USD680505S1 - Adhesive tape for semiconductor manufacturing - Google Patents

Adhesive tape for semiconductor manufacturing Download PDF

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Publication number
USD680505S1
USD680505S1 US29/413,509 US201229413509F USD680505S US D680505 S1 USD680505 S1 US D680505S1 US 201229413509 F US201229413509 F US 201229413509F US D680505 S USD680505 S US D680505S
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US
United States
Prior art keywords
adhesive tape
semiconductor manufacturing
view
design
sectional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/413,509
Inventor
Kouhei Taniguchi
Takayuki Matsuzaki
Shinya Katou
Kouji Komorida
Michio Mashino
Tatsuya Sakuta
Rie Katou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to US29/413,509 priority Critical patent/USD680505S1/en
Application granted granted Critical
Publication of USD680505S1 publication Critical patent/USD680505S1/en
Assigned to HITACHI CHEMICAL COMPANY, LTD. reassignment HITACHI CHEMICAL COMPANY, LTD. CHANGE OF ADDRESS Assignors: HITACHI CHEMICAL COMPANY, LTD.
Assigned to SHOWA DENKO MATERIALS CO., LTD. reassignment SHOWA DENKO MATERIALS CO., LTD. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI CHEMICAL COMPANY, LTD.
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SHOWA DENKO MATERIALS CO., LTD.
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF ADDRESS Assignors: RESONAC CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top plan view of an adhesive tape for semiconductor manufacturing incorporating a first embodiment of our new design;
FIG. 2 is a bottom plan view of the adhesive tape of FIG. 1;
FIG. 3 is a rear side view of the adhesive tape of FIG. 1;
FIG. 4 is a front side view of the adhesive tape of FIG. 1;
FIG. 5 is a right side view of the adhesive tape of FIG. 1;
FIG. 6 is a left side view of the adhesive tape of FIG. 1;
FIG. 7 is a cross-sectional view taken at line VII-VII in FIG. 1;
FIG. 8 is a cross-sectional view taken at line VIII-VIII in FIG. 1;
FIG. 9 is an enlarged view of portion IX-IX in FIG. 7; and,
FIG. 10 is an enlarged view of portions X-X, XI-XI in FIG. 1.
The dashed line showing of the adhesive tape is for purposes of illustrating portions of the adhesive tape and forms no part of the claimed design.
The broken lines having alternating long and short segments define bounds of the claimed design and form no part thereof.

Claims (1)

    CLAIM
  1. The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.
US29/413,509 2010-10-15 2012-02-16 Adhesive tape for semiconductor manufacturing Active USD680505S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/413,509 USD680505S1 (en) 2010-10-15 2012-02-16 Adhesive tape for semiconductor manufacturing

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2010024758 2010-10-15
JP2010024759 2010-10-15
JPD2010-024761 2010-10-15
JPD2010-024758 2010-10-15
JPD2010-024759 2010-10-15
JP2010024761 2010-10-15
US29/389,788 USD656909S1 (en) 2010-10-15 2011-04-15 Adhesive tape for semiconductor manufacturing
US29/413,509 USD680505S1 (en) 2010-10-15 2012-02-16 Adhesive tape for semiconductor manufacturing

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/389,788 Division USD656909S1 (en) 2010-10-15 2011-04-15 Adhesive tape for semiconductor manufacturing

Publications (1)

Publication Number Publication Date
USD680505S1 true USD680505S1 (en) 2013-04-23

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US29/389,788 Active USD656909S1 (en) 2010-10-15 2011-04-15 Adhesive tape for semiconductor manufacturing
US29/413,509 Active USD680505S1 (en) 2010-10-15 2012-02-16 Adhesive tape for semiconductor manufacturing

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Application Number Title Priority Date Filing Date
US29/389,788 Active USD656909S1 (en) 2010-10-15 2011-04-15 Adhesive tape for semiconductor manufacturing

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US (2) USD656909S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD804435S1 (en) * 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD928890S1 (en) * 2017-03-30 2021-08-24 Chrome Cherry Design Studio (Pty) Ltd Tape forming a toy building block base
USD946540S1 (en) * 2020-11-02 2022-03-22 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI662385B (en) 2010-06-11 2019-06-11 日商理光股份有限公司 Container, and image forming apparatus

Non-Patent Citations (9)

* Cited by examiner, † Cited by third party
Title
Office Action dated Feb. 25, 2013, in Design U.S. Appl. No. 29/413,518.
Office Action dated Jan. 18, 2013, in Design U.S. Appl. No. 29/413,539.
Office Action dated Jan. 29, 2013, in Design U.S. Appl. No. 29/413,548.
Taniguchi et al., U.S. Appl. No. 29/389,790, filed Apr. 15, 2011.
Taniguchi et al., U.S. Appl. No. 29/389,794, filed Apr. 15, 2011.
Taniguchi et al., U.S. Appl. No. 29/389,797, filed Apr. 15, 2011.
Taniguchi et al., U.S. Appl. No. 29/413,518, filed Feb. 16, 2012.
Taniguchi et al., U.S. Appl. No. 29/413,539, filed Feb. 16, 2012.
Taniguchi et al., U.S. Appl. No. 29/413,548, filed Feb. 16, 2012.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD804435S1 (en) * 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD928890S1 (en) * 2017-03-30 2021-08-24 Chrome Cherry Design Studio (Pty) Ltd Tape forming a toy building block base
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD998577S1 (en) 2019-11-14 2023-09-12 Resonac Corporation Temporary protective film for manufacturing semiconductor devices
USD946540S1 (en) * 2020-11-02 2022-03-22 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD999179S1 (en) 2020-11-02 2023-09-19 Resonac Corporation Temporary protective film for manufacturing semiconductor devices

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