WO2024009732A1 - ポジ型感光性樹脂組成物 - Google Patents
ポジ型感光性樹脂組成物 Download PDFInfo
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- WO2024009732A1 WO2024009732A1 PCT/JP2023/022421 JP2023022421W WO2024009732A1 WO 2024009732 A1 WO2024009732 A1 WO 2024009732A1 JP 2023022421 W JP2023022421 W JP 2023022421W WO 2024009732 A1 WO2024009732 A1 WO 2024009732A1
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- resin composition
- formula
- alkali
- photosensitive resin
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- 239000011342 resin composition Substances 0.000 title claims abstract description 148
- 229920005989 resin Polymers 0.000 claims abstract description 253
- 239000011347 resin Substances 0.000 claims abstract description 253
- -1 quinone diazide compound Chemical class 0.000 claims abstract description 127
- 229920001577 copolymer Polymers 0.000 claims abstract description 90
- 125000000524 functional group Chemical group 0.000 claims abstract description 90
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 87
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 62
- 229920003986 novolac Polymers 0.000 claims abstract description 62
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229930003836 cresol Natural products 0.000 claims abstract description 43
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 41
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000011737 fluorine Substances 0.000 claims abstract description 35
- 125000000962 organic group Chemical group 0.000 claims abstract description 24
- 239000004094 surface-active agent Substances 0.000 claims abstract description 18
- 239000000178 monomer Substances 0.000 claims description 100
- 125000004432 carbon atom Chemical group C* 0.000 claims description 97
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 71
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 62
- 239000003086 colorant Substances 0.000 claims description 35
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 34
- 125000003118 aryl group Chemical group 0.000 claims description 33
- 125000003700 epoxy group Chemical group 0.000 claims description 30
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 24
- 238000005192 partition Methods 0.000 claims description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 19
- 239000000975 dye Substances 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 16
- 239000000049 pigment Substances 0.000 claims description 16
- 125000002947 alkylene group Chemical group 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 125000006165 cyclic alkyl group Chemical group 0.000 claims description 12
- 125000003545 alkoxy group Chemical group 0.000 claims description 8
- 229920006243 acrylic copolymer Polymers 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 4
- 125000001183 hydrocarbyl group Chemical class 0.000 claims 1
- 239000010408 film Substances 0.000 description 107
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 45
- 238000000576 coating method Methods 0.000 description 36
- 239000011248 coating agent Substances 0.000 description 35
- 150000001875 compounds Chemical class 0.000 description 34
- 239000000126 substance Substances 0.000 description 29
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- 238000011161 development Methods 0.000 description 27
- 230000018109 developmental process Effects 0.000 description 27
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- 239000003513 alkali Substances 0.000 description 23
- 239000003822 epoxy resin Substances 0.000 description 23
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- 230000005855 radiation Effects 0.000 description 23
- 125000001931 aliphatic group Chemical group 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 20
- 238000010438 heat treatment Methods 0.000 description 19
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 19
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- 239000011148 porous material Substances 0.000 description 16
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 239000007864 aqueous solution Substances 0.000 description 15
- 239000008199 coating composition Substances 0.000 description 14
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- 125000001424 substituent group Chemical group 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 125000001153 fluoro group Chemical group F* 0.000 description 12
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- 239000012298 atmosphere Substances 0.000 description 10
- 229910001873 dinitrogen Inorganic materials 0.000 description 10
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 10
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 10
- 239000003505 polymerization initiator Substances 0.000 description 10
- PJMXUSNWBKGQEZ-UHFFFAOYSA-N (4-hydroxyphenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=C(O)C=C1 PJMXUSNWBKGQEZ-UHFFFAOYSA-N 0.000 description 9
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
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- 238000011156 evaluation Methods 0.000 description 8
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- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 8
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- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 8
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- 238000010526 radical polymerization reaction Methods 0.000 description 8
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 8
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 7
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical compound [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 7
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- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 235000010724 Wisteria floribunda Nutrition 0.000 description 6
- 230000003321 amplification Effects 0.000 description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 6
- 238000001914 filtration Methods 0.000 description 6
- 238000003199 nucleic acid amplification method Methods 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 5
- 239000007877 V-601 Substances 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
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- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 5
- WXTMDXOMEHJXQO-UHFFFAOYSA-N 2,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC=C1O WXTMDXOMEHJXQO-UHFFFAOYSA-N 0.000 description 4
- UYEMGAFJOZZIFP-UHFFFAOYSA-N 3,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC(O)=C1 UYEMGAFJOZZIFP-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
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- 125000003277 amino group Chemical group 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid group Chemical group C(C1=CC=CC=C1)(=O)O WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
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- 125000004122 cyclic group Chemical group 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
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- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
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- 238000001291 vacuum drying Methods 0.000 description 4
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 3
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- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
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- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
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- 150000003951 lactams Chemical class 0.000 description 3
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 3
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- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 3
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 3
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- 239000003973 paint Substances 0.000 description 1
- 125000006340 pentafluoro ethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000006551 perfluoro alkylene group Chemical group 0.000 description 1
- 125000005007 perfluorooctyl group Chemical group FC(C(C(C(C(C(C(C(F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)* 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000001792 phenanthrenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C=CC12)* 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- LYKRPDCJKSXAHS-UHFFFAOYSA-N phenyl-(2,3,4,5-tetrahydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC(C(=O)C=2C=CC=CC=2)=C1O LYKRPDCJKSXAHS-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 208000017983 photosensitivity disease Diseases 0.000 description 1
- 231100000434 photosensitization Toxicity 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920002577 polybenzoxazole Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- JINLXNKYCADLRM-UHFFFAOYSA-N propan-2-yl 2-fluoroprop-2-enoate Chemical compound CC(C)OC(=O)C(F)=C JINLXNKYCADLRM-UHFFFAOYSA-N 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- UORVCLMRJXCDCP-UHFFFAOYSA-N propynoic acid Chemical compound OC(=O)C#C UORVCLMRJXCDCP-UHFFFAOYSA-N 0.000 description 1
- 125000002568 propynyl group Chemical group [*]C#CC([H])([H])[H] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 238000006862 quantum yield reaction Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010421 standard material Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 229910052717 sulfur Chemical group 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- RCSSZBOUAGQERK-UHFFFAOYSA-N tert-butyl 2-(trifluoromethyl)prop-2-enoate Chemical compound CC(C)(C)OC(=O)C(=C)C(F)(F)F RCSSZBOUAGQERK-UHFFFAOYSA-N 0.000 description 1
- PRFZRHRJCVTLFD-UHFFFAOYSA-N tert-butyl 2-fluoroprop-2-enoate Chemical compound CC(C)(C)OC(=O)C(F)=C PRFZRHRJCVTLFD-UHFFFAOYSA-N 0.000 description 1
- ILMRJRBKQSSXGY-UHFFFAOYSA-N tert-butyl(dimethyl)silicon Chemical group C[Si](C)C(C)(C)C ILMRJRBKQSSXGY-UHFFFAOYSA-N 0.000 description 1
- QIFZBTPXXULUNF-UHFFFAOYSA-N tert-butyl-ethenyl-dimethylsilane Chemical compound CC(C)(C)[Si](C)(C)C=C QIFZBTPXXULUNF-UHFFFAOYSA-N 0.000 description 1
- 125000001981 tert-butyldimethylsilyl group Chemical group [H]C([H])([H])[Si]([H])(C([H])([H])[H])[*]C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 229940035024 thioglycerol Drugs 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 description 1
- SVGQCVJXVAMCPM-UHFFFAOYSA-N triethyl(prop-2-enyl)silane Chemical compound CC[Si](CC)(CC)CC=C SVGQCVJXVAMCPM-UHFFFAOYSA-N 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 125000000025 triisopropylsilyl group Chemical group C(C)(C)[Si](C(C)C)(C(C)C)* 0.000 description 1
- ZFDUTAIOLLHHSG-UHFFFAOYSA-N trimethyl(2-methylprop-1-enylsilyloxy)silane Chemical compound C[Si](O[SiH2]C=C(C)C)(C)C ZFDUTAIOLLHHSG-UHFFFAOYSA-N 0.000 description 1
- HYWCXWRMUZYRPH-UHFFFAOYSA-N trimethyl(prop-2-enyl)silane Chemical compound C[Si](C)(C)CC=C HYWCXWRMUZYRPH-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
Definitions
- the present invention relates to a positive photosensitive resin composition. More specifically, the present invention relates to a positive photosensitive resin composition containing a quinonediazide compound as a radiation-sensitive compound.
- the positive photosensitive resin composition can be used as an interlayer insulating film, planarizing film, or protective film for semiconductor devices, or as an insulating film, planarizing film, or partition material for display devices such as organic EL displays (OLEDs) and liquid crystal displays. It is widely used as.
- partition materials are used at intervals between colored patterns in the display area or at edges around the display area in order to improve display characteristics.
- partition walls are first formed, and organic material pixels are formed between the partition walls.
- This partition wall is generally formed by photolithography using a photosensitive resin composition and has insulating properties.
- a photosensitive resin composition is applied onto a substrate using a coating device, volatile components are removed by means such as heating, and then exposed to light through a mask, and then, in the case of a negative type, unexposed areas are In the case of a positive type, the exposed portion is developed by removing it with a developer such as an alkaline aqueous solution, and the resulting pattern is heat-treated to form partition walls (insulating film).
- a film of an organic substance that emits light in three colors of red, green, and blue is formed between the partition walls to form pixels of an organic EL display device.
- Patent Document 1 Japanese Unexamined Patent Application Publication No. 2001-281440 discloses a positive radiation-sensitive resin composition containing an alkali-soluble resin and a quinone diazide compound as a radiation-sensitive resin composition that exhibits high light-shielding properties by heat treatment after exposure. A composition in which titanium black is added is described.
- Patent Document 2 Japanese Unexamined Patent Publication No. 2002-116536 discloses a radiation-sensitive resin composition containing [A] an alkali-soluble resin, [B] a 1,2-quinonediazide compound, and [C] a colorant, in which carbon black This paper describes a method for blackening partition wall materials.
- Patent Document 3 Japanese Unexamined Patent Publication No. 2010-237310 discloses a positive radiation-sensitive resin composition containing an alkali-soluble resin and a quinone diazide compound as a radiation-sensitive resin composition that exhibits light-shielding properties by heat treatment after exposure. A composition to which a heat-sensitive dye is added is described.
- Patent Document 4 International Publication No. 2017/069172 discloses at least one compound selected from (A) a binder resin, (B) a quinone diazide compound, and (C) a black dye defined by a color index of Solvent Black 27 to 47.
- a positive-working photosensitive resin composition containing various types of black dye is described.
- a chemically amplified photosensitive resin composition generally includes a resin in which an alkali-soluble functional group is protected with an acid-decomposable group and a photoacid generator.
- the acid generated from the photoacid generator during exposure promotes decomposition (deprotection) of acid-decomposable groups and regenerates alkali-soluble functional groups. This promotes alkali dissolution of the resin in exposed areas during development.
- the acid derived from the photoacid generator is regenerated and participates in the decomposition of another acid-decomposable group.
- the apparent quantum efficiency of a chemical amplification system based on the above reaction mechanism is expressed as the product of the quantum efficiency of acid generation and the reaction chain, so high sensitivity is achieved by using a photosensitive resin composition as a chemical amplification system. can do.
- Patent Document 5 International Publication No. 2015/087830 discloses a polybenzoxazole precursor containing a specific repeating unit, a photoacid generator, a solvent, a crosslinking agent, and a group in which the acid group is protected with an acid-decomposable group.
- a photosensitive resin composition containing the compound in the molecule is described.
- Patent Document 6 International Publication No. 2020/246517 discloses a first resin (A) having a plurality of phenolic hydroxyl groups, at least a part of which is protected with an acid-decomposable group, and an epoxy resin.
- the photosensitive resin composition tends to have low sensitivity, and as a result, the exposure time may become longer and productivity may decrease. Therefore, the photosensitive resin composition used to form the partition wall material, especially containing a colorant, is required to have higher sensitivity.
- the photosensitive resin composition used to form a colored partition wall material it is necessary to use a considerable amount of a colorant in order to sufficiently enhance the light-shielding properties of the cured film.
- a large amount of colorant is used in this way, the radiation irradiated to the photosensitive resin composition film is absorbed by the colorant, so the effective intensity of the radiation in the film decreases, and the photosensitive resin composition is not sufficiently exposed, resulting in poor pattern formation.
- a black colorant is blended into a photosensitive resin composition to form a thick film, for example a film with a thickness of 2 to 3 ⁇ m, for the purpose of improving the image quality, making the display device more flexible, or saving power. This is noticeable.
- a chemically amplified positive photosensitive resin composition has higher sensitivity than a positive photosensitive resin composition containing, for example, a quinonediazide compound as a radiation-sensitive compound.
- photoacid generators used in chemical amplification systems are expensive, and positive photosensitive resin compositions for chemical amplification systems tend to have coating unevenness and promote decomposition of acid-decomposable groups.
- Post Exposure Bake (PEB) is required for this purpose.
- acid generated from a photoacid generator during exposure diffuses in the film during the PEB process, so the shape and size of the pattern, sensitivity, etc. may change depending on the PEB conditions. Therefore, it is difficult to form a step pattern on a thick film with high precision using a chemically amplified positive photosensitive resin composition.
- the present inventors have proposed a positive photosensitive resin composition containing a quinonediazide compound as a radiation-sensitive compound, in which a hydrophobic resin which is an addition (co)polymer as a resin component, an alkali-soluble resin having a novolak skeleton, and a fluorine-based interface.
- An object of the present invention is to provide a positive photosensitive resin composition that can form a thick film pattern with high precision.
- the present inventors have developed a positive-type compound containing a quinonediazide compound as a radiation-sensitive compound, a hydrophobic resin as an addition (co)polymer as a resin component, an alkali-soluble resin having a novolak skeleton, and a fluorosurfactant. It has been discovered that by adding a cresol novolac resin to a photosensitive resin composition, it is possible to suppress surface roughness and the generation of pores in step portions, and as a result, it is possible to form thick film patterns with high precision. Ta.
- a hydrophobic resin (A) which is an addition (co)polymer, an alkali-soluble resin (B) having a structural unit represented by formula (1);
- a positive photosensitive resin composition comprising a cresol novolac resin.
- x is an integer of 0 to 3
- R 1 is each independently an alkyl group having 1 to 5 carbon atoms
- R 2 is an organic group having an alkali-soluble functional group.
- y is an integer of 0 to 3
- R 3 is each independently an alkyl group having 1 to 5 carbon atoms
- R 4 is an organic group having no alkali-soluble functional group. .
- the alkali-soluble resin (B) has a total of the structural units represented by the formula (1) and the structural units represented by the formula (2), based on all the structural units of the alkali-soluble resin (B).
- Mw weight average molecular weight
- the hydrophobic resin (A) has the formula (3) (In formula (3), R 5 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 6 is represented by SiR 7 R 8 R 9 , and R 7 , R 8 and R 9 are each independently is an alkyl group having 1 to 8 carbon atoms or an aryl group having 6 to 20 carbon atoms, r is an integer of 0 to 5, and s is an integer of 0 to 5, provided that r+s is an integer of 1 to 5. It is an integer.)
- the hydrophobic resin (A) has the formula (4) (In formula (4), R 10 and R 11 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and R 12 is a hydrogen atom or a straight chain having 1 to 6 carbon atoms. At least one member selected from the group consisting of an alkyl group, a cyclic alkyl group having 3 to 12 carbon atoms, a phenyl group, or a hydroxy group, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms.
- [12] [ The positive photosensitive resin composition according to any one of [1] to [11].
- An organic EL device partition wall comprising a cured product of the positive photosensitive resin composition according to any one of [1] to [15].
- An organic EL device insulating film comprising a cured product of the positive photosensitive resin composition according to any one of [1] to [15].
- An organic EL device comprising a cured product of the positive photosensitive resin composition according to any one of [1] to [15].
- (A) is an FE-SEM diagram of the sample surface of Comparative Example 1
- (B) is an FE-SEM diagram of the sample surface of Example 1.
- alkali-soluble means that the positive photosensitive resin composition or its components, or the film or cured film of the positive photosensitive resin composition is dissolved in a 2.38% by mass tetramethylammonium hydroxide aqueous solution. It means possible.
- Alkali-soluble resin refers to a resin that can be dissolved in a 2.38% by mass aqueous solution of tetramethylammonium hydroxide, either alone or in a state of being contained in a positive photosensitive resin composition unexposed or after exposure. means.
- Alkali-soluble functional group means a group that has the ability to impart such alkali solubility to a positive-working photosensitive resin composition or its components, or a film or a cured film of a positive-working photosensitive resin composition.
- alkali-soluble functional group include a phenolic hydroxyl group, a carboxy group, a sulfo group, a phosphoric acid group, an acid anhydride group, and a mercapto group.
- a "radically polymerizable functional group” means an ethylenically unsaturated group
- a "radically polymerizable compound” means a compound having one or more ethylenically unsaturated groups.
- structural unit refers to an atomic group that constitutes a part of the basic structure of a polymer, and this atomic group may have pendant atoms or pendant atomic groups.
- a radical (co)polymer it means a unit derived from a radically polymerizable compound used as a monomer
- a phenol novolak resin it means a unit derived from a radical polymerizable compound used as a monomer
- a phenol novolac resin one molecule of phenol (C 6 H 5 OH) and one molecule of phenol (C 6 H 5 OH) It refers to the following units formed by the condensation reaction of formaldehyde (HCHO) molecules.
- structural units having pendant groups side groups
- structural units having pendant groups or groups derived therefrom that are used to form crosslinking sites and structural units having free pendant groups that are not involved in forming crosslinking sites. are considered to be different from each other.
- polymers having branched molecular chains branched chains
- the structural unit containing the branch point (branching unit) and the structural unit contained in the linear molecular chain are considered to be different from each other.
- (meth)acrylic means acrylic or methacrylic
- (meth)acrylate means acrylate or methacrylate
- (meth)acryloyl means acryloyl or methacryloyl
- ( “Meth)allyl” means allyl or methallyl.
- (co)polymer means a homopolymer or a copolymer.
- the number average molecular weight (Mn) and weight average molecular weight (Mw) of the resin, polymer, or copolymer are standard polystyrene equivalent values measured by gel permeation chromatography (GPC). means.
- Phenolic hydroxyl group equivalent (Epoxy equivalent of raw material + molecular weight of carboxylic acid to be added) / (number of phenolic hydroxyl groups of carboxylic acid) means the value calculated by
- the "resin component” refers to a hydrophobic resin (A), an alkali-soluble resin (B), a cresol novolak resin, and a copolymer having an optionally included alkali-soluble functional group.
- Components corresponding to the fluorosurfactant (D) are not included in the hydrophobic resin (A), the alkali-soluble resin (B), and the optionally included copolymer having an alkali-soluble functional group. shall be.
- solid content refers to a hydrophobic resin (A), an alkali-soluble resin (B), a quinonediazide compound (C), a fluorine-based surfactant (D), a cresol novolac resin, and an alkali-soluble functional group. It means the total mass of the components, including optional components such as the copolymer, the colorant (E), and the solubility promoter (F), and excluding the liquid solvent (G).
- a positive photosensitive resin composition of one embodiment includes a hydrophobic resin (A) which is an addition (co)polymer, an alkali-soluble resin (B) having a structural unit represented by formula (1), and a quinonediazide. It contains a compound (C), a fluorosurfactant (D), and a cresol novolac resin.
- a hydrophobic resin (A) which is an addition (co)polymer, an alkali-soluble resin (B) having a structural unit represented by formula (1), and a quinonediazide. It contains a compound (C), a fluorosurfactant (D), and a cresol novolac resin.
- x is an integer of 0 to 3
- R 1 is each independently an alkyl group having 1 to 5 carbon atoms
- R 2 is an organic group having an alkali-soluble functional group.
- Hydrophobic resin (A) (also simply referred to as hydrophobic resin (A)), which is an addition (co)polymer, is unevenly distributed on the coating surface by the fluorine-based surfactant (D), resulting in positive photosensitive
- This is a resin that makes the coating surface of a synthetic resin composition hardly soluble in an alkaline aqueous solution.
- the hydrophobic resin (A) accompanies the fluorosurfactant (D) that moves to the surface of the film during the process of forming a film of the positive photosensitive resin composition. hardly moves toward the coating surface.
- the hydrophobic resin (A) is present at a higher concentration on the surface of the film than inside the film, reducing the alkali solubility of the surface of the film.
- the hydrophobic resin (A) serves as a resin component with low alkali solubility and suppresses dissolution of the coating surface in the unexposed areas, while in the exposed areas, the hydrophobic resin (A) contains a carboxylic acid compound derived from the quinonediazide compound (C), which has high alkali solubility.
- C quinonediazide compound
- the interior of the coating which has higher alkali solubility than the surface of the coating, rapidly progresses because the concentration of the hydrophobic resin (A) is relatively low. Thereby, the contrast between the exposed area and the unexposed area can be increased, and as a result, the pattern formability in a thick film of the positive photosensitive resin composition can be improved.
- the hydrophobic resin (A) is not particularly limited as long as it is an addition (co)polymer, and may be a radical (co)polymer, a cationic (co)polymer, or an anionic (co)polymer.
- examples of the hydrophobic resin (A) include olefin (co)polymers, (meth)acrylic (co)polymers, styrene (co)polymers, acrylamide (co)polymers, acrylonitrile (co)polymers, N -substituted maleimide (co)polymers, and derivatives of these resins. It is preferable that these resin derivatives have a hydrophobic group.
- hydrophobic group examples include a silicon-containing group and a fluorine-containing group.
- hydrophobic resin (A) a homopolymer or copolymer of a polymerizable monomer having an alkali-soluble functional group is used as a base resin, and some or all of the alkali-soluble functional groups are replaced with the group having the above-mentioned hydrophobic group. Converted resins can also be used.
- the hydrophobic resin (A) can be used alone or in combination of two or more types.
- the hydrophobic resin (A) is a resin having at least one selected from the group consisting of a silicon-containing group and a fluorine-containing group.
- the silicon-containing group and the fluorine-containing group may constitute the main chain of the hydrophobic resin (A), or may be pendant groups.
- silicon-containing group examples include a silyl group substituted with an aliphatic hydrocarbon group or an aryl group, a group having a cyclic siloxane structure, and a group having a silsesquioxane structure.
- the silyl group substituted with an aliphatic hydrocarbon group or an aryl group is mono-substituted, di-substituted or tri-substituted.
- the substituents of the silyl group substituted with an aliphatic hydrocarbon group or an aryl group may be the same or different.
- the silyl group substituted with an aliphatic hydrocarbon group or an aryl group is preferably trisubstituted.
- the silyl group substituted with an aliphatic hydrocarbon group or an aryl group may further have a substituent other than an alkyl group or an aryl group, such as a silyloxy group substituted with an aliphatic hydrocarbon group or an aryl group.
- the number of ring members in the cyclic siloxane moiety of the group having a cyclic siloxane structure is preferably 6 to 14. Some or all of the hydrogen atoms on the silicon atoms of the group having a cyclic siloxane structure may be each independently substituted with an aliphatic hydrocarbon group or an aryl group.
- Some or all of the hydrogen atoms on the silicon atoms of the group having a silsesquioxane structure may be each independently substituted with an aliphatic hydrocarbon group or an aryl group.
- Aliphatic hydrocarbon group or aliphatic hydrocarbon group of a silyl group substituted with an aryl group aliphatic hydrocarbon group as a substituent of a group having a cyclic siloxane structure, as a substituent of a group having a silsesquioxane structure
- the aliphatic hydrocarbon group and the aliphatic hydrocarbon group as a substituent of the silyloxy group substituted with an aliphatic hydrocarbon group or an aryl group are preferably aliphatic hydrocarbon groups having 1 to 20 carbon atoms. , more preferably an aliphatic hydrocarbon group having 1 to 8 carbon atoms.
- Examples of the aliphatic hydrocarbon group having 1 to 20 carbon atoms include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, etc.
- Saturated hydrocarbon groups such as ethenyl, propenyl, butenyl, ethynyl, propynyl; cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclodecyl unsaturated monocyclic hydrocarbon groups such as cyclopropenyl, cyclobutenyl, cyclopentenyl, cyclohexenyl, cyclooctenyl, cyclodecenyl; bicyclo [2.2.
- Saturated polycyclic hydrocarbon groups such as heptanyl group, bicyclo[2.2.2]octanyl group, adamantyl group; and bicyclo[2.2.1]heptenyl group, bicyclo[2.2.2]octenyl group, etc. unsaturated polycyclic hydrocarbon groups.
- the aryl group as a substituent of the group hydrocarbon group or the silyloxy group substituted with an aryl group is preferably an aryl group having 6 to 20 carbon atoms, more preferably an aryl group having 6 to 14 carbon atoms.
- Examples of the aryl group having 6 to 20 carbon atoms include phenyl group, naphthyl group, fluorenyl group, anthryl group, and phenanthrenyl group.
- Examples of the silyl group substituted with an aliphatic hydrocarbon group or an aryl group include trimethylsilyl group, triethylsilyl group, triisopropylsilyl group, tert-butyldimethylsilyl group, diphenylmethylsilyl group, triphenylsilyl group, and trimethylsilyl group.
- Examples include oxydimethylsilyl group.
- Examples of the group having a cyclic siloxane structure include a pentamethylcyclotrisilyloxy group, a heptamethylcyclotetrasilyloxy group, and a nonamethylcyclopentasilyloxy group.
- Examples of the group having a silsesquioxane structure include a silsesquioxanyl group, a heptamethylsilsesquioxanyl group, a heptaethylsilsesquioxanyl group, a hepta(n-propyl)silsesquioxanyl group, and a hepta( n-butyl)silsesquioxanyl group.
- fluorine-containing group examples include a fluorine-substituted alkyl group, a fluorine-substituted aryl group, and a fluoroacryloyl group.
- the fluorine-substituted alkyl group may be a perfluoroalkyl group or a partially fluorinated alkyl group.
- the substituents of the fluorine-substituted alkyl group may be the same or different from each other.
- the fluorine-substituted alkyl group may further have a substituent other than a fluorine atom, such as a hydroxy group.
- the fluorine-substituted alkyl group is preferably a perfluoroalkyl group having 1 to 20 carbon atoms or a partially fluorinated alkyl group having 1 to 20 carbon atoms, more preferably a perfluoroalkyl group having 1 to 8 carbon atoms or It is a partially fluorinated alkyl group having 1 to 8 carbon atoms.
- Examples of the perfluoroalkyl group having 1 to 20 carbon atoms and the partially fluorinated alkyl group having 1 to 20 carbon atoms include trifluoromethyl group, 2,2,2-trifluoroethyl group, pentafluoroethyl group, Pentafluoropropyl group, hexafluoroisopropyl group, heptafluoroisopropyl group, hexafluoro(2-methyl)isopropyl group, heptafluorobutyl group, nonafluorobutyl group, octafluoroisobutyl group, nonafluoro-tert-butyl group, perfluoroisobutyl group
- Straight chain or branched fluorine-substituted alkyl groups such as pentyl group, nonafluorohexyl group, perfluoro(trimethyl)hexyl group, perfluorooctyl group, 2-perfluor
- fluorine-substituted alkyl group having a hydroxy group as a substituent examples include -CH(CF 3 )OH, -C(CF 3 ) 2 OH, -C(CF 3 )(CH 3 )OH, and -C(C 2F 5 ) 2 OH, and -C(CF 3 ) 2 OH is preferred.
- the fluorine-substituted aryl group may be a perfluoroaryl group or a partially fluorinated aryl group.
- the substituents of the fluorine-substituted aryl group may be the same or different from each other.
- the fluorine-substituted aryl group may further have a substituent other than a fluorine atom, such as a hydroxy group.
- the fluorine-substituted aryl group is preferably a perfluoroaryl group having 6 to 20 carbon atoms or a partially fluorinated aryl group having 6 to 20 carbon atoms.
- Examples of the perfluoroaryl group having 6 to 20 carbon atoms and the partially fluorinated aryl group having 6 to 20 carbon atoms include p-fluorophenyl group, pentafluorophenyl group, and 3,5-di(trifluoromethyl ) phenyl group.
- the fluorine-substituted aryl group is preferably a pentafluorophenyl group.
- the hydrophobic resin (A) can be produced, for example, by radical polymerization of a polymerizable monomer having a hydrophobic group, or by radical copolymerization of a polymerizable monomer having a hydrophobic group and another polymerizable monomer. It can be manufactured by When producing the hydrophobic resin (A) by radical polymerization, a polymerization initiator and a RAFT (Reversible Addition Fragmentation Transfer) agent can be used as necessary.
- the hydrophobic resin (A) is produced by reacting a resin having a functional group such as a hydroxy group, a carboxy group, an amino group, or an epoxy group with a compound having a hydrophobic group to convert the functional group into a group containing a hydrophobic group. It can also be manufactured by
- the hydrophobic resin (A) is a copolymer of a polymerizable monomer having a hydrophobic group and another polymerizable monomer.
- the polymerizable monomer having a hydrophobic group include a polymerizable monomer having a silicon-containing group and a polymerizable monomer having a fluorine-containing group.
- Examples of the polymerizable monomer having a silicon-containing group include trimethylvinylsilane, trimethylallylsilane, trimethyl(3-butenyl)silane, tert-butyldimethylvinylsilane, (trimethylsilyloxy)dimethylvinylsilane, (trimethylsilyloxy)dimethylallylsilane, and triethyl.
- Examples of the polymerizable monomer having a fluorine-containing group include 2-perfluorohexylethyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, and 2,2,3,3-tetrafluoro Propyl (meth)acrylate, 2-(1,1,1,3,3,3-hexafluoropropyl)(meth)acrylate, 2,2,3,3,4,4,4-heptafluorobutyl (meth) Acrylate, 3,3,4,4,5,5,6,6,6-nonafluorohexyl (meth)acrylate, 2-(1,1,1,3,3,3-hexafluoro-2-methylpropyl )(meth)acrylate, 2-(1,1,1,3,3,3-hexafluoro-2-phenylpropyl)(meth)acrylate, pentafluorophenyl(meth)acrylate, 3,5-bis(trifluoro Methyl) phenyl (meth)
- polymerizable monomers include, for example, styrene; styrene derivatives such as ⁇ -methylstyrene, p-methylstyrene, and p-ethylstyrene; acrylamide; acrylonitrile; ether compounds of vinyl alcohol such as vinyl-n-butyl ether; Methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert- Butyl (meth)acrylate, phenyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, glycid
- the other polymerizable monomers may be polymerizable monomers having an alkali-soluble functional group.
- the polymerizable monomer having an alkali-soluble functional group include maleic acid derivatives such as monomethyl maleate, monoethyl maleate, and monoisopropyl maleate; (meth)acrylic acid, ⁇ -bromo(meth)acrylic acid, ⁇ -(meth)acrylic acid derivatives such as chloro(meth)acrylic acid, ⁇ -furyl(meth)acrylic acid, ⁇ -styryl(meth)acrylic acid; maleic acid, fumaric acid, cinnamic acid, ⁇ -cyanocinnamic acid, Unsaturated carboxylic acid compounds such as itaconic acid, crotonic acid, propiolic acid, 3-maleimidopropionic acid, 4-maleimidobutyric acid, 6-maleimidohexanoic acid; 4-hydroxystyrene, 4-hydroxyphenyl
- R 5 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms
- R 6 is represented by SiR 7 R 8 R 9
- R 7 , R 8 and R 9 are each independently is an alkyl group having 1 to 8 carbon atoms or an aryl group having 6 to 20 carbon atoms
- r is an integer of 0 to 5
- s is an integer of 0 to 5, provided that r+s is an integer of 1 to 5. is an integer)
- R 5 is preferably a hydrogen atom or a methyl group.
- R 7 , R 8 , and R 9 are each independently a methyl group, ethyl group, isopropyl group, tert-butyl group, or phenyl group.
- r is preferably an integer of 0 to 3, more preferably 0.
- s is preferably an integer of 1 to 3, and more preferably 1.
- 4-triethylsilyloxyphenyl methacrylate and 4-tert-butyldimethylsilyloxyphenyl methacrylate are particularly preferred.
- R 10 and R 11 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms
- R 12 is a hydrogen atom or a straight chain having 1 to 6 carbon atoms.
- a phenyl group substituted with is preferable.
- R 10 and R 11 are hydrogen atoms.
- R 12 is at least one selected from the group consisting of a cyclic alkyl group having 3 to 12 carbon atoms, a phenyl group, or a hydroxy group, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms.
- a phenyl group substituted with a species is preferable, and a cyclic alkyl group having 3 to 12 carbon atoms or a phenyl group is more preferable.
- phenylmaleimide and N-cyclohexylmaleimide are particularly preferred.
- R 13 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and a is an integer of 1 to 5.
- R 13 is preferably a hydrogen atom or a methyl group.
- a is preferably an integer of 1 to 3, and more preferably 1.
- 4-hydroxyphenyl methacrylate is particularly preferred.
- the hydrophobic resin (A) has the formula (3) (In formula (3), R 5 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 6 is represented by SiR 7 R 8 R 9 , and R 7 , R 8 and R 9 are each independently is an alkyl group having 1 to 8 carbon atoms or an aryl group having 6 to 20 carbon atoms, r is an integer of 0 to 5, and s is an integer of 0 to 5, provided that r+s is an integer of 1 to 5. ), and has at least one structural unit represented by formula (3), where s is an integer of 1 or more.
- the hydrophobic resin (A) has the formula (4) (In formula (4), R 10 and R 11 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and R 12 is a hydrogen atom or a straight chain having 1 to 6 carbon atoms. At least one member selected from the group consisting of an alkyl group, a cyclic alkyl group having 3 to 12 carbon atoms, a phenyl group, or a hydroxy group, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms. It is preferable to further have a structural unit represented by (a phenyl group substituted with ).
- the hydrophobic resin (A) has the formula (5) (In formula (5), R 13 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and a is an integer of 1 to 5.) It is preferable to further have a structural unit represented by the following.
- a structural unit represented by formula (3), a structural unit represented by formula (4), and a structural unit represented by formula (5), where s is an integer of 1 or more are combined.
- 4-triethylsilyloxyphenyl methacrylate or 4-tert-butyldimethylsilyloxyphenyl methacrylate is used as the polymerizable monomer having a hydrophobic group, and phenylmaleimide or N-cyclohexylmaleimide is used as the other polymerizable monomer. , 4-hydroxyphenyl methacrylate are particularly preferably used.
- the content of silicon atoms is preferably 1.0% by mass to 10% by mass, more preferably 3.0% by mass, based on the mass of the hydrophobic resin (A). It is 0% by mass to 8.0% by mass.
- the hydrophobic resin (A) having a silicon-containing group preferably contains a structural unit having a silicon-containing group in an amount of 3 mol% to 60 mol%, more preferably 5 mol% to 50 mol%, based on the total structural units of the hydrophobic resin (A). Contains in an amount of %.
- the content of fluorine atoms is preferably from 1% by mass to 35% by mass, more preferably from 5% by mass, based on the mass of the hydrophobic resin (A). It is 30% by mass.
- the hydrophobic resin (A) having a fluorine-containing group preferably contains structural units having a fluorine-containing group in an amount of 5 mol% to 55 mol%, more preferably 6 mol% to 50 mol%, based on all the structural units of the hydrophobic resin (A). Contains in an amount of %.
- the hydrophobic resin (A) may or may not have an alkali-soluble functional group.
- the hydrophobic resin (A) preferably contains a structural unit having an alkali-soluble functional group in a proportion of 20 mol% to 90 mol%, more preferably 30 mol% to 85 mol%, and even more preferably is contained in an amount of 40 mol% to 80 mol%. In one embodiment, the hydrophobic resin (A) does not have alkali-soluble functional groups.
- the weight average molecular weight (Mw) of the hydrophobic resin (A) is preferably 3,000 to 80,000, more preferably 4,000 to 70,000, even more preferably 5,000 to 60,000.
- the number average molecular weight (Mn) of the hydrophobic resin (A) is preferably 1,000 to 30,000, more preferably 1,500 to 25,000, even more preferably 2,000 to 20,000.
- the polydispersity (Mw/Mn) of the hydrophobic resin (A) is preferably 1.0 to 3.5, more preferably 1.1 to 3.0, even more preferably 1.2 to 2.8. .
- the positive photosensitive resin composition contains 1% by mass to 50% by mass, preferably 2% to 40% by mass of the hydrophobic resin (A), more preferably 2% to 40% by mass, based on 100% by mass of solid content. contains 3% to 30% by mass. If the content of the hydrophobic resin (A) is 1% by mass or more based on the solid content of 100% by mass, the fluorosurfactant (D) can prevent the hydrophobic resin (A) from being unevenly distributed on the coating surface. The hydrophobic resin (A) becomes highly concentrated on the surface of the coating, and the surface of the coating becomes poorly soluble in an alkaline aqueous solution, making it possible to achieve high sensitivity.
- the content of the hydrophobic resin (A) is 50% by mass or less based on 100% by mass of solid content, the carboxylic acid compound derived from the quinonediazide compound in the exposed area, other highly alkali-soluble resin components, and any Since the coating surface rapidly dissolves as the dissolution promoter dissolves, high sensitivity can be achieved.
- the hydrophobic resin (A) is preferably 1% by mass to 50% by mass, more preferably 3% to 45% by mass, even more preferably 5% by mass, based on the total mass of the resin components. Contains from % to 40% by mass. If the content of the hydrophobic resin (A) is 1% by mass or more based on the total mass of the resin components, uneven distribution of the hydrophobic resin (A) on the coating surface is prevented by the fluorosurfactant (D). The hydrophobic resin (A) becomes highly concentrated on the surface of the coating, and the surface of the coating becomes poorly soluble in an alkaline aqueous solution, making it possible to achieve high sensitivity.
- the content of the hydrophobic resin (A) is 50% by mass or less based on the total mass of the resin components, the carboxylic acid compound derived from the quinonediazide compound in the exposed area, other highly alkali-soluble resin components, and any Since the coating surface rapidly dissolves as the dissolution promoter dissolves, high sensitivity can be achieved.
- the alkali-soluble resin (B) has a structural unit represented by formula (1).
- x is an integer of 0 to 3
- R 1 is each independently an alkyl group having 1 to 5 carbon atoms
- R 2 is an organic group having an alkali-soluble functional group.
- x is preferably 0 or 1.
- R 1 is preferably a methyl group.
- R2 has an alkali-soluble functional group, but is not particularly limited, and includes an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an alkylene group, an alkenylene group, an alkynylene group, an ester group, an ether group, a carbonyl group, and an arylene group.
- the organic group is preferably an organic group containing a group, an amino group, an imino group, an imido group, an amide group, a heterocyclic group, a sulfonyl group, or a combination of two or more of these.
- R2 is an alkali-soluble functional group, and an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an alkylene group, an alkenylene group, an alkynylene group, an ester group, an ether group, a carbonyl group, an arylene group, an amino group. , an imino group, an imide group, an amide group, a heterocyclic group, a sulfonyl group, or a combination of two or more of these.
- the number of carbon atoms in R 2 is, for example, 1 to 30, preferably 2 to 25.
- alkali-soluble functional group examples include, but are not limited to, a phenolic hydroxyl group, a carboxy group, a sulfo group, a phosphoric acid group, an acid anhydride group, and a mercapto group, with a phenolic hydroxyl group being preferred.
- An alkali-soluble resin (B) having two or more types of alkali-soluble functional groups may be used.
- the alkali-soluble resin (B) can be used alone or in combination of two or more types.
- the alkali-soluble resin (B) contains preferably 20 mol% to 95 mol% of the structural unit represented by formula (1), more preferably 25 mol% to 90 mol%, based on all structural units of the alkali-soluble resin (B). More preferably, it is contained in an amount of 30 mol% to 85 mol%. When it is 20 mol % or more, alkali solubility is sufficiently expressed and the problem of residue at the bottom of the pattern does not occur. If it is 95 mol % or less, it will not affect the solubility of the unexposed area.
- the alkali-soluble resin (B) may contain structural units other than the structural unit represented by formula (1).
- Other structural units include a structural unit represented by the following formula (2).
- y is an integer of 0 to 3
- R 3 is each independently an alkyl group having 1 to 5 carbon atoms
- R 4 is an organic group having no alkali-soluble functional group. .
- y is preferably 0 or 1.
- R 3 is preferably a methyl group.
- R4 is an alkyl group, alkenyl group, alkynyl group, aryl group, alkylene group, alkenylene group, alkynylene group, ester group, ether group, carbonyl group, arylene group, amino group, imino group, imido group, amide group, hetero
- An organic group containing a cyclic group, a sulfonyl group, or a combination of two or more of these is preferable.
- the organic group of R4 may be a monovalent group or a polyvalent group, and in the case of a polyvalent group, it is bonded to other parts of the alkali-soluble resin (B) to form a crosslinked structure. It means that.
- R 4 is preferably an organic group having a heterocyclic group, more preferably an organic group having an epoxy group. More specifically, R 4 is preferably an organic group (glycidyl group) represented by -CH 2 -Y (Y represents an epoxy group).
- the alkali-soluble resin (B) has a total of the structural units represented by formula (1) and the structural units represented by formula (2), preferably 30 mol, based on all the structural units of the alkali-soluble resin (B). % to 100 mol%, more preferably 40 mol% to 100 mol%, even more preferably 50 mol% to 100 mol%. If it is 30 mol % or more, the effect of improving the compatibility between the hydrophobic resin (A) and the alkali-soluble resin (B) by adding the cresol novolak resin to the resin component can be sufficiently obtained.
- the alkali-soluble resin (B) preferably contains a structural unit in which R 2 in formula (1) is an organic group having a phenolic hydroxyl group.
- Examples of such alkali-soluble resin (B) include resins in which an organic group having a phenolic hydroxyl group is introduced into a novolac-type epoxy resin such as a phenol novolak-type epoxy resin and a cresol novolac-type epoxy resin.
- Novolak type epoxy resins are resins in which glycidyl groups are introduced into the hydroxyl groups of phenol novolaks and cresol novolaks.
- the novolac type epoxy resin into which an organic group having a phenolic hydroxyl group is introduced may have an alkali-soluble functional group other than the phenolic hydroxyl group.
- the alkali-soluble resin (B) contains a structural unit represented by formula (1) and a structural unit represented by formula (2)
- Such an alkali-soluble resin (B) can be obtained by reacting a part of the epoxy group of a novolac type epoxy resin with a carboxyl group of a hydroxybenzoic acid compound (hereinafter, this resin will be referred to as "epoxy group and phenol"). (Sometimes referred to as "resin having a functional hydroxyl group.")
- This resin has an unreacted epoxy group derived from a novolac type epoxy resin and a phenolic hydroxyl group derived from a hydroxybenzoic acid compound. Since this resin is a thermosetting type, it is common knowledge for those skilled in the art that its structure cannot be uniquely described due to differences in the presence or absence of epoxy groups, types of functional groups, degree of polymerization, etc.
- the epoxy groups of resins containing epoxy groups and phenolic hydroxyl groups form crosslinks through reaction with phenolic hydroxyl groups during heat treatment (post-bake) after development, thereby improving the chemical resistance, heat resistance, etc. of the film. be able to. Since phenolic hydroxyl groups contribute to solubility in alkaline aqueous solutions during development, resins with epoxy groups and phenolic hydroxyl groups also function as dissolution promoters for other resins when exposed to light at low doses.
- a photosensitive resin composition can be made highly sensitive.
- Reaction Formula 1 shows an example of a reaction in which one of the epoxy groups of a novolak-type epoxy resin reacts with a carboxy group of a hydroxybenzoic acid compound to form a resin having an epoxy group and a phenolic hydroxyl group.
- R 14 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and m is an integer of 1 to 50.
- Examples of the phenol novolac type epoxy resin include EPICLON (trademark) N-770 (DIC Corporation) and jER (trademark) -152 (Mitsubishi Chemical Corporation).
- Examples of the cresol novolac type epoxy resin include EPICLON (trademark) N-695 (DIC Corporation) and EOCN (trademark) -102S (Nippon Kayaku Corporation).
- the novolak epoxy resin is preferably at least one selected from the group consisting of phenol novolac epoxy resins and cresol novolac epoxy resins, and more preferably cresol novolak epoxy resins.
- a positive photosensitive resin composition containing a resin having an epoxy group and a phenolic hydroxyl group derived from a novolac type epoxy resin, particularly a cresol novolac type epoxy resin, has excellent pattern forming properties and easy adjustment of alkali solubility. Yes, there is less outgas.
- Hydroxybenzoic acid compounds are compounds in which at least one of the 2nd to 6th positions of benzoic acid is substituted with a hydroxyl group, and examples include salicylic acid, 4-hydroxybenzoic acid, 2,3-dihydroxybenzoic acid, and 2,4-dihydroxybenzoic acid. Acid, 2,5-dihydroxybenzoic acid, 2,6-dihydroxybenzoic acid, 3,4-dihydroxybenzoic acid, 3,5-dihydroxybenzoic acid, 2-hydroxy-5-nitrobenzoic acid, 3-hydroxy-4- Examples include nitrobenzoic acid and 4-hydroxy-3-nitrobenzoic acid, and dihydroxybenzoic acid compounds are preferred from the standpoint of improving alkali developability. Hydroxybenzoic acid compounds can be used alone or in combination of two or more.
- the alkali-soluble resin (B) is a reaction product of a novolak-type epoxy resin and a hydroxybenzoic acid compound, and has the formula (7) (In formula (7), b is an integer of 1 to 5, and * represents the bonding portion of the novolak epoxy resin with the residue other than the epoxy group involved in the reaction.)
- the hydroxybenzoic acid compound is used in an amount of 0.2 to 0.95 equivalents per equivalent of the epoxy group of the novolak-type epoxy resin. It is preferably used in an amount of 0.3 to 0.9 equivalents, more preferably 0.4 to 0.8 equivalents.
- the amount of the hydroxybenzoic acid compound is 0.2 equivalent or more, sufficient alkali solubility can be obtained, and when it is 0.95 equivalent or less, increase in molecular weight due to side reactions can be suppressed.
- a catalyst may be used to promote the reaction between the epoxy group of the novolac type epoxy resin and the carboxy group of the hydroxybenzoic acid compound.
- the amount of the catalyst used can be 0.1 to 10 parts by mass based on 100 parts by mass of the reaction raw material mixture consisting of the novolak epoxy resin and the hydroxybenzoic acid compound.
- the reaction temperature can be 60 to 150°C and the reaction time can be 3 to 30 hours.
- Examples of the catalyst used in this reaction include triethylamine, benzyldimethylamine, triethylammonium chloride, benzyltrimethylammonium bromide, benzyltrimethylammonium iodide, triphenylphosphine, chromium octoate, and zirconium octoate.
- the number average molecular weight (Mn) of the alkali-soluble resin (B) is preferably 500 to 8,000, more preferably 800 to 6,000, and still more preferably 1,000 to 5,000.
- the weight average molecular weight (Mw) of the alkali-soluble resin (B) is preferably 500 to 30,000, more preferably 2,000 to 25,000, even more preferably 3,000 to 20,000.
- the alkali development rate is appropriate and the difference in dissolution rate between the exposed area and the unexposed area is sufficient, so that the resolution of the pattern is good. If the number average molecular weight is 8,000 or less or the weight average molecular weight is 30,000 or less, the coatability and alkali developability are good.
- the alkali-soluble resin (B) is a resin having an epoxy group and a phenolic hydroxyl group
- the epoxy equivalent thereof is preferably 300 to 7000, more preferably 400 to 6000, still more preferably 500 to 5000. be.
- the epoxy equivalent of the resin having an epoxy group and a phenolic hydroxyl group is 300 or more, sufficient alkali solubility can be imparted to the resin having an epoxy group and a phenolic hydroxyl group. If the epoxy equivalent of the resin having an epoxy group and a phenolic hydroxyl group is 7000 or less, the strength and heat resistance of the cured film can be improved.
- Epoxy equivalent weight is determined according to JIS K 7236:2009.
- the positive photosensitive resin composition contains 5% to 60% by mass, preferably 10% to 50% by mass, more preferably 10% to 50% by mass of the alkali-soluble resin (B), based on 100% by mass of solid content. contains 15% to 40% by mass. If the content of the alkali-soluble resin (B) is 5% by mass or more based on the solid content of 100% by mass, phase separation from the hydrophobic resin (A) can be maintained and the surface of the hydrophobic resin (A) can be coated. It does not impede uneven distribution. If the content of the alkali-soluble resin (B) is 60% by mass or less based on the solid content of 100% by mass, phase separation from the hydrophobic resin (A) is maintained and the surface of the hydrophobic resin (A) is not coated. It does not interfere with uneven distribution and does not affect the solubility of unexposed areas.
- the positive photosensitive resin composition contains preferably 15% to 80% by mass, more preferably 20% to 75% by mass, even more preferably 25% by mass of the alkali-soluble resin (B), based on the total mass of the resin components. Contains from % to 70% by mass. If the content of the alkali-soluble resin (B) is 15% by mass or more based on the total mass of the resin components, phase separation from the hydrophobic resin (A) can be maintained and the surface of the hydrophobic resin (A) can be coated. It does not impede uneven distribution.
- the content of the alkali-soluble resin (B) is 80% by mass or less based on the total mass of the resin components, phase separation from the hydrophobic resin (A) will be maintained and the surface of the hydrophobic resin (A) will not be coated. It does not interfere with uneven distribution and does not affect the solubility of unexposed areas.
- the positive photosensitive resin composition is a copolymer of a polymerizable monomer having an alkali-soluble functional group and another polymerizable monomer, and is represented by formula (1). It may further contain an alkali-soluble resin having no structural unit (also simply referred to as "a copolymer having an alkali-soluble functional group").
- alkali-soluble functional group contained in the copolymer having an alkali-soluble functional group examples include a phenolic hydroxyl group, a carboxy group, a sulfo group, a phosphoric acid group, an acid anhydride group, and a mercapto group.
- the copolymer of a polymerizable monomer having an alkali-soluble functional group and another polymerizable monomer may have two or more types of alkali-soluble functional groups.
- the copolymer having an alkali-soluble functional group is one or more selected from the group consisting of an alicyclic structure, an aromatic structure, a polycyclic structure, an inorganic cyclic structure, and a heterocyclic structure. It is preferable to have a cyclic structure.
- a copolymer having an alkali-soluble functional group can be produced, for example, by radical polymerizing a polymerizable monomer having an alkali-soluble functional group and another polymerizable monomer.
- a polymerization initiator and a RAFT (Reversible Addition Fragmentation Transfer) agent can be used as necessary.
- an alkali-soluble functional group may be added to the copolymer.
- the polymerizable monomer having an alkali-soluble functional group for example, the polymerizable monomer having an alkali-soluble functional group described for the hydrophobic resin (A) can be used.
- the polymerizable monomer having an alkali-soluble functional group is preferably a polymerizable monomer having a carboxyl group or a phenolic hydroxyl group, and is preferably a polymerizable monomer having a phenolic hydroxyl group. is even more preferable.
- the other polymerizable monomer for example, the other polymerizable monomers described for the hydrophobic resin (A) can be used.
- R 13 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and a is an integer of 1 to 5.
- R 13 is preferably a hydrogen atom or a methyl group.
- a is preferably an integer of 1 to 3, and more preferably 1.
- 4-hydroxyphenyl methacrylate is particularly preferred.
- R 10 and R 11 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms
- R 12 is a hydrogen atom or a straight chain having 1 to 6 carbon atoms.
- a phenyl group substituted with is preferable.
- R 10 and R 11 are hydrogen atoms.
- R 12 is at least one selected from the group consisting of a cyclic alkyl group having 3 to 12 carbon atoms, a phenyl group, or a hydroxy group, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms.
- a phenyl group substituted with a species is preferable, and a cyclic alkyl group having 3 to 12 carbon atoms or a phenyl group is more preferable.
- phenylmaleimide and N-cyclohexylmaleimide are particularly preferred.
- the copolymer having an alkali-soluble functional group has the formula (5) (In formula (5), R 13 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and a is an integer of 1 to 5.), and a structural unit represented by formula (4) (In formula (4), R 10 and R 11 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and R 12 is a hydrogen atom or a straight chain having 1 to 6 carbon atoms.
- the weight average molecular weight (Mw) of the copolymer having an alkali-soluble functional group is preferably 3,000 to 80,000, more preferably 4,000 to 70,000, even more preferably 5,000 to 60,000.
- the number average molecular weight (Mn) of the copolymer having an alkali-soluble functional group is preferably 1,000 to 30,000, more preferably 1,500 to 25,000, still more preferably 2,000 to 20,000.
- the polydispersity (Mw/Mn) of the copolymer having an alkali-soluble functional group is preferably 1.0 to 3.5, more preferably 1.1 to 3.0, even more preferably 1.2 to 2. It is 8.
- a positive photosensitive resin composition that has excellent coating properties, pattern formation properties, and alkali developability by setting the weight average molecular weight, number average molecular weight, and polydispersity of the copolymer having an alkali-soluble functional group to the above ranges. can be obtained.
- the alkali-soluble functional group of the copolymer having an alkali-soluble functional group is a phenolic hydroxyl group
- the phenolic hydroxyl group equivalent of the copolymer having an alkali-soluble functional group is preferably 60 to 400, more preferably 80. ⁇ 350, more preferably 100 ⁇ 300. If the phenolic hydroxyl equivalent of the copolymer having an alkali-soluble functional group is 60 or more, the film thickness of the unexposed area can be sufficiently maintained during alkali development. If the phenolic hydroxyl equivalent of the copolymer having an alkali-soluble functional group is 400 or less, desired alkali solubility can be obtained.
- the positive photosensitive resin composition contains 1% to 70% by weight, preferably 3% to 60% by weight of the copolymer having an alkali-soluble functional group, based on 100% by weight solid content. , more preferably 5% to 50% by weight. If the content of the copolymer having an alkali-soluble functional group is 1% by mass or more based on the solid content of 100% by mass, dissolution of the exposed area can be promoted to achieve high sensitivity, and after heat curing, The stability and durability of the film can be ensured. If the content of the copolymer having an alkali-soluble functional group is 70% by mass or less based on the solid content of 100% by mass, a beautiful pattern can be formed without causing the problem of residue at the bottom of the exposed pattern.
- the positive photosensitive resin composition preferably contains a copolymer having an alkali-soluble functional group in an amount of 1% by mass to 80% by mass, more preferably 3% by mass to 70% by mass, based on the total mass of resin components. It preferably contains 5% by mass to 60% by mass. If the content of the copolymer having an alkali-soluble functional group is 1% by mass or more based on the total mass of the resin components, it is possible to promote dissolution of the exposed area and achieve high sensitivity. The stability and durability of the film can be ensured. If the content of the copolymer having an alkali-soluble functional group is 80% by mass or less based on the total mass of the resin components, a beautiful pattern can be formed without causing the problem of residue at the bottom of the exposed pattern.
- quinonediazide compound (C) When the quinonediazide compound (C) is irradiated with radiation such as visible light, ultraviolet light, gamma rays, and electron beams, it undergoes the reaction shown in Reaction Formula 2 below to generate an alkali-soluble carboxylic acid compound.
- the quinonediazide compound (C) before photosensitization, is added to the alkali-soluble resin (B), and the cresol novolac resin, and optionally a copolymer having an alkali-soluble functional group, such as an alkali-soluble functional group, such as a phenolic hydroxyl group. (e.g. hydrogen bond formation) to render these resins insoluble in aqueous alkaline solutions.
- carboxylic acid compounds have a relatively larger molecular structure than acids generated from photoacid generators commonly used in chemically amplified resists, such as p-toluenesulfonic acid and 1-propanesulfonic acid, and are difficult to diffuse in the film. It's hard to do.
- the quinonediazide compound (C) can be used alone or in combination of two or more.
- the positive photosensitive resin composition preferably does not substantially contain a photoacid generator commonly used in chemically amplified resists, and contains only the quinonediazide compound (C) as a photosensitizer without containing the photoacid generator. It is more preferable to include.
- substantially free of photoacid generator means that the amount of the photoacid generator contained in the positive photosensitive resin composition is 0.2 parts by mass based on the total of 100 parts by mass of the resin components. Hereinafter, it means 0.1 part by mass or less, or 0.05 part by mass or less.
- high-resolution patterns can be formed without post-exposure heat treatment (PEB) required with typical chemically amplified resists.
- the quinonediazide compound (C) has a relatively high quantum yield, and a carboxylic acid compound is efficiently generated in the exposed area.
- PEB post-exposure heat treatment
- the alkali-soluble resin (B) contains a resin having an epoxy group and a phenolic hydroxyl group
- PEB if PEB is omitted, the ring-opening polymerization of the epoxy group of the resin having an epoxy group and a phenolic hydroxyl group will not proceed.
- the alkaline solubility of the resin having a group and a phenolic hydroxyl group can be maintained.
- the quinonediazide compound (C) is a compound in which the sulfonic acid of quinonediazide is bonded to a polyhydroxy compound through an ester bond, a compound in which the sulfonic acid of quinonediazide is bonded to a polyamino compound through a sulfonamide bond, a compound in which the sulfonic acid of quinonediazide is bonded to a polyhydroxy polyamino compound through an ester bond, or Examples include those with sulfonamide bonds. From the viewpoint of contrast between exposed areas and unexposed areas, it is preferable that 20 mol % or more of the entire functional groups of the polyhydroxy compound, polyamino compound, or polyhydroxy polyamino compound be substituted with quinonediazide.
- polyhydroxy compounds include Bis-Z, BisP-EZ, TekP-4HBPA, TrisP-HAP, TrisP-PA, TrisP-SA, TrisOCR-PA, BisOCHP-Z, BisP-MZ, BisP-PZ, BisP-IPZ, BisOCP-IPZ, BisP-CP, BisRS-2P, BisRS-3P, BisP-OCHP, Methylene Tris-FR-CR, BisRS-26X, DML-MBPC, DML-MBOC, DML-OCHP, DML-PCHP, DML-PC , DML-PTBP, DML-34X, DML-EP, DML-POP, Dimethylol-BisOC-P, DML-PFP, DML-PSBP, DML-MTrisPC, TriML-P, TriML-35XL, TML-BP, TML-HQ , TML-pp-BPF, TML-BPA, TMOM-BP, HML-TPPHBA, HML-TPHAP
- the quinonediazide compound (C) is preferably a 1,2-naphthoquinonediazide-4-sulfonic acid ester or a 1,2-naphthoquinonediazide-5-sulfonic acid ester of a polyhydroxy compound.
- the positive photosensitive resin composition contains 5 parts by weight to 70 parts by weight, preferably 7 parts to 65 parts by weight of the quinonediazide compound (C), based on a total of 100 parts by weight of the resin components. It preferably contains 10 to 60 parts by weight. If the content of the quinonediazide compound (C) is 5 parts by mass or more based on the above-mentioned total of 100 parts by mass, high sensitivity can be achieved. If the content of the quinonediazide compound (C) is 70 parts by mass or less based on the above-mentioned total of 100 parts by mass, the alkali developability is good.
- the fluorinated surfactant (D) is not particularly limited, but a surfactant having at least one fluorinated hydrocarbon group selected from the group consisting of a fluorinated alkyl group and a fluorinated alkylene group and a hydrophilic group is used. be able to.
- fluorosurfactants (D) include perfluoroalkyl sulfonic acids, partially fluorinated alkyl sulfonic acids, perfluoroalkyl carboxylic acids, partially fluorinated alkyl carboxylic acids, perfluoroalkyl phosphoric esters, and partially fluorinated alkyl carboxylic acids.
- fluorinated alkyl phosphate esters perfluoroalkyl trimethyl ammonium salts, partially fluorinated alkyl trimethyl ammonium salts, perfluoroalkyl betaines, partially fluorinated alkyl betaines, perfluoroalkyl EO adducts, and fluorotelomer alcohols.
- the fluorine-based surfactant (D) includes a perfluoroalkyl group, a partially fluorinated alkyl group, a perfluoroalkylene group, or a partially fluorinated alkylene group, and a sulfo group, a carboxy group, a phosphoric acid group, an ammonium group, and an oxyalkylene group.
- a homopolymer or copolymer having a hydrophilic group such as a polyoxyalkylene group in the molecule can also be used.
- the fluorosurfactant (D) can be used alone or in combination of two or more.
- the fluorosurfactant (D) preferably contains an acrylic copolymer having at least one fluorinated hydrocarbon group selected from the group consisting of a fluorinated alkyl group and a fluorinated alkylene group.
- the acrylic copolymer can promote the migration of the hydrophobic resin (A) to the coating surface of the positive photosensitive resin composition, thereby making the coating surface more poorly soluble in alkali.
- the acrylic copolymer has the formula (8) (In formula (8), R 15 is a hydrogen atom or a methyl group, L 1 is a divalent group having 1 to 30 carbon atoms, and Rf 1 may contain one or more ether bonds in the chain. It is a perfluoroalkyl group or a partially fluorinated alkyl group having 4 to 6 carbon atoms.)
- a fluorine-containing polymerizable monomer represented by and formula (9) (In formula (9), R 16 is a hydrogen atom or a methyl group, R 17 is each independently a linear or branched alkylene group having 2 to 4 carbon atoms, and R 18 is a hydrogen atom or a carbon atom. It is an alkyl group of numbers 1 to 6, and c is an integer of 2 to 50.) It is a copolymer (D1) with a polymerizable monomer having a polyoxyalkylene group represented by:
- the divalent group having 1 to 30 carbon atoms represented by L 1 may contain at least one heteroatom selected from the group consisting of oxygen atom, nitrogen atom, and sulfur atom, and carbon It may also contain a perfluoroalkyl group or a partially fluorinated alkyl group having 4 to 6 atoms.
- Rf 1 is preferably -C 4 F 9 or -C 6 F 13 .
- the fluorine-containing polymerizable monomer represented by formula (8) can be used alone or in combination of two or more types.
- the linear or branched alkylene group having 2 to 4 carbon atoms represented by R 17 includes ethylene group, propylene group, tetramethylene group, and isobutylene group.
- R 17 may be the same or different from each other.
- R 17 is preferably a propylene group, a tetramethylene group, or an isobutylene group, and a plurality of the same groups are connected via adjacent oxygen atoms to form a polyoxypropylene chain, a polyoxytetramethylene chain, and a polyoxytetramethylene chain. It is more preferable to form a chain or a polyoxyisobutylene chain.
- the alkyl group having 1 to 6 carbon atoms represented by R 18 includes, for example, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, and an n-hexyl group. can be mentioned.
- the polymerizable monomer having a polyoxyalkylene group represented by formula (9) can be used alone or in combination of two or more types.
- the copolymer (D1) contains, in addition to the fluorine-containing polymerizable monomer represented by formula (8) and the polymerizable monomer having a polyoxyalkylene group represented by formula (9), other polymers. It may also be a copolymer with a monomer.
- polymerizable monomers include, for example, formula (10) (In formula (10), R 19 is a hydrogen atom or a methyl group, and R 20 is a straight chain, branched or cyclic alkyl group having 1 to 18 carbon atoms.) Polymerizable monomers represented by:
- the linear, branched or cyclic alkyl group having 1 to 18 carbon atoms represented by R 20 includes, for example, a methyl group, an ethyl group, an n-propyl group, an n-butyl group, an n-butyl group, and an n-butyl group.
- polymerizable monomers include aromatic vinyl compounds such as styrene, ⁇ -methylstyrene, p-methylstyrene, and p-methoxystyrene; and maleimide, methylmaleimide, ethylmaleimide, n-propylmaleimide, isopropylmaleimide, Also included are maleimide compounds such as n-butylmaleimide, n-hexylmaleimide, n-octylmaleimide, n-dodecylmaleimide, stearylmaleimide, phenylmaleimide, and cyclohexylmaleimide.
- aromatic vinyl compounds such as styrene, ⁇ -methylstyrene, p-methylstyrene, and p-methoxystyrene
- maleimide methylmaleimide, ethylmaleimide, n-propylmaleimide, isopropy
- polymerizable monomers can be used alone or in combination of two or more types.
- the fluorine-containing polymerizable monomer represented by formula (8) and the polymerizable monomer having a polyoxyalkylene group represented by formula (9) in copolymer (D1) are
- the mass ratio (mass of the fluorine-containing polymerizable monomer represented by formula (8)/mass of the polymerizable monomer having a polyoxyalkylene group represented by formula (9)) is preferably 10/90. ⁇ 70/30, more preferably 15/85 ⁇ 60/40, even more preferably 25/75 ⁇ 50/50.
- the copolymer (D1) includes, for example, a fluorine-containing polymerizable monomer represented by formula (8), a polymerizable monomer having a polyoxyalkylene group represented by formula (9), and optionally Other polymerizable monomers can be obtained by radical polymerization using a polymerization initiator in an organic solvent.
- organic solvents examples include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; esters such as ethyl acetate, butyl acetate, and propylene glycol monomethyl ether acetate; amides such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone; dimethyl Examples include sulfoxides such as sulfoxide; ethers such as diethyl ether, diisopropyl ether, tetrahydrofuran, and dioxane; and aromatic hydrocarbons such as toluene and xylene.
- ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone
- esters such as ethyl acetate, butyl acetate, and propylene glycol monomethyl ether acetate
- polymerization initiator examples include peroxide polymerization initiators such as benzoyl peroxide, and azo polymerization initiators such as 2,2'-azobisisobutyronitrile. If necessary, a chain transfer agent such as lauryl mercaptan, 2-mercaptoethanol, thioglycerol, ethylthioglycolic acid, octylthioglycolic acid, etc. may be used.
- peroxide polymerization initiators such as benzoyl peroxide
- azo polymerization initiators such as 2,2'-azobisisobutyronitrile.
- a chain transfer agent such as lauryl mercaptan, 2-mercaptoethanol, thioglycerol, ethylthioglycolic acid, octylthioglycolic acid, etc. may be used.
- the number average molecular weight (Mn) of the copolymer (D1) is preferably 2,000 to 100,000, more preferably 2,500 to 100,000, since it has good compatibility or miscibility with the resin component and provides excellent leveling properties. It is 50,000.
- the fluorine atom content of the copolymer (D1) is preferably 2 to 40% by mass, more preferably 5 to 30% by mass, and even more preferably It is 10 to 25% by mass.
- the fluorine atom content of the copolymer (D1) is a value calculated from the mass ratio of fluorine atoms based on the total mass of the polymerizable monomers used.
- the acrylic copolymer has the formula (11) (In formula (11), R 21 is a radically polymerizable functional group, L 2 is a divalent group having 1 to 8 carbon atoms, L 3 is a divalent group having 1 to 8 carbon atoms, Rf 2 is each independently a fluorinated alkylene group having 1 to 3 carbon atoms, and d is an integer of 1 to 100.)
- a fluorine-containing polymerizable monomer represented by and formula (12) (In formula (12), R 22 is a hydrogen atom or a methyl group, R 23 is each independently a linear or branched alkylene group having 2 to 4 carbon atoms, and R 24 is a hydrogen atom or a carbon atom. It is an alkyl group of numbers 1 to 6, and e is an integer of 1 to 80.) It is a copolymer (D2) with a polymerizable monomer having an oxyalkylene group represented by:
- R 21 may be the same or different from each other.
- the divalent group having 1 to 8 carbon atoms represented by L 2 may contain at least one heteroatom selected from the group consisting of an oxygen atom and a nitrogen atom.
- the divalent group having 1 to 8 carbon atoms represented by L 3 may contain at least one heteroatom selected from the group consisting of an oxygen atom and a nitrogen atom.
- the fluorinated alkylene group having 1 to 3 carbon atoms represented by Rf 2 is specifically -CF 2 - (perfluoromethylene group), -CF 2 CF 2 - (perfluoromethylene group) (ethylene group), -CF 2 CF 2 CF 2 -, -CF 2 CF(CF 3 )-, and -CF(CF 3 )CF 2 -.
- the moiety represented by -(Rf 2 O) d Rf 2 - in formula (11) preferably contains a combination of a perfluoromethylene group and a perfluoroethylene group.
- the molar ratio of perfluoromethylene groups to perfluoroethylene groups is preferably from 1/10 to 10/1.
- d is preferably 3 to 100, more preferably 6 to 70.
- the fluorine-containing polymerizable monomer represented by formula (11) preferably has 18 to 200 fluorine atoms, more preferably 25 to 150 fluorine atoms. Including pcs.
- the fluorine-containing polymerizable monomer represented by formula (11) can be used alone or in combination of two or more types.
