USD962882S1 - Temporary protective film for manufacturing semiconductor devices - Google Patents
Temporary protective film for manufacturing semiconductor devices Download PDFInfo
- Publication number
- USD962882S1 USD962882S1 US35/355,107 US35510733F USD962882S US D962882 S1 USD962882 S1 US D962882S1 US 35510733 F US35510733 F US 35510733F US D962882 S USD962882 S US D962882S
- Authority
- US
- United States
- Prior art keywords
- protective film
- semiconductor devices
- manufacturing semiconductor
- temporary protective
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 230000001681 protective effect Effects 0.000 title claims description 4
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
Images
Description
FIG. 1.1 is a perspective view of a temporary protective film for manufacturing semiconductor devices showing my design;
FIG. 1.2 is a front view thereof;
FIG. 1.3 is a back view thereof;
FIG. 1.4 is a top view thereof;
FIG. 1.5 is a bottom view thereof;
FIG. 1.6 is a left side view thereof;
FIG. 1.7 is a right side view thereof;
FIG. 1.8 is a vertical cross-sectional view passing through the center of FIG. 1.6 .
FIG. 3.1 is a perspective view of a temporary protective film for manufacturing semiconductor devices showing my design;
FIG. 3.2 is a front view thereof;
FIG. 3.3 is a back view thereof;
FIG. 3.4 is a top view thereof;
FIG. 3.5 is a bottom view thereof;
FIG. 3.6 is a left side view thereof;
FIG. 3.7 is a right side view thereof;
FIG. 3.8 is a vertical cross-sectional view passing through the center of FIG. 3.6 .
Each article includes a core part and a film part, and is characterized by the fact that the width of the core part is larger than the width of the film part, and the core part protrudes greatly to one side; each article is temporarily attached to a back of a lead frame when manufacturing a semiconductor device with only one side encapsulated and the lead frame on the back side exposed; the film part of each article has an adhesive layer on one side; each article is easy to position when set on a manufacturing equipment. The parallel thin lines in the representation represent contours only and do not illustrate an ornamentation or decoration on the surface of the product.
Claims (1)
- The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/834,586 USD998577S1 (en) | 2019-11-14 | 2022-04-13 | Temporary protective film for manufacturing semiconductor devices |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-025329 | 2019-02-15 | ||
JPD2019-25330F JP1667713S (en) | 2019-11-14 | 2019-11-14 | |
JP2019-025326 | 2019-11-14 | ||
JPD2019-25326F JP1667641S (en) | 2019-11-14 | 2019-11-14 | |
JP2019-025330 | 2019-11-14 | ||
JPD2019-25329F JP1667712S (en) | 2019-11-14 | 2019-11-14 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/834,586 Division USD998577S1 (en) | 2019-11-14 | 2022-04-13 | Temporary protective film for manufacturing semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
USD962882S1 true USD962882S1 (en) | 2022-09-06 |
Family
ID=83104231
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US35/355,107 Active USD962882S1 (en) | 2019-11-14 | 2020-05-07 | Temporary protective film for manufacturing semiconductor devices |
US29/834,586 Active USD998577S1 (en) | 2019-11-14 | 2022-04-13 | Temporary protective film for manufacturing semiconductor devices |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/834,586 Active USD998577S1 (en) | 2019-11-14 | 2022-04-13 | Temporary protective film for manufacturing semiconductor devices |
Country Status (1)
Country | Link |
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US (2) | USD962882S1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD998577S1 (en) * | 2019-11-14 | 2023-09-12 | Resonac Corporation | Temporary protective film for manufacturing semiconductor devices |
USD999179S1 (en) * | 2020-11-02 | 2023-09-19 | Resonac Corporation | Temporary protective film for manufacturing semiconductor devices |
