフェノール性水酸基を有し、前記複数のフェノール性水酸基の少なくとも一部が酸分解性基で保護された第1樹脂(A)と、
エポキシ基及びフェノール性水酸基を有する第2樹脂(B)と、
黒色染料及び黒色顔料からなる群より選択される少なくとも1種の着色剤(C)と、
光酸発生剤(D)と
を含む、ポジ型感光性樹脂組成物。
[2]
前記第1樹脂(A)が、複数のフェノール性水酸基を有し、前記複数のフェノール性水酸基の少なくとも一部が前記酸分解性基で保護された、フェノール性水酸基を有する重合性単量体とその他の重合性単量体とのアルカリ水溶液可溶性共重合体である、[1]に記載のポジ型感光性樹脂組成物。
[3]
前記第1樹脂(A)の前記酸分解性基が、1-アルコキシアルキル基である、[1]又は[2]のいずれかに記載のポジ型感光性樹脂組成物。
[4]
前記第1樹脂(A)が、式(3)
で表される構造単位を有し、前記第1樹脂(A)が、sが1以上の整数である前記構造単位を少なくとも1つ有する、[2]に記載のポジ型感光性樹脂組成物。
[5]
前記第1樹脂(A)が、式(2)
で表される構造単位を有する、[2]~[4]のいずれかに記載のポジ型感光性樹脂組成物。
[6]
前記第1樹脂(A)のフェノール性水酸基の10モル%~95モル%が前記酸分解性基で保護されている、[1]~[5]のいずれかに記載のポジ型感光性樹脂組成物。
[7]
前記第1樹脂(A)及び前記第2樹脂(B)のアルカリ可溶性官能基の合計を基準として、前記第1樹脂(A)のフェノール性水酸基の5モル%~65モル%が前記酸分解性基で保護されている、[1]~[6]のいずれかに記載のポジ型感光性樹脂組成物。
[8]
前記第1樹脂(A)及び前記第2樹脂(B)の合計質量を基準として、20質量%~90質量%の前記第1樹脂(A)を含む、[1]~[7]のいずれかに記載のポジ型感光性樹脂組成物。
[9]
前記第1樹脂(A)及び前記第2樹脂(B)の合計100質量部を基準として、10質量部~150質量部の前記着色剤(C)を含む、[1]~[8]のいずれかに記載のポジ型感光性樹脂組成物。
[10]
前記光酸発生剤(D)を、前記第1樹脂(A)及び前記第2樹脂(B)の合計100質量部を基準として0.1質量部~85質量部含む、[1]~[9]のいずれかに記載のポジ型感光性樹脂組成物。
[11]
前記ポジ型感光性樹脂組成物の硬化被膜の光学濃度(OD値)が膜厚1μmあたり0.5以上である、[1]~[10]のいずれかに記載のポジ型感光性樹脂組成物。
[12]
前記第2樹脂(B)が、1分子中に少なくとも2個のエポキシ基を有する化合物とヒドロキシ安息香酸化合物との反応物であって、式(5)
の構造を有する化合物である、[1]~[11]のいずれかに記載のポジ型感光性樹脂組成物。
[13]
前記1分子中に少なくとも2個のエポキシ基を有する化合物がノボラック型エポキシ樹脂である、[12]に記載のポジ型感光性樹脂組成物。
[14]
前記ヒドロキシ安息香酸化合物がジヒドロキシ安息香酸化合物である、[12]又は[13]のいずれかに記載のポジ型感光性樹脂組成物。
[15]
前記第2樹脂(B)のエポキシ当量が300~1800であり、前記光酸発生剤(D)が光照射によりトリフルオロメタンスルホン酸を生成する、[1]~[14]のいずれかに記載のポジ型感光性樹脂組成物。
[16]
[1]~[15]のいずれかに記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子隔壁。
[17]
[1]~[15]のいずれかに記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子絶縁膜。
[18]
[1]~[15]のいずれかに記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子。
第1樹脂(A)は複数のフェノール性水酸基を有し、複数のフェノール性水酸基の少なくとも一部が酸分解性基で保護されたものであれば特に限定されない。フェノール性水酸基はアルカリ可溶性官能基であり、その一部が酸分解性基で保護されていることにより、第1樹脂(A)の露光前のアルカリ溶解性は抑制されている。第1樹脂(A)は、フェノール性水酸基以外のアルカリ可溶性官能基を有していてもよく、それらのアルカリ可溶性官能基は、フェノール性水酸基と同様に酸分解性基で保護されていてもよい。露光時に発生した酸の存在下、必要に応じて露光後ベーク(PEB、post exposure bake)を行うことにより、酸分解性基の分解(脱保護)が促進され、フェノール性水酸基が再生する。これにより現像時に露光部で第1樹脂(A)のアルカリ溶解が促進される。第1樹脂(A)はフェノール性水酸基以外のアルカリ可溶性官能基、例えばカルボキシ基、スルホ基、リン酸基、酸無水物基、メルカプト基等を有してもよい。第1樹脂(A)は、単独で、又は2種類以上を組み合わせて使用することができる。例えば、第1樹脂(A)は、重合体の構成単位、酸分解性基、フェノール性水酸基の保護率、又はこれらの組み合わせが異なる2種類以上の樹脂の組み合わせであってよい。