- the linear or branched alkylene group having 2 to 4 carbon atoms represented by R 23 includes an ethylene group, a propylene group, a tetramethylene group, and an isobutylene group.
- R 23 may be the same or different from each other.
- R 23 is preferably an ethylene group or a propylene group, and a plurality of the same groups are connected via adjacent oxygen atoms to form a polyoxyethylene chain, a polyoxypropylene chain, or a polyoxyethylene chain. It is more preferable to form a chain in which an ethylene chain and a polyoxypropylene chain are combined.
- the alkyl group having 1 to 6 carbon atoms represented by R 24 includes, for example, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, and an n-hexyl group. can be mentioned.
- e is preferably 3 to 50.
- the polymerizable monomer having an oxyalkylene group represented by formula (12) can be used alone or in combination of two or more types.
- Copolymer (D2) contains a fluorine-containing polymerizable monomer represented by formula (11), a polymerizable monomer having an oxyalkylene group represented by formula (12), and other polymerizable monomers. It may also be a copolymer with a monomer. Examples of other polymerizable monomers include those described for copolymer (D1).
- the copolymer (D2) can be obtained by the radical polymerization described for the copolymer (D1).
- the number average molecular weight (Mn) of the copolymer (D2) is preferably 500 to 20,000, more preferably 1,500 to 1,500, since it has good compatibility or miscibility with the resin component and provides excellent leveling properties.
- 10,000, and the weight average molecular weight (Mw) of the copolymer (D2) is preferably 2,000 to 100,000, more preferably 3,000 to 50,000.
- the fluorine atom content of the copolymer (D2) is preferably 2 to 40% by mass, more preferably 5 to 30% by mass, even more preferably It is 10 to 25% by mass.
- the fluorine atom content of the copolymer (D2) is a value calculated from the mass ratio of fluorine atoms based on the total mass of the polymerizable monomers used.
- fluorosurfactant (D) examples include Megafac (trademark) F-251, F-281, F-430, F-444, R-40, F-553, F-554, F-555. , F-556, F-557, F-558, F-559, F-562, and F-563 (product name, DIC Corporation), and Surflon (trademark) S-242, S-243, S-386 , S-420, and S-611 (trade name, AGC Seimi Chemical Co., Ltd.).
- the fluorosurfactant (D) is preferably Megafac (trademark) F-563, F-559, F-554, R-40, or F-562, more preferably Megafac (trademark) F- 563, F-554, or R-40.
- the content of the fluorosurfactant (D) in the positive photosensitive resin composition is preferably 0.01 parts by mass to 5 parts by mass, more preferably 0.01 parts by mass, based on a total of 100 parts by mass of the resin components. 0.03 parts by mass to 3 parts by mass, more preferably 0.05 parts by mass to 2 parts by mass. If the content of the fluorine-based surfactant (D) is 0.01 parts by mass or more based on the above-mentioned total of 100 parts by mass, the leveling properties of the positive-working photosensitive resin composition will be improved, so the positive-working photosensitive resin composition will be improved.
- the hydrophobic resin composition can be uniformly applied to the substrate, thereby promoting uneven distribution of the hydrophobic resin (A).
- the positive photosensitive resin composition can be cured without adversely affecting the cured film after post-baking. It is possible to improve leveling properties and promote uneven distribution of the hydrophobic resin (A).
- the positive photosensitive resin composition contains a cresol novolak resin. By adding the cresol novolac resin, it is possible to suppress surface roughness and generation of pores in the stepped portion.
- the positive photosensitive resin composition has a hydrophobic resin (A) which is an addition (co)polymer as a resin component and a novolak skeleton represented by formula (1).
- A hydrophobic resin
- B alkali-soluble resin
- phase separation occurs between the hydrophobic resin (A) and the alkali-soluble resin (B) inside the coating, and surface roughness and pores occur in the step portion.
- cresol novolak resin By adding the cresol novolak resin to this resin component, the compatibility between the hydrophobic resin (A) and the alkali-soluble resin (B) is improved, and phase separation within the coating is suppressed. As a result, surface roughness and generation of pores in the stepped portions are suppressed.
- the weight average molecular weight (Mw) of the cresol novolak resin is preferably 500 or more, more preferably 1000 or more, and still more preferably 1500 or more.
- the weight average molecular weight (Mw) of the cresol novolac resin is preferably 17,500 or less, more preferably 15,000 or less, still more preferably 12,500 or less. Any combination of these lower limit values and upper limit values may be used.
- the weight average molecular weight (Mw) of the cresol novolac resin is preferably 500 to 17,500, more preferably 1,000 to 15,000, and still more preferably 1,500 to 12,500.
- cresol novolak resin examples include TR4020G, TR4080G, and TR4000B (trade names, Asahi Yokuzai Co., Ltd.).
- the positive photosensitive resin composition contains 0.1% to 40% by weight of a cresol novolac resin, preferably 0.2% to 30% by weight, based on 100% by weight solid content. It preferably contains 0.3% by mass to 20% by mass. If the content of the cresol novolak resin is 0.1% by mass or more based on 100% by mass of solid content, the surface smoothness of the stepped portion can be sufficiently improved. If the content of the cresol novolac resin is 40% by mass or less based on 100% by mass of solid content, there will be no reduction in sensitivity and no influence on the solubility of the unexposed area.
- the positive photosensitive resin composition preferably contains cresol novolac resin in an amount of 0.5% by mass or more, more preferably 0.6% by mass or more, still more preferably 0.7% by mass or more, based on the total mass of the resin components.
- the positive photosensitive resin composition preferably contains a cresol novolak resin in an amount of 35% by mass or less, more preferably 30% by mass or less, still more preferably 25% by mass or less, based on the total mass of the resin components. Any combination of these lower limit values and upper limit values may be used.
- the positive photosensitive resin composition preferably contains a cresol novolac resin in an amount of 0.5% by mass to 35% by mass, more preferably 0.6% by mass to 30% by mass, even more preferably Contains 0.7% by mass to 25% by mass.
- the content of the cresol novolac resin is 0.5% by mass or more based on the total mass of the resin components, the surface smoothness of the stepped portion can be sufficiently improved. If the content of the cresol novolac resin is 35% by mass or less based on the total mass of the resin components, there will be no reduction in sensitivity and no influence on the solubility of the unexposed area.
- the positive photosensitive resin composition may further contain at least one colorant (E) selected from the group consisting of black dyes and black pigments.
- E colorant
- the positive photosensitive resin composition may further contain at least one colorant (E) selected from the group consisting of black dyes and black pigments.
- the carboxylic acid compound derived from the quinonediazide compound (C) has low diffusivity in the coating, it remains near the coating surface and contributes to promoting dissolution of the coating surface in the exposed area. Since the concentration of the hydrophobic resin (A) inside the coating is relatively low, the alkali solubility is relatively high. Therefore, even if radiation does not sufficiently penetrate into the inside of the film, by using the positive photosensitive resin composition of this embodiment, a thick film pattern with high sensitivity and precision can be formed.
- black dye examples include dyes defined by the color index (C.I.) of Solvent Black 27 to 47.
- the black dye is preferably Solvent Black 27, 29 or 34 C.I. I. It is specified by. Solvent Black 27-47 C.I. I.
- the light-shielding property of the film of the positive photosensitive resin composition after curing can be maintained.
- a positive photosensitive resin composition containing a black dye has less colorant residue during development than a positive photosensitive resin composition containing a black pigment, and can form a high-definition pattern.
- black pigments include carbon black, carbon nanotubes, acetylene black, graphite, iron black, aniline black, titanium black, perylene pigments, and lactam pigments. It is also possible to use surface-treated black pigments.
- examples of commercially available perylene pigments include BASF's K0084, K0086, Pigment Black 21, 30, 31, 32, 33, and 34.
- An example of a commercially available lactam pigment is IrgaphorTM Black S0100CF from BASF. Since it has high light-shielding properties, the black pigment is preferably at least one selected from the group consisting of carbon black, titanium black, perylene pigments, and lactam pigments.
- the content of the colorant (E) in the positive photosensitive resin composition is preferably 10 to 150 parts by mass, more preferably 15 to 100 parts by mass, based on a total of 100 parts by mass of the resin components. , more preferably 20 to 80 parts by mass. If the content of the colorant (E) is 10 parts by mass or more based on the above-mentioned total of 100 parts by mass, sufficient light-shielding properties can be obtained, and especially when the colorant (E) contains a black dye, curing The light-shielding properties of the subsequent coating can be maintained.
- the content of the colorant (E) is 150 parts by mass or less based on the above-mentioned total of 100 parts by mass, the residual film rate and sensitivity are appropriate, and especially when the colorant (E) contains a black dye, the coating can be imparted with high heat resistance.
- the positive photosensitive resin composition includes, as optional components, a dissolution promoter (F), a thermosetting agent, a second surfactant other than the fluorosurfactant (D), and a second colorant other than the colorant (E). etc. can be included.
- optional components are defined as those that do not apply to any of (A) to (E), cresol novolac resins, and copolymers having alkali-soluble functional groups.
- the positive photosensitive resin composition may further contain a dissolution promoter (F) for improving the solubility of the alkali-soluble portion in a developer during development.
- a dissolution promoter (F) for improving the solubility of the alkali-soluble portion in a developer during development.
- the solubility promoter (F) include organic low molecular compounds selected from the group consisting of compounds having a carboxy group and compounds having a phenolic hydroxyl group.
- the solubility promoter (F) can be used alone or in combination of two or more.
- a "low molecular compound” refers to a compound with a molecular weight of 1000 or less.
- the organic low-molecular compound has one or more carboxy groups or multiple phenolic hydroxyl groups and is alkali-soluble.
- organic low-molecular compounds include aliphatic monocarboxylic acids such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, pivalic acid, caproic acid, diethyl acetic acid, enanthic acid, and caprylic acid; oxalic acid, and malonic acid. acids, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, brassylic acid, methylmalonic acid, ethylmalonic acid, dimethylmalonic acid, methylsuccinic acid, tetramethylsuccinic acid, citraconic acid, etc.
- aliphatic monocarboxylic acids such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, pivalic acid, caproic acid, diethyl acetic acid, enanthic acid, and caprylic acid
- Aliphatic dicarboxylic acids such as aliphatic tricarboxylic acids such as tricarballylic acid, aconitic acid, and camphoronic acid; aromatic monocarboxylic acids such as benzoic acid, toluic acid, cumic acid, and mesitylenic acid; phthalic acid, isophthalic acid, terephthalic acid, and tricarboxylic acid; Aromatic polycarboxylic acids such as mellitic acid, trimesic acid, merophanic acid, pyromellitic acid, and hemimellitic acid; Aromatic hydroxycarboxylic acids such as dihydroxybenzoic acid, trihydroxybenzoic acid, and gallic acid; Phenyl acetic acid, hydroatropaic acid, and hydrosilicic acid Other carboxylic acids such as cinnamic acid, mandelic acid, phenylsuccinic acid, atropaic acid, cinnamic acid, methyl cinnamate, benzyl
- the content of the dissolution promoter (F) in the positive photosensitive resin composition can be 0.1 parts by mass to 50 parts by mass, preferably 1 part by mass, based on a total of 100 parts by mass of the resin components. parts to 35 parts by weight, more preferably 2 parts to 20 parts by weight. If the content of the dissolution promoter (F) is 0.1 part by mass or more based on the above total 100 parts by mass, it can effectively promote the dissolution of the resin component, and if it is 50 parts by mass or less. Excessive dissolution of the resin component can be suppressed, and the pattern formability and surface quality of the film can be improved.
- the positive photosensitive resin composition can be dissolved or dispersed in a solvent (G) and used as a coating composition in a solution or dispersion state.
- a solvent for example, in a solution obtained by dissolving a hydrophobic resin (A), an alkali-soluble resin (B), a cresol novolac resin, and optionally a copolymer having an alkali-soluble functional group in a solvent (G), By mixing the quinonediazide compound (C), the fluorine-based surfactant (D), and optional components such as a dissolution promoter (E), a thermosetting agent, and other surfactants as necessary, in a predetermined ratio, A coating composition containing a positive photosensitive resin composition can be prepared. The viscosity of the coating composition can be adjusted to suit the application method used by varying the amount of solvent (G).
- Examples of the solvent (G) include glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol dimethyl ether, ethylene glycol methyl ethyl ether, and ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as methyl cellosolve acetate and ethyl cellosolve acetate; diethylene glycol Diethylene glycol compounds such as monomethyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether; propylene glycol monoalkyl ether acetate compounds such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate; Aromatic hydrocarbons such as toluene and xylene; Ketones such as methyl ethyl ketone, methyl am
- the solid content concentration of the coating composition can be appropriately determined depending on the intended use.
- the solid content concentration of the coating composition may be 1 to 60% by weight, 3 to 50% by weight, or 5 to 40% by weight.
- dispersion mixing method when using pigments, known methods can be used.
- ball types such as ball mills, sand mills, bead mills, paint shakers, and rocking mills, blade types such as kneaders, paddle mixers, planetary mixers, and Henschel mixers, roll types such as three-roll mixers, and others such as Laikai machines, colloid mills, Ultrasonic waves, a homogenizer, a rotation/revolution mixer, etc.
- a bead mill From the viewpoint of dispersion efficiency and fine dispersion, it is preferable to use a bead mill.
- the prepared coating composition is usually filtered before use.
- filtration means include Millipore filters with a pore size of 0.05 to 1.0 ⁇ m.
- the coating composition prepared in this way also has excellent long-term storage stability.
- a coating composition is prepared by dissolving or dispersing the positive photosensitive resin composition in a solvent.
- the coating composition can be applied to the substrate surface, and the solvent can be removed by heating or other means to form a film.
- the method of applying the coating composition to the substrate surface is not particularly limited, and for example, a spray method, a roll coating method, a slit method, or a spin coating method can be used.
- the solvent is usually removed by heating to form a film (prebaking). Heating conditions vary depending on the type and blending ratio of each component, but the coating is usually obtained by heating at 70 to 130°C, for example, for 30 seconds to 20 minutes on a hot plate, or for 1 to 60 minutes in an oven. Can be done. In one embodiment, the thickness of the coating formed is 2-3 ⁇ m.
- the prebaked film is irradiated with radiation (for example, visible light, ultraviolet rays, far ultraviolet rays, X-rays, electron beams, gamma rays, or synchrotron radiation) through a photomask having a predetermined pattern (exposure step).
- radiation for example, visible light, ultraviolet rays, far ultraviolet rays, X-rays, electron beams, gamma rays, or synchrotron radiation
- Preferred radiation is ultraviolet to visible light having a wavelength of 250 to 450 nm.
- the radiation is i-line.
- the radiation is ghi radiation.
- developing solutions include inorganic alkali compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, and aqueous ammonia; primary amines such as ethylamine and n-propylamine; diethylamine and di- Secondary amines such as n-propylamine; Tertiary amines such as triethylamine and methyldiethylamine; Alcohol amines such as dimethylethanolamine and triethanolamine; Quaternary amines such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, and choline and alkaline compounds such as cyclic amines such as pyrrole, piperidine, 1,8-diazabicyclo[5.4.0]-7-undecene, 1,5-diazabic
- An aqueous solution of can be used.
- An aqueous solution obtained by adding an appropriate amount of a water-soluble organic solvent such as methanol or ethanol, a surfactant, etc. to an alkaline aqueous solution can also be used as the developer.
- the development time is usually 30 to 180 seconds.
- the developing method may be a piling method, a shower method, a dipping method, or the like. After development, a pattern can be formed on the film by washing with running water for 30 to 90 seconds, removing unnecessary parts, and air drying with compressed air or compressed nitrogen.
- a cured film can be obtained by heat-treating the patterned film at 100 to 350°C for 20 to 200 minutes using a heating device such as a hot plate or an oven (post-baking, heat treatment, etc.). process).
- a heating device such as a hot plate or an oven (post-baking, heat treatment, etc.). process).
- the temperature may be kept constant, the temperature may be raised continuously, or the temperature may be raised stepwise.
- the heat treatment is preferably performed under a nitrogen gas atmosphere.
- a positive photosensitive resin composition is applied so that the film thickness after prebaking is 3.0 ⁇ 0.3 ⁇ m, prebaked at 125°C for 120 seconds to form a film, and then heated to 23°C.
- Remaining film rate (%) Film thickness after development ( ⁇ m) / Film thickness before development ( ⁇ m)
- the residual film ratio defined by is 90% or more, preferably 95% or more, more preferably 99% or more.
- the residual film rate is an index of the solubility of the unexposed area, and the higher the residual film rate, the greater the difference in solubility between the exposed and unexposed areas, which makes it possible to form thick film patterns with large height differences with high precision. can.
- the optical density (OD value) of the cured film of the positive photosensitive resin composition may be 0.5 or more per 1 ⁇ m of film thickness. It is preferably 0.7 or more, more preferably 1.0 or more. If the OD value of the cured film is 0.5 or more per 1 ⁇ m of film thickness, sufficient light-shielding properties can be obtained.
- a method for manufacturing an organic EL device partition wall or an organic EL device insulating film includes preparing a coating composition by dissolving or dispersing a positive photosensitive resin composition in a solvent, and applying the coating composition to a base material. forming a film by removing the solvent contained in the film, drying the film by irradiating the dried film with radiation through a photomask, and applying the exposed film to a developer. Developing by contacting them to form a pattern on the film, and heating the patterned film at a temperature of 100° C. to 350° C. to form an organic EL device partition wall or an organic EL device insulating film. Including.
