USD998577S1 - Temporary protective film for manufacturing semiconductor devices - Google Patents
Temporary protective film for manufacturing semiconductor devices Download PDFInfo
- Publication number
- USD998577S1 USD998577S1 US29/834,586 US202229834586F USD998577S US D998577 S1 USD998577 S1 US D998577S1 US 202229834586 F US202229834586 F US 202229834586F US D998577 S USD998577 S US D998577S
- Authority
- US
- United States
- Prior art keywords
- protective film
- semiconductor devices
- manufacturing semiconductor
- temporary protective
- temporary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 230000001681 protective effect Effects 0.000 title claims description 3
- 239000004065 semiconductor Substances 0.000 title claims description 3
Images
Description
Claims (1)
- The ornamental design for a temporary protective film for manufacturing semiconductor devices, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/834,586 USD998577S1 (en) | 2019-11-14 | 2022-04-13 | Temporary protective film for manufacturing semiconductor devices |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2019-25330F JP1667713S (en) | 2019-11-14 | 2019-11-14 | |
JP2019-025330D | 2019-11-14 | ||
JPD2019-25326F JP1667641S (en) | 2019-11-14 | 2019-11-14 | |
JPD2019-25329F JP1667712S (en) | 2019-11-14 | 2019-11-14 | |
JP2019-025329D | 2019-11-14 | ||
JP2019-025326D | 2019-11-14 | ||
US35/355,107 USD962882S1 (en) | 2019-11-14 | 2020-05-07 | Temporary protective film for manufacturing semiconductor devices |
US29/834,586 USD998577S1 (en) | 2019-11-14 | 2022-04-13 | Temporary protective film for manufacturing semiconductor devices |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US35/355,107 Division USD962882S1 (en) | 2019-11-14 | 2020-05-07 | Temporary protective film for manufacturing semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
USD998577S1 true USD998577S1 (en) | 2023-09-12 |
Family
ID=83104231
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US35/355,107 Active USD962882S1 (en) | 2019-11-14 | 2020-05-07 | Temporary protective film for manufacturing semiconductor devices |
US29/834,586 Active USD998577S1 (en) | 2019-11-14 | 2022-04-13 | Temporary protective film for manufacturing semiconductor devices |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US35/355,107 Active USD962882S1 (en) | 2019-11-14 | 2020-05-07 | Temporary protective film for manufacturing semiconductor devices |
Country Status (1)
Country | Link |
---|---|
US (2) | USD962882S1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD962882S1 (en) * | 2019-11-14 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD962883S1 (en) * | 2020-11-02 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
Citations (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2080052A (en) | 1936-02-04 | 1937-05-11 | Lemaster Hager | Adhesive tape box |
US2082546A (en) * | 1936-04-07 | 1937-06-01 | Machate Fred | Tape dispensing package |
US2229961A (en) * | 1938-10-04 | 1941-01-28 | Gerard C Deane | Shielded cutting device |
US2414333A (en) * | 1944-01-17 | 1947-01-14 | Internat Plastic Corp | Combined container and dispenser for tape |
US2626666A (en) * | 1949-04-16 | 1953-01-27 | Scholl Mfg Co Inc | Tape cutter |
US2694533A (en) | 1954-03-16 | 1954-11-16 | Zucker Sam | Adhesive tape dispenser |
US2699251A (en) | 1952-06-25 | 1955-01-11 | Frank E Rizza | Dispenser for adhesive tape |
US3001306A (en) * | 1956-02-20 | 1961-09-26 | Walter B Wilkinson | Index tabs and production thereof |
US3187968A (en) * | 1963-10-11 | 1965-06-08 | Edward A Favre | Tape dispenser |
US3216634A (en) * | 1963-11-18 | 1965-11-09 | Johns Manville | Tape dispenser |
US3237174A (en) * | 1962-11-02 | 1966-02-22 | Ex Cell O Corp | Magnetic core memory matrix and process of manufacturing the same |
US4983932A (en) | 1988-09-26 | 1991-01-08 | Kitagawa Industries Co., Ltd. | Electric noise absorber |
US5258888A (en) | 1991-03-15 | 1993-11-02 | Compaq Computer Corporation | Thermal packaging for natural convection cooled electronics |
