WO2018108006A1 - 降低碳化硅外延基平面位错密度的方法 - Google Patents
降低碳化硅外延基平面位错密度的方法 Download PDFInfo
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000006243 chemical reaction Methods 0.000 claims abstract description 73
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000001257 hydrogen Substances 0.000 claims abstract description 44
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000005530 etching Methods 0.000 claims abstract description 23
- 239000002131 composite material Substances 0.000 claims abstract description 15
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 30
- 239000007789 gas Substances 0.000 claims description 26
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 23
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- 239000010703 silicon Substances 0.000 claims description 17
- 229910052786 argon Inorganic materials 0.000 claims description 15
- 238000011065 in-situ storage Methods 0.000 claims description 15
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 11
- 239000001294 propane Substances 0.000 claims description 11
- 229910000077 silane Inorganic materials 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 229910002804 graphite Inorganic materials 0.000 claims description 10
- 239000010439 graphite Substances 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 9
- 239000002019 doping agent Substances 0.000 claims description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 claims description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- 238000000407 epitaxy Methods 0.000 claims description 3
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 claims description 3
- 239000005052 trichlorosilane Substances 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 24
- 230000006698 induction Effects 0.000 abstract description 4
- 230000010354 integration Effects 0.000 abstract description 4
- 238000007781 pre-processing Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 42
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 4
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000003181 co-melting Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000007847 structural defect Effects 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
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- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- the invention relates to a method for growing a silicon carbide epitaxial layer, in particular to a method for reducing planar dislocation density of silicon carbide epitaxial base.
- the commercialization of silicon carbide power electronics is mainly limited by structural defects in the silicon carbide epitaxial layer. Structural defects can lead to degradation of the performance of silicon carbide devices, which will lead to a decrease in breakdown voltage, a decrease in minority carrier lifetime, and an increase in forward conduction resistance. To increase the magnitude of leakage, the long-term goal of silicon carbide research is to eliminate these defects.
- the main problem in the research of silicon carbide devices is to solve the stacking fault caused by induced recombination in the active region of the device under forward bias.
- Stacking faults cause device performance to degrade over time, increasing conduction voltage drop and on-state energy loss.
- BPD defects in the substrate In order to avoid degradation of device performance, it is necessary to avoid BPD defects in the substrate from entering the epitaxial layer.
- the commonly used method for reducing BPD defects in epitaxial layers is to form a BPD etching pit by KOH or KOH-NaOH-MgO co-melting corrosion on a silicon carbide substrate, and then performing epitaxial growth on the etched substrate, using BPD.
- the lateral epitaxy rate near the etch pit closes the propagation path of the BPD defect, transforming it into a blade dislocation (TED) defect with the same Burgers vector, and the TED defect is less harmful to the device.
- KOH melt corrosion of SiC substrate or KOH–NaOH–MgO co-melting corrosion seriously damages the surface of SiC substrate, and the process is relatively cumbersome, which is not suitable for silicon carbide epitaxial process integration.
- the present invention proposes a method of reducing the planar dislocation density of silicon carbide epitaxial base.
- the technical solution adopted by the present invention is: a method for reducing planar dislocation density of silicon carbide epitaxial base, comprising the following steps:
- a small flow of silicon source and carbon source are introduced into the reaction chamber, and the flow ratio of the silicon source and the hydrogen gas is controlled to be less than 0.03%, and the doping source is introduced to grow a thickness of 0.2.
- a small flow source of silicon and a carbon source are introduced into the reaction chamber, and the flow rate of the silicon source is the same as that of step (3), and a doping source is introduced to grow to a thickness of 0.2-0.5 ⁇ m and a doping concentration of 5-8E18 cm . 3 buffer layer 2;
- the present invention epitaxially grows a plurality of periodic high-low doped composite buffer layers on a SiC substrate, and performs interfacial high-temperature hydrogen etching treatment on each single-layer buffer layer.
- interface high temperature processing and doping induction to introduce multiple interfaces
- interface image force to promote the conversion of BPD defects to TED defects
- greatly reducing BPD defects in the epitaxial layer the method is simple to facilitate epitaxial process integration, while avoiding The complex pre-treatment of the SiC substrate reduces the damage to the surface of the substrate.
- Figure 1 is a schematic view showing the structure of an epitaxial wafer grown in accordance with the present invention
- the method for reducing planar dislocation density of silicon carbide epitaxial base mainly comprises epitaxially growing a plurality of periodic high-low doping concentration composite buffer layers on a SiC substrate, and performing a single buffer layer for each single layer buffer layer.
