TW201817088A - 導電性膜、捲繞體、連接結構體及連接結構體的製造方法 - Google Patents

導電性膜、捲繞體、連接結構體及連接結構體的製造方法 Download PDF

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TW201817088A
TW201817088A TW106134022A TW106134022A TW201817088A TW 201817088 A TW201817088 A TW 201817088A TW 106134022 A TW106134022 A TW 106134022A TW 106134022 A TW106134022 A TW 106134022A TW 201817088 A TW201817088 A TW 201817088A
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film
adhesive
adhesive film
conductive
release
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TW106134022A
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TWI761376B (zh
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立澤貴
松田和也
土田豊
関貴志
島村充芳
篠原研吾
白川哲之
川端泰典
松本悟
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日商日立化成股份有限公司
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Abstract

導電性膜具備長條的剝離膜、以及設置於剝離膜上的具有導電性的多個接著劑膜片。並且,多個接著劑膜片排列於剝離膜的長邊方向X上。因此,可任意地設定接著劑膜片的形狀。藉此,可對形狀多樣的接著面貼附接著劑膜片,並且可有效利用接著劑膜片。

Description

導電性膜、捲繞體、連接結構體及連接結構體的製造方法
本發明是有關於一種導電性膜、捲繞體、連接結構體及連接結構體的製造方法。
當將積體電路(integrated circuit,IC)晶片等第一電路構件與玻璃基板等第二電路構件連接來製造連接結構體時,有時使用各向異性導電性膜等導電性膜(例如參照專利文獻1、專利文獻2)。導電性膜是於長條的剝離膜的整個面形成有接著劑膜者。各向異性導電性膜是於長條的剝離膜的整個面形成有於接著劑中分散有導電粒子的接著劑膜者。導電性膜作為捲繞於捲芯的捲繞體而提供,當將第一電路構件與第二電路構件連接時,自捲繞體捲出。並且,將導電性膜的接著劑膜貼附於第一電路構件的接著面,其後,隔著接著劑膜來將第一電路構件的接著面與第二電路構件的接著面重合。 [現有技術文獻] [專利文獻]
專利文獻1:日本專利特開2008-274019號公報 專利文獻2:日本專利特開2015-135748號公報
[發明所欲解決之課題] 但,根據連接結構體的種類不同,貼附接著劑膜的接著面的形狀不同。因此,若於剝離膜的整個面形成有接著劑膜,則僅可於具有與剝離膜相同的寬度的矩形的接著面貼附接著劑膜。於接著面的形狀並非具有與剝離膜相同的寬度的矩形的情況下,剝離膜上所形成的接著劑膜內,僅將一部分接著劑膜貼附於接著面。因此,剩餘的接著劑膜浪費了。
因此,本發明的一側面的目的在於提供一種可對形狀多樣的接著面貼附接著劑膜,並且可有效利用接著劑膜的導電性膜、捲繞體、連接結構體及連接結構體的製造方法。 [解決課題之手段]
本發明的一側面的導電性膜具備長條的剝離膜、以及設置於剝離膜上的多個具有導電性的接著劑膜片,多個接著劑膜片排列於剝離膜的長邊方向上。
該導電性膜中,於長條的剝離膜上,多個接著劑膜片排列於剝離膜的長邊方向上。因此,可任意地設定接著劑膜片的形狀。藉此,可對形狀多樣的接著面貼附接著劑膜片,並且可有效利用接著劑膜片。
所述導電性膜中,多個接著劑膜片可於剝離膜的長邊方向上隔開配置。該導電性膜中,多個接著劑膜片在剝離膜的長邊方向上隔開配置,因此可不會對相鄰的接著劑膜片造成影響地將接著劑膜片貼附於接著面。藉此,可對接著面容易地貼附接著劑膜片。另外,可進一步擴展接著劑膜片的形狀的自由度。
所述導電性膜中,多個接著劑膜片可呈相同形狀。該導電性膜中,多個接著劑膜片呈相同形狀,因此可對呈相同形狀的多個接著面有效率地貼附接著劑膜片。
所述導電性膜中,多個接著劑膜片可配置於剝離膜的寬度方向上的中央部。該導電性膜中,多個接著劑膜片配置於剝離膜的寬度方向上的中央部,因此可容易地進行當將接著劑膜片貼附於接著面時的導電性膜對接著面的定位。
所述導電性膜中,多個接著劑膜片可配置於剝離膜的寬度方向上的端部。該導電性膜中,多個接著劑膜片配置於剝離膜的寬度方向上的端部,因此即便於接著面的其中一方向側並無充分的空間的情況下,亦可容易地將接著劑膜片貼附於接著面。
所述導電性膜中,多個接著劑膜片亦可排列於剝離膜的寬度方向上。該導電性膜中,多個接著劑膜片亦排列於剝離膜的寬度方向上,因此可提高接著劑膜片對剝離膜的密度。藉此,可於剝離膜上設置更多的接著劑膜片。
所述導電性膜中,剝離膜的長邊方向上的多個接著劑膜片的間隔可為0.1 mm以上、10 mm以下。該導電性膜中,剝離膜的長邊方向上的多個接著劑膜片的間隔為0.1 mm以上,因此可不會對相鄰的接著劑膜片造成影響地將接著劑膜片容易地貼附於接著面。另一方面,該間隔為10 mm以下,因此可提高接著劑膜片對剝離膜的密度,而於剝離膜上設置更多的接著劑膜片。
