WO2018066411A1 - 導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法 - Google Patents
導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法 Download PDFInfo
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- WO2018066411A1 WO2018066411A1 PCT/JP2017/034743 JP2017034743W WO2018066411A1 WO 2018066411 A1 WO2018066411 A1 WO 2018066411A1 JP 2017034743 W JP2017034743 W JP 2017034743W WO 2018066411 A1 WO2018066411 A1 WO 2018066411A1
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- Prior art keywords
- film
- adhesive
- adhesive film
- piece
- release
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Definitions
- the present invention relates to a conductive film, a wound body, a connection structure, and a method for manufacturing the connection structure.
- a conductive film such as an anisotropic conductive film may be used (for example, (See Patent Documents 1 and 2).
- the conductive film is obtained by forming an adhesive film on the entire surface of a long release film.
- the anisotropic conductive film is obtained by forming an adhesive film in which conductive particles are dispersed in an adhesive on the entire surface of a long release film.
- the conductive film is provided as a wound body wound around a winding core, and is unwound from the wound body when connecting the first circuit member and the second circuit member.
- the adhesive film of an electroconductive film is affixed on the adhesive surface of a 1st circuit member, and the adhesive surface of a 1st circuit member and the adhesive surface of a 2nd circuit member are overlaid through an adhesive film after that. .
- JP 2008-274019 A Japanese Patent Laying-Open No. 2015-135748
- the shape of the adhesive surface to which the adhesive film is attached varies depending on the type of the connection structure. For this reason, when the adhesive film is formed on the entire surface of the release film, the adhesive film can be attached only to a rectangular adhesive surface having the same width as the release film. When the shape of the adhesive surface is not a rectangle having the same width as the release film, only a part of the adhesive film of the adhesive film formed on the release film can be attached to the adhesive surface. For this reason, the remaining adhesive film is wasted.
- one aspect of the present invention is an electrically conductive film, a wound body, a connection structure, and an adhesive film that can effectively use the adhesive film while being able to affix an adhesive film to adhesive surfaces of various shapes.
- An object of the present invention is to provide a method for manufacturing a connection structure.
- the conductive film according to one aspect of the present invention includes a long release film and a plurality of conductive adhesive film pieces provided on the release film, and the plurality of adhesive film pieces are peeled off. They are arranged in the longitudinal direction of the film.
- a plurality of adhesive film pieces are arranged in the longitudinal direction of the release film on a long release film. For this reason, the shape of an adhesive film piece can be set arbitrarily. Thereby, while being able to affix an adhesive film piece with respect to the adhesive surface of various shapes, an adhesive film piece can be utilized effectively.
- the plurality of adhesive film pieces may be separated in the longitudinal direction of the release film.
- the adhesive film pieces since a plurality of adhesive film pieces are separated in the longitudinal direction of the release film, the adhesive film pieces can be attached to the adhesive surface without affecting the adjacent adhesive film pieces. it can. Thereby, an adhesive film piece can be easily affixed with respect to an adhesive surface. Moreover, the freedom degree of the shape of an adhesive film piece can be expanded further.
- the plurality of adhesive film pieces may have the same shape.
- the adhesive film pieces can be efficiently attached to the plurality of adhesive surfaces having the same shape.
- the plurality of adhesive film pieces may be arranged at the center in the width direction of the release film.
- a plurality of adhesive film pieces are arranged in the central portion in the width direction of the release film, positioning of the conductive film with respect to the adhesive surface is performed when the adhesive film piece is attached to the adhesive surface. It can be done easily.
- the plurality of adhesive film pieces may be disposed at the end in the width direction of the release film.
- the adhesive film adheres to the adhesive surface even when there is not enough space on one side of the adhesive surface.
- the agent film piece can be easily attached.
- the plurality of adhesive film pieces may be arranged in the width direction of the release film.
- the plurality of adhesive film pieces are also arranged in the width direction of the release film, the density of the adhesive film pieces relative to the release film can be increased. Thereby, more adhesive film pieces can be provided on a peeling film.
- the distance between the plurality of adhesive film pieces in the longitudinal direction of the release film may be 0.1 mm or more and 10 mm or less.
- the adhesive film piece is attached to the adhesive surface without affecting the adjacent adhesive film piece. Can be easily pasted.
- interval is 10 mm or less, the density of the adhesive film piece with respect to a peeling film can be made high, and more adhesive film pieces can be provided on a peeling film.
- the distance between the edge of the release film and the adhesive film piece closest to the end edge in the width direction of the release film may be 0.1 mm or more and 10 mm or less.
- the end of the release film interferes with other members. Even if it does, it can suppress that an adhesive film piece peels from a peeling film.
- interval is 10 mm or less, an adhesive film piece can be efficiently provided on a peeling film.
- the adhesive film piece when the adhesive film piece is attached to the adhesive surface with high accuracy, it is necessary to specify the position of the adhesive film piece in the conductive film. Therefore, it is conceivable to detect the position of the adhesive film piece in the conductive film using an imaging device. However, considering that the adhesive film piece is subsequently attached to the adhesive surface, it is preferable to dispose the imaging device on the opposite side of the adhesive film piece with respect to the release film. Therefore, in the above conductive film, the release film may have light transmittance. In this conductive film, since the release film is light-transmitting, even if an imaging device is arranged on the opposite side of the adhesive film piece with respect to the release film, the adhesive film piece in the conductive film by the imaging device. The position of can be detected.
- the transmittance of the release film may be 15% or more and 100% or less.
- the transmittance of the release film since the transmittance of the release film is 15% or more, the position of the adhesive film piece can be easily detected from the release film side.
- permeability of a peeling film is 100% or less, a peeling film can be produced easily.
- the haze value of the release film may be 3% or more and 100% or less.
- the haze value of the release film since the haze value of the release film is 3% or more, the position of the adhesive film piece can be easily detected from the release film side.
- the haze value of a peeling film is 100% or less, a peeling film can be produced easily.
- the conductive film may further include a second release film piece provided on the adhesive film piece.
- the adhesive film piece since the surface of the adhesive film piece is covered with the second release film piece, the adhesive film piece can be protected. For this reason, for example, when a conductive film is wound as a wound body, it can suppress that an adhesive film piece is transcribe
- the adhesive film piece may have conductive particles dispersed in the adhesive.
- the adhesive film piece can have anisotropic conductivity because conductive particles are dispersed in the adhesive.
- a wound body according to one aspect of the present invention includes any one of the above-described conductive films and a core around which the conductive film is wound.
- the adhesive film piece can be attached to the adhesive surface of various shapes, and the adhesive film piece Can be used effectively.
- connection structure which concerns on 1 side of this invention is the said 1st circuit member which has a 1st adhesion surface, the 2nd circuit member which has a 2nd adhesion surface, and the said 1st adhesion surface and the 2nd adhesion surface Any one of the adhesive film pieces.
- connection structure the first adhesive surface and the second adhesive surface are connected by any one of the above adhesive film pieces. For this reason, the connection structure by which the adhesive film piece was appropriately affixed on the first adhesive surface and the second adhesive surface can be obtained regardless of the shapes of the first adhesive surface and the second adhesive surface.
- a plurality of adhesive film pieces having conductivity are provided on a long release film, and the plurality of adhesive film pieces are in the longitudinal direction of the release film.
- connection structure manufacturing method a conductive film in which a plurality of adhesive film pieces are provided on a release film is manufactured, and the first adhesive surface and the second adhesive are bonded via the adhesive film pieces of the conductive film. Connect the surface. And since the shape of the adhesive film piece can be arbitrarily set, the adhesive film piece is appropriate for the first adhesive surface and the second adhesive surface regardless of the shape of the first adhesive surface and the second adhesive surface.