- Interface high-temperature hydrogen etching treatment using interface high temperature processing and doping induction to introduce multiple interfaces, using interface image force to promote the conversion of BPD defects to TED defects, greatly reducing BPD defects in the epitaxial layer
- the simple process facilitates the integration of the epitaxial process, and avoids complicated pre-processing of the SiC substrate and reduces damage to the surface of the substrate, including the following steps:
- the silicon carbide substrate can be selected to be 4° or 8 in the direction of ⁇ 11-20>.
- silicon source may be silane, dichlorosilane, trichlorosilane, tetrachlorosilane, etc.
- carbon source may be methane, ethylene or acetylene.
- Source high purity nitrogen (N 2 ), pass or p-type dopant source trimethyl aluminum (TMA), can pass 500sccm high purity nitrogen (N 2 ), set growth time 6 minutes, grow thickness 0.2- 0.5 ⁇ m, doping concentration of 5 ⁇ 8E18cm -3 buffer layer 2;
- the flow rate of the growth source and the doping source is changed by linear ramping, the flow ratio of SiH 4 /H 2 is controlled to 0.1%, the C/Si ratio of the inlet end is 1.2, and hydrogen chloride gas is introduced.
- the inlet end Cl/Si ratio is set to 2.5, and 10 sccm of nitrogen gas is introduced, and the epitaxial time is set to 15 minutes, which are set to the set values required for growing the epitaxial structure, and the epitaxial structure is grown according to a conventional process procedure;
- an appropriate amount of hydrogen chloride gas, propane, silane or trichlorosilane can be introduced to assist the hydrogen etching, and the process personnel can select and judge according to the actual situation.
- the buffer layer 1 and the buffer layer 2 in steps 3 and 5 have different doping concentrations, which can be achieved by changing the C/Si ratio of the inlet end or the doping source flow rate.
- the doping concentration is inversely proportional to the C/Si ratio at the inlet end
- the doping concentration is proportional to the C/Si ratio at the inlet end.
- the doping concentration is proportional to the doping source flow rate.
- the epitaxial wafer structure grown in accordance with the present invention has a plurality of composite buffer layers as shown in FIG.
- the case of growing a composite buffer layer of one cycle and two cycles of high-low doping structure will be described below by means of two embodiments.
- the SiC epitaxial wafer is grown on a composite buffer layer of a high-low doped structure, and the specific steps are as follows:
- reaction chamber gas is replaced by argon gas several times, hydrogen gas is introduced into the reaction chamber, the H 2 flow rate is gradually increased to 80 L/min, the pressure in the reaction chamber is set to 100 mbar, and the reaction chamber is gradually heated to a growth temperature of 1600. °C, after the growth temperature is reached, the temperature of the reaction chamber is maintained for 10 minutes, and the substrate is subjected to pure hydrogen etching;
- step (3) Pass silane and propane into the reaction chamber, the flow rate of silane is the same as in step (3), increase the flow rate of propane, control the C/Si ratio to 1.2, pass 500 sccm of high-purity nitrogen, and set the growth time to 6 minutes.
- a buffer layer 2 having a thickness of 0.5 ⁇ m and a doping concentration of 5E17 cm -3 ;
- a SiC epitaxial wafer is grown on a composite buffer layer of two cycles of high-low doping structure, and the specific steps are as follows:
- reaction chamber gas is replaced by argon gas several times, hydrogen gas is introduced into the reaction chamber, the H 2 flow rate is gradually increased to 80 L/min, the pressure in the reaction chamber is set to 100 mbar, and the reaction chamber is gradually heated to a growth temperature of 1600. °C, after the growth temperature is reached, the temperature of the reaction chamber is maintained for 10 minutes, and the substrate is subjected to pure hydrogen etching;
- step (3) Pass silane and propane into the reaction chamber, the flow rate of silane is the same as in step (3), increase the flow rate of propane, control the C/Si ratio to 1.2, pass 500 sccm of high-purity nitrogen, and set the growth time to 6 minutes.
- a buffer layer 2 having a thickness of 0.5 ⁇ m and a doping concentration of 5E17 cm -3 ;
- the defect density of the epitaxial wafer BPD grown on the composite buffer layer having a period of high-low doping structure has been reduced to 2.5 cm -2 , and the BPD conversion rate is 99.75%;
- the epitaxial wafer BPD defect density grown on the composite buffer layer of the two-cycle high-low doping structure has been reduced to 0.5 cm -2 and the BPD conversion rate is 99.95%.
- the high temperature hydrogen treatment combined with the doping induction process can effectively reduce the BPD defect density in the epitaxial layer, and the BPD defect density in the epitaxial layer can be further reduced by increasing the repetition period of the high-low doped structure in the composite buffer layer. .
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Abstract
提供一种降低碳化硅外延基平面位错密度的方法,主要通过在SiC衬底上外延生长多个周期的高-低掺杂浓度的复合缓冲层,并对每个单层缓冲层进行界面高温氢气刻蚀处理,利用界面高温处理以及掺杂诱导引入多个界面,利用界面象力促进BPD缺陷向TED缺陷的转化。该方法极大减少了外延层中的BPD缺陷,可以有效降低外延层中的BPD缺陷密度,方法简单,有利于外延工艺集成,同时避免了对SiC衬底进行复杂的前期处理,减少了对衬底表面的破坏。
Description
本发明涉及一种碳化硅外延层的生长方法,尤其涉及一种降低碳化硅外延基平面位错密度的方法。
碳化硅电力电子商业化主要受限于碳化硅外延层中的结构缺陷,结构缺陷会导致碳化硅器件性能的退化,会导致击穿电压下降,降低少数载流子寿命,增加正向导通电阻,增加漏电的量级等问题,碳化硅研究的长远目标就是消除这些缺陷。
目前研究碳化硅器件的主要问题是解决正向偏压下器件有源区内诱导复合引起的堆垛层错。堆垛层错导致器件性能随着时间退化,增加导通压降和开态能量损失。为了避免器件性能的退化,需要避免衬底中BPD缺陷进入外延层。
目前国际上常用的降低外延层中BPD缺陷的方法是对碳化硅衬底进行KOH或KOH–NaOH–MgO共融腐蚀形成BPD腐蚀坑,然后在腐蚀处理后的衬底上进行外延生长,利用BPD腐蚀坑附近的横向外延速率,闭合BPD缺陷的传播通道,使其转化为具有相同伯格斯矢量的刃位错(TED)缺陷,TED缺陷对器件危害比较低。但是碳化硅衬底的KOH熔融腐蚀或者KOH–NaOH–MgO共融腐蚀对碳化硅衬底表面破坏严重,而且工艺相对繁琐,并不适用于碳化硅外延工艺集成。
发明内容
发明目的:针对以上问题,本发明提出一种降低碳化硅外延基平面位错密度的方法。
技术方案:为实现本发明的目的,本发明所采用的技术方案是:一种降低碳化硅外延基平面位错密度的方法,包括以下步骤:
(1)将碳化硅衬底置于碳化硅外延系统反应室内的石墨基座上;
(2)采用氩气对反应室气体进行多次置换,然后向反应室通入氢气,逐渐加大氢气流量至60~120L/min,设置反应室的压力为80~200mbar,并将反应室逐渐升温至1550~1700℃,到达设定温度后,保持所有参数不变,对碳化硅衬底进行5~15分钟原位氢气刻蚀处理;