所述導電性膜中,剝離膜的寬度方向上的剝離膜的端緣與最接近該端緣的接著劑膜片的間隔可為0.1 mm以上、10 mm以下。該導電性膜中,剝離膜的寬度方向上的剝離膜的端緣與最接近該端緣的接著劑膜片的間隔為0.1 mm以上,因此即便剝離膜的端部與其他構件發生干涉等,亦可抑制接著劑膜片自剝離膜剝離。另一方面,該間隔為10 mm以下,因此可於剝離膜上有效率地設置接著劑膜片。
但,當將接著劑膜片高精度地貼附於接著面時,需要確定導電性膜上的接著劑膜片的位置。因此,考慮藉由攝像裝置來檢測導電性膜上的接著劑膜片的位置。然而,若考慮其後將接著劑膜片貼附於接著面,則較佳為於剝離膜的與接著劑膜片相反的一側配置攝像裝置。因此,所述導電性膜中,剝離膜可設為具有透光性者。該導電性膜中,剝離膜設為具有透光性者,因此,即便將攝像裝置配置於剝離膜的與接著劑膜片相反的一側,亦能夠藉由該攝像裝置來檢測導電性膜上的接著劑膜片的位置。
所述導電性膜中,剝離膜的透過率可為15%以上、100%以下。該導電性膜中,剝離膜的透過率為15%以上,因此可容易地自剝離膜側檢測接著劑膜片的位置。另一方面,剝離膜的透過率為100%以下,因此可容易地製作剝離膜。
所述導電性膜中,剝離膜的霧度值可為3%以上、100%以下。該導電性膜中,剝離膜的霧度值為3%以上,因此可容易地自剝離膜側檢測接著劑膜片的位置。另一方面,剝離膜的霧度值為100%以下,因此可容易地製作剝離膜。
所述導電性膜可更具備設置於接著劑膜片上的第二剝離膜片。該導電性膜中,接著劑膜片的表面被第二剝離膜片覆蓋,因此可保護接著劑膜片。因此,例如於將導電性膜捲繞為捲繞體的情況下,可抑制接著劑膜片被轉印至鄰接於內周側或外周側的剝離膜。
所述導電性膜中,接著劑膜片可於接著劑中分散有導電粒子。該導電性膜中,接著劑膜片於接著劑中分散有導電粒子,因此可設為具有各向異性導電性者。
本發明的一側面的捲繞體具備所述任一導電性膜、以及捲繞有導電性膜的捲芯。
該捲繞體中,於捲芯上捲繞有所述任一導電性膜,因此可對形狀多樣的接著面貼附接著劑膜片,並且可有效利用接著劑膜片。
本發明的一側面的連接結構體具備:具有第一接著面的第一電路構件、具有第二接著面的第二電路構件、以及將第一接著面與第二接著面連接的所述任一接著劑膜片。
該連接結構體中,藉由所述任一接著劑膜片,將第一接著面與第二接著面連接。因此,可獲得不論第一接著面及第二接著面的形狀如何,而於第一接著面及第二接著面適當地貼附有接著劑膜片的連接結構體。
本發明的一側面的連接結構體的製造方法包括:膜製造步驟,製造於長條的剝離膜上設置多個具有導電性的接著劑膜片,並且多個接著劑膜片排列於剝離膜的長邊方向上的導電性膜;以及連接步驟,隔著導電性膜的接著劑膜片來連接第一電路構件的第一接著面與第二電路構件的第二接著面。
該連接結構體的製造方法中,製造於剝離膜上設置有多個接著劑膜片的導電性膜,隔著該導電性膜的接著劑膜片來連接第一接著面與第二接著面。並且,接著劑膜片可任意地設定形狀,因此可製造不論第一接著面及第二接著面的形狀如何,而於第一接著面及第二接著面適當地貼附有接著劑膜片的連接結構體。另外,可有效地利用接著劑膜片。
所述連接結構體的製造方法中,接著劑膜片可於接著劑中分散有導電粒子。該連接結構體的製造方法中,接著劑膜片於接著劑中分散有導電粒子,因此可設為具有各向異性導電性者。
所述連接結構體的製造方法中,膜製造步驟可具有:接著劑膜層形成步驟,於剝離膜上的整個面形成具有導電性的接著劑膜層;接著劑膜層切斷步驟,沿形成接著劑膜片的外形的外形線切斷接著劑膜層;以及邊緣剝離步驟,沿經切斷的外形線將接著劑膜層上的成為接著劑膜片以外的部分的邊緣部分自剝離膜剝離。該連接結構體的製造方法中,於剝離膜上的整個面形成接著劑膜層,沿外形線切斷接著劑膜層,沿切斷的外形線將邊緣部分自剝離膜剝離。藉此,可容易地於剝離膜上設置多個接著劑膜片。
所述連接結構體的製造方法中,接著劑膜層可於接著劑中分散有導電粒子。該連接結構體的製造方法中,接著劑膜層於接著劑中分散有導電粒子,因此切斷接著劑膜層而成的接著劑膜片可設為具有各向異性導電性者。
所述連接結構體的製造方法中,連接步驟可具有:位置檢測步驟,藉由攝像裝置來檢測導電性膜上的接著劑膜片的位置;貼附步驟,基於藉由位置檢測步驟所檢測出的位置來將接著劑膜片貼附於第一接著面;以及重合步驟,隔著接著劑膜片來將第一接著面與第二接著面重合。該連接結構體的製造方法中,藉由攝像裝置來檢測導電性膜上的接著劑膜片的位置,基於該檢測出的位置來將接著劑膜片貼附於第一接著面。因此,可提高接著劑膜片相對於接著面的位置精度。並且,隔著該接著劑膜片來將第一接著面與第二接著面重合,因此可容易地將接著劑膜片收入第一接著面及第二接著面內。
所述連接結構體的製造方法中,膜製造步驟可製造於接著劑膜片上設置有第二剝離膜片的導電性膜。該連接結構體的製造方法中,接著劑膜片的表面被第二剝離膜片覆蓋,因此可保護接著劑膜片。因此,例如於導電性膜捲繞為捲繞體的情況下,可抑制接著劑膜片被轉印至鄰接於內周側或外周側的剝離膜。
所述連接結構體的製造方法中,膜製造步驟可具有:接著劑膜層形成步驟,於剝離膜上的整個面形成具有導電性的接著劑膜層,進而於接著劑膜層上的整個面覆蓋第二剝離膜;接著劑膜層切斷步驟,沿形成接著劑膜片的外形的外形線切斷接著劑膜層及第二剝離膜;以及邊緣剝離步驟,沿經切斷的外形線將接著劑膜層及第二剝離膜上的成為接著劑膜片以外的部分的邊緣部分自剝離膜剝離。該連接結構體的製造方法中,於剝離膜上的整個面形成接著劑膜層,於接著劑膜層上的整個面覆蓋第二剝離膜,沿外形線切斷接著劑膜層,沿切斷的外形線將邊緣部分自剝離膜剝離。藉此,可容易地於剝離膜上設置多個接著劑膜片,並且可於接著劑膜片上覆蓋第二剝離膜片。