Citations (27)
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US2080052A (en) * | 1936-02-04 | 1937-05-11 | Lemaster Hager | Adhesive tape box |
US2082546A (en) * | 1936-04-07 | 1937-06-01 | Machate Fred | Tape dispensing package |
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US2414333A (en) * | 1944-01-17 | 1947-01-14 | Internat Plastic Corp | Combined container and dispenser for tape |
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US2694533A (en) * | 1954-03-16 | 1954-11-16 | Zucker Sam | Adhesive tape dispenser |
US2699251A (en) * | 1952-06-25 | 1955-01-11 | Frank E Rizza | Dispenser for adhesive tape |
US3001306A (en) * | 1956-02-20 | 1961-09-26 | Walter B Wilkinson | Index tabs and production thereof |
US3187968A (en) * | 1963-10-11 | 1965-06-08 | Edward A Favre | Tape dispenser |
US3216634A (en) * | 1963-11-18 | 1965-11-09 | Johns Manville | Tape dispenser |
US3237174A (en) * | 1962-11-02 | 1966-02-22 | Ex Cell O Corp | Magnetic core memory matrix and process of manufacturing the same |
US4983932A (en) * | 1988-09-26 | 1991-01-08 | Kitagawa Industries Co., Ltd. | Electric noise absorber |
US5258888A (en) * | 1991-03-15 | 1993-11-02 | Compaq Computer Corporation | Thermal packaging for natural convection cooled electronics |
USD433061S (en) * | 1999-05-26 | 2000-10-31 | Dick Shen | Pivot collar of adhesive tape |
US20070241436A1 (en) * | 2004-05-18 | 2007-10-18 | Keisuke Ookubo | Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device |
USD571859S1 (en) * | 2006-09-21 | 2008-06-24 | Terry Harmston | Heat sealed ribbon roll |
US7669631B2 (en) * | 2004-04-02 | 2010-03-02 | Shurtech Brands, Llc | Adhesive tape dispenser |
US20100080989A1 (en) * | 2008-10-01 | 2010-04-01 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet for laser processing and method for laser processing |
USD621051S1 (en) * | 2008-10-17 | 2010-08-03 | Kinesio IP, LLC | Adhesive tape |
USD621803S1 (en) * | 2008-07-16 | 2010-08-17 | The Furukawa Electric Co., Ltd. | Semiconductor wafer processing tape |
USD656910S1 (en) * | 2010-10-15 | 2012-04-03 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD656909S1 (en) * | 2010-10-15 | 2012-04-03 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD664512S1 (en) * | 2010-10-15 | 2012-07-31 | Hitachi Chemical Comapany, Ltd. | Adhesive tape for semiconductor manufacturing |
USD664511S1 (en) * | 2010-10-15 | 2012-07-31 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD741406S1 (en) * | 2014-09-25 | 2015-10-20 | Jeremy Doucette | Adhesive tape roll with non-adherent pull tab |
USD804435S1 (en) * | 2010-10-15 | 2017-12-05 | Hitachi Chemical Company, Ltd. | Flap in an adhesive tape for semiconductor manufacturing |
USD847258S1 (en) * | 2017-07-23 | 2019-04-30 | Heejoong Kang | Adhesive tape |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200837137A (en) * | 2007-01-26 | 2008-09-16 | Hitachi Chemical Co Ltd | Sealing film and semiconductor device using the same |
KR102529006B1 (en) * | 2016-10-03 | 2023-05-04 | 가부시끼가이샤 레조낙 | Electroconductive film, roll, connected structure, and process for producing connected structure |
USD962882S1 (en) * | 2019-11-14 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD962883S1 (en) * | 2020-11-02 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
JP1685752S (en) * | 2020-11-02 | 2021-05-24 | ||
JP2022076616A (en) * | 2020-11-10 | 2022-05-20 | 昭和電工マテリアルズ株式会社 | Reel body, reel body manufacturing method, and article manufacturing method |
-
2020
- 2020-05-07 US US35/355,107 patent/USD962882S1/en active Active
-
2022
- 2022-04-13 US US29/834,586 patent/USD998577S1/en active Active
Patent Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2080052A (en) * | 1936-02-04 | 1937-05-11 | Lemaster Hager | Adhesive tape box |
US2082546A (en) * | 1936-04-07 | 1937-06-01 | Machate Fred | Tape dispensing package |
US2229961A (en) * | 1938-10-04 | 1941-01-28 | Gerard C Deane | Shielded cutting device |
US2414333A (en) * | 1944-01-17 | 1947-01-14 | Internat Plastic Corp | Combined container and dispenser for tape |
US2626666A (en) * | 1949-04-16 | 1953-01-27 | Scholl Mfg Co Inc | Tape cutter |
US2699251A (en) * | 1952-06-25 | 1955-01-11 | Frank E Rizza | Dispenser for adhesive tape |
US2694533A (en) * | 1954-03-16 | 1954-11-16 | Zucker Sam | Adhesive tape dispenser |
US3001306A (en) * | 1956-02-20 | 1961-09-26 | Walter B Wilkinson | Index tabs and production thereof |
US3237174A (en) * | 1962-11-02 | 1966-02-22 | Ex Cell O Corp | Magnetic core memory matrix and process of manufacturing the same |
US3187968A (en) * | 1963-10-11 | 1965-06-08 | Edward A Favre | Tape dispenser |
US3216634A (en) * | 1963-11-18 | 1965-11-09 | Johns Manville | Tape dispenser |
US4983932A (en) * | 1988-09-26 | 1991-01-08 | Kitagawa Industries Co., Ltd. | Electric noise absorber |
US5258888A (en) * | 1991-03-15 | 1993-11-02 | Compaq Computer Corporation | Thermal packaging for natural convection cooled electronics |
USD433061S (en) * | 1999-05-26 | 2000-10-31 | Dick Shen | Pivot collar of adhesive tape |
US7669631B2 (en) * | 2004-04-02 | 2010-03-02 | Shurtech Brands, Llc | Adhesive tape dispenser |
US20070241436A1 (en) * | 2004-05-18 | 2007-10-18 | Keisuke Ookubo | Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device |
USD571859S1 (en) * | 2006-09-21 | 2008-06-24 | Terry Harmston | Heat sealed ribbon roll |
USD621803S1 (en) * | 2008-07-16 | 2010-08-17 | The Furukawa Electric Co., Ltd. | Semiconductor wafer processing tape |
US20100080989A1 (en) * | 2008-10-01 | 2010-04-01 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet for laser processing and method for laser processing |
USD621051S1 (en) * | 2008-10-17 | 2010-08-03 | Kinesio IP, LLC | Adhesive tape |
USD664512S1 (en) * | 2010-10-15 | 2012-07-31 | Hitachi Chemical Comapany, Ltd. | Adhesive tape for semiconductor manufacturing |
USD656909S1 (en) * | 2010-10-15 | 2012-04-03 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD656910S1 (en) * | 2010-10-15 | 2012-04-03 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD664511S1 (en) * | 2010-10-15 | 2012-07-31 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD680505S1 (en) * | 2010-10-15 | 2013-04-23 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD689831S1 (en) * | 2010-10-15 | 2013-09-17 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD690278S1 (en) * | 2010-10-15 | 2013-09-24 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD804435S1 (en) * | 2010-10-15 | 2017-12-05 | Hitachi Chemical Company, Ltd. | Flap in an adhesive tape for semiconductor manufacturing |
USD741406S1 (en) * | 2014-09-25 | 2015-10-20 | Jeremy Doucette | Adhesive tape roll with non-adherent pull tab |
USD847258S1 (en) * | 2017-07-23 | 2019-04-30 | Heejoong Kang | Adhesive tape |
Non-Patent Citations (4)
Title |
---|
"Back-grinding . . . " reference dated Nov. 6, 2021 on the internet at: https://www.nitto.com/us/en/products/semicon/. * |
"Disposal . . . " reference dated Nov. 6, 2021 on the internet at: https://www.pvawatersolublefilm.com/sale-11363692-disposable-high-temperature-water-soluble-plastic-film-for-mold-release.html. * |
"Establishing . . . " reference dated Sep. 13, 2018 on the internet at: https://www.mc.showadenko.com/english/information/2018/n_180913uo3.html. * |
"RD Series . . . " reference dated Nov. 6, 2021 on the internet at: https://www.mc.showadenko.com/english/products/pm/015.html. * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD998577S1 (en) * | 2019-11-14 | 2023-09-12 | Resonac Corporation | Temporary protective film for manufacturing semiconductor devices |
USD999179S1 (en) * | 2020-11-02 | 2023-09-19 | Resonac Corporation | Temporary protective film for manufacturing semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
USD998577S1 (en) | 2023-09-12 |
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