USD433061S (en) * | 1999-05-26 | 2000-10-31 | Dick Shen | Pivot collar of adhesive tape |
US20070241436A1 (en) | 2004-05-18 | 2007-10-18 | Keisuke Ookubo | Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device |
USD571859S1 (en) * | 2006-09-21 | 2008-06-24 | Terry Harmston | Heat sealed ribbon roll |
US20090189300A1 (en) * | 2007-01-26 | 2009-07-30 | Hiroyuki Kawakami | Sealing Film and a Semiconductor Device Using the Same |
US7669631B2 (en) | 2004-04-02 | 2010-03-02 | Shurtech Brands, Llc | Adhesive tape dispenser |
US20100080989A1 (en) | 2008-10-01 | 2010-04-01 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet for laser processing and method for laser processing |
USD621051S1 (en) * | 2008-10-17 | 2010-08-03 | Kinesio IP, LLC | Adhesive tape |
USD621803S1 (en) | 2008-07-16 | 2010-08-17 | The Furukawa Electric Co., Ltd. | Semiconductor wafer processing tape |
USD656910S1 (en) | 2010-10-15 | 2012-04-03 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD656909S1 (en) | 2010-10-15 | 2012-04-03 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD664512S1 (en) | 2010-10-15 | 2012-07-31 | Hitachi Chemical Comapany, Ltd. | Adhesive tape for semiconductor manufacturing |
USD664511S1 (en) | 2010-10-15 | 2012-07-31 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD741406S1 (en) * | 2014-09-25 | 2015-10-20 | Jeremy Doucette | Adhesive tape roll with non-adherent pull tab |
USD804435S1 (en) | 2010-10-15 | 2017-12-05 | Hitachi Chemical Company, Ltd. | Flap in an adhesive tape for semiconductor manufacturing |
USD847258S1 (en) | 2017-07-23 | 2019-04-30 | Heejoong Kang | Adhesive tape |
USD946540S1 (en) * | 2020-11-02 | 2022-03-22 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD962883S1 (en) * | 2020-11-02 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD962882S1 (en) * | 2019-11-14 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
US20230043876A1 (en) * | 2020-11-10 | 2023-02-09 | Showa Denko Materials Co., Ltd. | Reel body, method for manufacturing reel body, and method for manufacturing article |
US11667817B2 (en) * | 2016-10-03 | 2023-06-06 | Showa Denko Materials Co., Ltd. | Electroconductive film, roll, connected structure, and process for producing connected structure |
-
2020
- 2020-05-07 US US35/355,107 patent/USD962882S1/en active Active
-
2022
- 2022-04-13 US US29/834,586 patent/USD998577S1/en active Active
Patent Citations (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2080052A (en) | 1936-02-04 | 1937-05-11 | Lemaster Hager | Adhesive tape box |
US2082546A (en) * | 1936-04-07 | 1937-06-01 | Machate Fred | Tape dispensing package |
US2229961A (en) * | 1938-10-04 | 1941-01-28 | Gerard C Deane | Shielded cutting device |
US2414333A (en) * | 1944-01-17 | 1947-01-14 | Internat Plastic Corp | Combined container and dispenser for tape |
US2626666A (en) * | 1949-04-16 | 1953-01-27 | Scholl Mfg Co Inc | Tape cutter |
US2699251A (en) | 1952-06-25 | 1955-01-11 | Frank E Rizza | Dispenser for adhesive tape |
US2694533A (en) | 1954-03-16 | 1954-11-16 | Zucker Sam | Adhesive tape dispenser |
US3001306A (en) * | 1956-02-20 | 1961-09-26 | Walter B Wilkinson | Index tabs and production thereof |
US3237174A (en) * | 1962-11-02 | 1966-02-22 | Ex Cell O Corp | Magnetic core memory matrix and process of manufacturing the same |
US3187968A (en) * | 1963-10-11 | 1965-06-08 | Edward A Favre | Tape dispenser |
US3216634A (en) * | 1963-11-18 | 1965-11-09 | Johns Manville | Tape dispenser |
US4983932A (en) | 1988-09-26 | 1991-01-08 | Kitagawa Industries Co., Ltd. | Electric noise absorber |
US5258888A (en) | 1991-03-15 | 1993-11-02 | Compaq Computer Corporation | Thermal packaging for natural convection cooled electronics |
USD433061S (en) * | 1999-05-26 | 2000-10-31 | Dick Shen | Pivot collar of adhesive tape |
US7669631B2 (en) | 2004-04-02 | 2010-03-02 | Shurtech Brands, Llc | Adhesive tape dispenser |
US20070241436A1 (en) | 2004-05-18 | 2007-10-18 | Keisuke Ookubo | Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device |