- the connection structure affixed to can be manufactured. Moreover, an adhesive film piece can be utilized effectively.
- the adhesive film piece may have conductive particles dispersed in the adhesive.
- the adhesive film piece can have anisotropic conductivity because the conductive particles are dispersed in the adhesive.
- the film manufacturing process includes an adhesive film layer forming process for forming an adhesive film layer having conductivity on the entire surface of the release film, and an adhesive film layer. From the release film, the adhesive film layer cutting step that cuts along the outline forming the outer shape of the piece, and the blank portion that becomes the portion other than the adhesive film piece in the adhesive film layer along the cut outer shape line. And a blank peeling step for peeling.
- an adhesive film layer is formed on the entire surface of the release film, the adhesive film layer is cut along the outline, and the blank portion is peeled off from the release film along the cut outline. To do. Thereby, a several adhesive film piece can be easily provided on a peeling film.
- connection structure manufacturing method conductive particles may be dispersed in the adhesive in the adhesive film layer.
- the adhesive film layer since the adhesive film layer has conductive particles dispersed in the adhesive, the adhesive film piece formed by cutting the adhesive film layer has anisotropic conductivity. can do.
- connection step is based on the position detection step of detecting the position of the adhesive film piece in the conductive film by the imaging device and the position detected by the position detection step.
- the position of the adhesive film piece in the conductive film is detected by the imaging device, and the adhesive film piece is attached to the first adhesive surface based on the detected position. For this reason, the positional accuracy of the adhesive film piece with respect to the bonding surface can be increased.
- the 1st adhesion surface and the 2nd adhesion surface are piled up via this adhesive film piece, it can make it easy to store an adhesive film piece in the 1st adhesion surface and the 2nd adhesion surface.
- the film manufacturing step may manufacture a conductive film in which a second release film piece is provided on an adhesive film piece.
- the adhesive film piece can be protected. For this reason, for example, when a conductive film is wound as a wound body, it can suppress that an adhesive film piece is transcribe
- the film manufacturing process includes forming a conductive adhesive film layer on the entire surface of the release film, and further providing a second release film on the entire surface of the adhesive film layer.
- Adhesive film layer forming step covering the adhesive film layer and the second release film along the outline forming the outline of the adhesive film piece, and along the cut outline
- the blank peeling process which peels the blank part used as parts other than the adhesive film piece in an adhesive film layer and a 2nd peeling film from a peeling film may be included.
- the adhesive film layer is formed on the entire surface of the release film, the second release film is covered on the entire surface of the adhesive film layer, and the adhesive film layer is cut along the outline. Then, the blank portion is peeled off from the release film along the cut outline.
- connection structure manufacturing method conductive particles may be dispersed in the adhesive in the adhesive film layer.
- the adhesive film layer since the adhesive film layer has conductive particles dispersed in the adhesive, the adhesive film piece formed by cutting the adhesive film layer has anisotropic conductivity. can do.
- connection step is based on the position detection step of detecting the position of the adhesive film piece in the conductive film by the imaging device and the position detected by the position detection step.
- the pasting step of pasting the piece to the first adhesive surface, the overlapping step of superposing the first adhesive surface and the second adhesive surface via the adhesive film piece, and the adhesive film piece before the pasting step You may have a 2nd peeling film piece peeling process which peels a 2 peeling film piece.
- the position of the adhesive film piece in the conductive film is detected by the imaging device, and the adhesive film piece is attached to the first adhesive surface based on the detected position. For this reason, the positional accuracy of the adhesive film piece with respect to the bonding surface can be increased.
- the adhesive film piece in the attaching step, the adhesive film piece may be attached to the first adhesive surface, and then the release film may be released from the adhesive film piece.
- the release film since the release film is peeled from the adhesive film piece after the adhesive film piece is attached to the first adhesive surface, the adhesive film piece is easily attached to the first adhesive surface. Can do.
- the connecting step cuts the conductive film into a plurality of conductive film pieces in which one or more adhesive film pieces are provided on the release film before the position detecting step.
- a film cutting step may be further included, and in the position detection step, the position of the adhesive film piece in the conductive film piece may be detected by the imaging device.
- the imaging device in order to cut the conductive film into a plurality of conductive film pieces, when affixing the adhesive film piece at a plurality of locations, when changing the affixing direction of the adhesive film piece, etc. Can also respond flexibly. And since the position of the adhesive film piece in the conductive film piece is detected by the imaging device, even if the conductive film is cut into a plurality of conductive film pieces, the positional accuracy of the adhesive film piece with respect to the adhesive surface is increased. Can do.
- the adhesive film can be applied to the adhesive surfaces of various shapes, and the adhesive film can be used effectively.
- FIG. 3 is a cross-sectional view taken along line III-III shown in FIG. It is a top view for demonstrating the position of the adhesive film piece with respect to a peeling film.
- FIG. 8A, FIG. 8B, FIG. 8C, and FIG. 8D are cross-sectional views for explaining the film manufacturing process shown in FIG. FIG. 9A, FIG. 9B, FIG.
- FIG. 9C, and FIG. 9D are perspective views for explaining the film manufacturing process shown in FIG. It is a flowchart which shows the connection process shown in FIG.
- FIG. 7 is a schematic process diagram for explaining the connection process shown in FIG. 6.
- FIG. 13A, FIG. 13B, and FIG. 13C are plan views showing anisotropic conductive films according to modifications.
- FIG. 14A, FIG. 14B, and FIG. 14C are plan views showing an anisotropic conductive film of a modification.
- FIG. 17B, and FIG. 17C are plan views showing an anisotropic conductive film of a modification.
- 18 (a), 18 (b), and 18 (c) are plan views showing an anisotropic conductive film of a modification. It is sectional drawing which shows the anisotropic conductive film of the modification 1.
- 20 (a), FIG. 20 (b), FIG. 20 (c), FIG. 20 (d), and FIG. 20 (e) illustrate the film manufacturing process in the method for manufacturing the anisotropic conductive film of Modification 1. It is sectional drawing for doing.
- 10 is a flowchart showing a connection step in the method for manufacturing a connection structure according to Modification 2.
- FIG. 22 is a schematic process diagram for explaining the connection process shown in FIG. 21. It is a top view for demonstrating the film cutting process shown in FIG.
- the conductive film according to the present invention is applied to an anisotropic conductive film having anisotropic conductivity.
- the conductive film according to the present invention can be applied to various conductive films having no anisotropic conductivity.
- the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted.
- the size ratio and the like are appropriately changed for easy understanding of the description.
- the wound body 1 includes a long (tape-shaped) anisotropic conductive film 2 and a core 3 around which the anisotropic conductive film 2 is wound. That is, the wound body 1 is formed by winding the anisotropic conductive film 2 around the core 3.
- the winding core 3 includes a core material 3a and a pair of side plates 3b.
- the core material 3a is formed in a columnar shape.
- the anisotropic conductive film 2 is wound around the outer peripheral surface of the core material 3a.
- the pair of side plates 3b are attached to both end portions in the axial direction of the core member 3a.
- the pair of side plates 3b supports the anisotropic conductive film 2 from the left and right.
- the distance between the pair of side plates 3 b is slightly wider than the width of the anisotropic conductive film 2.