所述連接結構體的製造方法中,接著劑膜層可於接著劑中分散有導電粒子。該連接結構體的製造方法中,接著劑膜層於接著劑中分散有導電粒子,因此切斷接著劑膜層而成的接著劑膜片可設為具有各向異性導電性者。
所述連接結構體的製造方法中,連接步驟可具有:位置檢測步驟,藉由攝像裝置來檢測導電性膜上的接著劑膜片的位置;貼附步驟,基於藉由位置檢測步驟所檢測出的位置來將接著劑膜片貼附於第一接著面;重合步驟,隔著接著劑膜片來將第一接著面與第二接著面重合;以及第二剝離膜片剝離步驟,於貼附步驟之前將第二剝離膜片自接著劑膜片剝離。該連接結構體的製造方法中,藉由攝像裝置來檢測導電性膜上的接著劑膜片的位置,基於該檢測出的位置來將接著劑膜片貼附於第一接著面。因此,可提高接著劑膜片相對於接著面的位置精度。並且,隔著該接著劑膜片來將第一接著面與第二接著面重合,因此可容易地將接著劑膜片收入第一接著面及第二接著面內。並且,於貼附步驟之前將第二剝離膜片自接著劑膜片剝離,因此可將接著劑膜片確實地貼附於第一接著面。
所述連接結構體的製造方法中,貼附步驟可於將該接著劑膜片貼附於第一接著面後,將剝離膜自接著劑膜片剝離。該連接結構體的製造方法中,於將接著劑膜片貼附於第一接著面後將剝離膜自接著劑膜片剝離,因此可容易地將接著劑膜片貼附於第一接著面。
所述連接結構體的製造方法中,連接步驟可更具有膜切斷步驟,於位置檢測步驟之前,將導電性膜切斷為於剝離膜上設置有一個或多個接著劑膜片的多個導電性膜片,位置檢測步驟中可藉由攝像裝置來檢測導電性膜片上的接著劑膜片的位置。該連接結構體的製造方法中,將導電性膜切斷為多個導電性膜片,因此即便於在多個地方貼附接著劑膜片的情況、欲改變接著劑膜片的貼附方向的情況等下,亦可靈活地應對。並且,藉由攝像裝置來檢測導電性膜片上的接著劑膜片的位置,因此,即便將導電性膜切斷為多個導電性膜片,亦可提高接著劑膜片相對於接著面的位置精度。 [發明的效果]
根據本發明,可對形狀多樣的接著面貼附接著劑膜,並且可有效利用接著劑膜。
以下,參照圖式對本發明的適宜的實施方式加以詳細說明。本實施方式將本發明的導電性膜應用於具有各向異性導電性的各向異性導電性膜。其中,本發明的導電性膜能夠應用於不具有各向異性導電性的各種導電性膜。再者,圖式中,對相同或相當部分標注同一符號,省略重覆的說明。另外,圖式中,為了容易理解說明,適宜變更尺寸比例等。
[捲繞體] 如圖1所示,捲繞體1具備長條的(帶狀的)各向異性導電性膜2、以及捲繞有各向異性導電性膜2的捲芯3。即,捲繞體1是於捲芯3上捲繞有各向異性導電性膜2而成。
捲芯3具備芯材3a、以及一對側板3b。芯材3a形成為圓柱狀。各向異性導電性膜2捲繞於芯材3a的外周面。一對側板3b安裝於芯材3a的軸線方向上的兩端部。一對側板3b自左右支撐各向異性導電性膜2。一對側板3b的間隔略微寬於各向異性導電性膜2的寬度。
[各向異性導電性膜] 如圖1~圖3所示,各向異性導電性膜2具備長條的(帶狀的)剝離膜4、以及設置於剝離膜4上的多個具有導電性的接著劑膜片5。接著劑膜片5為了具有導電性而於接著劑6中分散有導電粒子7。再者,俯視時,各向異性導電性膜2的外形由剝離膜4的外形規定。
剝離膜4貼附於接著劑膜片5,支撐接著劑膜片5。剝離膜4的原材料例如可使用聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚乙烯、聚丙烯等。剝離膜4中可含有任意的填充劑。另外,對於剝離膜4的表面,可實施脫模處理、電漿處理等。
但是,當將接著劑膜片5高精度地貼附於接著對象(未圖示)的接著面(未圖示)時,需要確定各向異性導電性膜2上的接著劑膜片5的位置。因此,考慮藉由攝像裝置21(參照圖11)來檢測各向異性導電性膜2上的接著劑膜片5的位置。然而,若考慮其後將接著劑膜片5貼附於接著面,則較佳為於剝離膜4的與接著劑膜片5相反的一側配置攝像裝置21。
因此,剝離膜4可具有透光性,以便可藉由攝像裝置21自剝離膜4側檢測接著劑膜片5的位置。
該情況下,剝離膜4的透過率可設為15%以上、100%以下,較佳為設為15%以上、99%以下,更佳為設為16%以上、98%以下。
剝離膜4的透過率可以如下方式測定。於霧度計(例如日本電色工業股份有限公司製造的NDH-5000)上安置切斷為50 mm×50 mm的正方形的剝離膜,測定總透光率。並且,將該測定結果設為剝離膜4的透過率。
另外,剝離膜4的霧度值可設為3%以上、100%以下,較佳為設為3%以上、99%以下,更佳為設為4%以上、99%以下。
剝離膜4的霧度值可以如下方式測定。於霧度計(例如日本電色工業股份有限公司製造的NDH-5000)上安置切斷為50 mm×50 mm的正方形的剝離膜,測定霧度值。並且,將該測定結果設為剝離膜4的霧度值。
作為形成接著劑膜片5的接著劑6,例如可使用熱塑性樹脂、熱硬化性樹脂、熱塑性樹脂及熱硬化性樹脂的混合系、光硬化性樹脂。作為熱塑性樹脂,例如可使用苯乙烯樹脂系、聚酯樹脂系。作為熱硬化性樹脂,例如可使用環氧樹脂系、矽酮樹脂系。於使用熱塑性樹脂、熱硬化性樹脂的情況下,通常需要加熱加壓。對於熱塑性樹脂而言,目的在於使樹脂流動而獲得與被附著體的密接力,另外對於熱硬化性樹脂而言,目的在於進一步進行樹脂的硬化反應。另外,光硬化性樹脂於硬化中不需要加熱,因而於謀求低溫下的連接的情況下有用。
作為形成接著劑膜片5的導電粒子7,例如可使用Au、Ag、Ni、Cu、Pd、焊料等金屬粒子、碳粒子。另外,導電粒子7亦可為利用Au、Pd等貴金屬類被覆Ni、Cu等過渡金屬類的表面者。另外,導電粒子7亦可為藉由利用導電物質被覆玻璃、陶瓷、塑膠等非導電粒子的表面等方法,而於非導電粒子表面形成導通層者。導電粒子7進而亦可為利用貴金屬類構成最外層者、使用熱熔融金屬粒子者等。