第1樹脂(A)は、複数のフェノール性水酸基を有するベース樹脂(a)のフェノール性水酸基の一部を酸分解性基で保護することによって得ることができる。酸分解性基で保護されたフェノール性水酸基を有する第1樹脂(A)は、Ar-O-Rの部分構造を有し、Arはフェノール由来の芳香環を表し、Rは酸分解性基を表す。
-CR6R7-O-R8 (7)
(式(7)中、R6及びR7は、それぞれ独立して水素原子、又は炭素原子数1~4の直鎖状若しくは分岐状のアルキル基であり、R8は、炭素原子数1~12の直鎖状、分岐状若しくは環状のアルキル基、炭素原子数7~12のアラルキル基、又は炭素原子数2~12のアルケニル基であり、R6又はR7の一方とR8とが結合して環構造を形成してもよい。)で表される基が挙げられる。式(7)で表される基は、フェノール性水酸基由来の酸素原子と一緒にアセタール構造又はケタール構造を形成する。これらの酸分解性基は、単独で、又は2種類以上を組み合わせて使用することができる。環構造の環員数は3~10であることが好ましい。R6、R7及びR8は、フッ素、塩素、臭素及びヨウ素からなる群より選ばれるハロゲン原子で置換されていてもよい。
第1樹脂(A)のベース樹脂(a)としては、例えば、複数のフェノール性水酸基を有する、ポリスチレン樹脂、エポキシ樹脂、ポリアミド樹脂、フェノール樹脂、ポリイミド樹脂、ポリアミック酸樹脂、ポリベンゾオキサゾール樹脂、ポリベンゾオキサゾール樹脂前駆体、シリコーン樹脂、環状オレフィンポリマー、カルド樹脂、及びこれらの樹脂の誘導体が挙げられる。例えば、フェノール樹脂の誘導体として、アルケニル基がベンゼン環に結合したポリアルケニルフェノール樹脂、ポリスチレン樹脂の誘導体として、フェノール性水酸基とヒドロキシアルキル基又はアルコキシ基とがベンゼン環に結合したヒドロキシポリスチレン樹脂誘導体などが挙げられる。ベース樹脂(a)として、フェノール性水酸基を有する重合性単量体の単独重合体又は共重合体を使用することもできる。これらのベース樹脂(a)は、単独で、又は2種類以上を組み合わせて使用することができる。ベース樹脂(a)はラジカル重合性官能基を有してもよい。一実施態様では、ベース樹脂(a)はラジカル重合性官能基として(メタ)アクリロイルオキシ基、アリル基又はメタリル基を有する。
一実施態様では、第1樹脂(A)のベース樹脂(a)は、フェノール性水酸基を有する重合性単量体とその他の重合性単量体とのアルカリ水溶液可溶性共重合体(a1)であり、アルカリ水溶液可溶性共重合体(a1)は複数のフェノール性水酸基を有する。この実施態様において、第1樹脂(A)は、アルカリ水溶液可溶性共重合体(a1)の複数のフェノール性水酸基の少なくとも一部が酸分解性基で保護されたものである。アルカリ水溶液可溶性共重合体(a1)は、フェノール性水酸基以外のアルカリ可溶性官能基、例えばカルボキシ基、スルホ基、リン酸基、酸無水物基、又はメルカプト基をさらに有してもよい。重合性単量体が有する重合性官能基としては、ラジカル重合性官能基を挙げることができ、例えば、CH2=CH-、CH2=C(CH3)-、CH2=CHCO-、CH2=C(CH3)CO-、-OC-CH=CH-CO-などが挙げられる。
で表される構造単位、及び式(2)
で表される構造単位を有する。
-CR6R7-O-R8 (7)
で表される基であることが好ましい。式(7)中、R6及びR7は、それぞれ独立して水素原子、又は炭素原子数1~4の直鎖状若しくは分岐状のアルキル基であることがより好ましい。R8は炭素原子数1~12の直鎖状、分岐状若しくは環状のアルキル基、炭素原子数7~12のアラルキル基、又は炭素原子数2~12のアルケニル基であるか、R6又はR7の一方とR8とが結合して環員数3~10の環構造を形成することがより好ましい。R6、R7及びR8は、フッ素、塩素、臭素及びヨウ素からなる群より選ばれるハロゲン原子で置換されていてもよい。そのような酸分解性基としては、例えば、1-アルコキシアルキル基が挙げられる。1-アルコキシアルキル基としては、例えば、メトキシメチル基、1-メトキシエチル基、1-エトキシエチル基、1-n-プロポキシエチル基、1-n-ブトキシエチル基、1-イソブトキシエチル基、1-(2-クロロエトキシ)エチル基、1-(2-エチルヘキシルオキシ)エチル基、1-シクロヘキシルオキシエチル基、及び1-(2-シクロヘキシルエトキシ)エチル基が挙げられ、1-エトキシエチル基及び1-n-プロポキシエチル基が好ましい。R6又はR7の一方とR8とが結合して環員数3~10の環構造を形成した酸分解性基としては、例えば、2-テトラヒドロフラニル基、及び2-テトラヒドロピラニル基が挙げられ、2-テトラヒドロフラニル基が好ましい。
エポキシ基及びフェノール性水酸基を有する第2樹脂(B)はアルカリ水溶液可溶性樹脂である。第2樹脂(B)はフェノール性水酸基以外のアルカリ可溶性官能基を有していてもよい。フェノール性水酸基及び他のアルカリ可溶性官能基は酸分解性基で保護されていてもよい。第2樹脂(B)は、例えば、1分子中に少なくとも2個のエポキシ基を有する化合物(以下、「エポキシ化合物」と表記することがある。)のエポキシ基の一部と、ヒドロキシ安息香酸化合物のカルボキシ基を反応させることで得ることができる。第2樹脂(B)のエポキシ基は、現像後の加熱処理(ポストベーク)時にフェノール性水酸基との反応により架橋を形成し、これにより被膜の耐薬品性、耐熱性などを向上させることができる。フェノール性水酸基は、現像時のアルカリ水溶液に対する可溶性に寄与することから、第2樹脂(B)は、低露光量で露光したときに、露光部において酸分解性基が十分に分解(脱保護)されなかった第1樹脂(A)の溶解促進剤としても機能し、一方で、フェノール性水酸基はカルボキシ基と比較してアルカリ可溶性が相対的に低いことから、未露光部において第2樹脂(B)はアルカリ水溶液に過度に溶解しない。そのため、第2樹脂(B)を用いることで、感光性樹脂組成物を高感度にすることができ、かつ高解像度のパターンを形成することができる。また、第2樹脂(B)では、アルカリ可溶性官能基として酸性度の比較的低いフェノール性水酸基が、酸に対する反応性を有するエポキシ基と共存することから、カルボキシ基などの酸性度の高い官能基及びエポキシ基を有する樹脂と比較して、第2樹脂(B)のエポキシ基の開環重合が進行しにくい。これにより、感光性樹脂組成物の性能、例えばアルカリ溶解性、架橋反応性などを長期間にわたり安定的に維持することができる。
着色剤(C)は黒色染料及び黒色顔料からなる群より選択される少なくとも1種である。黒色染料と黒色顔料とを併用してもよい。例えば、着色剤(C)を含むポジ型感光性樹脂組成物を用いて有機EL素子に黒色の隔壁を形成することにより、有機ELディスプレイ等の表示装置の視認性を向上させることができる。
ポジ型感光性樹脂組成物は光酸発生剤(D)を含む。光酸発生剤(D)は可視光、紫外光、γ線、電子線などの放射線が照射されると酸を生成する化合物である。光酸発生剤(D)は、第1樹脂(A)の酸分解性基の分解を促進してフェノール性水酸基を再生させ、第1樹脂(A)のアルカリ溶解性を増大させる。また、放射線が照射された部分に光酸発生剤(D)から生じた酸が存在することで、その部分の樹脂が酸と一緒にアルカリ水溶液に溶解し易くなる。その結果、低露光量でも高感度で高解像度のパターンを形成することができる。光酸発生剤(D)は、単独で、又は2種類以上を組み合わせて使用することができる。
ポジ型感光性樹脂組成物は、現像時にアルカリ可溶性部分の現像液への溶解性を向上させるための溶解促進剤(E)をさらに含んでもよい。溶解促進剤(E)として、カルボキシ基を有する化合物及びフェノール性水酸基を有する化合物からなる群より選択される有機低分子化合物が挙げられる。溶解促進剤(E)は、単独で、又は2種類以上を組み合わせて使用することができる。
ポジ型感光性樹脂組成物は、任意成分(F)として、第1樹脂(A)及び第2樹脂(B)以外の樹脂、熱硬化剤、界面活性剤、(C)以外の着色剤、キノンジアジド化合物等を含むことができる。本開示において、任意成分(F)は(A)~(E)のいずれにも当てはまらないものと定義する。
ポジ型感光性樹脂組成物は、溶媒(G)に溶解されて溶液状態(但し、黒色顔料を含むときは、顔料は分散状態である。)で用いることができる。例えば、第1樹脂(A)及び第2樹脂(B)を溶媒(G)に溶解して得られた溶液に、着色剤(C)、及び光酸発生剤(D)、並びに必要に応じて溶解促進剤(E)、熱硬化剤、界面活性剤等の任意成分(F)を所定の割合で混合することにより、溶液状態のポジ型感光性樹脂組成物を調製することができる。ポジ型感光性樹脂組成物は、溶媒(G)の量を変化させることにより使用する塗布方法に適した粘度に調整することができる。
ポジ型感光性樹脂組成物を放射線リソグラフィーに使用する場合、まず、ポジ型感光性樹脂組成物を溶媒に溶解又は分散してコーティング組成物を調製する。次に、コーティング組成物を基板表面に塗布し、加熱等の手段により溶媒を除去して、被膜を形成することができる。基板表面へのコーティング組成物の塗布方法は特に限定されず、例えばスプレー法、ロールコート法、スリット法、スピンコート法等を使用することができる。
実施例及び比較例で使用した原料を以下のとおり製造又は入手した。
装置名:Shodex(登録商標)GPC-101
カラム:Shodex(登録商標)LF-804
移動相:テトラヒドロフラン
流速:1.0mL/分
検出器:Shodex(登録商標)RI-71
温度:40℃
4-ヒドロキシフェニルメタクリレート(昭和電工株式会社製「PQMA」)25.5g、及びN-シクロヘキシルマレイミド(株式会社日本触媒製)4.50gを、溶媒である1-メトキシ-2-プロピルアセテート(株式会社ダイセル製)77.1gに、重合開始剤としてV-601(富士フイルム和光純薬株式会社製)3.66gを、1-メトキシ-2-プロピルアセテート(株式会社ダイセル製)14.6gにそれぞれ完全に溶解させた。得られた2つの溶液を、300mLの3つ口型フラスコ中、窒素ガス雰囲気下で85℃に加熱した1-メトキシ-2-プロピルアセテート(株式会社ダイセル製)61.2gに同時に2時間かけて滴下し、その後85℃で3時間反応させた。室温まで冷却した反応溶液を815gのトルエン中に滴下し、共重合体を沈殿させた。沈殿した共重合体をろ過により回収し、90℃で4時間真空乾燥し白色の粉体を32.4g回収した。得られたPCX-02eの数平均分子量は3100、重量平均分子量は6600であった。
グリシジルメタクリレート(GMA)99.5g(0.7モル)、及びメタクリル酸(MAA)8.6g(0.1モル)をプロピレングリコールモノメチルエーテル(PGME)72.1gに、重合開始剤としてV-65(富士フイルム和光純薬株式会社製)7.6gをPGME7.6gにそれぞれ完全に溶解させた。得られた2つの溶液を、500mLの3つ口型フラスコ中、窒素ガス雰囲気下で80℃に加熱したPGME172.6gに同時に2時間かけて滴下し、その後2時間撹拌して反応させた。このようにして、グリシジルメタクリレートとメタクリル酸のモル比が7:1のグリシジルメタクリレートとメタクリル酸の共重合体(GMA-MAA)を、固形分30質量%のPGMEA溶液の形態で得た。得られたGMA-MAAは、カルボキシ基とエポキシ基を分子内に有することから、自己反応性が高い、すなわちエポキシ基の開環重合が進行し易いため、再沈殿及び真空乾燥を行うと高分子量化してしまい単離することはできなかった。GMA-MAAのPGMEA溶液は、安定性が低く、高分子量化が経時で進行して溶液の粘度が増加した。
[製造例1]フェノール性水酸基が1-エトキシエチル基で保護された第1樹脂(A)(PCX-02e-EOE)の製造
100mLの3つ口型フラスコ中で、フェノール性水酸基を有する重合性単量体とその他の重合性単量体のアルカリ水溶液可溶性共重合体(PCX-02e)10.0g、及び酸触媒としてp-トルエンスルホン酸のピリジニウム塩(東京化成工業株式会社製)0.60gを、テトラヒドロフラン(富士フイルム和光純薬株式会社製)50.0gに溶解させた。その後窒素ガス雰囲気下で氷冷し、エチルビニルエーテル(東京化成工業株式会社製)6.88gを1時間かけて滴下した。その後室温で16時間撹拌した。飽和炭酸水素ナトリウム水溶液で酸触媒を中和した後、水層を除去した。さらに有機層を水で2回洗浄した。その後、テトラヒドロフランを留去した。得られた固体を酢酸エチル50.0gに溶解させ、200gのトルエン中に滴下し、生成物を沈殿させた。沈殿物をろ過により回収し、80℃で4時間真空乾燥して白色の粉体11.0gを回収した。得られた粉体をプロピレングリコールモノメチルアセテートに溶解し、フェノール性水酸基が1-エトキシエチル基で保護された第1樹脂(A)(PCX-02e-EOE)の固形分20質量%溶液を得た。得られたPCX-02e-EOEの数平均分子量は4300、重量平均分子量は7900、酸分解性基で保護されているフェノール性水酸基の割合は65モル%、少なくとも1つのフェノール性水酸基が酸分解性基で保護されている式(3)で表される構造単位の数は第1樹脂(A)の全構造単位数の55%であった。酸分解性基で保護されているフェノール性水酸基の割合は、熱重量示差熱分析装置(TG/DTA6200、株式会社日立ハイテクサイエンス製)を用い、窒素ガス気流中、昇温速度10℃/分の条件下で室温から250℃まで昇温し、10分保持し、さらに昇温速度10℃/分の条件で400℃まで昇温したときの、260℃における第1樹脂(A)の重量減少率(%)より算出した。
100mLの3つ口型フラスコ中で、フェノール性水酸基を有する重合性単量体とその他の重合性単量体のアルカリ水溶液可溶性共重合体(PCX-02e)10.0g、及び塩基としてトリエチルアミン(富士フイルム和光純薬株式会社製)1.74gを、テトラヒドロフラン(富士フイルム和光純薬株式会社製)50.0gに溶解させた。その後窒素ガス雰囲気下で氷冷し、二炭酸ジ-tert-ブチル(東京化成工業株式会社製)3.47gを1時間かけて滴下した。その後室温で16時間撹拌した。その後、テトラヒドロフランを留去し、得られた固体を酢酸エチル50.0gに溶解させ、200gのヘキサン中に滴下し、生成物を沈殿させた。沈殿物をろ過により回収し、80℃で4時間真空乾燥して白色の粉体10.3gを回収した。得られた粉体をプロピレングリコールモノメチルアセテートに溶解し、フェノール性水酸基がtert-ブトキシカルボニル基で保護された第1樹脂(A)(PCX-02e-Boc)の固形分20質量%溶液を得た。得られたPCX-02e-Bocの数平均分子量は4400、重量平均分子量は7800、酸分解性基で保護されているフェノール性水酸基の割合は30モル%、少なくとも1つのフェノール性水酸基が酸分解性基で保護されている式(3)で表される構造単位の数は第1樹脂(A)の全構造単位数の26%であった。酸分解性基で保護されているフェノール性水酸基の割合は、熱重量示差熱分析装置(TG/DTA6200、株式会社日立ハイテクサイエンス製)を用い、窒素ガス気流中、昇温速度10℃/分の条件下で室温から400℃まで昇温したときの、220℃における第1樹脂(A)の重量減少率(%)より算出した。