- the positive photosensitive resin composition of the present disclosure can form a thick film pattern with high sensitivity and precision even in an embodiment in which the positive photosensitive resin composition contains the colorant (E).
- Organic EL element partition wall containing a cured product of a positive photosensitive resin composition. It is preferable that the positive photosensitive resin composition contains a colorant (E).
- Organic EL element insulating film One embodiment is an organic EL element insulating film containing a cured product of a positive photosensitive resin composition. It is preferable that the positive photosensitive resin composition contains a colorant (E).
- Organic EL element One embodiment is an organic EL device including a cured product of a positive photosensitive resin composition. It is preferable that the positive photosensitive resin composition contains a colorant (E).
- the weight average molecular weight (Mw) and number average molecular weight (Mn) of the resin were calculated using a calibration curve created using a polystyrene standard material under the following measurement conditions.
- the two obtained solutions were simultaneously added dropwise over 2 hours to 61.2 g of 1-methoxy-2-propyl acetate (Daicel Corporation) heated to 85°C under a nitrogen gas atmosphere in a 300 mL three-necked flask. After that, the mixture was reacted at 85°C for 3 hours.
- the reaction solution cooled to room temperature was dropped into 815 g of toluene to precipitate a copolymer.
- the precipitated copolymer was collected by filtration and vacuum dried at 90°C for 4 hours to collect 33.4g of white powder.
- the number average molecular weight of the obtained PCX-01 was 6,600, and the weight average molecular weight was 11,600.
- PCX-02e Copolymer having an alkali-soluble functional group
- the two obtained solutions were simultaneously added dropwise over 2 hours to 61.2 g of 1-methoxy-2-propyl acetate (Daicel Corporation) heated to 85°C under a nitrogen gas atmosphere in a 300 mL three-necked flask. After that, the mixture was reacted at 85°C for 3 hours.
- the reaction solution cooled to room temperature was dropped into 815 g of toluene to precipitate a copolymer.
- the precipitated copolymer was collected by filtration and vacuum dried at 90°C for 4 hours to collect 32.4g of white powder.
- the number average molecular weight of the obtained PCX-02e was 3100, the weight average molecular weight was 6700, and the phenolic hydroxyl equivalent was 210.
- Hydrophobic resin (A) Production of resin with silicon-containing group (PCX-02e-TBDMS34) 4-hydroxyphenyl methacrylate (Showa Denko K.K. "PQMA") 15.9 g, 4-tert-butyl 16.6 g of dimethylsilyloxyphenyl methacrylate (PQMA-TBDMS) and 4.62 g of N-cyclohexylmaleimide (Tokyo Chemical Industry Co., Ltd.) were completely added to 55.8 g of isopropyl acetate (Shinko Organic Chemical Industry Co., Ltd.) as a solvent.
- PCX-02e-TBDMS34 4-hydroxyphenyl methacrylate
- PQMA-TBDMS 4-tert-butyl 16.6 g of dimethylsilyloxyphenyl methacrylate
- N-cyclohexylmaleimide Tokyo Chemical Industry Co., Ltd.
- PCX-02e-TBDMS34 white powder
- Hydrophobic resin (A) Production of resin with silicon-containing group (PCX-02e-TES34) 15.9 g of 4-hydroxyphenyl methacrylate (Showa Denko K.K. "PQMA"), 4-triethylsilyloxy 16.6 g of phenyl methacrylate (PQMA-TES) and 4.62 g of N-cyclohexylmaleimide (Tokyo Chemical Industry Co., Ltd.) were completely dissolved in 55.8 g of isopropyl acetate (Shinko Organic Chemical Industry Co., Ltd.) as a solvent. Ta.
- PCX-02e-TES34 silicon-containing group
- PQMA 4-hydroxyphenyl methacrylate
- PQMA-TES 4-triethylsilyloxy 16.6 g of phenyl methacrylate
- N-cyclohexylmaleimide Tokyo Chemical Industry Co., Ltd.
- V-601 dimethyl 2,2'-azobis(2-methylpropionate), Fuji Film Wako Pure Chemical Industries, Ltd.
- isopropyl acetate (Shinko Organic Chemical Industry Co., Ltd.); It was completely dissolved in 29g.
- the two obtained solutions were simultaneously added to 90.4 g of isopropyl acetate (Shinko Organic Chemical Industry Co., Ltd.) heated to 89°C under a nitrogen gas atmosphere in a 300 mL three-necked flask equipped with a reflux tube. The mixture was added dropwise over a period of time, and then reacted at 89° C. for 4 hours.
- PCX-02e-TES34 The number average molecular weight of the obtained PCX-02e-TES34 was 3,847, and the weight average molecular weight was 7,534.
- Hydrophobic resin (A) Production of resin with fluorine-containing group (PCX-02e-C6SFMA36) 4-hydroxyphenyl methacrylate (Showa Denko K.K. "PQMA") 12.1 g, 2-perfluorohexyl 20.5 g of ethyl methacrylate (Tokyo Kasei Kogyo Co., Ltd.) and 3.62 g of N-cyclohexylmaleimide (Tokyo Kasei Kogyo Co., Ltd.) were completely added to 84.5 g of isopropyl acetate (Shinko Organic Chemical Industry Co., Ltd.) as a solvent. Dissolved.
- PCX-02e-C6SFMA36 4-hydroxyphenyl methacrylate
- PQMA Showa Denko K.K.
- PCX-02e-C6SFMA36 The precipitated copolymer was collected by filtration and vacuum dried at 80°C for 5 hours to collect 5.58g of white powder (PCX-02e-C6SFMA36).
- the number average molecular weight of the obtained PCX-02e-C6SFMA36 was 2,869, and the weight average molecular weight was 5,743.
- the molar ratio of the structural unit derived from 2-perfluorohexylethyl methacrylate, the structural unit represented by formula (4), and the structural unit represented by formula (5) is 36:6:58. Based on all the structural units, the structural units having an alkali-soluble functional group were 58 mol%.
- the content of fluorine atoms was 24% by mass based on the mass of PCX-02e-C6SFMA36.
- Alkali-soluble resin (B) Production of resin having epoxy groups and phenolic hydroxyl groups (N695OH70) In a 300 mL three-necked flask, 75.2 g of ⁇ -butyrolactone (Mitsubishi Chemical Corporation) was added as a solvent, and 37.8 g of EPICLON (trademark) N-695 (DIC Corporation, cresol novolac type epoxy resin, epoxy equivalent: 214) was charged and dissolved at 60° C. under a nitrogen gas atmosphere.
- EPICLON trademark
- Alkali-soluble resin (B) N695OH70 of Production Example 6 was used as the alkali-soluble resin (B).
- TS-150A and TS-200A The structures of TS-150A and TS-200A are shown below.
- TS-150A an average of 1.5 out of 3 Rs per molecule has a quinonediazide structure.
- TS-200A out of 3 R's per molecule, 2.0 R's on average have a quinone diazide structure.
- Fluorine surfactant (D) As the fluorosurfactant (D), Megafac (trademark) F-554, Megafac (trademark) R-40, and Megafac (trademark) F-563 (all manufactured by DIC Corporation) were used.
- TR4080G weight average molecular weight (Mw): 4785
- TR4020G weight average molecular weight (Mw): 9920
- TR4000B weight average molecular weight (Mw): 3021) (all manufactured by Asahi Yokuzai Co., Ltd.) were used. used.
- Shownol (trademark) BRG-556 weight average molecular weight (Mw): 558 or less, manufactured by Showa Denko Co., Ltd.
- Showan (trademark) BRG-558 weight average molecular weight (Mw): 3000, Showa Denko Co., Ltd.) Denko Co., Ltd.
- BRN-5834Y weight average molecular weight (Mw): 7400, Showa Denko Co., Ltd.
- a positive photosensitive resin composition was bar coated on a glass substrate (size 100 mm x 100 mm x 1 mm) to a dry film thickness of 3.0 ⁇ 0.3 ⁇ m, and after vacuum drying at room temperature for 60 seconds, a hot plate with a lid was applied. Prebaking was performed on the plate by heating at 125° C. for 120 seconds. The film was exposed to light through a quartz photomask (having an aperture pattern of 10 ⁇ m in diameter) using an exposure device incorporating an ultra-high-pressure mercury lamp (trade name: Multilight ML-251A/B, manufactured by Ushio Inc.).
- the exposure amount was measured using an ultraviolet integrated light meter (trade name: UIT-150, light receiving unit UVD-S365, manufactured by Ushio Inc.). After exposure, alkaline development was performed for 60 seconds with a 2.38% by mass tetramethylammonium hydroxide aqueous solution at a temperature of 23° C. using a spin development device (AD-1200, Takizawa Sangyo Co., Ltd.). The above procedure was repeated while changing the exposure amount, and the minimum exposure amount (mJ/cm 2 ) that could form a pattern with a hole diameter of 10 ⁇ m that completely reached the glass substrate after development was defined as the sensitivity.
- the exposure amount was measured using an ultraviolet integrating light meter (trade name: UIT-150 light receiving unit UVD-S365, Ushio Inc.), and the exposure amount was adjusted to be 25% of the sensitivity of each formulation.
- development was performed for 80 seconds with a 2.38% by mass tetramethylammonium hydroxide aqueous solution at a temperature of 23° C. using a spin development device (AD-1200, Takizawa Sangyo Co., Ltd.). Thereafter, post-baking was performed in an inert oven at 250° C. for 60 minutes in a nitrogen gas atmosphere to obtain a measurement sample.
- the arithmetic mean roughness Ra of the surface of the obtained sample was measured using a laser microscope (VK-X200, Keyence Corporation) at a magnification of 50 times and a measurement pitch of 0.02 ⁇ m, which was defined as an intermediate exposed area Ra. Regarding the evaluation of the roughness of the intermediate exposed area, Ra of less than 0.06 was considered to be a pass, and an Ra of 0.06 or more was judged to be a fail.
- a positive photosensitive resin composition was bar coated on a glass substrate (size 100 mm x 100 mm x 1 mm) to a dry film thickness of 3.0 ⁇ 0.3 ⁇ m, and after vacuum drying at room temperature for 60 seconds, a hot plate with a lid was applied. Prebaking was performed on the plate by heating at 125° C. for 120 seconds. The dried film was exposed through a bandpass filter for mercury exposure (product name HB0365, Asahi Spectroscopy Co., Ltd.) using an exposure device incorporating an ultra-high pressure mercury lamp (product name Multilight ML-251A/B, Ushio Inc.). did.
- the exposure amount was measured using an ultraviolet integrating light meter (trade name: UIT-150 light receiving unit UVD-S365, Ushio Inc.), and the exposure amount was adjusted to be 25% of the sensitivity of each formulation.
- development was performed for 80 seconds with a 2.38% by mass tetramethylammonium hydroxide aqueous solution at a temperature of 23° C. using a spin development device (AD-1200, Takizawa Sangyo Co., Ltd.). Thereafter, post-baking was performed in an inert oven at 250° C. for 60 minutes in a nitrogen gas atmosphere to obtain a measurement sample.
- a positive photosensitive resin composition was bar coated on a glass substrate (size 100 mm x 100 mm x 1 mm) to a dry film thickness of 3.0 ⁇ 0.3 ⁇ m, and after vacuum drying at room temperature for 60 seconds, a hot plate with a lid was applied. Prebaking was performed on the plate by heating at 125° C. for 120 seconds. After measuring the dry film thickness using an optical film thickness measuring device (F20-NIR, Filmetrics Co., Ltd.), it was subjected to 2. Alkaline development was performed for 60 seconds using a 38% by mass aqueous tetramethylammonium hydroxide solution.
- the film thickness after alkaline development was measured again using an optical film thickness measuring device (F20-NIR, Filmetrics Co., Ltd.), and the film thickness ( ⁇ m) dissolved before and after development was used as an index of the solubility of the unexposed area. .
- [OD value of cured film] A positive photosensitive resin composition was spin-coated on a glass substrate (size 100 mm x 100 mm x 1 mm) to a dry film thickness of approximately 1.5 ⁇ m, and prebaked by heating at 125° C. for 120 seconds on a hot plate. Ta. Thereafter, a film was obtained by curing at 250° C. for 60 minutes in a nitrogen gas atmosphere. The OD value of the film after curing was measured with a transmission densitometer (BMT-1, Sakata Inx Engineering Co., Ltd.), corrected using the OD value of the glass alone, and converted into an OD value per 1 ⁇ m of film thickness. The thickness of the film was measured using an optical film thickness measuring device (F20-NIR, Filmetrics Co., Ltd.).
- the positive photosensitive resin compositions of Examples 1 to 14 have solubility in the unexposed area of 0 ⁇ m, so they can increase the contrast between the exposed area and the unexposed area. Furthermore, since surface roughness in the intermediate exposed area was small and no pores were observed, it was determined that a thick film pattern having a step structure could be formed with high precision. Furthermore, it was confirmed that the exposure amount required to form a pattern with a hole diameter of 10 ⁇ m after development was 300 mJ/cm 2 or less, indicating high sensitivity.
- the positive photosensitive resin composition according to the present disclosure can be suitably used in radiation lithography for forming partition walls or insulating films of organic EL elements.
- an organic EL element having partition walls or an insulating film formed from a positive photosensitive resin composition according to an embodiment containing a colorant (E) is suitably used as an electronic component of a display device that exhibits good contrast. Ru.