- the anisotropic conductive film 2 includes a long (tape-like) release film 4 and a plurality of conductive adhesive film pieces 5 provided on the release film 4. And comprising. Since the adhesive film piece 5 has conductivity, the conductive particles 7 are dispersed in the adhesive 6. In plan view, the outer shape of the anisotropic conductive film 2 is defined by the outer shape of the release film 4.
- the release film 4 is attached to the adhesive film piece 5 to support the adhesive film piece 5.
- polyethylene terephthalate (PET), polyethylene, polypropylene, or the like can be used as the material of the release film 4.
- PET polyethylene terephthalate
- the release film 4 may contain an arbitrary filler. Further, the surface of the release film 4 may be subjected to a mold release process, a plasma process, or the like.
- the release film 4 may have light transmittance so that the position of the adhesive film piece 5 can be detected from the release film 4 side by the imaging device 21.
- the transmittance of the release film 4 can be 15% to 100%, preferably 15% to 99%, and more preferably 16% to 98%.
- the transmittance of the release film 4 can be measured as follows. A release film cut into a 50 mm ⁇ 50 mm square is set in a haze meter (for example, NDH-5000 manufactured by Nippon Denshoku Industries Co., Ltd.), and the total light transmittance is measured. The measurement result is defined as the transmittance of the release film 4.
- a haze meter for example, NDH-5000 manufactured by Nippon Denshoku Industries Co., Ltd.
- the haze value of the release film 4 can be 3% or more and 100% or less, preferably 3% or more and 99% or less, and more preferably 4% or more and 99% or less.
- the haze value of the release film 4 can be measured as follows. A release film cut into a 50 mm ⁇ 50 mm square is set in a haze meter (for example, NDH-5000 manufactured by Nippon Denshoku Industries Co., Ltd.), and the haze value is measured. Then, this measurement result is set as the haze value of the release film 4.
- a haze meter for example, NDH-5000 manufactured by Nippon Denshoku Industries Co., Ltd.
- thermoplastic resin for example, a thermoplastic resin, a thermosetting resin, a mixed system of a thermoplastic resin and a thermosetting resin, or a photocurable resin
- thermoplastic resin for example, a styrene resin type or a polyester resin type is used.
- thermosetting resin for example, a epoxy resin system or a silicone resin system is used.
- the conductive particles 7 forming the adhesive film piece 5 for example, metal particles such as Au, Ag, Ni, Cu, Pd, solder, and carbon particles are used. Further, the conductive particles 7 may be those in which the surface of a transition metal such as Ni or Cu is coated with a noble metal such as Au or Pd. Further, the conductive particles 7 may be formed by forming a conductive layer on the surface of the non-conductive particles by a method such as coating the surface of the non-conductive particles such as glass, ceramic, and plastic with a conductive substance. Further, the conductive particles 7 may be one in which the outermost layer is composed of noble metals, one using hot-melt metal particles, or the like.
- the plurality of adhesive film pieces 5 are arranged in the longitudinal direction X of the release film 4.
- the longitudinal direction X of the release film 4 is a direction of unwinding from the wound body 1 of the anisotropic conductive film 2.
- the plurality of adhesive film pieces 5 may be separated in the longitudinal direction X of the release film 4 or may be connected in the longitudinal direction X of the release film 4. As shown in FIG. 2, in the present embodiment, the plurality of adhesive film pieces 5 are separated in the longitudinal direction X of the release film 4. However, the plurality of adhesive film pieces 5 may be connected in the longitudinal direction X of the release film 4 as in the anisotropic conductive film 2A shown in FIG.
- the shape of the adhesive film piece 5 is not particularly limited and can be various shapes. As shown in FIG. 2, in this embodiment, the adhesive film piece 5 is formed in a circle. However, the adhesive film piece 5 may be formed in an ellipse like the anisotropic conductive film 2B1 shown in FIG. 13A, and like the anisotropic conductive film 2C1 shown in FIG. Further, it may be formed in an elongated straight line shape. In these cases, the adhesive film piece 5 is arranged in the longitudinal direction X of the release film 4 like the anisotropic conductive film 2B1 shown in FIG. 13 (a) and the anisotropic conductive film 2C1 shown in FIG. 14 (a).
- the anisotropic conductive film 2B3 shown in FIG. 13 (c) and the anisotropic conductive film 2C3 shown in FIG. 14 (c) can be extended in the longitudinal direction X of the release film 4. You may extend in the direction which inclines with respect.
- the adhesive film piece 5 may be formed with a hole. As shown in FIG. 2, in this embodiment, the adhesive film piece 5 is not formed with a hole. However, as shown in FIG. 18A, the anisotropic conductive film 2G1, the anisotropic conductive film 2G2 shown in FIG. 18B, and the anisotropic conductive film 2G3 shown in FIG. A hole 5 a may be formed in the film piece 5.
- the hole 5a is a part of the adhesive film piece 5 cut out (punched).
- the shape, size, position, number, etc. of the holes 5a are not particularly limited.
- the hole 5 a may be similar to the adhesive film piece 5 or may not be similar to the adhesive film piece 5.
- Examples of the shape of the hole 5a include a circle such as a perfect circle and an ellipse, a polygon such as a triangle and a rectangle, a complicated shape such as a star, and various marks.
- Examples of the quadrangle include a square, a rectangle, and a trapezoid.
- the center of the adhesive film piece 5 may be sufficient as the position of the hole 5a, and the edge part of the adhesive film piece 5 may be sufficient as it.
- the number of holes 5a formed in one adhesive film piece 5 may be one, or two or more. When a plurality of holes 5a are formed in one adhesive film piece 5, the shape, size, etc. of each hole 5a may be the same or different.
- a square hole 5a similar to the adhesive film piece 5 is formed at the center of the adhesive film piece 5 having a square outer shape.
- a circular hole 5a similar to the adhesive film piece 5 is formed at the center of the adhesive film piece 5 having a circular outer shape.
- a circular quadrangular hole 5a is formed at the center of the adhesive film piece 5 having a quadrangular outer shape.
- the plurality of adhesive film pieces 5 may have the same shape or different shapes. As shown in FIG. 2, in this embodiment, the plurality of adhesive film pieces 5 are all the same shape. However, the plurality of adhesive film pieces 5 may have different shapes as in the anisotropic conductive film 2D shown in FIG. In this case, all the adhesive film pieces 5 may have different shapes, or different shapes of adhesive film pieces 5 and the same shape of adhesive film pieces 5 may be mixed.
- the plurality of adhesive film pieces 5 may be arranged at any position in the width direction Y of the release film 4.
- the width direction Y of the release film 4 is a direction orthogonal to the longitudinal direction X of the release film 4 and the thickness direction Z (see FIG. 3) of the release film 4.
- the adhesive film piece 5 is disposed in the central portion in the width direction Y of the release film 4.
- the adhesive film piece 5 may be arrange
- the plurality of adhesive film pieces 5 may be arranged in one row in the width direction of the release film 4, or may be arranged in a plurality of rows in the width direction of the release film 4. As shown in FIG. 2, in the present embodiment, the plurality of adhesive film pieces 5 are arranged in a line in the width direction of the release film 4. However, the plurality of adhesive film pieces 5 may be arranged in two rows in the width direction of the release film 4 as in the anisotropic conductive film 2F1 shown in FIG. 17A.
- the anisotropic film 2F2 may be arranged in three rows in the width direction of the release film 4, and the release film 4 may be arranged like the anisotropic conductive film 2F3 shown in FIG. In the longitudinal direction, the number of arrays in the width direction of the release film 4 may be different.
- the plurality of adhesive film pieces 5 that are separated in the longitudinal direction X of the release film 4 may be arranged at positions that do not overlap each other when viewed from the width direction Y of the release film 4, and are arranged at positions that overlap each other. May be. As shown in FIG. 2, in the present embodiment, the plurality of adhesive film pieces 5 that are separated in the longitudinal direction X of the release film 4 are arranged at positions that do not overlap each other when viewed from the width direction Y of the release film 4. ing. However, the plurality of adhesive film pieces 5 separated in the longitudinal direction X of the release film 4 are formed of the anisotropic conductive film 2B3 shown in FIG. 13 (c) and the anisotropic conductive film 2C3 shown in FIG. 14 (c). Thus, it may be arrange
- the interval A between the plurality of adhesive film pieces 5 in the longitudinal direction X of the release film 4 can be 0.1 mm or more and 10 mm or less, and is 0.1 mm or more and 0.8 mm or less. Is preferable, and more preferably 0.2 mm or more and 0.5 mm or less.
- the interval B between the edge of the release film 4 and the adhesive film piece 5 closest to the end edge in the width direction Y of the release film 4 can be 0.1 mm or more and 10 mm or less, and 0.1 mm or more.
- the thickness is preferably 0.8 mm or less, and more preferably 0.2 mm or more and 0.5 mm or less.
- connection structure 10 includes a first circuit member 11 having a first adhesive surface 11a, a second circuit member 12 having a second adhesive surface 12a, and a first adhesive surface 11a and a second adhesive.
- the adhesive film piece 5 which connects the surface 12a is provided.
- the first circuit member 11 is, for example, a chip component such as an IC chip, an LSI chip, a resistor chip, or a capacitor chip.
- the surface facing the 2nd circuit member 12 is the 1st adhesion surface 11a.
- a first electrode (not shown) for electrical connection with the second circuit member 12 is disposed on the first adhesive surface 11a.
- the second circuit member 12 is, for example, a glass substrate, a polyimide substrate, a polyethylene terephthalate substrate, a polycarbonate substrate, a cycloolefin polymer (COP) substrate, a polyethylene naphthalate substrate, a glass reinforced epoxy substrate, a paper phenol substrate, a ceramic substrate, or a laminate. It is a board
- the surface facing the 1st adhesion surface 11a of the 1st circuit member 11 is the 2nd adhesion surface 12a.
- a second electrode (not shown) for electrical connection with the first circuit member 11 is disposed on the second adhesive surface 12a.
- first circuit member 11 there is no clear distinction between the first circuit member 11 and the second circuit member 12, and any member may be applied to each circuit member.
- first circuit member 11 include a glass substrate, a polyimide substrate, a polyethylene terephthalate substrate, a polycarbonate substrate, a cycloolefin polymer (COP) substrate, a polyethylene naphthalate substrate, a glass reinforced epoxy substrate, a paper phenol substrate, a ceramic substrate, and a laminated layer.
- a light-transmitting substrate such as a plate may be used.
- the second circuit member 12 for example, a chip component such as an IC chip, an LSI chip, a resistor chip, a capacitor chip may be used.
- the adhesive film piece 5 is the adhesive film piece 5 peeled from the anisotropic conductive film 2 described above.
- the adhesive film piece 5 connects the first adhesive surface 11a and the second adhesive surface 12a by the adhesive 6, and the first electrode on the first adhesive surface 11a and the first electrode by the conductive particles 7 dispersed in the adhesive 6.
- the second electrode on the second bonding surface 12a is electrically connected.
- connection structure As shown in FIG. 6, the manufacturing method of a connection structure is equipped with the film manufacturing process (S1) and the connection process (S2) performed after a film manufacturing process (S1).
- the film manufacturing step (S1) a plurality of adhesive film pieces 5 having conductivity are provided on the long release film 4, and the plurality of adhesive film pieces 5 are arranged in the longitudinal direction of the release film 4. Further, the anisotropic conductive film 2 is manufactured. Since the adhesive film piece 5 has anisotropic conductivity, conductive particles 7 are dispersed in the adhesive 6.
- the connecting step (S2) the first adhesive surface 11a of the first circuit member 11 and the second adhesive surface 12a of the second circuit member 12 are connected via the adhesive film piece 5 of the anisotropic conductive film 2. .
- the film manufacturing process (S1) includes an adhesive film layer forming process (S11), an adhesive film layer cutting process (S12) performed after the adhesive film layer forming process (S1), Blank space peeling process (S13) performed after an agent film layer cutting process (S12).
- a release film 4 is prepared as shown in FIGS. 8 (a) and 9 (a).
- 5 A of adhesive film layers which have electroconductivity are formed in the whole surface on the peeling film 4.
- the adhesive film layer 5 ⁇ / b> A is obtained by dispersing conductive particles 7 in an adhesive 6.
- the adhesive 6 and the conductive particles 7 that form the adhesive film layer 5A are the same as the adhesive 6 and the conductive particles 7 that form the adhesive film piece 5 described above.
- the adhesive film layer 5A formed on the release film 4 is replaced with the outer shape of the adhesive film piece 5. Cut along the outline 5B. Thereby, the adhesive film layer 5A is separated into an inner portion 5A1 located inside the outer shape line 5B and a plurality of margin portions 5A2 located outside the outer shape line 5B.
- the inner portion 5 ⁇ / b> A ⁇ b> 1 is a portion that becomes the adhesive film piece 5.
- the blank portion 5 ⁇ / b> A ⁇ b> 2 is a portion other than the adhesive film piece 5.
- the cutting of the adhesive film layer 5A is performed, for example, by pressing the adhesive film layer 5A against a roll cutter having a cutting blade formed on the outer peripheral surface. Thereby, even if the adhesive film piece 5 is a complicated shape, a fine shape, etc., the adhesive film layer 5A can be easily cut along the outline 5B.
- the adhesive film layer 5A is a portion other than the adhesive film piece 5 along the cut outline 5B.
- the blank portion 5A2 is peeled off from the release film 4.
- the blank portion 5A2 is peeled off by, for example, sticking an adhesive tape to the blank portion 5A2, pulling the adhesive tape, and peeling off the blank portion 5A2 from the release film 4.
- the inner portion 5 ⁇ / b> A ⁇ b> 1 remaining on the release film 4 becomes the adhesive film piece 5.
- the anisotropic conductive film 2 in which the some adhesive film piece 5 was provided on the peeling film 4 is manufactured.
- the anisotropic conductive film 2 manufactured in this way is stored and transported as the wound body 1 wound around the core 3, and then taken over in the connection step (S2).
- the anisotropic conductive film 2 may be succeeded to the connection process (S2) without being wound as the wound body 1.
- connection step (S2) includes a position detection step (S21), a pasting step (S22), and an overlapping step (S23).
- the imaging device 21 In the position detection step (S21), first, the anisotropic conductive film 2 is unwound from the wound body 1. Then, as shown in FIG. 11, the position of the adhesive film piece 5 in the anisotropic conductive film is detected by the imaging device 21. At this time, the imaging device 21 may be disposed on the adhesive film piece 5 side with respect to the release film 4 or may be disposed on the opposite side of the adhesive film piece 5 with respect to the release film 4. As shown in FIG. 11, in the present embodiment, the imaging device 21 is disposed on the opposite side of the adhesive film piece 5 with respect to the release film 4. In this case, the imaging device 21 can detect the position of the adhesive film piece 5 in the anisotropic conductive film 2 from the release film 4 side by using the release film 4 having light transmittance.
- the adhesive film piece 5 is attached to the first adhesive surface 11a based on the position detected in the position detecting step (S21). Thereafter, the release film 4 is peeled from the adhesive film piece 5 attached to the first adhesive surface 11a.
- the first adhesive surface 11a and the second adhesive surface 12a are overlapped via the adhesive film piece 5. Thereby, the first adhesive surface 11 a and the second adhesive surface 12 a are temporarily connected by the adhesive 6 of the adhesive film piece 5. Then, by pressing the first circuit member 11 and the second circuit member 12, the first circuit member 11 and the second circuit member 12 are electrically connected by the conductive particles 7 of the adhesive film piece 5, and the adhesive film piece 5. The adhesive 6 is cured by applying heat or light to the adhesive 6. Thereby, the connection structure 10 with which the 1st adhesion surface 11a and the 2nd adhesion surface 12a were connected by the adhesive film piece 5 is obtained.
- a plurality of adhesive film pieces 5 are arranged in the longitudinal direction X of the release film 4 on the long release film 4. For this reason, the shape of the adhesive film piece 5 can be set arbitrarily. Thereby, while being able to affix the adhesive film piece 5 with respect to the adhesive surface of various shapes, the adhesive film piece 5 can be utilized effectively.
- the adhesive film piece 5 when the several adhesive film piece 5 is spaced apart in the longitudinal direction X of the peeling film 4, it does not affect the adjacent adhesive film piece 5, but an adhesive surface
- the adhesive film piece 5 can be affixed to.
- the adhesive film piece 5 can be easily affixed with respect to an adhesive surface.
- the freedom degree of the shape of the adhesive film piece 5 can further be expanded.
- anisotropic conductive film 2 when the some adhesive film piece 5 is arrange
- this anisotropic conductive film 2 when the space
- the adhesive film piece 5 can be easily attached to the adhesive surface.
- the distance is 10 mm or less, the density of the adhesive film piece 5 with respect to the release film 4 can be increased, and more adhesive film pieces 5 can be provided on the release film 4.
- this anisotropic conductive film 2 when the space
- this anisotropic conductive film 2 when the transmittance of the release film 4 is 15% or more, the position of the adhesive film piece 5 can be easily detected from the release film 4 side. On the other hand, when the transmittance of the release film 4 is 100% or less, the release film 4 can be easily produced.
- this anisotropic conductive film 2 when the haze value of the release film 4 is 3% or more, the position of the adhesive film piece 5 can be easily detected from the release film 4 side. On the other hand, when the haze value of the release film 4 is 100% or less, the release film 4 can be easily produced.
- the adhesive film piece 5 can be attached to the adhesive surfaces having various shapes. In addition, the adhesive film piece 5 can be used effectively.
- connection structure 10 In the connection structure 10 according to the present embodiment, the first adhesive surface 11a and the second adhesive surface 12a are connected by the adhesive film piece 5 described above. For this reason, the connection structure 10 in which the adhesive film piece 5 is appropriately attached to the first adhesive surface 11a and the second adhesive surface 12a is obtained regardless of the shapes of the first adhesive surface 11a and the second adhesive surface 12a. be able to.
- the anisotropic conductive film 2 in which a plurality of adhesive film pieces 5 are provided on the release film 4 is manufactured, and the adhesive film of the anisotropic conductive film 2 is manufactured.
- the first adhesive surface 11a and the second adhesive surface 12a are connected via the piece 5.
- the adhesive film piece 5 can set an arbitrary shape, it adheres to the 1st adhesive surface 11a and the 2nd adhesive surface 12a irrespective of the shape of the 1st adhesive surface 11a and the 2nd adhesive surface 12a.
- the connecting structure 10 to which the agent film piece 5 is appropriately attached can be manufactured. Moreover, the adhesive film piece 5 can be utilized effectively.
- the adhesive film layer 5A is formed on the entire surface of the release film 4, the adhesive film layer 5A is cut along the outline 5B, and along the cut outline 5B.
- the blank portion 5A2 is peeled off from the release film 4. Thereby, a plurality of adhesive film pieces 5 can be easily provided on the release film 4.
- connection structure manufacturing method the position of the adhesive film piece 5 in the anisotropic conductive film 2 is detected by the imaging device 21, and the adhesive film piece 5 is attached to the first adhesive surface based on the detected position. Affix to 11a. For this reason, the positional accuracy of the adhesive film piece 5 with respect to the adhesive surface can be increased. And since the 1st adhesive surface 11a and the 2nd adhesive surface 12a are piled up via this adhesive film piece 5, it makes it easy to put the adhesive film piece 5 in the 1st adhesive surface 11a and the 2nd adhesive surface 12a. be able to.
- connection structure manufacturing method since the release film 4 is peeled off from the adhesive film piece 5 after the adhesive film piece 5 is attached to the first adhesive surface 11a, the adhesive film piece 5 can be easily removed. It can be affixed to one adhesive surface 11a.
- the anisotropic conductive film 2 ⁇ / b> H of Modification 1 further includes a second release film piece 8 that covers the adhesive film piece 5. That is, the anisotropic conductive film 2 ⁇ / b> H includes a long release film 4, a plurality of adhesive film pieces 5 provided on the release film 4 in which conductive particles 7 are dispersed, and each adhesive. And a second release film piece 8 provided on the film piece 5.
- the second release film piece 8 is a film that protects the adhesive film piece 5 by covering the surface of the adhesive film piece 5. For this reason, in the first modification, the wound body 1 is formed by winding the anisotropic conductive film 2 ⁇ / b> H around the core 3.
- a release film 4 is prepared as shown in FIG.
- an adhesive film layer 5 ⁇ / b> A is formed on the entire surface of the release film 4.
- the 2nd peeling film 8A is put on the whole surface on the adhesive film layer 5A (it affixes).
- the material of the second release film 8A is the same as that of the second release film piece 8.
- the adhesive film layer 5A and the second release film 8A formed on the release film 4 are externally shaped. Cut along line 5B. Thereby, the adhesive film layer 5A is separated into an inner portion 5A1 located inside the outer shape line 5B and a plurality of margin portions 5A2 located outside the outer shape line 5B. Similarly, the second release film 8A is separated into an inner portion 8A1 located inside the outer shape line 5B and a plurality of margin portions 8A2 located outside the outer shape line 5B.
- the blank peeling step (S13) of the film manufacturing step (S1) the blank portion 5A2 and the blank portion 8A2 are peeled from the release film 4 along the cut outline 5B as shown in FIG. . Then, the inner part 5A1 and the inner part 8A1 remain on the release film 4. The inner part 5A1 and the inner part 8A1 remaining on the release film 4 become the adhesive film piece 5 and the second release film piece 8. Thereby, the anisotropic conductive film 2H by which the some adhesive film piece 5 covered with the 2nd peeling film piece 8 was provided on the peeling film 4 is manufactured.
- the anisotropic conductive film 2H manufactured in this way is stored and transported as a wound body 1 wound around the core 3, and then taken over in the connection step (S2).
- the anisotropic conductive film 2H may be succeeded to the connection step (S2) without being wound as the wound body 1.
- the second peeling film piece peeling step is performed before the sticking step (S22).
- the peeling step first, the second peelable film piece 8 is peeled from the adhesive film piece 5 in the anisotropic conductive film 2H drawn from the wound body 1.
- the peeling of the second release film piece 8 is performed, for example, by sticking the adhesive tape to the second release film piece 8, pulling the adhesive tape, and peeling the second release film piece 8 from the adhesive film piece 5. Can do.