100mLの3つ口型フラスコ中で、フェノール性水酸基を有する重合性単量体とその他の重合性単量体のアルカリ水溶液可溶性共重合体(PCX-02e)10.0g、及び酸触媒としてp-トルエンスルホン酸のピリジニウム塩(東京化成工業株式会社製)0.60gを、テトラヒドロフラン(富士フイルム和光純薬株式会社製)50.0gに溶解させた。その後窒素ガス雰囲気下で氷冷し、2,3-ジヒドロフラン(東京化成工業株式会社製)6.69gを1時間かけて滴下した。その後室温で16時間撹拌した。飽和炭酸水素ナトリウム水溶液で酸触媒を中和した後、水層を除去した。さらに有機層を水で2回洗浄した。その後、テトラヒドロフランを留去した。得られた固体を酢酸エチル50.0gに溶解させ、200gのトルエン中に滴下し、生成物を沈殿させた。沈殿物をろ過により回収し、80℃で4時間真空乾燥して白色の粉体11.0gを回収した。得られた粉体をプロピレングリコールモノメチルアセテートに溶解し、フェノール性水酸基が2-テトラヒドロフラニル基で保護された第1樹脂(A)(PCX-02e-THF)の固形分20質量%溶液を得た。得られたPCX-02e-THFの数平均分子量は3716、重量平均分子量は6806、酸分解性基で保護されているフェノール性水酸基の割合は65モル%、少なくとも1つのフェノール性水酸基が酸分解性基で保護されている式(3)で表される構造単位の数は第1樹脂(A)の全構造単位数の55%であった。酸分解性基で保護されているフェノール性水酸基の割合は、熱重量示差熱分析装置(TG/DTA6200、株式会社日立ハイテクサイエンス製)を用い、窒素ガス気流中、昇温速度10℃/分の条件下で室温から250℃まで昇温し、10分保持し、さらに昇温速度10℃/分の条件で400℃まで昇温したときの、260℃における第1樹脂(A)の重量減少率(%)より算出した。
100mLの3つ口型フラスコ中で、フェノール性水酸基を有する重合性単量体とその他の重合性単量体のアルカリ水溶液可溶性共重合体(PCX-02e)10.0g、及び酸触媒としてp-トルエンスルホン酸のピリジニウム塩(東京化成工業株式会社製)0.60gを、テトラヒドロフラン(富士フイルム和光純薬株式会社製)50.0gに溶解させた。その後窒素ガス雰囲気下で氷冷し、n-プロピルビニルエーテル(東京化成工業株式会社製)8.23gを1時間かけて滴下した。その後室温で16時間撹拌した。飽和炭酸水素ナトリウム水溶液で酸触媒を中和した後、水層を除去した。さらに有機層を水で2回洗浄した。その後、テトラヒドロフランを留去した。得られた固体を酢酸エチル50.0gに溶解させ、200gのトルエン中に滴下し、生成物を沈殿させた。沈殿物をろ過により回収し、80℃で4時間真空乾燥して白色の粉体11.0gを回収した。得られた粉体をプロピレングリコールモノメチルアセテートに溶解し、フェノール性水酸基が1-n-プロポキシエチル基で保護された第1樹脂(A)(PCX-02e-POE)の固形分20質量%溶液を得た。得られたPCX-02e-POEの数平均分子量は4550、重量平均分子量は8054、酸分解性基で保護されているフェノール性水酸基の割合は65モル%、少なくとも1つのフェノール性水酸基が酸分解性基で保護されている式(3)で表される構造単位の数は第1樹脂(A)の全構造単位数の55%であった。酸分解性基で保護されているフェノール性水酸基の割合は、熱重量示差熱分析装置(TG/DTA6200、株式会社日立ハイテクサイエンス製)を用い、窒素ガス気流中、昇温速度10℃/分の条件下で室温から250℃まで昇温し、10分保持し、さらに昇温速度10℃/分の条件で400℃まで昇温したときの、260℃における第1樹脂(A)の重量減少率(%)より算出した。
[製造例5]エポキシ基及びフェノール性水酸基を有する第2樹脂(N770OH70)の製造
300mLの3つ口型フラスコに溶媒としてγ-ブチロラクトン(三菱ケミカル株式会社製)75.2g、1分子中に少なくとも2個のエポキシ基を有する化合物としてEPICLON(登録商標)N-770(DIC株式会社製フェノールノボラック型エポキシ樹脂、エポキシ当量188)を37.6g仕込み、窒素ガス雰囲気下、60℃で溶解させた。そこへヒドロキシ安息香酸化合物として3,5-ジヒドロキシ安息香酸(富士フイルム和光純薬株式会社製)を20.1g(エポキシ1当量に対して0.65当量)、反応触媒としてトリフェニルホスフィン(東京化成工業株式会社製)を0.173g(0.660mmol)追加し、110℃で24時間反応させた。反応溶液を室温に戻し、γ-ブチロラクトンで固形分20質量%に希釈し、溶液をろ過して286.5gのエポキシ基及びフェノール性水酸基を有する第2樹脂(N770OH70)の溶液を得た。得られた反応物の数平均分子量は2400、重量平均分子量は8300、エポキシ当量は2000であった。
