USD998577S1 - Temporary protective film for manufacturing semiconductor devices - Google Patents

Temporary protective film for manufacturing semiconductor devices Download PDF

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Publication number
USD998577S1
USD998577S1 US29/834,586 US202229834586F USD998577S US D998577 S1 USD998577 S1 US D998577S1 US 202229834586 F US202229834586 F US 202229834586F US D998577 S USD998577 S US D998577S
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United States
Prior art keywords
protective film
semiconductor devices
manufacturing semiconductor
temporary protective
temporary
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Application number
US29/834,586
Inventor
Naoki Tomori
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Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2019-25330F external-priority patent/JP1667713S/ja
Priority claimed from JPD2019-25326F external-priority patent/JP1667641S/ja
Priority claimed from JPD2019-25329F external-priority patent/JP1667712S/ja
Application filed by Resonac Corp filed Critical Resonac Corp
Priority to US29/834,586 priority Critical patent/USD998577S1/en
Assigned to HITACHI CHEMICAL COMPANY, LTD. reassignment HITACHI CHEMICAL COMPANY, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOMORI, NAOKI
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SHOWA DENKO MATERIALS CO., LTD.
Application granted granted Critical
Publication of USD998577S1 publication Critical patent/USD998577S1/en
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF ADDRESS Assignors: RESONAC CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a temporary protective film for manufacturing semiconductor devices of the present invention;
FIG. 2 is a front view of the thereof.
FIG. 3 is a rear view of the thereof.
FIG. 4 is a top view of the thereof.
FIG. 5 is a bottom view of the thereof.
FIG. 6 is a left side view of the thereof.
FIG. 7 is a right side view of the thereof; and,
FIG. 8 is a sectional view taken along the line 8-8 of FIG. 6 .

Claims (1)

    CLAIM
  1. The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described.
US29/834,586 2019-11-14 2022-04-13 Temporary protective film for manufacturing semiconductor devices Active USD998577S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/834,586 USD998577S1 (en) 2019-11-14 2022-04-13 Temporary protective film for manufacturing semiconductor devices

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JPD2019-25330F JP1667713S (en) 2019-11-14 2019-11-14
JP2019-025330D 2019-11-14
JPD2019-25326F JP1667641S (en) 2019-11-14 2019-11-14
JPD2019-25329F JP1667712S (en) 2019-11-14 2019-11-14
JP2019-025329D 2019-11-14
JP2019-025326D 2019-11-14
US35/355,107 USD962882S1 (en) 2019-11-14 2020-05-07 Temporary protective film for manufacturing semiconductor devices
US29/834,586 USD998577S1 (en) 2019-11-14 2022-04-13 Temporary protective film for manufacturing semiconductor devices

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US35/355,107 Division USD962882S1 (en) 2019-11-14 2020-05-07 Temporary protective film for manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
USD998577S1 true USD998577S1 (en) 2023-09-12

Family

ID=83104231

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US35/355,107 Active USD962882S1 (en) 2019-11-14 2020-05-07 Temporary protective film for manufacturing semiconductor devices
US29/834,586 Active USD998577S1 (en) 2019-11-14 2022-04-13 Temporary protective film for manufacturing semiconductor devices

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US35/355,107 Active USD962882S1 (en) 2019-11-14 2020-05-07 Temporary protective film for manufacturing semiconductor devices

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices

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US2080052A (en) 1936-02-04 1937-05-11 Lemaster Hager Adhesive tape box
US2082546A (en) * 1936-04-07 1937-06-01 Machate Fred Tape dispensing package
US2229961A (en) * 1938-10-04 1941-01-28 Gerard C Deane Shielded cutting device
US2414333A (en) * 1944-01-17 1947-01-14 Internat Plastic Corp Combined container and dispenser for tape
US2626666A (en) * 1949-04-16 1953-01-27 Scholl Mfg Co Inc Tape cutter
US2694533A (en) 1954-03-16 1954-11-16 Zucker Sam Adhesive tape dispenser
US2699251A (en) 1952-06-25 1955-01-11 Frank E Rizza Dispenser for adhesive tape
US3001306A (en) * 1956-02-20 1961-09-26 Walter B Wilkinson Index tabs and production thereof
US3187968A (en) * 1963-10-11 1965-06-08 Edward A Favre Tape dispenser
US3216634A (en) * 1963-11-18 1965-11-09 Johns Manville Tape dispenser
US3237174A (en) * 1962-11-02 1966-02-22 Ex Cell O Corp Magnetic core memory matrix and process of manufacturing the same
US4983932A (en) 1988-09-26 1991-01-08 Kitagawa Industries Co., Ltd. Electric noise absorber
US5258888A (en) 1991-03-15 1993-11-02 Compaq Computer Corporation Thermal packaging for natural convection cooled electronics
USD433061S (en) * 1999-05-26 2000-10-31 Dick Shen Pivot collar of adhesive tape
US20070241436A1 (en) 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
USD571859S1 (en) * 2006-09-21 2008-06-24 Terry Harmston Heat sealed ribbon roll
US20090189300A1 (en) * 2007-01-26 2009-07-30 Hiroyuki Kawakami Sealing Film and a Semiconductor Device Using the Same
US7669631B2 (en) 2004-04-02 2010-03-02 Shurtech Brands, Llc Adhesive tape dispenser
US20100080989A1 (en) 2008-10-01 2010-04-01 Nitto Denko Corporation Pressure-sensitive adhesive sheet for laser processing and method for laser processing
USD621051S1 (en) * 2008-10-17 2010-08-03 Kinesio IP, LLC Adhesive tape
USD621803S1 (en) 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
USD656910S1 (en) 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656909S1 (en) 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664512S1 (en) 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
USD664511S1 (en) 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD741406S1 (en) * 2014-09-25 2015-10-20 Jeremy Doucette Adhesive tape roll with non-adherent pull tab
USD804435S1 (en) 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD847258S1 (en) 2017-07-23 2019-04-30 Heejoong Kang Adhesive tape
USD946540S1 (en) * 2020-11-02 2022-03-22 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
US20230043876A1 (en) * 2020-11-10 2023-02-09 Showa Denko Materials Co., Ltd. Reel body, method for manufacturing reel body, and method for manufacturing article
US11667817B2 (en) * 2016-10-03 2023-06-06 Showa Denko Materials Co., Ltd. Electroconductive film, roll, connected structure, and process for producing connected structure