- a peeling process is before a sticking process (S22)
- the subsequent steps are the same as in the above embodiment.
- the adhesive film piece 5 since the surface of the adhesive film piece 5 is covered with the second release film piece 8 in the anisotropic conductive film 2H of Modification 1, the adhesive film piece 5 can be protected. For this reason, in the wound body 1 in which the anisotropic conductive film 2H is wound around the core 3, the adhesive film piece 5 is prevented from being transferred to the release film 4 adjacent to the inner peripheral side or the outer peripheral side. can do.
- the adhesive film layer 5A is formed on the entire surface of the release film 4, the second release film 8A is covered on the entire surface of the adhesive film layer 5A, and the adhesive film layer 5A is applied to the outline 5B.
- the marginal part 5A2 is peeled off from the release film 4 along the cut outline 5B.
- the adhesive film piece 5 can be reliably affixed on the 1st adhesion surface 11a.
- connection step (S2) further includes a film cutting step (S24) performed before the position detection step (S21).
- the anisotropic conductive film 2 is cut into a plurality of anisotropic conductive film pieces 2Z.
- the anisotropic conductive film piece 2 ⁇ / b> Z is a film piece in which one or a plurality of adhesive film pieces 5 are provided on the release film 4.
- the position detection process (S21) following a film cutting process (S24) the position of the adhesive film piece 5 in the anisotropic conductive film piece 2Z is detected by the imaging device 21.
- the anisotropic conductive film piece 2Z only one adhesive film piece 5 may be provided, or two or more adhesive film pieces 5 may be provided. In the present embodiment, only one adhesive film piece 5 is provided on the anisotropic conductive film piece 2Z.
- connection structure manufacturing method since the anisotropic conductive film 2 is cut into a plurality of anisotropic conductive film pieces 2Z, when the adhesive film pieces 5 are pasted at a plurality of locations, It is possible to flexibly cope with the case of changing the sticking direction. And in order to detect the position of the adhesive film piece 5 in the anisotropic conductive film piece 2Z by the imaging device 21, even if the anisotropic conductive film 2 is cut into a plurality of anisotropic conductive film pieces 2Z, the adhesive surface The positional accuracy of the adhesive film piece 5 with respect to can be increased.
- the conductive film according to the present invention has been described as applied to an anisotropic conductive film having anisotropic conductivity.
- the conductive film according to the present invention has different anisotropic conductivity.
- the conductive film is not limited to this. That is, the adhesive film piece and the adhesive film layer are only required to have conductivity, and the conductive particles may not be dispersed in the adhesive.
- the adhesive film piece and the adhesive film layer in this case include metal oxides such as indium tin oxide (ITO), indium oxide, tin oxide, and conductive fibers.
- the conductive fiber include metal fibers such as gold, silver, and platinum, and carbon fibers such as carbon nanotubes.
- SYMBOLS 10 ... Connection structure, 11 ... 1st circuit member, 11a ... 1st adhesion surface, 12 ... 2nd circuit member, 12a ... 2nd adhesion surface, 21 ... Imaging device, X ... Longitudinal direction, Y ... Width direction, Z ... thickness direction.
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Abstract
Description
図1に示すように、巻回体1は、長尺の(テープ状の)異方導電性フィルム2と、異方導電性フィルム2が巻回された巻芯3と、を備える。つまり、巻回体1は、巻芯3に異方導電性フィルム2が巻回されてなる。
図1~図3に示すように、異方導電性フィルム2は、長尺の(テープ状の)剥離フィルム4と、剥離フィルム4上に設けられた複数の導電性を有する接着剤フィルム片5と、を備える。接着剤フィルム片5は、導電性を有するために、接着剤6に導電粒子7が分散されたものである。なお、平面視において、異方導電性フィルム2の外形は、剥離フィルム4の外形により規定される。
図5に示すように、接続構造体10は、第一接着面11aを有する第一回路部材11と、第二接着面12aを有する第二回路部材12と、第一接着面11aと第二接着面12aとを接続する接着剤フィルム片5と、を備える。
図6に示すように、接続構造体の製造方法は、フィルム製造工程(S1)と、フィルム製造工程(S1)の後に行う接続工程(S2)と、を備える。
図19に示すように、変形例1の異方導電性フィルム2Hは、接着剤フィルム片5を覆う第二剥離フィルム片8を更に備えている。つまり、異方導電性フィルム2Hは、長尺の剥離フィルム4と、剥離フィルム4上に設けられて、接着剤6に導電粒子7が分散された複数の接着剤フィルム片5と、各接着剤フィルム片5上に設けられた第二剥離フィルム片8と、を備える。第二剥離フィルム片8は、接着剤フィルム片5の表面を覆うことで接着剤フィルム片5を保護するフィルムである。このため、変形例1では、巻回体1は、この異方導電性フィルム2Hが巻芯3に巻回されてなる。
図21に示すように、変形例2の接続構造体の製造方法では、接続工程(S2)は、位置検出工程(S21)の前に行うフィルム切断工程(S24)を更に備えている。
上記実施形態では、本発明に係る導電性フィルムを、異方導電性を有する異方導電性フィルムに適用したものとして説明したが、本発明に係る導電性フィルムは、異方導電性を有する異方導電性フィルムに限定されるものではない。つまり、接着剤フィルム片及び接着剤フィルム層は、導電性を有していればよく、接着剤に導電粒子が分散されているものでなくてもよい。この場合の接着剤フィルム片及び接着剤フィルム層としては、酸化インジウムスズ(Indium-Tin-Oxide:ITO)、酸化インジュウム、酸化スズ等の金属酸化物、導電性繊維を含むもの、などが挙げられる。この導電性繊維としては、例えば、金、銀、白金等の金属繊維、及びカーボンナノチューブ等の炭素繊維が挙げられる。