(3)原位氢气刻蚀处理完成后,向反应室通入小流量的硅源和碳源,控制硅源和氢气的流量比小于0.03%,并通入掺杂源,生长出厚度为0.2-0.5μm,掺杂浓度2~5E18cm-3的缓冲层1;
(4)关闭生长源及掺杂源,保持反应室压力、生长温度以及氢气流量不变,对缓冲层1进行原位氢气刻蚀处理,处理时间2-10分钟;
(5)向反应室通入小流量硅源和碳源,硅源的流量与步骤(3)相同,并通入掺杂
源,生长出厚度为0.2-0.5μm,掺杂浓度5~8E18cm-3的缓冲层2;
(6)关闭生长源及掺杂源,保持反应室压力、生长温度以及氢气流量不变,对缓冲层2进行原位氢气刻蚀处理,处理时间2-10分钟;
(7)重复步骤(3)~(6),完成复合缓冲层的生长;
(8)通入生长源和掺杂源,采用线性缓变的方式将生长源和掺杂源的流量改变至生长外延结构所需的设定值,根据常规工艺程序生长外延结构;
(9)在完成外延结构生长后,关闭生长源和掺杂源,在氢气氛围中将反应室温度降至室温,然后将氢气排出,并通入氩气对反应室气体进行多次置换,并利用氩气将反应室压力提高至大气压,然后开腔取片。
有益效果:本发明与现有技术相比,在SiC衬底上外延生长多个周期的高-低掺杂结构的复合缓冲层,并在对每个单层缓冲层进行界面高温氢气刻蚀处理,利用界面高温处理以及掺杂诱导引入多个界面,利用界面象力促进BPD缺陷向TED缺陷的转化,极大减少了外延层中的BPD缺陷;该方法工艺简单有利于外延工艺集成,同时避免了对SiC衬底进行复杂的前期处理,减少了对衬底表面的破坏。
图1是按照本发明生长出的外延片结构示意图;
图2是生长一个复合缓冲层的SiC外延片的PL成像BPD缺陷分析结果;
图3是生长两个复合缓冲层的SiC外延片的PL成像BPD缺陷分析结果。
下面结合附图和实施例对本发明的技术方案作进一步的说明。
本发明所述的降低碳化硅外延基平面位错密度的方法,主要通过在SiC衬底上外延生长多个周期的高-低掺杂浓度的复合缓冲层,并对每个单层缓冲层进行界面高温氢气刻蚀处理,利用界面高温处理以及掺杂诱导引入多个界面,利用界面象力(image force)促进BPD缺陷向TED缺陷的转化,极大减少了外延层中的BPD缺陷,该方法工艺简单有利于外延工艺集成,同时避免了对SiC衬底进行复杂的前期处理,减少了对衬底表面的破坏,具体包括以下步骤:
(1)将碳化硅衬底置于SiC外延系统反应室内,放置于石墨基座上,石墨基座上具有碳化钽涂层,碳化硅衬底可以选取偏向<11-20>方向4°或者8°的硅面碳化硅衬底;
(2)采用氩气对反应室气体进行多次置换,然后向反应室通入氢气,逐渐加大氢气流量至60~120L/min,设置反应室的压力为80~200mbar,并将反应室逐渐升温至1550~1700℃,到达设定温度后,保持所有参数不变,对碳化硅衬底进行5~15分钟原位氢气刻蚀处理;
(3)向反应室通入小流量的硅源和碳源,其中,硅源可以是硅烷、二氯氢硅、三
氯氢硅、四氯氢硅等,碳源可以是甲烷、乙烯、乙炔、丙烷等,控制硅源和氢气的流量比小于0.03%,调节碳源流量,控制进气端C/Si比为0.9,并通入n型掺杂源高纯氮气(N2),或者通入p型掺杂源三甲基铝(TMA),可以通入500sccm高纯氮气(N2),设定生长时间6分钟,生出长厚度为0.2-0.5μm,掺杂浓度2~5E18cm-3的缓冲层1;
(4)关闭生长源及掺杂源,保持反应室压力、生长温度以及H2流量不变,对缓冲层1进行原位氢气刻蚀处理,处理时间2-10分钟;
(5)向反应室通入小流量硅源和碳源,硅源流量与步骤(3)相同,加大碳源流量,控制进气端C/Si比为1.2,并通入n型掺杂源高纯氮气(N2),通入或者p型掺杂源三甲基铝(TMA),可以通入500sccm高纯氮气(N2),设定生长时间6分钟,生长出厚度为0.2-0.5μm,掺杂浓度由5~8E18cm-3的缓冲层2;
(6)关闭生长源及掺杂源,保持反应室压力、生长温度以及H2流量不变,对缓冲层1进行原位氢气刻蚀处理,处理时间2-10分钟;
(7)重复步骤3-6,完成复合缓冲层的生长,具体重复次数可以由工艺人员根据实验结果进行确认;