多個接著劑膜片5排列於剝離膜4的長邊方向X上。剝離膜4的長邊方向X是指各向異性導電性膜2自捲繞體1卷出的方向。
此處,多個接著劑膜片5可於剝離膜4的長邊方向X上隔開配置,亦可於剝離膜4的長邊方向X上連接。如圖2所示,本實施方式中,多個接著劑膜片5於剝離膜4的長邊方向X上隔開配置。然而,多個接著劑膜片5亦可如圖12所示的各向異性導電性膜2A般,於剝離膜4的長邊方向X上連接。
另外,接著劑膜片5的形狀並無特別限定,可設為各種形狀。如圖2所示,本實施方式中,接著劑膜片5形成為圓形。然而,接著劑膜片5亦可如圖13(a)所示的各向異性導電性膜2B1般形成為橢圓,亦可如圖14(a)所示的各向異性導電性膜2C1般形成為細長的直線狀。該些情況下,接著劑膜片5可如圖13(a)所示的各向異性導電性膜2B1及圖14(a)所示的各向異性導電性膜2C1般,於剝離膜4的相對於長邊方向X正交的方向上延伸,亦可如圖13(b)所示的各向異性導電性膜2B2及圖14(b)所示的各向異性導電性膜2C2般,於剝離膜4的與長邊方向X平行的方向上延伸,亦可如圖13(c)所示的各向異性導電性膜2B3及圖14(c)所示的各向異性導電性膜2C3般,於剝離膜4的相對於長邊方向X傾斜的方向上延伸。
另外,接著劑膜片5亦可形成有孔。如圖2所示,本實施方式中,接著劑膜片5未形成有孔。然而,亦可如圖18(a)所示的各向異性導電性膜2G1、圖18(b)所示的各向異性導電性膜2G2、及圖18(c)所示的各向異性導電性膜2G3般,於接著劑膜片5形成有孔5a。孔5a為接著劑膜片5的一部分打通(打穿)者。孔5a的形狀、大小、位置、數量等並無特別限定。例如,孔5a可為與接著劑膜片5相似的形狀,亦可並非與接著劑膜片5相似的形狀。作為孔5a的形狀,可列舉正圓、橢圓等圓形,三角形、四邊形等多邊形,星形、各種標記等複雜的形狀等。作為四邊形,可列舉正方形、長方形、梯形等。孔5a的位置可為接著劑膜片5的中央部,亦可為接著劑膜片5的端部。一個接著劑膜片5上所形成的孔5a的數量可為一個,亦可為兩個以上。於一個接著劑膜片5上形成有多個孔5a的情況下,各孔5a的形狀、大小等可相同亦可不同。圖18(a)所示的各向異性導電性膜2G1中,於具有四邊形的外形的接著劑膜片5的中央部形成有與接著劑膜片5相似的四邊形的孔5a。圖18(b)所示的各向異性導電性膜2G2中,於具有圓形的外形的接著劑膜片5的中央部形成有與接著劑膜片5相似的圓形的孔5a。圖18(c)所示的各向異性導電性膜2G3中,於具有四邊形的外形的接著劑膜片5的中央部形成有圓形的四邊形的孔5a。
另外,多個接著劑膜片5可為相同的形狀,亦可為不同的形狀。如圖2所示,本實施方式中,多個接著劑膜片5全部為相同的形狀。然而,多個接著劑膜片5亦可如圖15所示的各向異性導電性膜2D般為不同的形狀。該情況下,可為所有的接著劑膜片5互為不同的形狀,亦可為不同形狀的接著劑膜片5與相同形狀的接著劑膜片5混合存在。
另外,多個接著劑膜片5可配置於剝離膜4的寬度方向Y上的任一位置。剝離膜4的寬度方向Y是指與剝離膜4的長邊方向X及剝離膜4的厚度方向Z(參照圖3)正交的方向。例如,如圖2所示,本實施方式中,接著劑膜片5配置於剝離膜4的寬度Y上的中央部。然而,接著劑膜片5亦可如圖16所示的各向異性導電性膜2E般,配置於剝離膜4的寬度方向Y上的端部。
另外,多個接著劑膜片5可於剝離膜4的寬度方向上排列為一列,亦可於剝離膜4的寬度方向上排列為多列。如圖2所示,本實施方式中,多個接著劑膜片5於剝離膜4的寬度方向上排列為一列。然而,多個接著劑膜片5亦可如圖17(a)所示的各向異性導電性膜2F1般,於剝離膜4的寬度方向上排列為兩列,亦可如圖17(b)所示的各向異性導電性膜2F2般,於剝離膜4的寬度方向上排列為三列,亦可如圖17(c)所示的各向異性導電性膜2F3般,於剝離膜4的長邊方向上,剝離膜4的寬度方向上的排列數不同。
另外,於剝離膜4的長邊方向X上隔開配置的多個接著劑膜片5可自剝離膜4的寬度方向Y觀察而配置於彼此不重合的位置,亦可配置於彼此重合的位置。如圖2所示,本實施方式中,於剝離膜4的長邊方向X上隔開配置的多個接著劑膜片5自剝離膜4的寬度方向Y觀察而配置於彼此不重合的位置。然而,於剝離膜4的長邊方向X上隔開配置的多個接著劑膜片5亦可如圖13(c)所示的各向異性導電性膜2B3及圖14(c)所示的各向異性導電性膜2C3般,自剝離膜4的寬度方向Y觀察而配置於彼此重合的位置。
如圖4所示,剝離膜4的長邊方向X上的多個接著劑膜片5的間隔A可設為0.1 mm以上、10 mm以下,較佳為設為0.1 mm以上、0.8 mm以下,更佳為設為0.2 mm以上、0.5 mm以下。另外,剝離膜4的寬度方向Y上的剝離膜4的端緣與最靠近該端緣的接著劑膜片5的間隔B可設為0.1 mm以上、10 mm以下,較佳為設為0.1 mm以上、0.8 mm以下,更佳為設為0.2 mm以上、0.5 mm以下。
[連接結構體] 如圖5所示,連接結構體10具備:具有第一接著面11a的第一電路構件11、具有第二接著面12a的第二電路構件12、以及將第一接著面11a與第二接著面12a連接的接著劑膜片5。
第一電路構件11例如為IC晶片、大型積體電路(large scale integrated circuit,LSI)晶片、電阻體晶片、電容器晶片等晶片零件。第一電路構件11中,與第二電路構件12對向的面為第一接著面11a。第一接著面11a中配置有用於與第二電路構件12導通的第一電極(未圖示)。
第二電路構件12例如為玻璃基板、聚醯亞胺基板、聚對苯二甲酸乙二酯基板、聚碳酸酯基板、環烯烴聚合物(cyclo olefin polymer,COP)基板、聚萘二甲酸乙二酯基板、玻璃強化環氧樹脂基板、紙苯酚基板、陶瓷基板、積層板等具有透光性的基板。第二電路構件12中,與第一電路構件11的第一接著面11a對向的面為第二接著面12a。第二接著面12a中配置有用於與第一電路構件11導通的第二電極(未圖示)。
再者,亦可不對第一電路構件11與第二電路構件12加以明確區分,而對各電路構件應用任何構件。作為第一電路構件11,例如可使用玻璃基板、聚醯亞胺基板、聚對苯二甲酸乙二酯基板、聚碳酸酯基板、環烯烴聚合物(COP)基板、聚萘二甲酸乙二酯基板、玻璃強化環氧樹脂基板、紙苯酚基板、陶瓷基板、積層板等具有透光性的基板。另外,作為第二電路構件12,例如可使用IC晶片、LSI晶片、電阻體晶片、電容器晶片等晶片零件。
接著劑膜片5為自所述各向異性導電性膜2剝離的接著劑膜片5。接著劑膜片5藉由接著劑6而將第一接著面11a與第二接著面12a連接,藉由分散於接著劑6中的導電粒子7而使第一接著面11a的第一電極與第二接著面12a的第二電極導通。
[連接結構體的製造方法] 如圖6所示,連接結構體的製造方法包括:膜製造步驟(S1)、以及於膜製造步驟(S1)之後進行的連接步驟(S2)。
膜製造步驟(S1)中,製造於長條的剝離膜4上設置多個具有導電性的接著劑膜片5,並且多個接著劑膜片5排列於剝離膜4的長邊方向上的各向異性導電性膜2。接著劑膜片5為了具有各向異性導電性而於接著劑6中分散有導電粒子7。連接步驟(S2)中,隔著各向異性導電性膜2的接著劑膜片5來將第一電路構件11的第一接著面11a與第二電路構件12的第二接著面12a連接。
如圖7所示,膜製造步驟(S1)包括:接著劑膜層形成步驟(S11);於接著劑膜層形成步驟(S1)之後進行的接著劑膜層切斷步驟(S12);以及於接著劑膜層切斷步驟(S12)之後進行的邊緣剝離步驟(S13)。
接著劑膜層形成步驟(S11)中,首先,如圖8(a)及圖9(a)所示,準備剝離膜4。並且,如圖8(b)及圖9(b)所示,於剝離膜4上的整個面形成具有導電性的接著劑膜層5A。接著劑膜層5A為於接著劑6中分散有導電粒子7者。形成接著劑膜層5A的接著劑6及導電粒子7與所述形成接著劑膜片5的接著劑6及導電粒子7相同。
接著劑膜層切斷步驟(S12)中,如圖8(c)及圖9(c)所示,沿形成接著劑膜片5的外形的外形線5B將剝離膜4上所形成的接著劑膜層5A切斷。藉此,接著劑膜層5A被分離為位於外形線5B的內側的內側部分5A1、及位於外形線5B的外側的多個邊緣部分5A2。內側部分5A1為成為接著劑膜片5的部分。邊緣部分5A2為成為接著劑膜片5以外的部分的部分。接著劑膜層5A的切斷例如是藉由將接著劑膜層5A抵壓至於外周面形成有切斷刃的輥切割器而進行。藉此,即便接著劑膜片5為複雜的形狀、微細的形狀等,亦可容易地沿外形線5B將接著劑膜層5A切斷。
邊緣剝離步驟(S13)中,如圖8(d)及圖9(d)所示,沿經切斷的外形線5B,將接著劑膜層5A中的成為接著劑膜片5以外的部分的邊緣部分5A2自剝離膜4剝離。邊緣部分5A2的剝離例如是藉由使黏著帶黏著於邊緣部分5A2,拉伸該黏著帶,將邊緣部分5A2自剝離膜4拉離而進行。如此,剝離膜4上殘留的內側部分5A1成為接著劑膜片5。藉此,製造出於剝離膜4上設置有多個接著劑膜片5的各向異性導電性膜2。
以所述方式製造的各向異性導電性膜2於作為捲繞於捲芯3的捲繞體1而保管、搬運等後,移交至連接步驟(S2)。再者,各向異性導電性膜2亦可不作為捲繞體1捲繞地移交至連接步驟(S2)。
如圖10所示,連接步驟(S2)包括:位置檢測步驟(S21)、貼附步驟(S22)、以及重合步驟(S23)。
位置檢測步驟(S21)中,首先,將各向異性導電性膜2自捲繞體1捲出。並且,如圖11所示,藉由攝像裝置21來檢測各向異性導電性膜2上的接著劑膜片5的位置。此時,攝像裝置21可配置於剝離膜4的接著劑膜片5這一側,亦可配置於剝離膜4的與接著劑膜片5相反的一側。如圖11所示,本實施方式中,攝像裝置21配置於剝離膜4的與接著劑膜片5相反的一側。該情況下,藉由使用具有透光性的剝離膜4,攝像裝置21可自剝離膜4側檢測各向異性導電性膜2上的接著劑膜片5的位置。
貼附步驟(S22)中,基於藉由位置檢測步驟(S21)所檢測出的位置,將接著劑膜片5貼附於第一接著面11a。其後,自貼附於第一接著面11a的接著劑膜片5將剝離膜4剝離。
重合步驟(S23)中,隔著接著劑膜片5來將第一接著面11a與第二接著面12a重合。藉此,第一接著面11a與第二接著面12a藉由接著劑膜片5的接著劑6而得到暫時連接。並且,藉由對第一電路構件11及第二電路構件12進行加壓,而利用接著劑膜片5的導電粒子7使第一電路構件11與第二電路構件12導通,且藉由對接著劑膜片5的接著劑6賦予熱或光,而使該接著劑6硬化。藉此,可獲得第一接著面11a與第二接著面12a藉由接著劑膜片5而得到連接的連接結構體10。
如上所述,本實施方式的各向異性導電性膜2中,於長條的剝離膜4上,多個接著劑膜片5排列於剝離膜4的長邊方向X上。因此,可任意地設定接著劑膜片5的形狀。藉此,可對形狀多樣的接著面貼附接著劑膜片5,並且可有效利用接著劑膜片5。
另外,該各向異性導電性膜2中,於多個接著劑膜片5在剝離膜4的長邊方向X上隔開配置的情況下,可不會對相鄰的接著劑膜片5造成影響地將接著劑膜片5貼附於接著面。藉此,可對接著面容易地貼附接著劑膜片5。另外,可進一步擴展接著劑膜片5的形狀的自由度。
另外,該各向異性導電性膜2中,於多個接著劑膜片5呈相同形狀的情況下,可對呈相同形狀的多個接著面有效率地貼附接著劑膜片5。
另外,該各向異性導電性膜2中,於多個接著劑膜片5配置於剝離膜4的寬度方向上的中央部的情況下,可容易地進行當將接著劑膜片5貼附於接著面時的各向異性導電性膜2對接著面的定位。
另外,該各向異性導電性膜2中,於多個接著劑膜片5配置於剝離膜4的寬度方向上的端部的情況下,即便於接著面的其中一方向側並無充分的空間的情況下,亦可容易地將接著劑膜片5貼附於接著面。
另外,該各向異性導電性膜2中,於多個接著劑膜片5亦排列於剝離膜4的寬度方向Y上的情況下,可提高接著劑膜片5對剝離膜4的密度。藉此,可於剝離膜4上設置更多的接著劑膜片5。
另外,該各向異性導電性膜2中,於剝離膜4的長邊方向X上的多個接著劑膜片5的間隔為0.1 mm以上的情況下,可不會對相鄰的接著劑膜片5造成影響地將接著劑膜片5容易地貼附於接著面。另一方面,於該間隔為10 mm以下的情況下,可提高接著劑膜片5對剝離膜4的密度,而於剝離膜4上設置更多的接著劑膜片5。
另外,該各向異性導電性膜2中,於剝離膜4的寬度方向上的剝離膜4的端緣與最接近該端緣的接著劑膜片5的間隔為0.1 mm以上的情況下,即便剝離膜4的端部與其他構件發生干涉等,亦可抑制接著劑膜片5自剝離膜4剝離。另一方面,於該間隔為10 mm以下的情況下,可於剝離膜4上有效率地設置接著劑膜片5。
另外,該各向異性導電性膜2中,於剝離膜4具有透光性的情況下,即便將攝像裝置21配置於剝離膜4的與接著劑膜片5相反的一側,亦能夠藉由該攝像裝置21來檢測各向異性導電性膜2上的接著劑膜片5的位置。
另外,該各向異性導電性膜2中,於剝離膜4的透過率為15%以上的情況下,可容易地自剝離膜4側檢測接著劑膜片5的位置。另一方面,於剝離膜4的透過率為100%以下的情況下,可容易地製作剝離膜4。
另外,該各向異性導電性膜2中,於剝離膜4的霧度值為3%以上的情況下,可容易地自剝離膜4側檢測接著劑膜片5的位置。另一方面,於剝離膜4的霧度值為100%以下的情況下,可容易地製作剝離膜4。
本實施方式的捲繞體1中,於捲芯3上捲繞有所述各向異性導電性膜2,因此可對形狀多樣的接著面貼附接著劑膜片5,並且可有效利用接著劑膜片5。
本實施方式的連接結構體10中,藉由所述接著劑膜片5,將第一接著面11a與第二接著面12a連接。因此,可獲得不論第一接著面11a及第二接著面12a的形狀如何,而於第一接著面11a及第二接著面12a適當地貼附有接著劑膜片5的連接結構體10。
本實施方式的連接結構體的製造方法中,製造於剝離膜4上設置有多個接著劑膜片5的各向異性導電性膜2,隔著該各向異性導電性膜2的接著劑膜片5來連接第一接著面11a與第二接著面12a。並且,接著劑膜片5可任意地設定形狀,因此可製造不論第一接著面11a及第二接著面12a的形狀如何,而於第一接著面11a及第二接著面12a適當地貼附有接著劑膜片5的連接結構體10。另外,可有效地利用接著劑膜片5。
另外,該連接結構體的製造方法中,於剝離膜4上的整個面形成接著劑膜層5A,沿外形線5B切斷接著劑膜層5A,沿切斷的外形線5B將邊緣部分5A2自剝離膜4剝離。藉此,可容易地於剝離膜4上設置多個接著劑膜片5。
另外,該連接結構體的製造方法中,藉由攝像裝置21來檢測各向異性導電性膜2上的接著劑膜片5的位置,基於該檢測出的位置來將接著劑膜片5貼附於第一接著面11a。因此,可提高接著劑膜片5相對於接著面的位置精度。並且,隔著該接著劑膜片5來將第一接著面11a與第二接著面12a重合,因此可容易地將接著劑膜片5收入第一接著面11a及第二接著面12a內。
另外,該連接結構體的製造方法中,於將接著劑膜片5貼附於第一接著面11a後將剝離膜4自接著劑膜片5剝離,因此可容易地將接著劑膜片5貼附於第一接著面11a。
本發明並不限定於所述實施方式,只要不脫離本發明的主旨則能夠適宜變更。以下,對所述實施方式的變形例進行說明。
[變形例1] 如圖19所示,變形例1的各向異性導電性膜2H更具備覆蓋接著劑膜片5的第二剝離膜片8。即,各向異性導電性膜2H具備:長條的剝離膜4;設置於剝離膜4上,於接著劑6中分散有導電粒子7的多個接著劑膜片5;以及設置於各接著劑膜片5上的第二剝離膜片8。第二剝離膜片8是藉由覆蓋接著劑膜片5的表面而保護接著劑膜片5的膜。因此,變形例1中,捲繞體1是該各向異性導電性膜2H捲繞於捲芯3而成。
變形例1中,膜製造步驟(S1)及連接步驟(S2)如下所述。
膜製造步驟(S1)的接著劑膜層形成步驟(S11)中,首先,如圖20(a)所示,準備剝離膜4。其次,如圖20(b)所示,於剝離膜4上的整個面形成接著劑膜層5A。其次,如圖20(c)所示,於接著劑膜層5A上的整個面覆蓋(貼附)第二剝離膜8A。第二剝離膜8A的原材料與第二剝離膜片8相同。
膜製造步驟(S1)的接著劑膜層切斷步驟(S12)中,如圖20(d)所示,沿外形線5B將剝離膜4上所形成的接著劑膜層5A及第二剝離膜8A切斷。藉此,接著劑膜層5A被分離為位於外形線5B的內側的內側部分5A1、及位於外形線5B的外側的多個邊緣部分5A2。同樣地,第二剝離膜8A被分離為位於外形線5B的內側的內側部分8A1、及位於外形線5B的外側的多個邊緣部分8A2。
膜製造步驟(S1)的邊緣剝離步驟(S13)中,如圖20(e)所示,沿經切斷的外形線5B,將邊緣部分5A2及邊緣部分8A2自剝離膜4剝離。如此,剝離膜4上殘留內側部分5A1及內側部分8A1。剝離膜4上殘留的內側部分5A1及內側部分8A1成為接著劑膜片5及第二剝離膜片8。藉此,製造出於剝離膜4上設置有被第二剝離膜片8覆蓋的多個接著劑膜片5的各向異性導電性膜2H。