Patent Citations (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2080052A (en) 1936-02-04 1937-05-11 Lemaster Hager Adhesive tape box
US2082546A (en) * 1936-04-07 1937-06-01 Machate Fred Tape dispensing package
US2229961A (en) * 1938-10-04 1941-01-28 Gerard C Deane Shielded cutting device
US2414333A (en) * 1944-01-17 1947-01-14 Internat Plastic Corp Combined container and dispenser for tape
US2626666A (en) * 1949-04-16 1953-01-27 Scholl Mfg Co Inc Tape cutter
US2699251A (en) 1952-06-25 1955-01-11 Frank E Rizza Dispenser for adhesive tape
US2694533A (en) 1954-03-16 1954-11-16 Zucker Sam Adhesive tape dispenser
US3001306A (en) * 1956-02-20 1961-09-26 Walter B Wilkinson Index tabs and production thereof
US3237174A (en) * 1962-11-02 1966-02-22 Ex Cell O Corp Magnetic core memory matrix and process of manufacturing the same
US3187968A (en) * 1963-10-11 1965-06-08 Edward A Favre Tape dispenser
US3216634A (en) * 1963-11-18 1965-11-09 Johns Manville Tape dispenser
US4983932A (en) 1988-09-26 1991-01-08 Kitagawa Industries Co., Ltd. Electric noise absorber
US5258888A (en) 1991-03-15 1993-11-02 Compaq Computer Corporation Thermal packaging for natural convection cooled electronics
USD433061S (en) * 1999-05-26 2000-10-31 Dick Shen Pivot collar of adhesive tape
US7669631B2 (en) 2004-04-02 2010-03-02 Shurtech Brands, Llc Adhesive tape dispenser
US20070241436A1 (en) 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
USD571859S1 (en) * 2006-09-21 2008-06-24 Terry Harmston Heat sealed ribbon roll
US20090189300A1 (en) * 2007-01-26 2009-07-30 Hiroyuki Kawakami Sealing Film and a Semiconductor Device Using the Same
USD621803S1 (en) 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
US20100080989A1 (en) 2008-10-01 2010-04-01 Nitto Denko Corporation Pressure-sensitive adhesive sheet for laser processing and method for laser processing
USD621051S1 (en) * 2008-10-17 2010-08-03 Kinesio IP, LLC Adhesive tape
USD804435S1 (en) 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD656910S1 (en) 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656909S1 (en) 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664512S1 (en) 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
USD664511S1 (en) 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD680505S1 (en) 2010-10-15 2013-04-23 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD689831S1 (en) 2010-10-15 2013-09-17 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD690278S1 (en) 2010-10-15 2013-09-24 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD741406S1 (en) * 2014-09-25 2015-10-20 Jeremy Doucette Adhesive tape roll with non-adherent pull tab
US11667817B2 (en) * 2016-10-03 2023-06-06 Showa Denko Materials Co., Ltd. Electroconductive film, roll, connected structure, and process for producing connected structure
USD847258S1 (en) 2017-07-23 2019-04-30 Heejoong Kang Adhesive tape
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD946540S1 (en) * 2020-11-02 2022-03-22 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
US20230043876A1 (en) * 2020-11-10 2023-02-09 Showa Denko Materials Co., Ltd. Reel body, method for manufacturing reel body, and method for manufacturing article

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"Back-grinding . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.nitto.com/us/en/products/semicon/.
"Disposal . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.pvawatersolublefilm.com/sale-11363692-disposable-high-temperature water-soluble-plastic-film-for-mold-release.html.
"Establishing . . . " reference dated Sep. 13, 2018 found by RMS on the internet at: https://www.mc.showadenko.com/english/information/2018/n_180913uo3.html.
"RD Series . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.mc.showadenko.com/english/products/pm/ 015.html.

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