Claims (26)
- 長尺の剥離フィルムと、
前記剥離フィルム上に設けられた複数の導電性を有する接着剤フィルム片と、を備え、
前記複数の接着剤フィルム片は、前記剥離フィルムの長手方向に配列されている、
導電性フィルム。 - 前記複数の接着剤フィルム片は、前記剥離フィルムの長手方向に離間している、
請求項1に記載の導電性フィルム。 - 前記複数の接着剤フィルム片は、同じ形をしている、
請求項1又は2に記載の導電性フィルム。 - 前記複数の接着剤フィルム片は、前記剥離フィルムの幅方向における中央部に配置されている、
請求項1~3の何れか一項に記載の導電性フィルム。 - 前記複数の接着剤フィルム片は、前記剥離フィルムの幅方向における端部に配置されている、
請求項1~3の何れか一項に記載の導電性フィルム。 - 前記複数の接着剤フィルム片は、前記剥離フィルムの幅方向にも配列されている、
請求項1~5の何れか一項に記載の導電性フィルム。 - 前記剥離フィルムの長手方向における前記複数の接着剤フィルム片の間隔は、0.1mm以上10mm以下である、
請求項1~6の何れか一項に記載の導電性フィルム。 - 前記剥離フィルムの幅方向における前記剥離フィルムの端縁と当該端縁に最も近い前記接着剤フィルム片との間隔は、0.1mm以上10mm以下である、
請求項1~7の何れか一項に記載の導電性フィルム。 - 前記剥離フィルムは、光透過性を有する、
請求項1~8の何れか一項に記載の導電性フィルム。 - 前記剥離フィルムの透過率は、15%以上100%以下である、
請求項9に記載の導電性フィルム。 - 前記剥離フィルムのヘイズ値は、3%以上100%以下である、
請求項9又は10に記載の導電性フィルム。 - 前記接着剤フィルム片上に設けられた第二剥離フィルム片を更に備える、
請求項1~11の何れか一項に記載の導電性フィルム。 - 前記接着剤フィルム片は、接着剤に導電粒子が分散されている、
請求項1~12の何れか一項に記載の導電性フィルム。 - 請求項1~13の何れか一項に記載の導電性フィルムと、
前記導電性フィルムが巻回された巻芯と、を備える
巻回体。 - 第一接着面を有する第一回路部材と、
第二接着面を有する第二回路部材と、
前記第一接着面と前記第二接着面とを接続する請求項1~13の何れか一項に記載の接着剤フィルム片と、を備える、
接続構造体。 - 長尺の剥離フィルム上に、複数の導電性を有する接着剤フィルム片が設けられるとともに、前記複数の接着剤フィルム片が前記剥離フィルムの長手方向に配列された導電性フィルムを製造するフィルム製造工程と、
前記導電性フィルムの前記接着剤フィルム片を介して第一回路部材の第一接着面と第二回路部材の第二接着面とを接続する接続工程と、を備える、
接続構造体の製造方法。 - 前記接着剤フィルム片は、接着剤に導電粒子が分散されている、
請求項16に記載の接続構造体の製造方法。 - 前記フィルム製造工程は、
前記剥離フィルム上の全面に、導電性を有する接着剤フィルム層を形成する接着剤フィルム層形成工程と、
前記接着剤フィルム層を、前記接着剤フィルム片の外形を成す外形線に沿って切断する接着剤フィルム層切断工程と、
切断された前記外形線に沿って、前記接着剤フィルム層における前記接着剤フィルム片以外の部分となる余白部分を、前記剥離フィルムから剥離する余白剥離工程と、を有する、
請求項16又は17に記載の接続構造体の製造方法。 - 前記接着剤フィルム層は、接着剤に導電粒子が分散されている、
請求項18に記載の接続構造体の製造方法。 - 前記接続工程は、
撮像装置により前記導電性フィルムにおける前記接着剤フィルム片の位置を検出する位置検出工程と、
前記位置検出工程により検出された位置に基づいて、前記接着剤フィルム片を前記第一接着面に貼り付ける貼付工程と、
前記接着剤フィルム片を介して前記第一接着面と前記第二接着面とを重ね合せる重ね合せ工程と、を有する、
請求項16~19の何れか一項に記載の接続構造体の製造方法。 - 前記フィルム製造工程は、前記接着剤フィルム片上に、第二剥離フィルム片が設けられた前記導電性フィルムを製造する、
請求項16又は17に記載の接続構造体の製造方法。 - 前記フィルム製造工程は、
前記剥離フィルム上の全面に、導電性を有する接着剤フィルム層を形成し、更に、前記接着剤フィルム層上の全面に、第二剥離フィルムを被せる接着剤フィルム層形成工程と、
前記接着剤フィルム層及び前記第二剥離フィルムを、前記接着剤フィルム片の外形を成す外形線に沿って切断する接着剤フィルム層切断工程と、
切断された前記外形線に沿って、前記接着剤フィルム層及び前記第二剥離フィルムにおける前記接着剤フィルム片以外の部分となる余白部分を、前記剥離フィルムから剥離する余白剥離工程と、を有する、
請求項21に記載の接続構造体の製造方法。 - 前記接着剤フィルム層は、接着剤に導電粒子が分散されている、
請求項22に記載の接続構造体の製造方法。 - 前記接続工程は、
撮像装置により前記導電性フィルムにおける前記接着剤フィルム片の位置を検出する位置検出工程と、
前記位置検出工程により検出された位置に基づいて、前記接着剤フィルム片を前記第一接着面に貼り付ける貼付工程と、
前記接着剤フィルム片を介して前記第一接着面と前記第二接着面とを重ね合せる重ね合せ工程と、
前記貼付工程の前に、前記接着剤フィルム片から前記第二剥離フィルム片を剥離する第二剥離フィルム片剥離工程と、を有する、
請求項21~23の何れか一項に記載の接続構造体の製造方法。 - 前記貼付工程では、当該接着剤フィルム片を前記第一接着面に貼り付けた後、前記接着剤フィルム片から前記剥離フィルムを剥離する、
請求項20又は24に記載の接続構造体の製造方法。 - 前記接続工程は、前記位置検出工程の前に、前記導電性フィルムを、前記剥離フィルムに1又は複数の前記接着剤フィルム片が設けられた複数の導電性フィルム片に切断するフィルム切断工程を更に有し、
前記位置検出工程では、前記撮像装置により前記導電性フィルム片における前記接着剤フィルム片の位置を検出する、
請求項20,24又は25に記載の接続構造体の製造方法。
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019151745A (ja) * | 2018-03-02 | 2019-09-12 | 日東電工株式会社 | 剥離材付き接着シートの巻回体 |
JP2019210416A (ja) * | 2018-06-07 | 2019-12-12 | 日立化成株式会社 | 接着剤シート |
WO2020213574A1 (ja) * | 2019-04-16 | 2020-10-22 | 北川工業株式会社 | 貼着体保持部材 |
JP7151919B1 (ja) | 2022-03-04 | 2022-10-12 | 昭和電工マテリアルズ株式会社 | フィルムの製造方法、フィルム、巻回体、接続構造体、及び接続構造体の製造方法 |
JP2022186740A (ja) * | 2016-10-03 | 2022-12-15 | 昭和電工マテリアルズ株式会社 | 導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7204204B2 (ja) * | 2019-04-16 | 2023-01-16 | 北川工業株式会社 | 貼着装置 |
USD962882S1 (en) * | 2019-11-14 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
KR20210121799A (ko) * | 2020-03-31 | 2021-10-08 | 동우 화인켐 주식회사 | 도전성 필름 적층체 및 이의 제조 방법 |
USD962883S1 (en) * | 2020-11-02 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
CN116209237B (zh) * | 2022-12-29 | 2023-10-27 | 东莞市富颖电子材料有限公司 | 一种元器件点胶贴及其制备工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1192716A (ja) * | 1997-09-19 | 1999-04-06 | Nippon Avionics Co Ltd | 貼着物の貼着装置 |
JP2004277573A (ja) * | 2003-03-17 | 2004-10-07 | Sony Chem Corp | 接着剤及び電気装置 |
JP2007246551A (ja) * | 2006-03-13 | 2007-09-27 | Sony Chemical & Information Device Corp | 接着剤層の貼付方法及び接着フィルム |
JP2009004767A (ja) * | 2007-05-24 | 2009-01-08 | Sony Chemical & Information Device Corp | 電気装置、接続方法及び接着フィルム |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03285977A (ja) | 1990-04-02 | 1991-12-17 | Three Bond Co Ltd | 異方導電性フィルム状接着剤 |
TW226406B (ja) * | 1991-04-12 | 1994-07-11 | Minnesota Mining & Mfg | |
US5275856A (en) * | 1991-11-12 | 1994-01-04 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive web |
JP3285977B2 (ja) | 1992-12-21 | 2002-05-27 | 株式会社東芝 | 負荷時タップ切換器の蓄勢装置 |
JP3562615B2 (ja) * | 1997-10-15 | 2004-09-08 | 日立化成工業株式会社 | 異方導電性膜状接続部材およびその製造方法 |
JP2003142176A (ja) * | 2001-10-31 | 2003-05-16 | Optrex Corp | 異方性導電膜構造 |
JP4333140B2 (ja) * | 2003-01-08 | 2009-09-16 | 日立化成工業株式会社 | 接着剤テープの製造方法 |
US20050255275A1 (en) | 2004-05-14 | 2005-11-17 | Downs John P | Adhesive dispensing tape including a transparent carrier material |