以所述方式製造的各向異性導電性膜2H於作為捲繞於捲芯3的捲繞體1而保管、搬運等後,移交至連接步驟(S2)。再者,各向異性導電性膜2H亦可不作為捲繞體1捲繞地移交至連接步驟(S2)。
連接步驟(S2)中,先於貼附步驟(S22)而進行第二剝離膜片剝離步驟。剝離步驟中,首先,於自捲繞體1拉出的各向異性導電性膜2H中,自接著劑膜片5將第二剝離膜片8剝離。第二剝離膜片8的剝離例如可藉由使黏著帶黏著於第二剝離膜片8,拉伸該黏著帶,將第二剝離膜片8自接著劑膜片5拉離而進行。再者,剝離步驟若先於貼附步驟(S22),則可於連接步驟(S2)的任一階段進行。其後,與所述實施方式相同。
如上所述,變形例1的各向異性導電性膜2H中,接著劑膜片5的表面被第二剝離膜片8覆蓋,因此可保護接著劑膜片5。因此,於各向異性導電性膜2H捲繞於捲芯3的捲繞體1中,可抑制接著劑膜片5被轉印至鄰接於內周側或外周側的剝離膜4。
另外,變形例1中,於剝離膜4上的整個面形成接著劑膜層5A,於接著劑膜層5A上的整個面覆蓋第二剝離膜8A,沿外形線5B切斷接著劑膜層5A,沿切斷的外形線5B將邊緣部分5A2自剝離膜4剝離。藉此,可容易地於剝離膜4上設置多個接著劑膜片5,並且可於接著劑膜片5上覆蓋第二剝離膜片8。
另外,於貼附步驟之前將第二剝離膜片8自接著劑膜片5剝離,因此可將接著劑膜片5確實地貼附於第一接著面11a。
[變形例2] 如圖21所示,變形例2的連接結構體的製造方法中,連接步驟(S2)更包括於位置檢測步驟(S21)之前進行的膜切斷步驟(S24)。
膜切斷步驟(S24)中,如圖22及圖23所示,首先,將各向異性導電性膜2切斷為多個各向異性導電性膜片2Z。各向異性導電性膜片2Z是於剝離膜4上設置有一個或多個接著劑膜片5的膜片。並且,於接續膜切斷步驟(S24)的位置檢測步驟(S21)中,藉由攝像裝置21來檢測各向異性導電性膜片2Z上的接著劑膜片5的位置。各向異性導電性膜片2Z中可僅設置有一個接著劑膜片5,亦可設置有兩個以上的接著劑膜片5。本實施方式中,於各向異性導電性膜片2Z中僅設置有一個接著劑膜片5。
該連接結構體的製造方法中,將各向異性導電性膜2切斷為多個各向異性導電性膜片2Z,因此即便於在多個地方貼附接著劑膜片5的情況、欲改變接著劑膜片5的貼附方向的情況等下,亦可靈活地應對。並且,藉由攝像裝置21來檢測各向異性導電性膜片2Z上的接著劑膜片5的位置,因此,即便將各向異性導電性膜2切斷為多個各向異性導電性膜片2Z,亦可提高接著劑膜片5相對於接著面的位置精度。
[變形例3] 所述實施方式中,作為將本發明的導電性膜應用於具有各向異性導電性的各向異性導電性膜者進行了說明,但本發明的導電性膜並不限定於具有各向異性導電性的各向異性導電性膜。即,接著劑膜片及接著劑膜層只要具有導電性即可,也可並非於接著劑中分散有導電粒子。作為該情況下的接著劑膜片及接著劑膜層,可列舉包含氧化銦錫(Indium-Tin-Oxide;ITO)、氧化銦、氧化錫等金屬氧化物、導電性纖維者等。作為該導電性纖維,例如可列舉:金、銀、鉑等金屬纖維,以及碳奈米管等碳纖維。
1‧‧‧捲繞體
2、2A、2B1、2B2、2B3、2C1、2C2、2C3、2D、2E、2F1、2F2、2F3、2G1、2G2、2G3、2H‧‧‧各向異性導電性膜(導電性膜)
2Z‧‧‧各向異性導電性膜片(導電性膜片)
3‧‧‧捲芯
3a‧‧‧芯材
3b‧‧‧側板
4‧‧‧剝離膜
5‧‧‧接著劑膜片
5a‧‧‧孔
5A‧‧‧接著劑膜片層
5A1、8A1‧‧‧內側部分
5A2、8A2‧‧‧邊緣部分
5B‧‧‧外形線
6‧‧‧接著劑
7‧‧‧導電粒子
8‧‧‧第二剝離膜片
8A‧‧‧第二剝離膜
10‧‧‧連接結構體
11‧‧‧第一電路構件
11a‧‧‧第一接著面
12‧‧‧第二電路構件
12a‧‧‧第二接著面
21‧‧‧攝像裝置
A、B‧‧‧間隔
S1、S2、S11、S12、S13、S21、S22、S23、S24‧‧‧步驟
X‧‧‧長邊方向
Y‧‧‧寬度方向
Z‧‧‧厚度方向
圖1是表示本實施方式的捲繞體的立體圖。 圖2是表示本實施方式的各向異性導電性膜的平面圖。 圖3是圖2所示的III-III線的剖面圖。 圖4是用於說明接著劑膜片相對於剝離膜的位置的平面圖。 圖5是表示本實施方式的連接結構體的剖面圖。 圖6是表示本實施方式的連接結構體的製造方法的流程圖。 圖7是表示圖6所示的膜製造步驟的流程圖。 圖8(a)、圖8(b)、圖8(c)及圖8(d)是用於說明圖6所示的膜製造步驟的剖面圖。 圖9(a)、圖9(b)、圖9(c)及圖9(d)是用於說明圖6所示的膜製造步驟的立體圖。 圖10是表示圖6所示的連接步驟的流程圖。 圖11是用於說明圖6所示的連接步驟的概略步驟圖。 圖12是表示變形例的各向異性導電性膜的平面圖。 圖13(a)、圖13(b)及圖13(c)是表示變形例的各向異性導電性膜的平面圖。 圖14(a)、圖14(b)及圖14(c)是表示變形例的各向異性導電性膜的平面圖。 圖15是表示變形例的各向異性導電性膜的平面圖。 圖16是表示變形例的各向異性導電性膜的平面圖。 圖17(a)、圖17(b)及圖17(c)是表示變形例的各向異性導電性膜的平面圖。 圖18(a)、圖18(b)及圖18(c)是表示變形例的各向異性導電性膜的平面圖。 圖19是表示變形例1的各向異性導電性膜的剖面圖。 圖20(a)、圖20(b)、圖20(c)、圖20(d)及圖20(e)是用於說明變形例1的各向異性導電性膜的製造方法中的膜製造步驟的剖面圖。 圖21是表示變形例2的連接結構體的製造方法中的連接步驟的流程圖。 圖22是用於說明圖21所示的連接步驟的概略步驟圖。 圖23是用於說明圖21所示的膜切斷步驟的平面圖。

Claims (26)