300mLの3つ口型フラスコに溶媒としてγ-ブチロラクトン(三菱ケミカル株式会社製)75.2g、1分子中に少なくとも2個のエポキシ基を有する化合物としてEPICLON(登録商標)N-695(DIC株式会社製クレゾールノボラック型エポキシ樹脂、エポキシ当量214)を37.8g仕込み、窒素ガス雰囲気下、60℃で溶解させた。そこへヒドロキシ安息香酸化合物として3,5-ジヒドロキシ安息香酸(富士フイルム和光純薬株式会社製)を20.1g(エポキシ1当量に対して0.65当量)、反応触媒としてトリフェニルホスフィン(東京化成工業株式会社製)を0.166g(0.660mmol)追加し、110℃で21時間反応させた。反応溶液を室温に戻し、γ-ブチロラクトンで固形分20質量%に希釈し、溶液をろ過して274.2gのエポキシ基及びフェノール性水酸基を有する第2樹脂(N695OH70)の溶液を得た。得られた反応物の数平均分子量は3000、重量平均分子量は7500、エポキシ当量は2200であった。
3,5-ジヒドロキシ安息香酸を15.4g用いた以外は製造例5と同様にして259.9gのエポキシ基及びフェノール性水酸基を有する第2樹脂(N770OH50)の溶液を得た。得られた反応物の数平均分子量は2000、重量平均分子量は6900、エポキシ当量は670であった。
3,5-ジヒドロキシ安息香酸を13.9g用いた以外は製造例6と同様にして256.2gのエポキシ基及びフェノール性水酸基を有する第2樹脂(N695OH50)の溶液を得た。得られた反応物の数平均分子量は2900、重量平均分子量は6400、エポキシ当量は820であった。
着色剤(C)として、黒色染料であるVALIFAST(登録商標)BLACK 3804(ソルベントブラック34のC.I.で規定される黒色染料、オリエント化学工業株式会社製)、NUBIAN(登録商標)BLACK PA-2802(ソルベントブラック27のC.I.で規定される黒色染料と油溶性染料の混合物、オリエント化学工業株式会社製)、又はVALIFAST(登録商標)BLACK 3820(ソルベントブラック27のC.I.で規定される黒色染料、オリエント化学工業株式会社製)を使用した。
光酸発生剤(D)としてオキシム系光酸発生剤であるPAI-101(みどり化学株式会社製、CAS No.82424-53-1)を使用した。PAI-101は光照射によりp-トルエンスルホン酸(pKa=-2.8)を発生させる。PAI-101の構造を以下に示す。
実施例及び比較例で使用した評価方法は以下のとおりである。
ガラス基板(大きさ100mm×100mm×1mm)にポジ型感光性樹脂組成物を乾燥膜厚が約1.5μm(実施例1~13、比較例1~4)又は約3.8μm(実施例14~19)になるようにスピンコートし、ホットプレート上120℃で80秒加熱し溶媒を乾燥した。その後、窒素ガス雰囲気下250℃で60分硬化させることにより被膜を得た。硬化後の被膜のOD値を透過濃度計(BMT-1、サカタインクスエンジニアリング株式会社製)で測定し、ガラスのみのOD値で補正を行って、被膜の厚さ1μm当たりのOD値に換算した。被膜の厚みは光学式膜厚測定装置(F20-NIR、フィルメトリクス株式会社製)を用いて測定した。
ガラス基板(大きさ100mm×100mm×1mm)にポジ型感光性樹脂組成物を乾燥膜厚が2.0μmになるようにバーコートし、ホットプレート上120℃で80秒加熱し溶媒を乾燥した。乾燥膜厚を光学式膜厚測定装置(F20-NIR、フィルメトリクス株式会社製)を用いて測定後、スピン現像装置(AD-1200、滝沢産業株式会社製)を用い2.38質量%テトラメチルアンモニウムハイドロオキサイド水溶液で60秒間アルカリ現像を行なった。アルカリ現像後の膜厚を再び光学式膜厚測定装置(F20-NIR、フィルメトリクス株式会社製)を用いて測定し、現像前後で溶解した膜厚(μm)を未露光部溶解性として算出した。
ガラス基板(大きさ100mm×100mm×1mm)にポジ型感光性樹脂組成物を乾燥膜厚が2.0μmになるようにバーコートし、ホットプレート上100℃で1分間加熱してプリベークを行った。乾燥膜厚を光学式膜厚測定装置(F20-NIR、フィルメトリクス株式会社製)を用いて測定後、超高圧水銀ランプを組み込んだ露光装置(商品名マルチライトML-251A/B、ウシオ電機株式会社製)で水銀露光用バンドパスフィルター(商品名HB0365、朝日分光株式会社製)と石英製のフォトマスク(5μm、10μm、20μm、50μm、100μm、200μm、500μmのライン&スペース(L/S)パターンを有するもの)を介して100mJ/cm2で露光した。露光量は紫外線積算光量計(商品名UIT-150 受光部 UVD-S365、ウシオ電機株式会社製)を用いて測定した。露光後、ホットプレート上100℃又は120℃で3分間又は5分間加熱してPEBを行った。その後、スピン現像装置(AD-1200、滝沢産業株式会社製)を用い2.38質量%テトラメチルアンモニウムハイドロオキサイド水溶液で60秒間アルカリ現像を行なった。アルカリ現像後の膜厚を再び光学式膜厚測定装置(F20-NIR、フィルメトリクス株式会社製)を用いて測定し、現像前後で溶解した膜厚(μm)を露光部溶解性として算出した。