USD571859S1 (en) * | 2006-09-21 | 2008-06-24 | Terry Harmston | Heat sealed ribbon roll |
US20090189300A1 (en) * | 2007-01-26 | 2009-07-30 | Hiroyuki Kawakami | Sealing Film and a Semiconductor Device Using the Same |
USD621803S1 (en) | 2008-07-16 | 2010-08-17 | The Furukawa Electric Co., Ltd. | Semiconductor wafer processing tape |
US20100080989A1 (en) | 2008-10-01 | 2010-04-01 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet for laser processing and method for laser processing |
USD621051S1 (en) * | 2008-10-17 | 2010-08-03 | Kinesio IP, LLC | Adhesive tape |
USD804435S1 (en) | 2010-10-15 | 2017-12-05 | Hitachi Chemical Company, Ltd. | Flap in an adhesive tape for semiconductor manufacturing |
USD656910S1 (en) | 2010-10-15 | 2012-04-03 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD656909S1 (en) | 2010-10-15 | 2012-04-03 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD664512S1 (en) | 2010-10-15 | 2012-07-31 | Hitachi Chemical Comapany, Ltd. | Adhesive tape for semiconductor manufacturing |
USD664511S1 (en) | 2010-10-15 | 2012-07-31 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD680505S1 (en) | 2010-10-15 | 2013-04-23 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD689831S1 (en) | 2010-10-15 | 2013-09-17 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD690278S1 (en) | 2010-10-15 | 2013-09-24 | Hitachi Chemical Company, Ltd. | Adhesive tape for semiconductor manufacturing |
USD741406S1 (en) * | 2014-09-25 | 2015-10-20 | Jeremy Doucette | Adhesive tape roll with non-adherent pull tab |
US11667817B2 (en) * | 2016-10-03 | 2023-06-06 | Showa Denko Materials Co., Ltd. | Electroconductive film, roll, connected structure, and process for producing connected structure |
USD847258S1 (en) | 2017-07-23 | 2019-04-30 | Heejoong Kang | Adhesive tape |
USD962882S1 (en) * | 2019-11-14 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD946540S1 (en) * | 2020-11-02 | 2022-03-22 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD962883S1 (en) * | 2020-11-02 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
US20230043876A1 (en) * | 2020-11-10 | 2023-02-09 | Showa Denko Materials Co., Ltd. | Reel body, method for manufacturing reel body, and method for manufacturing article |
Non-Patent Citations (4)
Title |
---|
"Back-grinding . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.nitto.com/us/en/products/semicon/. |
"Disposal . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.pvawatersolublefilm.com/sale-11363692-disposable-high-temperature water-soluble-plastic-film-for-mold-release.html. |
"Establishing . . . " reference dated Sep. 13, 2018 found by RMS on the internet at: https://www.mc.showadenko.com/english/information/2018/n_180913uo3.html. |
"RD Series . . . " reference dated Nov. 6, 2021 found by RMS on the internet at: https://www.mc.showadenko.com/english/products/pm/ 015.html. |
Also Published As
Publication number | Publication date |
---|---|
USD962882S1 (en) | 2022-09-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USD851381S1 (en) | Shoe | |
USD931389S1 (en) | J-cup | |
USD903611S1 (en) | Semiconductor device | |
USD864900S1 (en) | Set of headphones | |
USD913419S1 (en) | Showerhead | |
USD902286S1 (en) | Camera | |
USD845574S1 (en) | Dust pan | |
USD868866S1 (en) | Robot | |
USD876835S1 (en) | Caddy | |
USD882174S1 (en) | Handle | |
USD980625S1 (en) | Case | |
USD885466S1 (en) | Camera | |
USD932452S1 (en) | Semiconductor device | |
USD934821S1 (en) | Semiconductor device | |
USD841655S1 (en) | Protect case for IPAD | |
USD934820S1 (en) | Semiconductor device | |
USD876516S1 (en) | Camera | |
USD873224S1 (en) | Heatsink | |
USD998577S1 (en) | Temporary protective film for manufacturing semiconductor devices | |
USD937232S1 (en) | Semiconductor device | |
USD999179S1 (en) | Temporary protective film for manufacturing semiconductor devices | |
USD872159S1 (en) | Camera | |
USD911417S1 (en) | Camera | |
USD885926S1 (en) | Package | |
USD893280S1 (en) | Multi-tool |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |