USD690278S1 - Adhesive tape for semiconductor manufacturing - Google Patents
Adhesive tape for semiconductor manufacturing Download PDFInfo
- Publication number
- USD690278S1 USD690278S1 US29/413,539 US201229413539F USD690278S US D690278 S1 USD690278 S1 US D690278S1 US 201229413539 F US201229413539 F US 201229413539F US D690278 S USD690278 S US D690278S
- Authority
- US
- United States
- Prior art keywords
- adhesive tape
- semiconductor manufacturing
- view
- design
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002390 adhesive tape Substances 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000004065 semiconductor Substances 0.000 title claims description 3
Images
Description
The dashed line showing of the adhesive tape is for purposes of illustrating portions of the adhesive tape and forms no part of the claimed design.
The broken lines having alternating long and short segments define bounds of the claimed design and form no part thereof.
Claims (1)
- The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/413,539 USD690278S1 (en) | 2010-10-15 | 2012-02-16 | Adhesive tape for semiconductor manufacturing |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010024763 | 2010-10-15 | ||
JPD2010-024763 | 2010-10-15 | ||
US29/389,794 USD664512S1 (en) | 2010-10-15 | 2011-04-15 | Adhesive tape for semiconductor manufacturing |
US29/413,539 USD690278S1 (en) | 2010-10-15 | 2012-02-16 | Adhesive tape for semiconductor manufacturing |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/389,794 Continuation USD664512S1 (en) | 2010-10-15 | 2011-04-15 | Adhesive tape for semiconductor manufacturing |
Publications (1)
Publication Number | Publication Date |
---|---|
USD690278S1 true USD690278S1 (en) | 2013-09-24 |
Family
ID=46547923
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/389,794 Active USD664512S1 (en) | 2010-10-15 | 2011-04-15 | Adhesive tape for semiconductor manufacturing |
US29/413,539 Active USD690278S1 (en) | 2010-10-15 | 2012-02-16 | Adhesive tape for semiconductor manufacturing |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/389,794 Active USD664512S1 (en) | 2010-10-15 | 2011-04-15 | Adhesive tape for semiconductor manufacturing |
Country Status (1)
Country | Link |
---|---|
US (2) | USD664512S1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD804435S1 (en) * | 2010-10-15 | 2017-12-05 | Hitachi Chemical Company, Ltd. | Flap in an adhesive tape for semiconductor manufacturing |
USD809457S1 (en) * | 2016-01-29 | 2018-02-06 | Hitachi Industrial Equipment Systems Co., Ltd. | Transformer housing |
USD809458S1 (en) * | 2016-01-29 | 2018-02-06 | Hitachi Industrial Equipment Systems Co., Ltd. | Transformer housing |
USD946540S1 (en) * | 2020-11-02 | 2022-03-22 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD962883S1 (en) * | 2020-11-02 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD962882S1 (en) * | 2019-11-14 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104076672B (en) | 2010-06-11 | 2020-10-09 | 株式会社理光 | Information storage device, detachable device, developer container, and image forming apparatus |
-
2011
- 2011-04-15 US US29/389,794 patent/USD664512S1/en active Active
-
2012
- 2012-02-16 US US29/413,539 patent/USD690278S1/en active Active
Non-Patent Citations (7)
Title |
---|
Office Action dated Jan. 29, 2013, in Design U.S. Appl. No. 29/413,548. |
Taniguchi et al., Design U.S. Appl. No. 29/389,788, filed Apr. 15, 2011. |
Taniguchi et al., Design U.S. Appl. No. 29/389,790, filed Apr. 15, 2011. |
Taniguchi et al., Design U.S. Appl. No. 29/389,797, filed Apr. 15, 2011. |
Taniguchi et al., Design U.S. Appl. No. 29/413,509, filed Feb. 16, 2012. |
Taniguchi et al., Design U.S. Appl. No. 29/413,518, filed Feb. 16, 2012. |
Taniguchi et al., Design U.S. Appl. No. 29/413,548, filed Feb. 16, 2012. |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD804435S1 (en) * | 2010-10-15 | 2017-12-05 | Hitachi Chemical Company, Ltd. | Flap in an adhesive tape for semiconductor manufacturing |
USD809457S1 (en) * | 2016-01-29 | 2018-02-06 | Hitachi Industrial Equipment Systems Co., Ltd. | Transformer housing |
USD809458S1 (en) * | 2016-01-29 | 2018-02-06 | Hitachi Industrial Equipment Systems Co., Ltd. | Transformer housing |
USD962882S1 (en) * | 2019-11-14 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD998577S1 (en) | 2019-11-14 | 2023-09-12 | Resonac Corporation | Temporary protective film for manufacturing semiconductor devices |
USD946540S1 (en) * | 2020-11-02 | 2022-03-22 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD962883S1 (en) * | 2020-11-02 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD999179S1 (en) | 2020-11-02 | 2023-09-19 | Resonac Corporation | Temporary protective film for manufacturing semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
USD664512S1 (en) | 2012-07-31 |
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