露光部溶解性(μm)から未露光部溶解性(μm)を引いたものを溶解性差(μm)とした。溶解性差が大きいほど感度がより高く、パターン形成性に優れていることを意味する。
ガラス基板(大きさ100mm×100mm×1mm)にポジ型感光性樹脂組成物を乾燥膜厚が3.8μmになるようにバーコートし、真空乾燥90秒間の後、蓋つきホットプレート上110℃で2分間加熱してプリベークを行った。超高圧水銀ランプを組み込んだ露光装置(商品名マルチライトML-251A/B、ウシオ電機株式会社製)で水銀露光用バンドパスフィルター(商品名HB0365、朝日分光株式会社製)と石英製のフォトマスク(φ10μmパターンを有するもの)を介して100mJ/cm2以下で露光した。露光量は紫外線積算光量計(商品名UIT-150 受光部 UVD-S365、ウシオ電機株式会社製)を用いて測定した。露光後、蓋つきホットプレート上115~130℃で3分間又は4分間加熱してPEBを行った。その後、スピン現像装置(AD-1200、滝沢産業株式会社製)を用い2.38質量%テトラメチルアンモニウムハイドロオキサイド水溶液で60秒間アルカリ現像を行なった。さらに、被膜をイナートオーブン(DN411I、ヤマト科学株式会社製)内にて250℃で60分加熱して硬化した。硬化後塗膜の膜厚を光学式膜厚測定装置(F20-NIR、フィルメトリクス株式会社製)を用いて測定し、形成されているホールをマイクロスコープ(VHX-6000、キーエンス株式会社製)で観察した。膜厚が3.0μm以上、かつホール径が10μm以上を良好、膜厚が2.9μm以下、又はホール径が9μm以下を不良と判定した。
ガラス基板(大きさ100mm×100mm×1mm)にポジ型感光性樹脂組成物を乾燥膜厚が3.8μmになるようにバーコートし、真空乾燥90秒間の後、蓋つきホットプレート上110℃で2分間加熱してプリベークを行った。超高圧水銀ランプを組み込んだ露光装置(商品名マルチライトML-251A/B、ウシオ電機株式会社製)で水銀露光用バンドパスフィルター(商品名HB0365、朝日分光株式会社製)と石英製のハーフトーンフォトマスク(中央に透過率100%の直径10.5μmのホールを、その外側に透過率25%の外径30.5μm、幅10μmの円環のパターンを有するもの)を介して100mJ/cm2以下で露光した。露光量は紫外線積算光量計(商品名UIT-150 受光部 UVD-S365、ウシオ電機株式会社製)を用いて測定した。露光後、蓋つきホットプレート上110~130℃で3分間又は4分間加熱してPEBを行った。その後、スピン現像装置(AD-1200、滝沢産業株式会社製)を用い2.38質量%テトラメチルアンモニウムハイドロオキサイド水溶液で60秒間アルカリ現像を行なった。さらに、被膜をイナートオーブン(DN411I、ヤマト科学株式会社製)内にて250℃で60分加熱して硬化した。硬化後塗膜に形成されている段差パターンを形状解析レーザ顕微鏡(商品名VK-X200、キーエンス株式会社製)で観察し、段差幅が20μm以上を良好、20μm未満を不良と判定した。
[実施例1~13、比較例1~4]
表1又は表2に記載の組成で第1樹脂(A)、第2樹脂(B)及び任意にその他の樹脂(任意成分(F))を混合して溶解し、得られた溶液に、表1又は表2に記載の着色剤(C)、光酸発生剤(D)及びキノンジアジド化合物(任意成分(F))、溶解促進剤(E)、界面活性剤(任意成分(F))及びGBL/PGMEA混合溶媒(G)を加えて、さらに混合した。成分が溶解したことを目視で確認した後、孔径0.22μmのミリポアフィルターで濾過し、固形分濃度約12質量%のポジ型感光性樹脂組成物を調製した。表1及び表2における組成の質量部は固形分換算値である。表1及び表2には、第1樹脂(A)及び第2樹脂(B)のアルカリ可溶性官能基の合計を基準とした第1樹脂(A)のフェノール性水酸基の保護率も記載されている。実施例1~9及び比較例1~2のポジ型感光性樹脂組成物の評価結果を表1に示す。実施例10~13及び比較例3~4のポジ型感光性樹脂組成物の評価結果を表2に示す。
表3に記載の組成で第1樹脂(A)及び第2樹脂(B)を混合して溶解し、得られた溶液に、表3に記載の着色剤(C)、光酸発生剤(D)、溶解促進剤(E)、及びGBL/PGMEA混合溶媒(G)を加えて、さらに混合した。成分が溶解したことを目視で確認した後、孔径0.22μmのミリポアフィルターで濾過し、固形分濃度約12質量%のポジ型感光性樹脂組成物を調製した。表3における組成の質量部は固形分換算値である。表3には、第1樹脂(A)及び第2樹脂(B)のアルカリ可溶性官能基の合計を基準とした第1樹脂(A)のフェノール性水酸基の保護率、及び第2樹脂(B)のエポキシ当量も記載されている。実施例14~19のポジ型感光性樹脂組成物の評価結果を表3に示す。