  1. 一種導電性膜,其具備: 長條的剝離膜;以及 設置於所述剝離膜上的多個具有導電性的接著劑膜片;並且 多個所述接著劑膜片排列於所述剝離膜的長邊方向上。
  2. 如申請專利範圍第1項所述的導電性膜,其中 多個所述接著劑膜片於所述剝離膜的長邊方向上隔開配置。
  3. 如申請專利範圍第1項或第2項所述的導電性膜,其中 多個所述接著劑膜片呈相同形狀。
  4. 如申請專利範圍第1項至第3項中任一項所述的導電性膜,其中 多個所述接著劑膜片配置於所述剝離膜的寬度方向上的中央部。
  5. 如申請專利範圍第1項至第3項中任一項所述的導電性膜,其中 多個所述接著劑膜片配置於所述剝離膜的寬度方向上的端部。
  6. 如申請專利範圍第1項至第5項中任一項所述的導電性膜,其中 多個所述接著劑膜片亦排列於所述剝離膜的寬度方向上。
  7. 如申請專利範圍第1項至第6項中任一項所述的導電性膜,其中 所述剝離膜的長邊方向上的多個所述接著劑膜片的間隔為0.1 mm以上、10 mm以下。
  8. 如申請專利範圍第1項至第7項中任一項所述的導電性膜,其中 所述剝離膜的寬度方向上的所述剝離膜的端緣與最接近所述端緣的所述接著劑膜片的間隔為0.1 mm以上、10 mm以下。
  9. 如申請專利範圍第1項至第8項中任一項所述的導電性膜,其中 所述剝離膜具有透光性。
  10. 如申請專利範圍第9項所述的導電性膜,其中 所述剝離膜的透過率為15%以上、100%以下。
  11. 如申請專利範圍第9項或第10項所述的導電性膜,其中 所述剝離膜的霧度值為3%以上、100%以下。
  12. 如申請專利範圍第1項至第11項中任一項所述的導電性膜,其更具備設置於所述接著劑膜片上的第二剝離膜片。
  13. 如申請專利範圍第1項至第12項中任一項所述的導電性膜,其中 所述接著劑膜片於接著劑中分散有導電粒子。
  14. 一種捲繞體,其具備: 如申請專利範圍第1項至第13項中任一項所述的導電性膜;以及 捲繞有所述導電性膜的捲芯。
  15. 一種連接結構體,其具備: 具有第一接著面的第一電路構件; 具有第二接著面的第二電路構件;以及 將所述第一接著面與所述第二接著面連接的如申請專利範圍第1項至第13項中任一項所述的接著劑膜片。
  16. 一種連接結構體的製造方法,其包括: 膜製造步驟,製造於長條的剝離膜上設置多個具有導電性的接著劑膜片,並且多個所述接著劑膜片排列於所述剝離膜的長邊方向上的導電性膜;以及 連接步驟,隔著所述導電性膜的所述接著劑膜片來將第一電路構件的第一接著面與第二電路構件的第二接著面連接。
  17. 如申請專利範圍第16項所述的連接結構體的製造方法,其中 所述接著劑膜片於接著劑中分散有導電粒子。
  18. 如申請專利範圍第16項或第17項所述的連接結構體的製造方法,其中 所述膜製造步驟具有: 接著劑膜層形成步驟,於所述剝離膜上的整個面形成具有導電性的接著劑膜層; 接著劑膜層切斷步驟,沿形成所述接著劑膜片的外形的外形線將所述接著劑膜層切斷;以及 邊緣剝離步驟,沿經切斷的所述外形線,將所述接著劑膜層中的成為所述接著劑膜片以外的部分的邊緣部分自所述剝離膜剝離。
  19. 如申請專利範圍第18項所述的連接結構體的製造方法,其中 所述接著劑膜層於接著劑中分散有導電粒子。
  20. 如申請專利範圍第16項至第19項中任一項所述的連接結構體的製造方法,其中 所述連接步驟具有: 位置檢測步驟,藉由攝像裝置來檢測所述導電性膜上的所述接著劑膜片的位置; 貼附步驟,基於藉由所述位置檢測步驟所檢測出的位置,將所述接著劑膜片貼附於所述第一接著面;以及 重合步驟,隔著所述接著劑膜片來將所述第一接著面與所述第二接著面重合。
  21. 如申請專利範圍第16項或第17項所述的連接結構體的製造方法,其中 所述膜製造步驟製造於所述接著劑膜片上設置有第二剝離膜片的所述導電性膜。
  22. 如申請專利範圍第21項所述的連接結構體的製造方法,其中 所述膜製造步驟具有: 接著劑膜層形成步驟,於所述剝離膜上的整個面形成具有導電性的接著劑膜層,進而於所述接著劑膜層上的整個面覆蓋第二剝離膜; 接著劑膜層切斷步驟,沿形成所述接著劑膜片的外形的外形線將所述接著劑膜層及所述第二剝離膜切斷;以及 邊緣剝離步驟,沿經切斷的所述外形線,將所述接著劑膜層及所述第二剝離膜中的成為所述接著劑膜片以外的部分的邊緣部分自所述剝離膜剝離。
  23. 如申請專利範圍第22項所述的連接結構體的製造方法,其中 所述接著劑膜層於接著劑中分散有導電粒子。
  24. 如申請專利範圍第21項至第23項中任一項所述的連接結構體的製造方法,其中 所述連接步驟具有: 位置檢測步驟,藉由攝像裝置來檢測所述導電性膜上的所述接著劑膜片的位置; 貼附步驟,基於藉由所述位置檢測步驟所檢測出的位置,將所述接著劑膜片貼附於所述第一接著面; 重合步驟,隔著所述接著劑膜片來將所述第一接著面與所述第二接著面重合;以及 第二剝離膜片剝離步驟,於所述貼附步驟之前將所述第二剝離膜片自所述接著劑膜片剝離。
  25. 如申請專利範圍第20項或第24項所述的連接結構體的製造方法,其中 所述貼附步驟中,於將所述接著劑膜片貼附於所述第一接著面後,將所述剝離膜自所述接著劑膜片剝離。
  26. 如申請專利範圍第20項、第24項或第25項所述的連接結構體的製造方法,其中 所述連接步驟更具有膜切斷步驟,於所述位置檢測步驟之前,將所述導電性膜切斷為於所述剝離膜上設置有一個或多個所述接著劑膜片的多個導電性膜片, 所述位置檢測步驟中,藉由所述攝像裝置來檢測所述導電性膜片上的所述接著劑膜片的位置。
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