(8)采用线性缓变(ramping)的方式改变生长源及掺杂源的流量,控制SiH4/H2流量比为0.1%,进气端C/Si比为1.2,并通入氯化氢气体,设定进气端Cl/Si比为2.5,并通入10sccm的氮气,外延时间设定为15分钟,均设定为生长外延结构所需的设定值,根据常规工艺程序生长外延结构;
(9)在完成外延结构生长之后,关闭生长源和掺杂源,在氢气气氛中将反应室温度降温至室温,反应室温度达到室温后将氢气排外后,通过氩气对反应室内的气体进行多次置换,将反应室真空抽至0mbar,维持5分钟,向反应室充入氩气至大气压,开腔取片。
在进行氢气刻蚀过程中,可以引入适量的氯化氢气体、丙烷、硅烷或者三氯氢硅等工艺气体辅助氢气刻蚀,工艺人员可以根据实际情况进行选择判断。
步骤3和步骤5中缓冲层1和缓冲层2具有不同的掺杂浓度,可以通过改变进气端C/Si比或者掺杂源流量的方法实现。对于n型掺杂,掺杂浓度和进气端C/Si比成反比,对于p型掺杂,掺杂浓度和进气端C/Si比成正比。不论n型或者p型掺杂,掺杂浓度均和掺杂源流量成正比关系。
按照本发明生长出的外延片结构如图1所示,具有多个复合缓冲层。下面通过两个实施例说明生长一个周期和生长二个周期高-低掺杂结构的复合缓冲层的情况。
实施例一
生长一个周期高-低掺杂结构的复合缓冲层上生长SiC外延片,具体步骤如下:
(1)选取偏向<11-20>方向4°的硅面碳化硅衬底,衬底BPD缺陷密度为1000cm-2,,
将衬底置于SiC外延系统反应室内,放置于石墨基座上,石墨基座上具有碳化钽涂层;
(2)采用氩气对反应室气体进行多次置换,向反应室通入氢气,逐渐加大H2流量至80L/min,设置反应室的压力为100mbar,将反应室逐渐升温至生长温度1600℃,达到生长温度后维持反应室温度10分钟,对衬底进行纯氢气刻蚀;
(3)向反应室通入小流量硅烷(SiH4)和丙烷(C3H8),控制SiH4/H2比为0.025%,控制C/Si比为0.9,并通入500sccm高纯氮气,生长时间设定为6分钟,生长出厚度为0.5μm,掺杂浓度为2E18cm-3的缓冲层1;
(4)关闭生长源及掺杂源,保持反应室压力、生长温度以及H2流量不变,对缓冲层1进行原位氢气刻蚀处理,处理时间5分钟;
(5)向反应室通入硅烷和丙烷,硅烷流量与步骤(3)相同,加大丙烷流量,控制C/Si比为1.2,通入500sccm高纯氮气,生长时间设定为6分钟,生长出厚度为0.5μm,掺杂浓度为5E17cm-3的缓冲层2;
(6)关闭生长源及掺杂源,保持反应室压力、生长温度以及氢气流量不变,对缓冲层2进行原位氢气刻蚀处理,处理时间5分钟;
(7)采用线性缓变(ramping)的方式改变硅烷、丙烷以及氮气流量,控制SiH4/H2流量比为0.1%,设定进气端C/Si比为1.2,并通入氯化氢气体,设定进气端Cl/Si比为2.5,并通入10sccm的氮气,外延时间设定为15分钟;
(8)关闭生长源和掺杂源,在氢气气氛中将反应室温度降温至室温,通入氩气置换反应室内的氢气,将反应室真空抽至0mbar,维持5分钟,向反应室充入氩气至大气压,打开反应室,取出外延片。采用PL成像BPD检测方法对外延片表面进行表征,结果如图2所示。
实施例二
生长两个周期高-低掺杂结构的复合缓冲层上生长SiC外延片,具体步骤如下:
(1)选取偏向<11-20>方向4°的硅面碳化硅衬底,衬底BPD缺陷密度为1000cm-2,,将衬底置于SiC外延系统反应室内,放置于石墨基座上,石墨基座上具有碳化钽涂层;
(2)采用氩气对反应室气体进行多次置换,向反应室通入氢气,逐渐加大H2流量至80L/min,设置反应室的压力为100mbar,将反应室逐渐升温至生长温度1600℃,达到生长温度后维持反应室温度10分钟,对衬底进行纯氢气刻蚀;
(3)向反应室通入小流量硅烷(SiH4)和丙烷(C3H8),控制SiH4/H2比为0.025%,控制C/Si比为0.9,并通入500sccm高纯氮气,生长时间设定为6分钟,生长出厚度为0.5μm,掺杂浓度为2E18cm-3的缓冲层1;
(4)关闭生长源及掺杂源,保持反应室压力、生长温度以及H2流量不变,对缓冲层1进行原位氢气刻蚀处理,处理时间5分钟;