Claims (18)
- 複数のフェノール性水酸基を有し、前記複数のフェノール性水酸基の少なくとも一部が酸分解性基で保護された第1樹脂(A)と、
エポキシ基及びフェノール性水酸基を有する第2樹脂(B)と、
黒色染料及び黒色顔料からなる群より選択される少なくとも1種の着色剤(C)と、
光酸発生剤(D)と
を含む、ポジ型感光性樹脂組成物。 - 前記第1樹脂(A)が、複数のフェノール性水酸基を有し、前記複数のフェノール性水酸基の少なくとも一部が前記酸分解性基で保護された、フェノール性水酸基を有する重合性単量体とその他の重合性単量体とのアルカリ水溶液可溶性共重合体である、請求項1に記載のポジ型感光性樹脂組成物。
- 前記第1樹脂(A)の前記酸分解性基が、1-アルコキシアルキル基である、請求項1又は2のいずれかに記載のポジ型感光性樹脂組成物。
- 前記第1樹脂(A)のフェノール性水酸基の10モル%~95モル%が前記酸分解性基で保護されている、請求項1~5のいずれか一項に記載のポジ型感光性樹脂組成物。
- 前記第1樹脂(A)及び前記第2樹脂(B)のアルカリ可溶性官能基の合計を基準として、前記第1樹脂(A)のフェノール性水酸基の5モル%~65モル%が前記酸分解性基で保護されている、請求項1~6のいずれか一項に記載のポジ型感光性樹脂組成物。
- 前記第1樹脂(A)及び前記第2樹脂(B)の合計質量を基準として、20質量%~90質量%の前記第1樹脂(A)を含む、請求項1~7のいずれか一項に記載のポジ型感光性樹脂組成物。
- 前記第1樹脂(A)及び前記第2樹脂(B)の合計100質量部を基準として、10質量部~150質量部の前記着色剤(C)を含む、請求項1~8のいずれか一項に記載のポジ型感光性樹脂組成物。
- 前記光酸発生剤(D)を、前記第1樹脂(A)及び前記第2樹脂(B)の合計100質量部を基準として0.1質量部~85質量部含む、請求項1~9のいずれか一項に記載のポジ型感光性樹脂組成物。
- 前記ポジ型感光性樹脂組成物の硬化被膜の光学濃度(OD値)が膜厚1μmあたり0.5以上である、請求項1~10のいずれか一項に記載のポジ型感光性樹脂組成物。
- 前記1分子中に少なくとも2個のエポキシ基を有する化合物がノボラック型エポキシ樹脂である、請求項12に記載のポジ型感光性樹脂組成物。
- 前記ヒドロキシ安息香酸化合物がジヒドロキシ安息香酸化合物である、請求項12又は13のいずれかに記載のポジ型感光性樹脂組成物。
- 前記第2樹脂(B)のエポキシ当量が300~1800であり、前記光酸発生剤(D)が光照射によりトリフルオロメタンスルホン酸を生成する、請求項1~14のいずれか一項に記載のポジ型感光性樹脂組成物。
- 請求項1~15のいずれか一項に記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子隔壁。
- 請求項1~15のいずれか一項に記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子絶縁膜。
- 請求項1~15のいずれか一項に記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子。
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- 2020-06-03 WO PCT/JP2020/021996 patent/WO2020246517A1/ja active Application Filing
- 2020-06-03 CN CN202080040836.8A patent/CN113939767A/zh active Pending
- 2020-06-03 US US17/596,046 patent/US20220326614A1/en active Pending
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WO2024009732A1 (ja) * | 2022-07-08 | 2024-01-11 | 日本ポリテック株式会社 | ポジ型感光性樹脂組成物 |
Also Published As
Publication number | Publication date |
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CN113939767A (zh) | 2022-01-14 |
TWI736307B (zh) | 2021-08-11 |
TW202113483A (zh) | 2021-04-01 |
JPWO2020246517A1 (ja) | 2020-12-10 |
US20220326614A1 (en) | 2022-10-13 |
KR20220003598A (ko) | 2022-01-10 |
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