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Abstract
Description
[1]
付加(共)重合体である疎水性樹脂(A)と、
式(1)で表される構造単位を有するアルカリ可溶性樹脂(B)と、
キノンジアジド化合物(C)と、
フッ素系界面活性剤(D)と、
クレゾールノボラック樹脂と
を含むポジ型感光性樹脂組成物。
[2]
前記式(1)中、前記アルカリ可溶性官能基がフェノール性水酸基である、[1]に記載のポジ型感光性樹脂組成物。
[3]
前記アルカリ可溶性樹脂(B)が、式(2)で表される構造単位を更に有する、[1]又は[2]に記載のポジ型感光性樹脂組成物。
[4]
前記式(2)中、R4がエポキシ基を有する有機基である、[3]に記載のポジ型感光性樹脂組成物。
[5]
前記アルカリ可溶性樹脂(B)が、前記アルカリ可溶性樹脂(B)の全構造単位を基準として、前記式(1)で表される構造単位と前記式(2)で表される構造単位を合計で30mol%~100mol%の量で含む、[3]又は[4]に記載のポジ型感光性樹脂組成物。
[6]
前記クレゾールノボラック樹脂の重量平均分子量(Mw)が500~17500である、[1]~[5]のいずれかに記載のポジ型感光性樹脂組成物。
[7]
前記クレゾールノボラック樹脂を、樹脂成分の合計質量を基準として0.5質量%~35質量%含む、[1]~[6]のいずれかに記載のポジ型感光性樹脂組成物。
[8]
前記疎水性樹脂(A)が、ケイ素含有基及びフッ素含有基からなる群より選ばれる少なくとも1つを有する樹脂である、[1]~[7]のいずれかに記載のポジ型感光性樹脂組成物。
[9]
前記疎水性樹脂(A)が、式(3)
で表される構造単位を有し、sが1以上の整数である式(3)で表される構造単位を少なくとも1つ有する、[8]に記載のポジ型感光性樹脂組成物。
[10]
前記疎水性樹脂(A)が、式(4)
で表される構造単位を更に有する、[9]に記載のポジ型感光性樹脂組成物。
[11]
前記フッ素系界面活性剤(D)が、フッ素化アルキル基及びフッ素化アルキレン基からなる群より選ばれる少なくとも1つのフッ素化炭化水素基を有するアクリル系共重合体を含む、[1]~[10]のいずれかに記載のポジ型感光性樹脂組成物。
[12]
アルカリ可溶性官能基を有する重合性単量体とその他の重合性単量体との共重合体であって、前記式(1)で表される構造単位を有しないアルカリ可溶性樹脂を更に含む、[1]~[11]のいずれかに記載のポジ型感光性樹脂組成物。
[13]
黒色染料及び黒色顔料からなる群より選ばれる少なくとも1種の着色剤(E)を更に含む、[1]~[12]のいずれかに記載のポジ型感光性樹脂組成物。
[14]
前記着色剤(E)を、樹脂成分の合計100質量部を基準として10質量部~150質量部含む、[13]に記載のポジ型感光性樹脂組成物。
[15]
前記ポジ型感光性樹脂組成物の硬化被膜の光学濃度(OD値)が膜厚1μmあたり0.5以上である、[13]又は[14]に記載のポジ型感光性樹脂組成物。
[16]
[1]~[15]のいずれかに記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子隔壁。
[17]
[1]~[15]のいずれかに記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子絶縁膜。
[18]
[1]~[15]のいずれかに記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子。
フェノール性水酸基当量=
(原料のエポキシ当量+付加させるカルボン酸の分子量)/(カルボン酸のフェノール性水酸基数)
によって算出される値を意味する。
一実施態様のポジ型感光性樹脂組成物は、付加(共)重合体である疎水性樹脂(A)と、式(1)で表される構造単位を有するアルカリ可溶性樹脂(B)と、キノンジアジド化合物(C)と、フッ素系界面活性剤(D)と、クレゾールノボラック樹脂とを含む。
付加(共)重合体である疎水性樹脂(A)(単に疎水性樹脂(A)ともいう)は、フッ素系界面活性剤(D)によって被膜表面へのその偏在化が促進され、ポジ型感光性樹脂組成物の被膜表面をアルカリ水溶液に対して難溶化する樹脂である。いかなる理論に拘束される訳ではないが、疎水性樹脂(A)は、ポジ型感光性樹脂組成物の被膜の形成過程で、被膜表面に移動するフッ素系界面活性剤(D)に随伴して被膜表面に向かって移動しやすい。そのため、被膜形成後に、疎水性樹脂(A)は、被膜内部と比べて被膜表面により高濃度で存在し、被膜表面のアルカリ溶解性を低下させる。現像時には、疎水性樹脂(A)は、アルカリ低溶解性の樹脂成分として未露光部の被膜表面の溶解を抑制しつつ、露光部ではキノンジアジド化合物(C)由来のカルボン酸化合物、アルカリ可溶性の高い他の樹脂成分、及び任意の溶解促進剤の溶解に伴い、被膜から現像液中に放出される。露光部において被膜表面が一旦溶解すると、疎水性樹脂(A)の濃度が相対的に低いために被膜表面に比べアルカリ溶解性の高い被膜内部の溶解は速やかに進行する。これにより、露光部と未露光部のコントラストを増加させることができ、その結果、ポジ型感光性樹脂組成物の厚膜におけるパターン形成性を高めることができる。
アルカリ可溶性樹脂(B)は、式(1)で表される構造単位を有する。
式(2)において、yは0又は1が好ましい。R3はメチル基が好ましい。R4は、アルキル基、アルケニル基、アルキニル基、アリール基、アルキレン基、アルケニレン基、アルキニレン基、エステル基、エーテル基、カルボニル基、アリーレン基、アミノ基、イミノ基、イミド基、アミド基、複素環基、スルホニル基、又はこれらのうちの2つ以上を組み合わせた基を含む有機基であることが好ましい。R4の有機基は、1価基であっても多価基であってもよく、多価基の場合はアルカリ可溶性樹脂(B)の他の部分と結合して架橋構造が形成されていることを意味する。R4の炭素原子数は、例えば、1~30、好ましくは1~20、より好ましくは2~10である。式(2)において、R4は、好ましくは複素環基を有する有機基であり、より好ましくはエポキシ基を有する有機基である。より具体的には、R4は、-CH2-Y(Yはエポキシ基を表す。)で表される有機基(グリシジル基)であることが好ましい。
一実施態様では、ポジ型感光性樹脂組成物は、アルカリ可溶性官能基を有する重合性単量体とその他の重合性単量体との共重合体であって、式(1)で表される構造単位を有しないアルカリ可溶性樹脂(単に「アルカリ可溶性官能基を有する共重合体」ともいう。)を更に含んでもよい。
キノンジアジド化合物(C)は、可視光、紫外光、γ線、電子線等の放射線が照射されると下記反応式2に示す反応を経てアルカリ可溶性のカルボン酸化合物を生成する。キノンジアジド化合物(C)は、感光前にはアルカリ可溶性樹脂(B)、及びクレゾールノボラック樹脂、並びに任意選択的に含まれるアルカリ可溶性官能基を有する共重合体、のアルカリ可溶性官能基、例えばフェノール性水酸基と相互作用(例えば水素結合形成)して、それらの樹脂をアルカリ水溶液に対して不溶化させる。その一方で、放射線が照射された部分にアルカリ可溶性のカルボン酸化合物が存在することで、その部分にある樹脂がカルボン酸化合物と一緒にアルカリ水溶液に溶解し易くなる。更に、カルボン酸化合物は、化学増幅レジストに一般に使用される光酸発生剤から生じる酸、例えばp-トルエンスルホン酸、1-プロパンスルホン酸などよりも分子構造が相対的に大きく、被膜中で拡散しにくい。これらが相乗的に作用する結果、未露光部と露光部のアルカリ溶解性の差を大きくすることができ、それにより低露光量でも高感度で高解像度のパターンを形成することができる。キノンジアジド化合物(C)は、単独で、又は2種類以上を組み合わせて使用することができる。ポジ型感光性樹脂組成物は、化学増幅レジストに一般に使用される光酸発生剤を実質的に含まないことが好ましく、当該光酸発生剤を含まずに感光剤としてキノンジアジド化合物(C)のみを含むことがより好ましい。「光酸発生剤を実質的に含まない」とは、ポジ型感光性樹脂組成物に含まれる上記光酸発生剤の量が、樹脂成分の合計100質量部を基準として、0.2質量部以下、0.1質量部以下、又は0.05質量部以下であることを意味する。
フッ素系界面活性剤(D)は特に限定されないが、フッ素化アルキル基及びフッ素化アルキレン基からなる群より選ばれる少なくとも1つのフッ素化炭化水素基と親水性基とを有する界面活性剤を使用することができる。そのようなフッ素系界面活性剤(D)としては、例えば、パーフルオロアルキルスルホン酸、部分フッ素化アルキルスルホン酸、パーフルオロアルキルカルボン酸、部分フッ素化アルキルカルボン酸、パーフルオロアルキルリン酸エステル、部分フッ素化アルキルリン酸エステル、パーフルオロアルキルトリメチルアンモニウム塩、部分フッ素化アルキルトリメチルアンモニウム塩、パーフルオロアルキルベタイン、部分フッ素化アルキルベタイン、パーフルオロアルキルEO付加物、及びフッ素テロマーアルコールが挙げられる。フッ素系界面活性剤(D)としては、パーフルオロアルキル基、部分フッ素化アルキル基、パーフルオロアルキレン基又は部分フッ素化アルキレン基と、スルホ基、カルボキシ基、リン酸基、アンモニウム基、オキシアルキレン基、ポリオキシアルキレン基等の親水性基とを分子内に有する単独重合体又は共重合体も使用することができる。フッ素系界面活性剤(D)は、単独で、又は2種類以上を組み合わせて使用することができる。
で表される含フッ素重合性単量体と、式(9)
で表されるポリオキシアルキレン基を有する重合性単量体との共重合体(D1)である。
で表される重合性単量体が挙げられる。
で表される含フッ素重合性単量体と、式(12)
で表されるオキシアルキレン基を有する重合性単量体との共重合体(D2)である。
ポジ型感光性樹脂組成物は、クレゾールノボラック樹脂を含む。クレゾールノボラック樹脂を添加することにより、段差部分における表面荒れ及び細孔の発生を抑制することができる。いかなる理論に拘束される訳ではないが、ポジ型感光性樹脂組成物において、樹脂成分として付加(共)重合体である疎水性樹脂(A)と式(1)で表されるノボラック骨格を有するアルカリ可溶性樹脂(B)とを用いた場合、被膜内部において疎水性樹脂(A)とアルカリ可溶性樹脂(B)との間で相分離が起き、段差部分において表面荒れ及び細孔が発生する。この樹脂成分にクレゾールノボラック樹脂を添加することにより、疎水性樹脂(A)とアルカリ可溶性樹脂(B)の相溶性が向上し、被膜内部での相分離が抑制される。その結果、段差部分における表面荒れ及び細孔の発生が抑制される。
ポジ型感光性樹脂組成物は、黒色染料及び黒色顔料からなる群より選ばれる少なくとも1種の着色剤(E)を更に含んでもよい。着色剤(E)を含む感光性樹脂組成物を用いて有機EL素子に黒色の隔壁を形成することにより、有機ELディスプレイ等の表示装置の視認性を向上させることができる。この実施態様では、着色剤(E)が存在するために露光時の放射線の透過量が被膜の表面から内部にかけて急激に低下する。そのため、キノンジアジド化合物(C)由来のカルボン酸化合物は、被膜表面の近傍では比較的多く発生するが、被膜内部では発生しにくい。キノンジアジド化合物(C)由来のカルボン酸化合物は被膜中での拡散性が低いため、被膜表面の近傍に留まって露光部の被膜表面の溶解促進に寄与する。被膜内部は疎水性樹脂(A)の濃度が相対的に低いためにアルカリ可溶性が相対的に高い。そのため、被膜内部まで十分に放射線が透過しない場合であっても、この実施態様のポジ型感光性樹脂組成物を用いることにより、高感度で高精度の厚膜パターンを形成することができる。
ポジ型感光性樹脂組成物は任意成分として、溶解促進剤(F)、熱硬化剤、フッ素系界面活性剤(D)以外の第2界面活性剤、着色剤(E)以外の第2着色剤等を含むことができる。本開示において、任意成分は(A)~(E)、クレゾールノボラック樹脂、及びアルカリ可溶性官能基を有する共重合体のいずれにも当てはまらないものと定義する。
ポジ型感光性樹脂組成物は、現像時にアルカリ可溶性部分の現像液への溶解性を向上させるための溶解促進剤(F)を更に含んでもよい。溶解促進剤(F)として、カルボキシ基を有する化合物及びフェノール性水酸基を有する化合物からなる群より選択される有機低分子化合物が挙げられる。溶解促進剤(F)は、単独で、又は2種類以上を組み合わせて使用することができる。
〈溶媒(G)〉
ポジ型感光性樹脂組成物は、溶媒(G)に溶解又は分散させて溶液状態又は分散液状態のコーティング組成物として用いることができる。例えば、疎水性樹脂(A)、アルカリ可溶性樹脂(B)、及びクレゾールノボラック樹脂、並びに必要に応じてアルカリ可溶性官能基を有する共重合体を溶媒(G)に溶解して得られた溶液に、キノンジアジド化合物(C)、及びフッ素系界面活性剤(D)、並びに必要に応じて溶解促進剤(E)、熱硬化剤、その他界面活性剤等の任意成分を所定の割合で混合することにより、ポジ型感光性樹脂組成物を含むコーティング組成物を調製することができる。コーティング組成物は、溶媒(G)の量を変化させることにより、使用する塗布方法に適した粘度に調整することができる。
ポジ型感光性樹脂組成物を放射線リソグラフィーに使用する場合、まず、ポジ型感光性樹脂組成物を溶媒に溶解又は分散してコーティング組成物を調製する。次に、コーティング組成物を基板表面に塗布し、加熱等の手段により溶媒を除去して、被膜を形成することができる。基板表面へのコーティング組成物の塗布方法は特に限定されず、例えば、スプレー法、ロールコート法、スリット法、又はスピンコート法を使用することができる。
一実施態様では、ポジ型感光性樹脂組成物をプリベーク後の膜厚が3.0±0.3μmになるように塗布し、125℃で120秒プリベークして被膜を形成した後、温度23℃にて2.38質量%テトラメチルアンモニウムヒドロキシド水溶液で60秒間アルカリ現像したときに、下式:
残膜率(%)=現像後の膜厚(μm)/現像前の膜厚(μm)
で定義される残膜率が90%以上、好ましくは95%以上、より好ましくは99%以上である。残膜率は未露光部の溶解性の指標であり、残膜率が高いほど露光部と未露光部の溶解性の差が大きく、高低差の大きい厚膜パターンを高精度で形成することができる。
ポジ型感光性樹脂組成物が着色剤(E)を含む実施態様において、ポジ型感光性樹脂組成物の硬化被膜の光学濃度(OD値)は、膜厚1μmあたり0.5以上であることが好ましく、0.7以上であることがより好ましく、1.0以上であることが更に好ましい。硬化被膜のOD値が膜厚1μmあたり0.5以上であれば、十分な遮光性を得ることができる。
一実施態様は、ポジ型感光性樹脂組成物の硬化物を含む有機EL素子隔壁である。ポジ型感光性樹脂組成物は着色剤(E)を含むことが好ましい。
一実施態様は、ポジ型感光性樹脂組成物の硬化物を含む有機EL素子絶縁膜である。ポジ型感光性樹脂組成物は着色剤(E)を含むことが好ましい。
一実施態様は、ポジ型感光性樹脂組成物の硬化物を含む有機EL素子である。ポジ型感光性樹脂組成物は着色剤(E)を含むことが好ましい。
実施例及び比較例で使用した原料を以下のとおり製造又は入手した。
装置名:Shodex(商標)GPC-101
カラム:Shodex(商標)LF-804
移動相:テトラヒドロフラン
流速:1.0mL/分
検出器:Shodex(商標)RI-71
温度:40℃
4-ヒドロキシフェニルメタクリレート(昭和電工株式会社「PQMA」)28.0g、及びN-シクロヘキシルマレイミド(株式会社日本触媒)7.89gを、溶媒である1-メトキシ-2-プロピルアセテート(株式会社ダイセル)77.1gに、重合開始剤としてV-601(ジメチル2,2’-アゾビス(2-メチルプロピオネート)、富士フイルム和光純薬株式会社)3.66gを、1-メトキシ-2-プロピルアセテート(株式会社ダイセル)14.6gにそれぞれ完全に溶解させた。得られた2つの溶液を、300mLの3つ口型フラスコ中、窒素ガス雰囲気下で85℃に加熱した1-メトキシ-2-プロピルアセテート(株式会社ダイセル)61.2gに同時に2時間かけて滴下し、その後85℃で3時間反応させた。室温まで冷却した反応溶液を815gのトルエン中に滴下し、共重合体を沈殿させた。沈殿した共重合体をろ過により回収し、90℃で4時間真空乾燥し白色の粉体を33.4g回収した。得られたPCX-01の数平均分子量は6600、重量平均分子量は11600であった。
4-ヒドロキシフェニルメタクリレート(昭和電工株式会社「PQMA」)25.5g、及びN-シクロヘキシルマレイミド(株式会社日本触媒)4.50gを、溶媒である1-メトキシ-2-プロピルアセテート(株式会社ダイセル)77.1gに、重合開始剤としてV-601(ジメチル2,2’-アゾビス(2-メチルプロピオネート)、富士フイルム和光純薬株式会社)3.66gを、1-メトキシ-2-プロピルアセテート(株式会社ダイセル)14.6gにそれぞれ完全に溶解させた。得られた2つの溶液を、300mLの3つ口型フラスコ中、窒素ガス雰囲気下で85℃に加熱した1-メトキシ-2-プロピルアセテート(株式会社ダイセル)61.2gに同時に2時間かけて滴下し、その後85℃で3時間反応させた。室温まで冷却した反応溶液を815gのトルエン中に滴下し、共重合体を沈殿させた。沈殿した共重合体をろ過により回収し、90℃で4時間真空乾燥し白色の粉体を32.4g回収した。得られたPCX-02eの数平均分子量は3100、重量平均分子量は6700、フェノール性水酸基当量は210であった。
4-ヒドロキシフェニルメタクリレート(昭和電工株式会社「PQMA」)15.9g、4-tert-ブチルジメチルシリルオキシフェニルメタクリレート(PQMA-TBDMS)16.6g、及びN-シクロヘキシルマレイミド(東京化成工業株式会社)4.62gを、溶媒であるイソプロピルアセテート(神港有機化学工業株式会社)55.8gに完全に溶解させた。重合開始剤としてV-601(ジメチル2,2’-アゾビス(2-メチルプロピオネート)、富士フイルム和光純薬株式会社)2.86gを、イソプロピルアセテート(神港有機化学工業株式会社)4.29gに完全に溶解させた。得られた2つの溶液を、還流管が付いた300mLの3つ口型フラスコ中、窒素ガス雰囲気下で89℃に加熱したイソプロピルアセテート(神港有機化学工業株式会社)90.5gに、同時に2時間かけて滴下し、その後、89℃で4時間反応させた。室温まで冷却した反応溶液50gを、250gのヘキサンに滴下し、共重合体を沈殿させた。沈殿した共重合体をろ過により回収し、80℃で5時間真空乾燥し、白色の粉体(PCX-02e-TBDMS34)を9.73g回収した。得られたPCX-02e-TBDMS34の数平均分子量は3753、重量平均分子量は7581であった。PCX-02e-TBDMS34において、sが1以上の整数である式(3)で表される構造単位と式(4)で表される構造単位と式(5)で表される構造単位のモル比は、式(3):式(4):式(5)=32:7:61であり、全構造単位を基準として、アルカリ可溶性官能基を有する構造単位は61mol%であった。ケイ素原子の含有量は、PCX-02e-TBDMS34の質量を基準として、4.0質量%であった。