(5)向反应室通入硅烷和丙烷,硅烷流量与步骤(3)相同,加大丙烷流量,控制C/Si比为1.2,通入500sccm高纯氮气,生长时间设定为6分钟,生长出厚度为0.5μm,掺杂浓度为5E17cm-3的缓冲层2;
(6)关闭生长源及掺杂源,保持反应室压力、生长温度以及氢气流量不变,对缓冲层2进行原位氢气刻蚀处理,处理时间5分钟;
(7)重复步骤3~6一次;
(8)用流量增加的方式改变硅烷、丙烷以及氮气流量,控制SiH4/H2流量比为0.1%,设定进气端C/Si比为1.2,并通入氯化氢气体,设定进气端Cl/Si比为2.5,通入10sccm的氮气,外延时间设定为15分钟;
(9)关闭生长源和掺杂源,在氢气气氛中将反应室温度降温至室温,通入氩气置换反应室内的氢气,将反应室真空抽至0mbar,维持5分钟,向反应室充入氩气至大气压,打开反应室,取出外延片。采用PL成像BPD检测方法对外延片表面进行表征,结果如图3所示。
通过图2和图3可以看出该工艺下,具有一个周期高-低掺杂结构的复合缓冲层上生长的外延片BPD缺陷密度已经降低至2.5cm-2,BPD转化率达到99.75%;具有二个周期高-低掺杂结构的复合缓冲层上生长的外延片BPD缺陷密度已经降低至0.5cm-2,BPD转化率达到99.95%。可以看出利用界面高温氢气处理结合掺杂诱导工艺可以有效降低外延层中的BPD缺陷密度,同时通过增加复合缓冲层中高-低掺杂结构的重复周期,可以进一步降低外延层中的BPD缺陷密度。
Claims (4)
- 一种降低碳化硅外延基平面位错密度的方法,其特征在于:包括以下步骤:(1)将碳化硅衬底置于碳化硅外延系统反应室内的石墨基座上;(2)采用氩气对反应室气体进行多次置换,然后向反应室通入氢气,逐渐加大氢气流量至60~120L/min,设置反应室的压力为80~200mbar,并将反应室逐渐升温至1550~1700℃,到达设定温度后,保持所有参数不变,对碳化硅衬底进行5~15分钟原位氢气刻蚀处理;(3)原位氢气刻蚀处理完成后,向反应室通入小流量的硅源和碳源,控制硅源和氢气的流量比小于0.03%,并通入掺杂源,生长出厚度为0.2-0.5μm,掺杂浓度2~5E18cm-3的缓冲层1;(4)关闭生长源及掺杂源,保持反应室压力、生长温度以及氢气流量不变,对缓冲层1进行原位氢气刻蚀处理,处理时间2-10分钟;(5)向反应室通入小流量硅源和碳源,硅源的流量与步骤(3)相同,并通入掺杂源,生长出厚度为0.2-0.5μm,掺杂浓度5~8E18cm-3的缓冲层2;(6)关闭生长源及掺杂源,保持反应室压力、生长温度以及氢气流量不变,对缓冲层2进行原位氢气刻蚀处理,处理时间2-10分钟;(7)重复步骤(3)~(6),完成复合缓冲层的生长;(8)通入生长源和掺杂源,采用线性缓变的方式将生长源和掺杂源的流量改变至生长外延结构所需的设定值,根据常规工艺程序生长外延结构;(9)在完成外延结构生长后,关闭生长源和掺杂源,在氢气氛围中将反应室温度降至室温,然后将氢气排出,并通入氩气对反应室气体进行多次置换,并利用氩气将反应室压力提高至大气压,然后开腔取片。
- 根据权利要求1所述的降低碳化硅外延基平面位错密度的方法,其特征在于:掺杂源为n型掺杂源氮气或p型掺杂源三甲基铝。
- 根据权利要求1所述的降低碳化硅外延基平面位错密度的方法,其特征在于:硅源为硅烷、二氯氢硅、三氯氢硅或四氯氢硅,碳源为甲烷、乙烯、乙炔或丙烷。
- 根据权利要求1所述的降低碳化硅外延基平面位错密度的方法,其特征在于:步骤(3)和步骤(5)中缓冲层1和缓冲层2具有不同的掺杂浓度。
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CN107068539A (zh) | 2017-08-18 |
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KR102193732B1 (ko) | 2020-12-21 |
KR20190102211A (ko) | 2019-09-03 |
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