JP2007030085A (ja) * | 2005-07-25 | 2007-02-08 | Pioneer Electronic Corp | 粘着フィルム切出装置、配線接続装置、粘着フィルム切出方法、配線接続方法及び平面表示装置の製造方法 |
EP2374856B1 (en) | 2007-03-27 | 2014-07-16 | Interface, Inc. | System and method for floor covering installation |
JP5222490B2 (ja) | 2007-04-25 | 2013-06-26 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
JP5049176B2 (ja) * | 2008-03-27 | 2012-10-17 | ソニーケミカル&インフォメーションデバイス株式会社 | 接合体及びその製造方法、並びに、異方性導電材料及びその製造方法 |
JP4988793B2 (ja) * | 2009-07-06 | 2012-08-01 | ソニーケミカル&インフォメーションデバイス株式会社 | 電気装置 |
JP2011029207A (ja) * | 2010-11-02 | 2011-02-10 | Sony Chemical & Information Device Corp | フィルム積層体、フィルム積層体の貼付方法、フィルム積層体を用いた接続方法及び接続構造体 |
JP5816456B2 (ja) * | 2011-05-12 | 2015-11-18 | デクセリアルズ株式会社 | 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体 |
CN107189562B (zh) | 2012-08-29 | 2021-01-19 | 迪睿合电子材料有限公司 | 各向异性导电膜及其制备方法 |
JP6289831B2 (ja) * | 2013-07-29 | 2018-03-07 | デクセリアルズ株式会社 | 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法 |
JP2015135748A (ja) | 2014-01-17 | 2015-07-27 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体、接続構造体の製造方法、及び接続構造体の製造装置 |
JP2016001574A (ja) * | 2014-06-12 | 2016-01-07 | 株式会社デンソー | ラミネート外装電池 |
WO2016068083A1 (ja) * | 2014-10-31 | 2016-05-06 | デクセリアルズ株式会社 | 異方性導電フィルム |
US9620404B1 (en) * | 2015-12-09 | 2017-04-11 | Intel Corporation | Stiffener tape for electronic assembly that includes wafer or panel |
KR20230148853A (ko) * | 2016-10-03 | 2023-10-25 | 가부시끼가이샤 레조낙 | 도전성 필름, 권회체, 접속 구조체 및 접속 구조체의 제조 방법 |
-
2017
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-
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-
2023
- 2023-03-29 JP JP2023054094A patent/JP7306594B1/ja active Active
- 2023-09-06 JP JP2023144680A patent/JP7420310B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1192716A (ja) * | 1997-09-19 | 1999-04-06 | Nippon Avionics Co Ltd | 貼着物の貼着装置 |
JP2004277573A (ja) * | 2003-03-17 | 2004-10-07 | Sony Chem Corp | 接着剤及び電気装置 |
JP2007246551A (ja) * | 2006-03-13 | 2007-09-27 | Sony Chemical & Information Device Corp | 接着剤層の貼付方法及び接着フィルム |
JP2009004767A (ja) * | 2007-05-24 | 2009-01-08 | Sony Chemical & Information Device Corp | 電気装置、接続方法及び接着フィルム |
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JP7347618B2 (ja) | 2016-10-03 | 2023-09-20 | 株式会社レゾナック | 導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法 |
JP2022186740A (ja) * | 2016-10-03 | 2022-12-15 | 昭和電工マテリアルズ株式会社 | 導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法 |
JP2019151745A (ja) * | 2018-03-02 | 2019-09-12 | 日東電工株式会社 | 剥離材付き接着シートの巻回体 |
JP2019210416A (ja) * | 2018-06-07 | 2019-12-12 | 日立化成株式会社 | 接着剤シート |
JP7020305B2 (ja) | 2018-06-07 | 2022-02-16 | 昭和電工マテリアルズ株式会社 | 接着剤シート |
WO2020213574A1 (ja) * | 2019-04-16 | 2020-10-22 | 北川工業株式会社 | 貼着体保持部材 |
JP2020175968A (ja) * | 2019-04-16 | 2020-10-29 | 北川工業株式会社 | 貼着体保持部材 |
JP7227608B2 (ja) | 2019-04-16 | 2023-02-22 | 北川工業株式会社 | 貼着体保持部材 |
WO2023022076A1 (ja) * | 2021-08-16 | 2023-02-23 | 昭和電工マテリアルズ株式会社 | 接着剤シート及びその製造方法、巻回体、並びに、接続構造体の製造方法 |
WO2023153512A1 (ja) * | 2022-02-14 | 2023-08-17 | 株式会社レゾナック | 接着フィルム及び接着フィルムの製造方法 |
JP7231097B1 (ja) | 2022-03-04 | 2023-03-01 | 株式会社レゾナック | フィルム、巻回体、接続構造体、及び接続構造体の製造方法 |
WO2023167281A1 (ja) * | 2022-03-04 | 2023-09-07 | 株式会社レゾナック | フィルムの製造方法、フィルム、巻回体、接続構造体、接続構造体の製造方法、及び除去装置 |
JP2023129195A (ja) * | 2022-03-04 | 2023-09-14 | 株式会社レゾナック | フィルム、巻回体、接続構造体、及び接続構造体の製造方法 |
JP2023128969A (ja) * | 2022-03-04 | 2023-09-14 | 株式会社レゾナック | フィルムの製造方法、フィルム、巻回体、接続構造体、及び接続構造体の製造方法 |
JP7151919B1 (ja) | 2022-03-04 | 2022-10-12 | 昭和電工マテリアルズ株式会社 | フィルムの製造方法、フィルム、巻回体、接続構造体、及び接続構造体の製造方法 |
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WO2023248337A1 (ja) * | 2022-06-21 | 2023-12-28 | 株式会社レゾナック | フィルム、巻回体、接続構造体、及び接続構造体の製造方法 |
Also Published As
Publication number | Publication date |
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KR20230148853A (ko) | 2023-10-25 |
US20190241771A1 (en) | 2019-08-08 |
TW202226673A (zh) | 2022-07-01 |
JPWO2018066411A1 (ja) | 2019-08-29 |
KR20190060810A (ko) | 2019-06-03 |
TWI830173B (zh) | 2024-01-21 |
JP7420310B2 (ja) | 2024-01-23 |
JP2023168351A (ja) | 2023-11-24 |
KR102529006B1 (ko) | 2023-05-04 |
JP7305957B2 (ja) | 2023-07-11 |
KR20230062892A (ko) | 2023-05-09 |
US20230137299A1 (en) | 2023-05-04 |
JP7306594B1 (ja) | 2023-07-11 |
CN114507488A (zh) | 2022-05-17 |
CN109790425B (zh) | 2022-03-04 |
TWI761376B (zh) | 2022-04-21 |
JP2022186740A (ja) | 2022-12-15 |
KR20220032121A (ko) | 2022-03-15 |
CN109790425A (zh) | 2019-05-21 |
KR102522541B1 (ko) | 2023-04-17 |
US11667817B2 (en) | 2023-06-06 |
JP7347618B2 (ja) | 2023-09-20 |
TW201817088A (zh) | 2018-05-01 |
JP2023101416A (ja) | 2023-07-20 |
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