4-ヒドロキシフェニルメタクリレート(昭和電工株式会社「PQMA」)15.9g、4-トリエチルシリルオキシフェニルメタクリレート(PQMA-TES)16.6g、及びN-シクロヘキシルマレイミド(東京化成工業株式会社)4.62gを、溶媒であるイソプロピルアセテート(神港有機化学工業株式会社)55.8gに完全に溶解させた。重合開始剤としてV-601(ジメチル2,2’-アゾビス(2-メチルプロピオネート)、富士フイルム和光純薬株式会社)2.86gを、イソプロピルアセテート(神港有機化学工業株式会社)4.29gに完全に溶解させた。得られた2つの溶液を、還流管が付いた300mLの3つ口型フラスコ中、窒素ガス雰囲気下で89℃に加熱したイソプロピルアセテート(神港有機化学工業株式会社)90.4gに、同時に2時間かけて滴下し、その後、89℃で4時間反応させた。室温まで冷却した反応溶液50gを、200gのヘキサンと50gのトルエンの混合溶媒に滴下し、共重合体を沈殿させた。沈殿した共重合体をろ過により回収し、80℃で5時間真空乾燥し、白色の粉体(PCX-02e-TES34)を9.49g回収した。得られたPCX-02e-TES34の数平均分子量は3847、重量平均分子量は7534であった。PCX-02e-TES34において、sが1以上の整数である式(3)で表される構造単位と式(4)で表される構造単位と式(5)で表される構造単位のモル比は、式(3):式(4):式(5)=32:7:61であり、全構造単位を基準として、アルカリ可溶性官能基を有する構造単位は61mol%であった。ケイ素原子の含有量は、PCX-02e-TES34の質量を基準として、4.0質量%であった。
4-ヒドロキシフェニルメタクリレート(昭和電工株式会社「PQMA」)12.1g、2-パーフルオロヘキシルエチルメタクリレート(東京化成工業株式会社)20.5g、及びN-シクロヘキシルマレイミド(東京化成工業株式会社)3.62gを、溶媒であるイソプロピルアセテート(神港有機化学工業株式会社)84.5gに完全に溶解させた。重合開始剤としてV-601(ジメチル2,2’-アゾビス(2-メチルプロピオネート)、富士フイルム和光純薬株式会社)3.74gを、イソプロピルアセテート(神港有機化学工業株式会社)14.9gに完全に溶解させた。得られた2つの溶液を、還流管が付いた300mLの3つ口型フラスコ中、窒素ガス雰囲気下で89℃に加熱したイソプロピルアセテート(神港有機化学工業株式会社)51.0gに、同時に2時間かけて滴下し、その後、89℃で4時間反応させた。室温まで冷却した反応溶液50gを、250gのヘキサンに滴下し、共重合体を沈殿させた。沈殿した共重合体をろ過により回収し、80℃で5時間真空乾燥し、白色の粉体(PCX-02e-C6SFMA36)を5.58g回収した。得られたPCX-02e-C6SFMA36の数平均分子量は2869、重量平均分子量は5743であった。PCX-02e-C6SFMA36において、2-パーフルオロヘキシルエチルメタクリレートに由来する構造単位と式(4)で表される構造単位と式(5)で表される構造単位のモル比は36:6:58であり、全構造単位を基準として、アルカリ可溶性官能基を有する構造単位は58mol%であった。フッ素原子の含有量は、PCX-02e-C6SFMA36の質量を基準として、24質量%であった。
300mLの3つ口型フラスコに溶媒としてγ-ブチロラクトン(三菱ケミカル株式会社)75.2g、及びEPICLON(商標)N-695(DIC株式会社、クレゾールノボラック型エポキシ樹脂、エポキシ当量214)37.8gを仕込み、窒素ガス雰囲気下、60℃で溶解させた。そこへヒドロキシ安息香酸化合物として3,5-ジヒドロキシ安息香酸(富士フイルム和光純薬株式会社)20.1g(エポキシ1当量に対して0.65当量)、及び反応触媒としてトリフェニルホスフィン(東京化成工業株式会社)0.166g(0.660mmol)を追加し、110℃で21時間反応させた。反応溶液を室温に戻し、γ-ブチロラクトンで固形分20質量%に希釈し、溶液をろ過して274.2gのエポキシ基及びフェノール性水酸基を有する樹脂(N695OH70)の溶液を得た。得られた反応物の数平均分子量は3000、重量平均分子量は5100、エポキシ当量は2200、フェノール性水酸基当量は161であった。
疎水性樹脂(A)として、製造例3のPCX-02e-TBDMS34、及び製造例4のPCX-02e-TES34(ケイ素含有基を有する樹脂)、並びに製造例5のPCX-02e-C6SFMA36(フッ素含有基を有する樹脂)を使用した。
アルカリ可溶性樹脂(B)として、製造例6のN695OH70を使用した。
キノンジアジド化合物(C)として、TS-150A及びTS-200A(4,4’-[1-[4-[1-(4-ヒドロキシフェニル)-1-メチルエチル]フェニル]エチリデン]ビスフェノール(TrisP-PA)と6-ジアゾ-5,6-ジヒドロ-5-オキソナフタレン-1-スルホン酸(1,2-ナフトキノンジアジド-5-スルホン酸)とのエステル、東洋合成工業株式会社);TPPA(4)-150DF(4,4’-[1-[4-[1-(4-ヒドロキシフェニル)-1-メチルエチル]フェニル]エチリデン]ビスフェノール(TrisP-PA)の1,2-ナフトキノンジアジド-4-スルホン酸エステル、東洋合成工業株式会社);並びにTHDPP-280(2-(4-ヒドロキシフェニル)-2-(2’,4’-ジヒドロキシフェニル)プロパンの1,2-ナフトキノンジアジド-5-スルホン酸エステル、東洋合成工業株式会社)を使用した。
フッ素系界面活性剤(D)として、メガファック(商標)F-554、メガファック(商標)R-40、及びメガファック(商標)F-563(全てDIC株式会社)を使用した。
クレゾールノボラック樹脂として、TR4080G(重量平均分子量(Mw):4785)、TR4020G(重量平均分子量(Mw):9920)、及びTR4000B(重量平均分子量(Mw):3021)(全て旭有機材株式会社)を使用した。
アルカリ可溶性官能基を有する重合性単量体とその他の重合性単量体の共重合体として、製造例1のPCX-01、及び製造例2のPCX-02eを使用した。
着色剤として、黒色染料であるVALIFAST(商標)BLACK 3820(ソルベントブラック27のC.I.で規定される黒色染料、オリエント化学工業株式会社)、及びVALIFAST(商標)BLACK 3804(ソルベントブラック34のC.I.で規定される黒色染料、オリエント化学工業株式会社)を使用した。
溶解促進剤(F)としてフロログルシノールを使用した。
溶媒(G)としてγ-ブチロラクトン(GBL)及びプロピレングリコールモノメチルエーテルアセテート(PGMEA)の混合溶媒(GBL:PGMEA=40:60(質量比))を使用した。
実施例及び比較例で使用した評価方法は以下のとおりである。
ガラス基板(大きさ100mm×100mm×1mm)にポジ型感光性樹脂組成物を乾燥膜厚が3.0±0.3μmになるようにバーコートし、常温真空乾燥60秒間の後、蓋つきホットプレート上125℃で120秒加熱してプリベークを行った。超高圧水銀ランプを組み込んだ露光装置(商品名マルチライトML-251A/B、ウシオ電機株式会社)で石英製のフォトマスク(φ10μmの開口パターンを有するもの)を介して被膜を露光した。露光量は紫外線積算光量計(商品名UIT-150 受光部 UVD-S365、ウシオ電機株式会社)を用いて測定した。露光後、スピン現像装置(AD-1200、滝沢産業株式会社)を用い、温度23℃にて2.38質量%テトラメチルアンモニウムヒドロキシド水溶液で60秒間アルカリ現像を行なった。露光量を変えながら上記手順を繰り返して、現像後にガラス基板に完全に達するホール径10μmのパターンが形成できる最小露光量(mJ/cm2)を感度とした。
ガラス基板(大きさ100mm×100mm×1mm)にポジ型感光性樹脂組成物を乾燥膜厚が3.0±0.3μmになるようにバーコートし、常温真空乾燥60秒間の後、蓋つきホットプレート上125℃で120秒加熱してプリベークを行った。乾燥被膜を、超高圧水銀ランプを組み込んだ露光装置(商品名マルチライトML-251A/B、ウシオ電機株式会社)で水銀露光用バンドパスフィルター(商品名HB0365、朝日分光株式会社)を介して露光した。露光量を紫外線積算光量計(商品名UIT-150 受光部 UVD-S365、ウシオ電機株式会社)を用いて測定し、露光量が各配合の感度の25%となるように調整した。露光後、スピン現像装置(AD-1200、滝沢産業株式会社)を用い、温度23℃にて2.38質量%テトラメチルアンモニウムヒドロキシド水溶液で、80秒間現像した。その後、イナートオーブンにおいて、窒素ガス雰囲気下で250℃、60分間ポストベークを行い、測定サンプルを得た。得られたサンプルの表面をレーザーマイクロスコープ(VK-X200、株式会社キーエンス)を用いて、倍率50倍、測定ピッチ0.02μmで算術平均荒さRaを測定し、中間露光部Raとした。中間露光部の荒れ具合の評価について、Raが0.06未満を合格、0.06以上を不合格とした。
ガラス基板(大きさ100mm×100mm×1mm)にポジ型感光性樹脂組成物を乾燥膜厚が3.0±0.3μmになるようにバーコートし、常温真空乾燥60秒間の後、蓋つきホットプレート上125℃で120秒加熱してプリベークを行った。乾燥被膜を、超高圧水銀ランプを組み込んだ露光装置(商品名マルチライトML-251A/B、ウシオ電機株式会社)で水銀露光用バンドパスフィルター(商品名HB0365、朝日分光株式会社)を介して露光した。露光量を紫外線積算光量計(商品名UIT-150 受光部 UVD-S365、ウシオ電機株式会社)を用いて測定し、露光量が各配合の感度の25%となるように調整した。露光後、スピン現像装置(AD-1200、滝沢産業株式会社)を用い、温度23℃にて2.38質量%テトラメチルアンモニウムヒドロキシド水溶液で、80秒間現像した。その後、イナートオーブンにおいて、窒素ガス雰囲気下で250℃、60分間ポストベークを行い、測定サンプルを得た。得られたサンプルを10mm角に切り出し、全自動イオンコーター(JFC1500、日本電子株式会社)でサンプル表面を25s×2セットの条件で白金蒸着し、FE-SEM(JSM-7600F、日本電子株式会社)にサンプルを導入し、加速電圧2.0kV、LEI(Lower Secondary Electron Image)モードで、倍率15000倍においてサンプルを観察した。細孔有無の評価について、図1の(A)(比較例1)のように、サンプル表面に微細な穴(細孔)が見られる場合を細孔有とし、図1の(B)(実施例1)のように、サンプル表面に微細な穴(細孔)が見られない場合を細孔無しとした。
ガラス基板(大きさ100mm×100mm×1mm)にポジ型感光性樹脂組成物を乾燥膜厚が3.0±0.3μmになるようにバーコートし、常温真空乾燥60秒間の後、蓋つきホットプレート上125℃で120秒加熱してプリベークを行った。乾燥膜厚を光学式膜厚測定装置(F20-NIR、フィルメトリクス株式会社)を用いて測定した後、スピン現像装置(AD-1200、滝沢産業株式会社)を用い、温度23℃にて2.38質量%テトラメチルアンモニウムヒドロキシド水溶液で60秒間アルカリ現像を行なった。アルカリ現像後の膜厚を再び光学式膜厚測定装置(F20-NIR、フィルメトリクス株式会社)を用いて測定し、現像前後で溶解した膜厚(μm)を未露光部溶解性の指標とした。未露光部溶解性が0μmであることは、下式:
残膜率(%)=現像後の膜厚(μm)/現像前の膜厚(μm)
で定義される残膜率が100%であることと等価である。
ガラス基板(大きさ100mm×100mm×1mm)にポジ型感光性樹脂組成物を乾燥膜厚が約1.5μmになるようにスピンコートし、ホットプレート上125℃で120秒加熱してプリベークを行った。その後、窒素ガス雰囲気下250℃で60分硬化させることにより被膜を得た。硬化後の被膜のOD値を透過濃度計(BMT-1、サカタインクスエンジニアリング株式会社)で測定し、ガラスのみのOD値で補正を行って、被膜の厚さ1μm当たりのOD値に換算した。被膜の厚みは光学式膜厚測定装置(F20-NIR、フィルメトリクス株式会社)を用いて測定した。
[実施例1~14、比較例1~4]
表1に記載の組成で樹脂成分及びフェノールノボラック樹脂を溶媒(G)中で混合して溶解して得られた溶液に、表1に記載のキノンジアジド化合物(C)、フッ素系界面活性剤(D)、着色剤(E)、及び溶解促進剤(F)を加えて、更に混合した。成分が溶解したことを目視で確認した後、孔径0.22μmのミリポアフィルターで濾過し、固形分濃度12質量%のポジ型感光性樹脂組成物を調製した。表1における組成の質量部は固形分換算値である。実施例1~14、及び比較例1~4のポジ型感光性樹脂組成物の評価結果を表1に示す。
Claims (18)
- 付加(共)重合体である疎水性樹脂(A)と、
式(1)で表される構造単位を有するアルカリ可溶性樹脂(B)と、
キノンジアジド化合物(C)と、
フッ素系界面活性剤(D)と、
クレゾールノボラック樹脂と
を含むポジ型感光性樹脂組成物。
- 前記式(1)中、前記アルカリ可溶性官能基がフェノール性水酸基である、請求項1に記載のポジ型感光性樹脂組成物。
- 前記アルカリ可溶性樹脂(B)が、式(2)で表される構造単位を更に有する、請求項1に記載のポジ型感光性樹脂組成物。
- 前記式(2)中、R4がエポキシ基を有する有機基である、請求項3に記載のポジ型感光性樹脂組成物。
- 前記アルカリ可溶性樹脂(B)が、前記アルカリ可溶性樹脂(B)の全構造単位を基準として、前記式(1)で表される構造単位と前記式(2)で表される構造単位を合計で30mol%~100mol%の量で含む、請求項3又は4に記載のポジ型感光性樹脂組成物。
- 前記クレゾールノボラック樹脂の重量平均分子量(Mw)が500~17500である、請求項1~4のいずれか一項に記載のポジ型感光性樹脂組成物。
- 前記クレゾールノボラック樹脂を、樹脂成分の合計質量を基準として0.5質量%~35質量%含む、請求項1~4のいずれか一項に記載のポジ型感光性樹脂組成物。
- 前記疎水性樹脂(A)が、ケイ素含有基及びフッ素含有基からなる群より選ばれる少なくとも1つを有する樹脂である、請求項1~4のいずれか一項に記載のポジ型感光性樹脂組成物。
- 前記疎水性樹脂(A)が、式(3)
で表される構造単位を有し、sが1以上の整数である式(3)で表される構造単位を少なくとも1つ有する、請求項8に記載のポジ型感光性樹脂組成物。 - 前記疎水性樹脂(A)が、式(4)
で表される構造単位を更に有する、請求項9に記載のポジ型感光性樹脂組成物。 - 前記フッ素系界面活性剤(D)が、フッ素化アルキル基及びフッ素化アルキレン基からなる群より選ばれる少なくとも1つのフッ素化炭化水素基を有するアクリル系共重合体を含む、請求項1~4のいずれか一項に記載のポジ型感光性樹脂組成物。
- アルカリ可溶性官能基を有する重合性単量体とその他の重合性単量体との共重合体であって、前記式(1)で表される構造単位を有しないアルカリ可溶性樹脂を更に含む、請求項1~4のいずれか一項に記載のポジ型感光性樹脂組成物。
- 黒色染料及び黒色顔料からなる群より選ばれる少なくとも1種の着色剤(E)を更に含む、請求項1~4のいずれか一項に記載のポジ型感光性樹脂組成物。
- 前記着色剤(E)を、樹脂成分の合計100質量部を基準として10質量部~150質量部含む、請求項13に記載のポジ型感光性樹脂組成物。
- 前記ポジ型感光性樹脂組成物の硬化被膜の光学濃度(OD値)が膜厚1μmあたり0.5以上である、請求項13に記載のポジ型感光性樹脂組成物。
- 請求項1~4のいずれか一項に記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子隔壁。
- 請求項1~4のいずれか一項に記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子絶縁膜。
- 請求項1~4のいずれか一項に記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子。
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WO2017069172A1 (ja) * | 2015-10-21 | 2017-04-27 | 昭和電工株式会社 | ポジ型感光性樹脂組成物 |
JP2020126822A (ja) * | 2019-02-06 | 2020-08-20 | 昭和電工株式会社 | 感光性樹脂組成物、有機el素子隔壁、及び有機el素子 |
WO2020246517A1 (ja) * | 2019-06-03 | 2020-12-10 | 昭和電工株式会社 | ポジ型感光性樹脂組成物、及び有機el素子隔壁 |
WO2023080254A1 (ja) * | 2021-11-08 | 2023-05-11 | 株式会社レゾナック | ポジ型感光性樹脂組成物 |
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- 2023-06-16 WO PCT/JP2023/022421 patent/WO2024009732A1/ja active Application Filing
- 2023-06-16 KR KR1020247031150A patent/KR20240145042A/ko unknown
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JP2008241741A (ja) * | 2007-03-23 | 2008-10-09 | Jsr Corp | ソルダーレジスト用ポジ型ドライフィルム及びその硬化物並びにそれを備える回路基板及び電子部品 |
WO2017069172A1 (ja) * | 2015-10-21 | 2017-04-27 | 昭和電工株式会社 | ポジ型感光性樹脂組成物 |
JP2020126822A (ja) * | 2019-02-06 | 2020-08-20 | 昭和電工株式会社 | 感光性樹脂組成物、有機el素子隔壁、及び有機el素子 |
WO2020246517A1 (ja) * | 2019-06-03 | 2020-12-10 | 昭和電工株式会社 | ポジ型感光性樹脂組成物、及び有機el素子隔壁 |
WO2023080254A1 (ja) * | 2021-11-08 | 2023-05-11 | 株式会社レゾナック | ポジ型感光性樹脂組成物 |
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